JPH0855727A - Laminated electronic parts - Google Patents
Laminated electronic partsInfo
- Publication number
- JPH0855727A JPH0855727A JP6190757A JP19075794A JPH0855727A JP H0855727 A JPH0855727 A JP H0855727A JP 6190757 A JP6190757 A JP 6190757A JP 19075794 A JP19075794 A JP 19075794A JP H0855727 A JPH0855727 A JP H0855727A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- electrodes
- chip
- external electrode
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、積層チップインダク
タ、積層コンデンサ等の積層型電子部品で、その内部電
極と外部電極との接続構造を改良したものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer electronic component such as a multilayer chip inductor and a multilayer capacitor having an improved connection structure between internal electrodes and external electrodes.
【０００２】[0002]
【従来の技術】従来、この種の積層チップインダクタ、
例えばチップビーズとして図１１乃至図１４に示すもの
が知られている。2. Description of the Related Art Conventionally, this type of multilayer chip inductor,
For example, chip beads shown in FIGS. 11 to 14 are known.
【０００３】このチップビーズを製造するときは、ま
ず、図１１に示すように、磁性体グリーンシート１ａ，
１ｂ，１ｃを用意し、そのうちの一枚の磁性体グリーン
シート１ｂに導電ペーストを塗布し内部電極２のパター
ンを多数印刷する。次いで、この印刷された磁性体グリ
ーンシート１ｂ及びこれを挟む保護用の各磁性体グリー
ンシート１ａ，１ｃを実線矢印に示すように積層固着す
る。その後、磁性体グリーンシート１ｂが図１１の一点
鎖線に沿って分離されるよう、この積層体を切断する。
これにより、図１２及び図１３に示すようなチップビー
ズ素体３が形成される。When manufacturing this chip bead, first, as shown in FIG. 11, the magnetic green sheet 1a,
1b and 1c are prepared, a conductive paste is applied to one of the magnetic green sheets 1b, and a large number of patterns of the internal electrodes 2 are printed. Next, the printed magnetic green sheet 1b and the magnetic green sheets 1a and 1c for protection sandwiching the magnetic green sheet 1b are laminated and fixed as shown by solid arrows. Then, this laminated body is cut so that the magnetic green sheet 1b is separated along the alternate long and short dash line in FIG.
As a result, the chip bead body 3 as shown in FIGS. 12 and 13 is formed.
【０００４】このように形成されたチップビーズ素体３
を乾燥、焼成し、その後、このチップビーズ素体３の外
側に内部電極２の端部（引き出し電極部２ａ）に接続す
る外部電極４を図１４に示すように塗布形成する。最後
に、この外部電極４の外側にはんだメッキを行いチップ
ビーズが製造される。Chip bead element body 3 thus formed
Is dried and fired, and thereafter, the external electrode 4 connected to the end portion (lead-out electrode portion 2a) of the internal electrode 2 is applied and formed on the outside of the chip bead body 3. As shown in FIG. Finally, the outside of the external electrode 4 is plated with solder to manufacture chip beads.
【０００５】[0005]
【発明が解決しようとする課題】このようにチップビー
ズを製造するときは、外部電極４を塗布する前にペース
ト状の内部電極２が乾燥、焼成されるため、この焼成等
により内部電極２が収縮し、引き出し電極部２ａの電極
面積が減少したり、或いは、図１３に示すように引き出
し電極部２ａがチップビーズ素体３の内側に引き込まれ
てしまう。When the chip beads are manufactured as described above, the paste-like internal electrode 2 is dried and fired before the external electrode 4 is applied. It contracts and the electrode area of the extraction electrode portion 2a decreases, or the extraction electrode portion 2a is drawn inside the chip bead body 3 as shown in FIG.
【０００６】このような状態で外部電極４を塗布して
も、図１４に示すように引き出し電極部２ａと外部電極
４との間に隙間５ができ、接続不良を起こすおそれがあ
った。また、この内部電極２と外部電極４との接続信頼
性は、大きな電流を使用するとき特に高いものを要求さ
れるが、従来のチップビーズではその要求を満足させる
ことができず、チップビーズの高電流仕様の製造には不
向きなものとなっていた。Even if the external electrode 4 is applied in such a state, a gap 5 may be formed between the extraction electrode portion 2a and the external electrode 4 as shown in FIG. Further, the connection reliability between the internal electrode 2 and the external electrode 4 is required to be particularly high when a large current is used. However, the conventional chip beads cannot satisfy the requirement, and the chip beads have a high reliability. It was not suitable for manufacturing high current specifications.
【０００７】このようなことから、従来は、この引き出
し電極部２ａの接続面積をその厚さ方向にかせぐため、
引き出し電極部２ａを通常よりも厚膜に形成したり、或
いは、引き出し電極部２ａに導電ペーストを複数回に亘
って塗布したり、更には、引き出し電極部２ａを複数の
導電部材で積層する構造が採用されていた。For this reason, conventionally, in order to make the connecting area of the lead electrode portion 2a in the thickness direction,
A structure in which the extraction electrode portion 2a is formed to be thicker than usual, or a conductive paste is applied to the extraction electrode portion 2a multiple times, and further, the extraction electrode portion 2a is laminated with a plurality of conductive members. Was adopted.
【０００８】しかしながら、引き出し電極部２ａを通常
よりも厚膜に形成するときは、引き出し電極部２ａを含
む内部電極２全体を一回のスクリーン印刷等で形成でき
ないし、また、導電ペーストを複数回に亘り塗布する構
造では、内部電極２全体を印刷するマスクスクリーン
と、これとは別個に引き出し電極部２ａのみを印刷する
マスクスクリーンを用意しなければならず、製造コスト
が割高になるという問題点を有していた。更に、引き出
し電極部２ａに導電部材を積層する構造では、この引き
出し電極部２ａに対応する導電部材を予め用意し、これ
を積層しなければならず、その製造工程が複雑になると
いう問題点を有していた。However, when the lead-out electrode portion 2a is formed to be thicker than usual, the entire internal electrode 2 including the lead-out electrode portion 2a cannot be formed by one screen printing or the like, and the conductive paste is formed a plurality of times. In the structure of applying over the entire length, it is necessary to prepare a mask screen for printing the entire internal electrode 2 and a mask screen for printing only the extraction electrode portion 2a separately from the mask screen, which results in a high manufacturing cost. Had. Further, in the structure in which the conductive member is laminated on the lead electrode portion 2a, a conductive member corresponding to the lead electrode portion 2a must be prepared in advance and laminated, which makes the manufacturing process complicated. Had.
【０００９】本発明の目的は前記従来の課題に鑑み、内
部電極と外部電極とを簡単かつ確実に接続でき、接続信
頼性の高い積層型電子部品を提供することにある。In view of the above-mentioned conventional problems, an object of the present invention is to provide a laminated electronic component which can easily and surely connect an internal electrode and an external electrode and has high connection reliability.
【００１０】[0010]
【課題を解決するための手段】本発明は前記課題を解決
するため、積層した各層のうち少なくとも一層に内部電
極を形成するとともに、積層した各層の外側周縁に該内
部電極の端部に接続する外部電極を形成した積層型電子
部品において、前記内部電極が形成された層に、該層の
厚さ方向に延び該内部電極及び前記外部電極に接続する
導電性のスルーホールを形成したことを特徴とする。In order to solve the above-mentioned problems, the present invention forms an internal electrode in at least one of the laminated layers, and connects the end of the internal electrode to the outer peripheral edge of each laminated layer. In a multilayer electronic component having an external electrode formed, a conductive through hole extending in the thickness direction of the layer and connecting to the internal electrode and the external electrode is formed in the layer where the internal electrode is formed. And
【００１１】[0011]
【作用】本発明によれば、外部電極には内部電極の端部
と内部電極に接続したスルーホールがそれぞれ接続さ
れ、このスルーホールの接続面積の分、従来の接続面積
より大きくなる。According to the present invention, the external electrode is connected to the end portion of the internal electrode and the through hole connected to the internal electrode, and the connection area of the through hole becomes larger than the conventional connection area.
【００１２】また、この接続面積の拡大に際し、スルー
ホールを形成するだけで良いため、簡単に接続面積を拡
大できる。Further, when the connection area is expanded, it is only necessary to form the through hole, so that the connection area can be easily expanded.
【００１３】[0013]
【実施例】図１乃至図９の(a)(b)は本発明に係る積層型
電子部品の一実施例を示すもので、図１は磁性体グリー
ンシートの積層工程を示す斜視図、図２はチップビーズ
素体の斜視図、図３は図２のＡ−Ａ線矢視方向の断面
図、図４はチップビーズの断面図、図５は内部電極及び
スルーホールの平面図、図６の(a)(b)は内部電極及びス
ルーホールの接続部分を従来例と比較した断面図、図７
の(a)(b)はチップビーズのたわみ試験及び試験結果を示
す図、図８はたわみ試験による外部電極の剥離状態を示
す従来の断面図、図９はたわみ試験による外部電極の剥
離状態を示す本実施例の断面図である。なお、従来例と
同一構成部分は同一符号をもって表す。1 to 9 (a) and 9 (b) show an embodiment of a laminated electronic component according to the present invention. FIG. 1 is a perspective view showing a lamination process of magnetic green sheets. 2 is a perspective view of the chip bead body, FIG. 3 is a sectional view taken along the line AA of FIG. 2, FIG. 4 is a sectional view of the chip beads, FIG. 5 is a plan view of internal electrodes and through holes, and FIG. 7 (a) and 7 (b) are cross-sectional views comparing the connection part of the internal electrode and the through hole with the conventional example, and FIG.
(A) and (b) are diagrams showing the bending test and the test results of the chip beads, FIG. 8 is a conventional cross-sectional view showing the peeling state of the external electrode by the bending test, and FIG. It is sectional drawing of the present Example shown. The same components as those of the conventional example are represented by the same reference numerals.
【００１４】本実施例に係るチップビーズ素体も従来例
と同様に製造されるもので、図１に示すように、３枚の
磁性体グリーンシート１ａ，１ｂ，１ｃを実線矢印に示
すように積層固着し、次いで、内部電極２が印刷された
磁性体グリーンシート１ｂを図１の一点鎖線に沿って分
離するようこの積層体を切断し、図２に示すようなチッ
プビーズ素体６を形成する。The chip bead body according to this embodiment is also manufactured in the same manner as the conventional example. As shown in FIG. 1, three magnetic green sheets 1a, 1b and 1c are shown by solid arrows. This is laminated and fixed, and then this laminated body is cut so as to separate the magnetic green sheet 1b on which the internal electrodes 2 are printed along the alternate long and short dash line in FIG. 1 to form a chip bead body 6 as shown in FIG. To do.
【００１５】ここで、本実施例の特徴とするところは、
内部電極２を印刷した磁性体グリーンシート１ｂにおい
て、その内部電極２の端部である引き出し電極部２ａに
スルーホール７を形成した点にある。Here, the feature of this embodiment is that
In the magnetic green sheet 1b on which the internal electrodes 2 are printed, the through holes 7 are formed in the lead electrode portions 2a which are the ends of the internal electrodes 2.
【００１６】即ち、このスルーホール７は磁性体グリー
ンシート１ｂの厚さ方向に円筒状に形成されたもので、
図５に示すように、積層体の切断線がスルーホール７の
中央を通るよう配置されている。これにより、図２及び
図３に示すように、チップビーズ素体６の側面に外部電
極４への接続部分が露出する。この接続部分は引き出し
電極部２ａとスルーホール７とからなるため、その接続
面積が、図４に示すように、スルーホール７の分、従来
より広くなる。That is, the through hole 7 is formed in a cylindrical shape in the thickness direction of the magnetic green sheet 1b.
As shown in FIG. 5, the cutting line of the laminated body is arranged so as to pass through the center of the through hole 7. As a result, as shown in FIGS. 2 and 3, the connection portion to the external electrode 4 is exposed on the side surface of the chip bead body 6. Since this connecting portion is composed of the lead-out electrode portion 2a and the through hole 7, the connecting area is wider than the conventional one by the amount of the through hole 7 as shown in FIG.
【００１７】この接続面積の拡大割合を図５及び図６の
(a)(b)に基づいて説明する。ここで、本実施例（図６の
(a)）及び従来例（図６の(b)）の両者とも、その引き出
し電極部２ａの幅寸法が0.92mm、厚さ寸法が0.02mmとな
っており、その接続面積は0.0184mm2（0.92mm×0.02m
m）となる。一方、本実施例のスルーホール７の直径が
0.25mm、厚さ寸法が0.06mmであり、このスルーホール７
の接続面積が0.015mm2（0.25mm×0.06mm）となる。従っ
て、従来の接続面積に対する本実施例の接続面積の拡大
割合は約1.82［（0.0184mm2＋0.015mm2）／0.0184mm2］
倍となる。なお、一点鎖線は切断線を示している。The expansion ratio of this connection area is shown in FIG. 5 and FIG.
A description will be given based on (a) and (b). Here, the present embodiment (of FIG. 6)
In both (a)) and the conventional example (FIG. 6 (b)), the width dimension of the extraction electrode portion 2a is 0.92 mm, the thickness dimension is 0.02 mm, and the connection area is 0.0184 mm 2 ( 0.92mm x 0.02m
m). On the other hand, the diameter of the through hole 7 of this embodiment is
This through hole 7 has a thickness of 0.25 mm and a thickness of 0.06 mm.
Connection area is 0.015 mm 2 (0.25 mm × 0.06 mm). Therefore, expansion ratio of the connection area of the present embodiment for conventional connection area about 1.82 [(0.0184mm 2 + 0.015mm 2 ) /0.0184mm 2]
Double. The alternate long and short dash line indicates a cutting line.
【００１８】このように、本実施例に係るチップビーズ
は外部電極４との接続面積がスルーホール７の分広くな
るため、チップビーズの製造工程で内部電極２が収縮し
チップビーズ素体６側に引き込まれても、その分このス
ルーホール７の接続面積でカバーでき、内部電極２と外
部電極４の接続信頼性が向上する。As described above, in the chip bead according to this embodiment, the connection area with the external electrode 4 is widened by the through hole 7, so that the internal electrode 2 shrinks in the chip bead manufacturing process and the chip bead body 6 side. Even if the internal electrode 2 and the external electrode 4 are pulled in, the connection area of the through hole 7 can be covered and the connection reliability between the internal electrode 2 and the external electrode 4 is improved.
【００１９】このような接続信頼性を確認するため、図
７の(a)に示すたわみ試験を行った。試料として本実施
例のチップビーズと従来のチップビーズをそれぞれ１０
個宛用意し、これを基板にはんだ付けし、この基板のた
わみによる各チップビーズの機械的破壊及び電気的破壊
を計数した。この結果、図７の(b)に示すように、本実
施例のチップビーズはたわみ量が１２ｍｍ以上となった
ときのみ機械的破壊及び電気的破壊が起こるのに対し
て、従来のチップビーズはたわみ量が１２ｍｍ未満で、
機械的破壊及び電気的破壊が５個程度起きている。よっ
て、このたわみ試験からも本実施例に係るチップビーズ
が接続信頼性に優れていることが理解できる。In order to confirm such connection reliability, a flexure test shown in FIG. 7 (a) was conducted. As the sample, 10 chips of the chip beads of the present example and 10 chips of the conventional chips were used.
Each chip bead was prepared and soldered to a substrate, and the mechanical and electrical breakdown of each chip bead due to the deflection of the substrate was counted. As a result, as shown in FIG. 7 (b), the chip beads of the present example are mechanically and electrically destroyed only when the amount of deflection is 12 mm or more, whereas the conventional chip beads are not. If the amount of deflection is less than 12 mm,
About 5 mechanical and electrical breakdowns have occurred. Therefore, it can be understood from this deflection test that the chip beads according to this example have excellent connection reliability.
【００２０】また、このたわみ試験による機械的破壊及
び電気的破壊を図８の(a)(b)及び図９の(a)(b)を参照し
て説明する。図８の(a)に示すように、従来のチップビ
ーズを基板８にはんだ９で固着した後、図８の(b)に示
すように、白抜き矢印方向に圧力を加えたとき、はんだ
９及び外部電極４に実線矢印の方向に力が加わる。これ
により、チップビーズ素体６から外部電極４が剥離し、
外部電極４と引き出し電極部２ａが離隔する。この剥離
により機械的破壊及び電気的破壊が起こる。Mechanical breakdown and electrical breakdown due to the flexure test will be described with reference to FIGS. 8A and 8B and FIGS. 9A and 9B. As shown in FIG. 8 (a), after the conventional chip beads are fixed to the substrate 8 with solder 9, as shown in FIG. 8 (b), when pressure is applied in the direction of the white arrow, the solder 9 And, a force is applied to the external electrode 4 in the direction of the solid arrow. As a result, the external electrode 4 is separated from the chip bead body 6,
The external electrode 4 and the extraction electrode portion 2a are separated from each other. This peeling causes mechanical breakdown and electrical breakdown.
【００２１】他方、図９の(a)に示すように、本実施例
のチップビーズを基板８にはんだ９で固着した後、同じ
く図９の(b)に示すように白抜き矢印方向に圧力を加え
たときは、これまた実線矢印方向に力が加わりチップビ
ーズ素体６から外部電極４が剥離することがある。しか
しながら、内部電極２、スルーホール７及び外部電極４
がともにＡｇ等を主成分とする共通の材質からなるた
め、その接続強度が高く、従って本実施例の如く引き出
し電極部２ａをスルーホール７にて接触面積が広くとる
ときは、その機械的強度が向上し、その破壊が起こりに
くいことが理解できる。On the other hand, as shown in FIG. 9 (a), after the chip beads of this embodiment are fixed to the substrate 8 with solder 9, pressure is applied in the direction of the white arrow as shown in FIG. 9 (b). When is added, the external electrode 4 may be separated from the chip bead body 6 by applying a force in the direction of the solid arrow. However, the internal electrode 2, the through hole 7 and the external electrode 4
Since both are made of a common material containing Ag as a main component, their connection strength is high. Therefore, when the lead electrode portion 2a has a large contact area with the through hole 7 as in this embodiment, its mechanical strength is high. It can be understood that the damage is improved and the damage is less likely to occur.
【００２２】また、その電気的破壊の点を検討するに、
図９の(b)に示すように機械的破壊が起こったときで
も、その接続面積が広い分、内部電極２と外部電極４と
が電気的に接続しており、電気的破壊が起こりにくいこ
とが理解できる。To examine the point of electrical breakdown,
As shown in FIG. 9 (b), even if mechanical breakdown occurs, the internal electrode 2 and the external electrode 4 are electrically connected due to the large connection area, and the electrical breakdown is unlikely to occur. Can understand.
【００２３】更に、内部電極２及びスルーホール７を形
成するときは、磁性体グリーンシート１ｂにスルーホー
ル用の穴を穿設し、引き出し電極部２ａがこの穴に対応
するよう導電ペーストを塗布すれば良く、これにより、
内部電極２及びスルーホール７が一括して形成され、外
部電極４への接続面積を簡単に拡大できる。Further, when forming the internal electrodes 2 and the through holes 7, holes for through holes are formed in the magnetic green sheet 1b, and a conductive paste is applied so that the lead electrode portions 2a correspond to the holes. Good luck
Since the internal electrodes 2 and the through holes 7 are collectively formed, the connection area to the external electrodes 4 can be easily expanded.
【００２４】図１０の(a)(b)(c)(d)は本実施例に係るチ
ップビーズ素体の他の例を示すものである。図１０の
(a)にはチップビーズ素体６ａの引き出し電極部２ａの
両端にスルーホール７ａを形成したものが示されてい
る。このように２箇所にスルーホール７ａを形成するこ
とにより、外部電極４への接続面積を更に拡大してい
る。10A, 10B, 10C and 10D show another example of the chip bead body according to this embodiment. Of FIG.
In (a), there is shown a chip bead body 6a having through holes 7a formed at both ends of the extraction electrode portion 2a. By thus forming the through holes 7a at two locations, the connection area to the external electrode 4 is further expanded.
【００２５】図１０の(b)には内部電極２の電気特性を
向上させるため引き出し電極部２ａの幅を狭くしたチッ
プビーズ素体６ｂが示されている。このような場合は引
き出し電極部２ａの接続面積が非常に狭くなるため、こ
のスルーホール７ｂは外部電極４との接続のために必要
不可欠なものとなる。FIG. 10B shows a chip bead body 6b in which the width of the extraction electrode portion 2a is narrowed in order to improve the electric characteristics of the internal electrode 2. In such a case, the connection area of the extraction electrode portion 2a becomes very small, and thus the through hole 7b becomes indispensable for connection with the external electrode 4.
【００２６】図１０の(c)(d)には内部電極を上下２層に
亘って形成したチップビーズ素体６ｃ，６ｄが示されて
おり、そのうち図１０の(c)には上下の引き出し電極部
２ａを一体に接続するスルーホール７ｃが示され、図１
０の(d)には上下の引き出し電極部２ａをそれぞれ別個
に接続するスルーホール７ｄが示されている。このよう
に、内部電極が多層に亘って形成されている場合にあっ
ても、各スルーホール７ｃ，７ｄで任意に接続面積を拡
大できる。10 (c) and 10 (d) show chip bead bodies 6c and 6d in which internal electrodes are formed in two upper and lower layers, and in FIG. Through holes 7c for integrally connecting the electrode portions 2a are shown, and FIG.
In FIG. 0 (d), through holes 7d for connecting the upper and lower lead electrode portions 2a separately are shown. As described above, even when the internal electrodes are formed in multiple layers, the connection area can be arbitrarily expanded by the through holes 7c and 7d.
【００２７】なお、前記実施例では積層型電子部品中、
積層チップインダクタであるチップビーズについて説明
したが、内部電極とこれに接続する外部電極を有するも
のであれば積層コンデンサ等全ての積層型電子部品に適
用できることは言うまでもない。Incidentally, in the above-mentioned embodiment, in the laminated electronic component,
Although the chip bead, which is a multilayer chip inductor, has been described, it goes without saying that it can be applied to all multilayer electronic components such as a multilayer capacitor as long as it has an internal electrode and an external electrode connected thereto.
【００２８】[0028]
【発明の効果】以上説明したように、本発明によれば、
外部電極には内部電極の端部と内部電極に接続したスル
ーホールがそれぞれ接続され、このスルーホールの接続
面積の分、従来の接続面積より大きくなり、これによ
り、内部電極と外部電極との接続信頼性を向上させるこ
とができる。また、この接続面積の拡大に際し、スルー
ホールを形成するだけで良いため、簡単に接続面積を拡
大できる。As described above, according to the present invention,
The external electrode is connected to the end of the internal electrode and the through hole connected to the internal electrode, respectively, and the connection area of this through hole is larger than the conventional connection area, thereby connecting the internal electrode and the external electrode. The reliability can be improved. Further, when the connection area is expanded, it is only necessary to form the through hole, so that the connection area can be easily expanded.
【図１】本発明に係る磁性体グリーンシートの積層工程
を示す斜視図FIG. 1 is a perspective view showing a lamination process of magnetic green sheets according to the present invention.
【図２】本発明に係るチップビーズ素体の斜視図FIG. 2 is a perspective view of a chip bead body according to the present invention.
【図３】図２のＡ−Ａ線矢視方向の断面図FIG. 3 is a sectional view taken along the line AA of FIG.
【図４】本発明に係る外部電極が形成されたチップビー
ズ素体の断面図FIG. 4 is a cross-sectional view of a chip bead body on which external electrodes according to the present invention are formed.
【図５】本発明に係る内部電極及びスルーホールの平面
図FIG. 5 is a plan view of internal electrodes and through holes according to the present invention.
【図６】本発明に係る内部電極及びスルーホールの接続
部分を従来例と比較した断面図FIG. 6 is a cross-sectional view comparing a connection portion of internal electrodes and through holes according to the present invention with a conventional example.
【図７】チップビーズのたわみ試験及び試験結果を示す
図FIG. 7 is a view showing a deflection test of chip beads and a test result.
【図８】たわみ試験による外部電極の剥離状態を示す従
来の断面図FIG. 8 is a conventional cross-sectional view showing a peeled state of an external electrode by a deflection test.
【図９】たわみ試験による外部電極の剥離状態を示す本
実施例の断面図FIG. 9 is a cross-sectional view of the present example showing a peeled state of an external electrode by a deflection test.
【図１０】本発明に係るチップビーズ素体の他の例を示
す斜視図FIG. 10 is a perspective view showing another example of the chip bead body according to the present invention.
【図１１】従来の磁性体グリーンシートの積層工程を示
す斜視図FIG. 11 is a perspective view showing a stacking process of conventional magnetic green sheets.
【図１２】従来のチップビーズ素体の斜視図FIG. 12 is a perspective view of a conventional chip bead body.
【図１３】図１２のＡ−Ａ線矢視方向の断面図13 is a sectional view taken along the line AA of FIG.
【図１４】従来の外部電極が形成されたチップビーズ素
体の断面図FIG. 14 is a cross-sectional view of a chip bead body in which a conventional external electrode is formed.
２…内部電極、２ａ…引き出し電極部、４…外部電極、
６，６ａ，６ｂ，６ｃ，６ｄ…チップビーズ素体、７，
７ａ，７ｂ，７ｃ，７ｄ…スルーホール。2 ... internal electrode, 2a ... extraction electrode part, 4 ... external electrode,
6, 6a, 6b, 6c, 6d ... Chip bead body, 7,
7a, 7b, 7c, 7d ... through holes.
Claims (1)
部電極を形成するとともに、積層した各層の外側周縁に
該内部電極の端部に接続する外部電極を形成した積層型
電子部品において、 前記内部電極が形成された層に、該層の厚さ方向に延び
該内部電極及び前記外部電極に接続する導電性のスルー
ホールを形成したことを特徴とする積層型電子部品。1. A laminated electronic component, wherein an internal electrode is formed on at least one of the laminated layers, and an external electrode connected to an end of the internal electrode is formed on an outer peripheral edge of each laminated layer. A multilayer electronic component, wherein a conductive through hole extending in the thickness direction of the layer and connected to the internal electrode and the external electrode is formed in the layer in which the layer is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19075794A JP3230932B2 (en) | 1994-08-12 | 1994-08-12 | Multilayer electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19075794A JP3230932B2 (en) | 1994-08-12 | 1994-08-12 | Multilayer electronic components |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000200694A Division JP2001028312A (en) | 2000-01-01 | 2000-07-03 | Manufacture of laminated electronic component |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0855727A true JPH0855727A (en) | 1996-02-27 |
| JP3230932B2 JP3230932B2 (en) | 2001-11-19 |
Family
ID=16263231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19075794A Expired - Lifetime JP3230932B2 (en) | 1994-08-12 | 1994-08-12 | Multilayer electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3230932B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006287063A (en) * | 2005-04-01 | 2006-10-19 | Murata Mfg Co Ltd | Electronic part |
| JP2009295819A (en) * | 2008-06-05 | 2009-12-17 | Murata Mfg Co Ltd | Electronic component |
| JP2013219295A (en) * | 2012-04-12 | 2013-10-24 | Panasonic Corp | Common mode noise filter |
| JP2014123643A (en) * | 2012-12-21 | 2014-07-03 | Panasonic Corp | Common mode noise filter and manufacturing method therefor |
| JP2016032093A (en) * | 2014-07-29 | 2016-03-07 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Chip electronic component and mounting substrate of the same |
| JP2019140371A (en) * | 2018-02-08 | 2019-08-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Inductor |
| CN113053621A (en) * | 2019-12-27 | 2021-06-29 | 株式会社村田制作所 | Laminated coil component and design method |
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| KR101462747B1 (en) * | 2013-01-03 | 2014-11-17 | 삼성전기주식회사 | Fabricating method for multi layer ceramic electronic device and multi layer ceramic electronic device using thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62241310A (en) * | 1986-04-11 | 1987-10-22 | Murata Mfg Co Ltd | Laminated chip inductor |
-
1994
- 1994-08-12 JP JP19075794A patent/JP3230932B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62241310A (en) * | 1986-04-11 | 1987-10-22 | Murata Mfg Co Ltd | Laminated chip inductor |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006287063A (en) * | 2005-04-01 | 2006-10-19 | Murata Mfg Co Ltd | Electronic part |
| JP2009295819A (en) * | 2008-06-05 | 2009-12-17 | Murata Mfg Co Ltd | Electronic component |
| JP2013219295A (en) * | 2012-04-12 | 2013-10-24 | Panasonic Corp | Common mode noise filter |
| JP2014123643A (en) * | 2012-12-21 | 2014-07-03 | Panasonic Corp | Common mode noise filter and manufacturing method therefor |
| JP2016032093A (en) * | 2014-07-29 | 2016-03-07 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Chip electronic component and mounting substrate of the same |
| JP2019024113A (en) * | 2014-07-29 | 2019-02-14 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Chip electronic component and mounting board thereof |
| JP2019140371A (en) * | 2018-02-08 | 2019-08-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Inductor |
| US11056272B2 (en) | 2018-02-08 | 2021-07-06 | Samsung Electro-Mechanics Co., Ltd. | Inductor |
| CN113053621A (en) * | 2019-12-27 | 2021-06-29 | 株式会社村田制作所 | Laminated coil component and design method |
| US20210202161A1 (en) * | 2019-12-27 | 2021-07-01 | Murata Manufacturing Co., Ltd. | Multilayer coil component |
| JP2021108325A (en) * | 2019-12-27 | 2021-07-29 | 株式会社村田製作所 | Multilayer coil component |
| CN113053621B (en) * | 2019-12-27 | 2024-03-22 | 株式会社村田制作所 | Laminated coil component and design method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3230932B2 (en) | 2001-11-19 |
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