JPH0851002A - Electronic device and production thereof - Google Patents

Abstract

PURPOSE:To obtain an electronic device, and production method thereof, in which a glassy film is formed at a part on the surface of a ceramic body where the electrode is not required and an electrode is formed, by electroless plating, on the surface of the ceramic body not covered with the glassy coating. CONSTITUTION:A glassy coating 7 is formed on the surface of a substrate 1 where the electrode is not required and then a coating 8 is formed, by electroless plating, on the surface of the substrate 1 not covered with the glassy coating 7.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component element in which electrodes of an electronic component element are formed by electroless plating and a method for manufacturing the same.

[0002]

2. Description of the Related Art A conventional electronic component device and its manufacturing method will be described with reference to FIGS. For example, a disk-shaped electronic component element such as a ceramic capacitor and a thermistor will be described as an example.

In FIG. 4, for example, a disk-shaped ceramic body 1 having electric characteristics, which is represented by a ceramic dielectric or a thermistor, is electroless plated, and the entire surface thereof is plated. The film 2 is formed. next,
A ceramic in which an unnecessary portion of the plating film such as a circumferential edge is removed by a removal method using a mechanical method such as centerless processing or sandblasting, and electrodes 3 each having a circular plating film are formed on both main surfaces. Electronic component elements such as capacitors and thermistors can be obtained.

On the other hand, in FIG. 5, electroless plating is applied to the ceramic body 1 in which the plating resist 4 is applied in advance to the electrode unnecessary portion such as the circumferential edge, and the plating film 5 is formed on the entire surface including the plating resist 4. Is formed. Next, the plating resist 4 is removed by a chemical method to remove the plating film formed on the surface of the plating resist 4 together with the plating resist 4, and the circular electrodes 6 made of the plating film are formed on both main surfaces. Electronic component elements such as formed ceramic capacitors and thermistors can be obtained.

[0005]

However, in the method of removing an unnecessary portion of the plating film using a mechanical method such as grinding in the electronic component element having such a structure and the method of manufacturing the same, the constraint condition of the removing method causes It was difficult to form an electrode having a complicated shape or an electrode having a fine shape.

Further, in the method of removing the plating film of the unnecessary portion by using a chemical method such as peeling of the plating resist, the plating solution penetrates between the ceramic body 1 and the plating resist 4, and the unnecessary portion is exposed. It has a problem that a plating film may be formed.

The object of the present invention is to eliminate the above-mentioned problems. A glassy film is formed on a portion of the surface of the ceramic body which does not require an electrode, and the glassy film is formed by electroless plating. An object of the present invention is to provide an electronic component element in which an electrode made of a plating film is formed on the surface of a ceramic body not covered by (4) and a manufacturing method thereof.

[0008]

In order to achieve the above object, in the electronic component element of the present invention, a vitreous coating is formed on the surface of the substrate where no electrodes are required, and the substrate excluding the vitreous coating is formed. It is characterized in that a plating film is formed on the surface by electroless plating.

The substrate is a ceramic substrate having an electronic circuit or electronic component function.

Further, the substrate is a ceramic body having electric characteristics.

Further, the ceramic body is characterized in that it has electric characteristics.

The ceramic body is a positive characteristic thermistor body, a negative characteristic thermistor body, a capacitor body,
It is characterized by being any one of piezoelectric ceramic bodies.

The vitreous coating is characterized by comprising at least one component selected from the group consisting of lead borosilicate glass, zinc borosilicate glass and bismuth borosilicate glass.

In the method of manufacturing an electronic component element according to the present invention, a substrate is prepared, a vitreous film is formed on a portion of the surface of the substrate where no electrode is required, and electroless plating is performed on the substrate to obtain the vitreous substance. A plating film is formed on the surface of the substrate excluding the film.

The substrate is a ceramic substrate having an electronic circuit or electronic component function.

Further, the substrate is a ceramic body which itself has electrical characteristics.

The ceramic body is any one of a positive characteristic thermistor body, a negative characteristic thermistor body, a capacitor body, and a piezoelectric ceramic body.

The vitreous coating is composed of at least one component selected from the group consisting of lead borosilicate glass, zinc borosilicate glass and bismuth borosilicate glass.

[0019]

According to the present invention, the vitreous coating is formed in advance on the electrode unnecessary portion as described above, so that even if the whole substrate is electroless plated, the plating coating is formed on the portion where the vitreous coating is formed. As a result, a plating film is formed on the surface of the substrate on which the glassy film is not formed.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described in detail with reference to FIGS. However, the same parts as those of the above-described conventional example are designated by the same reference numerals, and detailed description thereof will be omitted.

In FIG. 1, paste is applied to both main surfaces of a disk-shaped ceramic element body 1 having electric characteristics by itself, on an annular portion along the outer shape of the ceramic element body 1 and on portions where no electrodes are required on the circumferential end surface. The vitreous coating film is formed by printing or the like. Next, 200 to 800
The glassy coating is fired by heat treatment at a temperature between ° C. As a result, the vitreous coating 7 fixed to the ceramic body 1 is formed. The material of the vitreous coating 7 formed here is selected from at least one of lead borosilicate glass, zinc borosilicate glass, and bismuth borosilicate glass.

Next, when the entire ceramic body 1 is subjected to activation treatment and then electroless plating is performed, the glass coating 7 is formed on the surface of the glass coating 7 without forming a plating coating. Electrodes 8 made of a plating film are formed on the required electrode portions that are not formed, and electronic component elements such as ceramic capacitors and thermistors can be obtained. Here, the electrode 8 is made of, for example, three layers of nickel, copper, silver, etc., and can withstand the temperature of soldering or the like.

Next, another embodiment in which annular electrodes are formed on both main surfaces of the ceramic body will be described.

In FIG. 2, a paste-like vitreous coating is formed on both main surfaces of the ceramic body 1 in a small circular shape which is an electrode unnecessary portion. Next, by firing the ceramic body 1 in the same manner as described above, the circular vitreous coating 9 fixed to the ceramic body 1 is formed. Next, when the whole ceramic body 1 is subjected to activation treatment and electroless plating is performed, no plating film is formed on the surface of the vitreous coating 9, and the vitreous coating 9 is not formed. The plating film 10 is formed on the electrode required portion and the circumferential end surface of the ceramic body 1. Next, the unnecessary plating film 10 on the circumferential end surface is removed by centerless processing or the like to form an electrode 11 made of an annular plating film on both main surfaces.
It is possible to obtain an electronic component element such as a ceramic capacitor or a thermistor in which is formed.

Next, as another embodiment, a sheet heating element will be described as an example. In FIG. 3, for example, a rectangular vitreous coating 13 is formed on one main surface of a square plate-shaped positive temperature coefficient thermistor element body 12, and a glassy coating 13 is formed on the other main surface and all of the end faces. Next, electroless plating is performed to form electrodes 14 and 14 formed of comb-teeth-shaped plating films on one main surface of the positive temperature coefficient thermistor element body 12 except for the glassy film 13. This makes it possible to obtain an electronic component element which is a planar heating element.

Similarly, a piezoelectric ceramic body (not shown) is used in place of the PTC thermistor body 12,
It can also be used as a surface wave filter.

As described in the above embodiments, the glassy coating according to the present invention does not form a plating coating by electroless plating even if the surface is subjected to activation treatment.

The substrate may be, for example, a ceramic substrate having dielectric strength such as alumina. Further, the substrate may be a ceramic substrate having an electronic circuit or electronic component function.

[0029]

As described above, in the electronic component element and the method of manufacturing the same according to the present invention, after the vitreous coating is formed on the surface of the ceramic body which does not require an electrode, the entire ceramic body is electroless plated. However, the plating film is not formed on the vitreous coating, and the electrode is formed on the surface of the ceramic body on which the vitreous coating is not formed. Therefore, it is not necessary to apply the plating resist before the electroless plating or peel the plating resist after the plating, and the plating film can be selectively formed. Moreover, since the shape of the electrode is determined by the vitreous coating, the shape of the electrode can be easily and arbitrarily formed.

[Brief description of drawings]

FIG. 1 is a side sectional view showing an embodiment of an electronic component element according to the present invention.

FIG. 2 is a side sectional view showing a manufacturing process of another embodiment of the electronic component element according to the present invention.

FIG. 3 is a plan view showing another embodiment of the electronic component element according to the present invention.

FIG. 4 is a side sectional view showing a manufacturing process of a conventional electronic component element.

FIG. 5 is a side sectional view showing another manufacturing process of the conventional electronic component element.

[Explanation of symbols]

 1,12 Ceramic body (substrate) 7,9,13 Vitreous coating 8,11,14 Electrode (plating coating)

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI technical display location H01G 4/12 301 H01L 41/22

Claims (10)

[Claims] 1. An electronic component device, wherein a vitreous coating is formed on a surface of a substrate where an electrode is not required, and a plating coating is formed on the surface of the substrate excluding the vitreous coating by electroless plating. . 2. The electronic component element according to claim 1, wherein the substrate is a ceramic substrate having an electronic circuit or electronic component function. 3. The electronic component element according to claim 1, wherein the substrate is a ceramic body having electric characteristics. 4. The electronic component according to claim 3, wherein the ceramic body is a positive characteristic thermistor body, a negative characteristic thermistor body, a capacitor body, or a piezoelectric ceramic body. element. 5. The glassy coating is composed of at least one component selected from the group consisting of lead borosilicate glass, zinc borosilicate glass, and bismuth borosilicate glass. Item 1. The electronic component element according to item 1, 2, 3 or 4. 6. A plating film is formed on the surface of the substrate excluding the glassy film by preparing a substrate, forming a glassy film on a portion of the surface of the substrate that does not require electrodes, and subjecting the substrate to electroless plating. A method for manufacturing an electronic component element, which comprises: 7. The method of manufacturing an electronic component element according to claim 6, wherein the substrate is a ceramic substrate having an electronic circuit or electronic component function. 8. The method of manufacturing an electronic component element according to claim 6, wherein the substrate is a ceramic element body having electric characteristics. 9. The electronic component according to claim 8, wherein the ceramic body is a positive characteristic thermistor body, a negative characteristic thermistor body, a capacitor body, or a piezoelectric ceramic body. Device manufacturing method. 10. The vitreous coating is composed of at least one component selected from the group consisting of lead borosilicate glass, zinc borosilicate glass, and bismuth borosilicate glass. Item 6. A method for manufacturing an electronic component element according to item 6, 7, 8 or 9.