JPH0850163A - Probing device - Google Patents

Abstract

PURPOSE:To solve the artificial mistake of a probing work, and improve the waveform measuring precision by providing a batch automatic conversion processing means for converting the arrangement and wiring design data of a circuit board by a CAD into a probe positioning control data. CONSTITUTION:A calibration is preliminarily performed so that X and Y coordinates in the coordinate system of the arrangement and wiring design data of a circuit board 1 on a CAD 7 and the coordinate system of a positioning device 6, and the coordinate system of the actual circuit board 1 are equal to each other. The arrangement and wiring design data of the circuit board 1 on the CAD 7 is displayed on a screen, and wirings to be waveformmeasured are thoroughly or successively selected. When all the wirings are selected, all the arrangement and wiring data is converted into a probe positioning control data at random by a batch automatic conversion processing means, and when the wirings are successively selected, the data is converted into the probe positioning control data in the data order selected at real time.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION The present invention relates to the automation of probing equipment.

[0002]

2. Description of the Related Art FIG. 9 shows a conventional probing apparatus. In the figure, 1 is a circuit board, 2 is an electronic component mounted on the circuit board 1, 3 is a pad for mounting the electronic component 2,
Reference numeral 7 denotes a CAD for designing the layout and wiring of the circuit board 1, which holds layout and wiring design data. Reference numeral 5 is a probe for measuring the waveform of the electronic component 2, 6 is a probe positioning device that fixes the probe 5 and is operable in the X, Y, and Z axis directions, and this adjustment is performed manually. 10 is a waveform measuring device with a waveform display function of the result of probing,
Reference numeral 11 is a waveform measurement cable for transmitting the waveform measurement data from the probe 5 to the waveform measurement device 10 having a waveform display function, and 20 is a measurer's eye to confirm when probing the probe 5 to the pad 3. .

FIG. 10 is a flow chart for explaining the operation of the conventional probing apparatus. The conventional probing device is configured as described above, and outputs the layout and wiring design data on the CAD 7 as drawing data (step 10).
0, 101). Next, the measurer reads the pad 3 which is the waveform measurement target from the output drawing data (step 10).
2). After reading, the probe 5 is fixed to the measurer's hand or the probe alignment device 6 and the prober 3 visually probes the measurer (step 10).
3, 104). The operator can check the display screen of the waveform measuring device 10 with a waveform display function to see if the probing is successful.
Check with 0. In parallel with the probing operation, the operation of the waveform measuring device 10 with the waveform display function is performed by the operator's own judgment.
The measurement result is output from the waveform measuring device 10 having a waveform display function (step 105). In addition, since the pad 3 and the probe 5 are carefully checked for damage during probing, two or more persons may be required to measure waveforms at two or more points.

[0004]

Since the conventional probing apparatus is configured as described above, when the circuit board 1 is mounted at a high density, the leads of the electronic component 2 have a narrow pitch. The drawing data output from the CAD 7 becomes very fine, it is very difficult to read the position of the pad 3 that is the waveform measurement target, and it is possible that two or more people are required to measure the waveform at two or more points. Therefore, there is a problem that human error is involved and the waveform measurement work efficiency is reduced. Further, since the pressure during manual probing is out of control, there is a problem that the probe 5 and the pad 3 are damaged and the measurement accuracy becomes unstable.

The present invention has been made to solve the above problems, and eliminates human error in probing work, improves waveform measurement work, improves waveform measurement accuracy, and damages probes and pads. It is intended for prevention.

[0006]

A probing device according to claim 1, wherein a probe, a probe alignment device, a probe alignment control device, a CAD, a waveform measuring device, a waveform data collecting device, and a circuit by CAD. A batch automatic conversion processing means for converting the layout and wiring design data of the substrate into the probe alignment control data.

According to a second aspect of the present invention, there is provided a probe, a probe alignment device, a probe alignment control device, a CAD, a waveform measurement device, a waveform data collection device, and circuit board layout and wiring design data by the CAD. An automatic conversion processing means is provided for converting in real time only data for which signal wirings or pads for waveform measurement are selected to probe alignment control data.

According to a third aspect of the present invention, there is provided a probe, a probe alignment device, a probe alignment control device, a CAD, a waveform measuring device, a waveform data collecting device, a visual sensor, and an image data processing device. , CA
Batch automatic conversion processing means for converting the layout and wiring design data of the circuit board into the data for controlling the probe alignment by D, or only the data in which the signal wiring or pad of the waveform measurement target is selected on the layout and wiring design data of the circuit board by CAD And an automatic conversion processing means for converting in real time into probe alignment control data.

According to a fourth aspect of the present invention, there is provided a probe, a probe alignment device, a probe alignment control device, a CAD, a waveform measuring device, a waveform data collecting device, a pressure sensor, and a pressure data processing device. , CA
Batch automatic conversion processing means for converting the layout and wiring design data of the circuit board into the data for controlling the probe alignment by D, or only the data in which the signal wiring or pad of the waveform measurement target is selected on the layout and wiring design data of the circuit board by CAD And an automatic conversion processing means for converting in real time into probe alignment control data.

According to a fifth aspect of the probing device, a probe, a probe alignment device, a probe alignment control device, CAD, a waveform measuring device, a waveform data collecting device, a visual sensor, and an image data processing device. , A pressure sensor, a pressure data processing device, and a batch automatic conversion processing means for converting the layout and wiring design data of the circuit board by the CAD into the probe alignment control data, or CAD
The automatic conversion processing means for converting only the data in which the signal wiring or pad of the waveform measurement target is selected on the layout and wiring design data of the circuit board into the probe alignment control data in real time.

According to a sixth aspect of the present invention, there is provided a probing apparatus including a plurality of probes, a plurality of probe positioning devices, a probe positioning control device, a CAD, a waveform measuring device, a waveform data collecting device, and a circuit board by CAD. Batch automatic conversion processing means for converting the layout and wiring design data into the probe alignment control data, or the probe alignment control only for the data in which the signal wiring or the pad of the waveform measurement target is selected on the layout and wiring design data of the circuit board by CAD. Automatic conversion processing means for converting the data into real-time data in real time.

[0012]

In the probing apparatus according to the first aspect, the probe alignment data is automatically generated by the batch automatic conversion processing means for converting the layout and wiring design data of the circuit board by CAD into the probe alignment control data.

According to a second aspect of the present invention, in the probing apparatus, an automatic conversion process for converting in real time only the data for selecting the signal wiring or the pad for the waveform measurement on the circuit board layout and wiring design data by CAD to the probe alignment control data. By the means, probe alignment data of only selected data is automatically generated in real time.

According to a third aspect of the present invention, there is provided a probing apparatus which is capable of detecting probing on a pad whose waveform is to be measured as image data, and a visual sensor which is connected to the visual sensor and which inputs image data to obtain probe alignment control data. By using the output image data processing device, the correction data of the plane parallel to the substrate at the probe position is automatically generated.

According to a fourth aspect of the present invention, there is provided a probing device, which is capable of detecting probing of a waveform measurement target pad as pressure data, and is connected to the pressure sensor, and the pressure data is input to obtain probe alignment control data. By using the output pressure data processing device, the correction data in the height direction of the substrate at the probe position is automatically generated.

According to a fifth aspect of the present invention, there is provided a probing apparatus which is capable of detecting probing of a waveform measurement target pad as image data and a visual sensor which is connected to the visual sensor and which inputs image data to obtain probe alignment control data. By using the image data processing device to output, the compensation data of the parallel surface of the substrate at the probe position is automatically generated, and the pressure sensor that can detect the probing of the waveform measurement target pad as the pressure data is connected to the pressure sensor. Further, by using the pressure data processing device which inputs the pressure data and outputs the probe alignment control data, the correction data in the height direction of the substrate at the probe position is automatically generated.

According to a sixth aspect of the probing apparatus, there are two or more probes capable of probing to a pad which is a connecting portion between an electronic component and a circuit board, and the probe is grasped to hold X / Y.
-There are two or more probe alignment devices that can operate in the Z-axis direction, and there is a probe alignment controller that can control two or more probe alignment devices and a waveform display function that connects to two or more probes. By using the waveform measuring device, the probe positions of two or more points are automatically adjusted at the same time.

[0018]

【Example】

Example 1. Embodiment 1 of the present invention will be described below with reference to the drawings. In FIG. 1, 1 is a circuit board, 2 is an electronic component mounted on the circuit board 1, 3 is a pad for mounting the electronic component 2, 4 is signal wiring connected to the pad 3, and 5 is an electronic component 2. A probe for measuring the waveform of the electronic component 2 connected via the signal wiring 4, and 6 is a probe positioning for holding the probe 5 vertically and operable in three directions of X, Y and Z axes. A device, 8 is a probe alignment control device for controlling the probe alignment device 6, 10
Is a waveform measuring device with a waveform display function for measuring and displaying the waveform of the electronic component 2 measured by the probe 5, 11 is the waveform measuring data measured by the probe 5 to the waveform measuring device 10 with a waveform display function. Waveform measuring cable for transmission, 12 is a waveform data collecting device for collecting and storing the waveform measurement data from the waveform measuring device 10 having a waveform display function, and 13 is a waveform measuring device 10 having a waveform display function.
A waveform data collecting cable for transmitting the waveform measurement data from the waveform data collecting device 12 to the waveform data collecting device 12, and 14 is a visual magnification held by the probe alignment device 6 for confirmation when the tip of the probe 5 probes the pad 3. A replaceable visual camera for confirmation of probing, 15 is an image data processing device for processing visual information from the visual camera 14 and visually displaying it, and 16 is a voltage change caused by the pressure generated when the probe 5 probes the pad 3. The piezoelectric element is detected as change data, and is arranged between the grip portion of the probe 5 on the probe alignment device 6 and the rear end portion of the probe 5. Reference numeral 17 is a pressure data processing device for processing the voltage change data from the piezoelectric element 16 as virtual pressure data, and 7 is the layout and wiring design data of the circuit board 1 for data conversion to the probe alignment control device 8 and an image. C having a data conversion processing unit from the data processing device 15 to the probe alignment control device 8 and a data conversion processing unit from the pressure data processing device 17 to the probe alignment control device 8
It is AD. Reference numeral 9 is an interface cable for alternately exchanging information between the CAD 7, the probe alignment control device 8, the waveform data collection device 12, the image data processing device 15, and the pressure data processing device 17.

FIG. 3 shows the visual camera 14 according to the first embodiment.
FIG. 3 is an enlarged view of a piezo element 16 part. In the figure,
Reference numeral 18 denotes a probe contact portion when the probe 5 of the probe alignment device 6 is gripped.
Can be slid by a small amount in the direction of the flange of the grip portion of the probe 5.

FIG. 4A is a diagram before the probe 5 performs the probing operation on the pad 3, and FIG. 4B is a diagram after the probe 5 completes the probing operation on the pad 3.

FIG. 5 is a diagram showing a probe gripping state of the probe alignment device 6. Reference numeral 19 is a probe origin for virtually aligning the probe 5 with the tip of the probe 5. The probe origin 19 is used to control the probe 5 in three directions of X, Y, and Z axes. .

FIG. 6A is a view showing a contact state of the probe 5 with the pad 3 in the probing operation. Figure 6
FIG. 6B is a diagram showing a state where the probe 5 pressurizes the pad 3 in the probing operation.

FIG. 7A is an image diagram of a calibration method between the coordinate system of the circuit board 1 on the CAD 7 and the actual coordinate system of the circuit board 1. Reference numeral 24 is a CAD board origin, and 25 is an actual board origin. FIG. 10b is an image diagram of a calibration method between the coordinate system of the circuit board 1 on the CAD 7 and the coordinate system of the probe alignment device 6, and FIG.
Is a substrate end point A, and 27 is a substrate end point B.

The operation of this embodiment will be described with reference to the operation flow chart of FIG. The X and Y coordinates of the coordinate system (step 200) of the layout and wiring design data of the circuit board 1 on the CAD 7, the coordinate system of the alignment device 5 and the actual coordinate system of the circuit board 1 (step 201) are equal in advance. Is performed as follows (step 202). As shown in FIG. 7A, the calibration of the actual coordinate system of the circuit board 1 on the CAD 7 to the coordinate system (X, Y) of the circuit board 1 is (X + a, Y +).
It is possible in b). However, a and b are values arbitrarily set by the designer when outputting the board manufacturing data. Due to this adjustment, the coordinate system at the real board origin 25 becomes the CAD board origin 2
It agrees with the coordinate system in 4. Next, the actual board origin 25, the board end point A26, and the board end point B set as shown in FIG. 7B.
The tip of the probe 5 is brought into contact with the three points 27 by the alignment device 6 while the probe 5 is held vertically.
Using the data thus obtained, the unit vector of the vector connecting the actual board origin 25 to the board end point A26 is obtained, and this is taken as the X-axis direction component at the actual board origin 25,
Similarly, a unit vector of a vector connecting the actual board origin 25 to the board end point B27 is obtained, and this is set as the Y-axis direction component at the actual board origin 25. This coordinate system coincides with the coordinate system at the CAD board origin 24. However, the height of the tip of the probe 5 in the Z direction is constant enough to avoid collision with the electronic component 2 on the circuit board 1 and the operating range of the probe alignment device 6 is maximum. To do. The X-axis and Y-axis directions of the probe origin 19 at the tip of the probe 5 are equal to those at the actual substrate origin 25.

After calibrating the coordinate system as described above, in step 203, the circuit board 1 in the CAD 7 is
With the layout and wiring design data of (1) displayed on the screen, all the wirings to be measured for waveform are selected or sequentially selected. When all wirings are selected, the batch automatic conversion processing unit randomly converts all placement and wiring data into probe alignment control data, and when sequential wiring is selected, the probe positions are selected in real time by the automatic conversion processing unit. It is converted to data for alignment control.

A series of probing operations from FIG. 4 (a) to FIG. 4 (b) are performed as follows. The probe alignment control data (step 204) is transferred to the probe alignment controller 8 via the interface cable 9 (step 205). Based on the transferred data, the probe alignment device 6 moves the probe 5 to the pad 3 which is the waveform measurement target while holding the probe 5 vertically on the circuit board 1 (steps 206 and 207).
However, the movement is performed with the probe origin 19 relative to the actual substrate origin 25 as shown in FIG. Further, the movement is not performed in the Z-axis direction, but is performed in the X-axis and Y-axis directions. As a result, the height that does not collide with the electronic component 2 mounted on the circuit board 1 is maintained, and the rough alignment in the X-axis and Y-axis directions is completed. After that, the movement in the Z-axis direction is performed, and the tip of the probe 5 and X in the pad 3 are moved while moving in the Z-axis direction.
When a displacement occurs in the axis and Y-axis directions, the displacement is detected by the visual camera 14 and the image data processing device 15, and a command to stop the movement in the Z-axis direction and the tip of the probe 5 is set to X.
And the data to be corrected in the Y-axis direction are sent to the probe alignment controller 8 via the CAD 7 to control the probe alignment device 6. Tip of probe 5 and pad 3
The correction operation is repeated until the contact state becomes as shown in FIG. 6A (steps 208 to 211).

Whether the contact state is present or not is determined by the change in the voltage of the piezoelectric element 8 in contact with the rear end of the probe 5.
It is recognized by the pressure data processing device 17 which processes it as virtual pressure data. Here, the processing by the visual sensor 14 and the image data processing device 15 is stopped.

From the contact state between the probe origin 19 and the pad 3, the probe origin 19 is further moved in the Z-axis direction.
As a result, the probe contact portion 18 of the probe alignment device 6 that holds the probe 5 has a "-" position as shown in FIG. 6b.
The piezoelectric element 8 that slides in the Z "direction and is in contact with the rear end of the probe 5 is pressed, the pressure change due to the pressurization is converted into a voltage change, and pressure data virtually obtained from the voltage change. Is input to the pressure data processing device 17 and compared with the optimum pressurization value of the probe 5. This is repeated until the optimum pressurization value of the probe 5 is reached (steps 213 to 21).
5).

The pressurizing operation is stopped in the optimum pressurizing state. The optimum pressurization state means that an effective contact state between the tip of the probe 5 and the pad 3 is secured to the extent that the probe 5 is not damaged.

The optimum pressure value of the probe 5 is known data, and this optimum pressure value is set in the pressure data processing device 17 before the probing work (step 2).
12).

With the probing condition optimized,
The waveform measuring device 10 reads the waveform from the probe 5 via the waveform measuring cable 11 and displays the waveform (steps 216 to 218), and the waveform data collecting device 12 performs probing with the waveform measurement data via the interface cable 9. The waveform measurement data, the display data, the work history of the waveform measurement data, and the like are saved in conformity with the signal name and the pad name being used (steps 219 to 2).
22).

According to this embodiment, the probe alignment data is automatically generated by the batch automatic conversion processing means for converting the circuit board layout and wiring design data by CAD into the probe alignment control data.

The data is selected by the automatic conversion processing means for converting in real time only the data for selecting the signal wiring or the pad for the waveform measurement on the layout and wiring design data of the circuit board by CAD into the probe alignment control data. Data-only probe alignment data is automatically generated in real time.

Further, a visual sensor capable of detecting the probing of a waveform measurement target pad as image data, and an image data processing device which is connected to the visual sensor and which inputs image data and outputs probe alignment control data. By using, the correction data of the plane parallel to the substrate at the probe position is automatically generated.

Further, a pressure sensor capable of detecting the probing to the pad whose waveform is to be measured as pressure data, and a pressure data processing device which is connected to the pressure sensor and which inputs the pressure data and outputs the probe alignment control data. By using, the correction data in the height direction of the substrate at the probe position is automatically generated.

Further, a visual sensor capable of detecting the probing of the pad whose waveform is to be measured as image data, and an image data processing device which is connected to the visual sensor and which inputs the image data and outputs the probe alignment control data. By using, the compensation data of the parallel surface of the substrate at the probe position is automatically generated, the pressure sensor that can detect the probing of the waveform measurement target pad as pressure data, and the pressure sensor is connected and the pressure data is input. By using a pressure data processing device that outputs probe alignment control data, compensation data in the height direction of the substrate at the probe position is automatically generated.

Example 2. FIG. 8A shows a second embodiment of the present invention.
3a, 3b and 3c are pads. Reference numeral 21 is a high-speed probe, 22a and 22b are high-precision probes, and 23 is a high-speed probe pad on the high-precision probes 22a and 22b. High precision probe 22
The mechanism for moving the a and 22b attaches importance to the accuracy rather than the moving speed, and the fine pads 3a, 3b and 3c on the circuit board 1 can be accurately probed. Pads 3a, 3b,
There is a good electrical connection between the tip portion in contact with 3c and the high-speed probe pad 23. High precision probe 2
Circuit boards 1 or pads 3a, 3 are provided on 2a, 22b.
Although high precision is required to prevent b and 3c from being destroyed, the high speed probe 21 does not require high precision because it probes the large and durable pad 23.

In FIG. 8A, the high precision probe 22
a contacts the pad 3a, and the high-speed probe 21
Touching 3. The electric signal on the circuit board 1 is read by the high-speed probe 21 via the high-precision probe 22a and sent to the measuring instrument 10. At that time, the high-precision probe 22b
Has already moved to the pad 3b to be measured next.

Next, as shown in FIG. 8B, the high speed probe 2
1 moves to the high-precision probe 22b at high speed and performs the next measurement. Meanwhile, the high-precision probe 22a is the high-speed probe 2
1 moves to the pad 3c which is to measure next to 22b.

As shown in FIG. 8 (c), the high-speed probe 21 contacts the high-precision probe 22b on the pad 3b to perform measurement, and then moves to the high-precision probe 22a which has moved on the pad 3c in advance. Take the following measurements. Meanwhile, the high-precision probe 22b moves to the pad where the high-speed probe 21 is going to make the next measurement. By repeating the above operation, the pads can be sequentially measured. However, although the device described in the first embodiment can be applied to the device shown in this embodiment, three probe alignment devices 6 are required.

According to this embodiment, there are two or more probes capable of probing the pads, which are the connecting portions between the electronic components and the circuit board, and the probes are capable of gripping the probes and operating in the X, Y, and Z axis directions. There are two or more alignment devices,
By using a probe alignment control device capable of controlling two or more probe alignment devices and a waveform measurement device with a waveform display function for connecting to two or more probes,
At the same time, the probe positions of two or more points are automatically adjusted.

[0042]

According to the probing apparatus of the first aspect, the CAD
A series of probing operations is automatically performed by batch automatic conversion processing of circuit board layout and wiring design data to probe positioning control data, which facilitates probing and completely prevents human error. .

According to another aspect of the present invention, in the probing apparatus, only the data for selecting the signal wiring or the pad of the waveform measurement target on the circuit board layout and wiring design data by CAD is converted into the probe alignment control data in real time. By means, the probe alignment data of only the selected data is automatically generated in real time, so you can probe only where you want to measure the waveform, and as a result, the efficiency of waveform measurement work and the effect of completely preventing human error are achieved. There is.

According to a third aspect of the present invention, there is provided a probing device which is capable of detecting probing of a waveform measurement target pad as image data, and a visual sensor which is connected to the visual sensor and which inputs the image data to obtain probe alignment control data. By using the output image data processing device, the correction data of the plane parallel to the substrate at the probe position is automatically generated, so that the positioning of the probing can be automated and the probing error can be prevented.

According to a fourth aspect of the present invention, there is provided a probing device, which is capable of detecting probing of a waveform measurement target pad as pressure data, is connected to the pressure sensor, and inputs the pressure data to obtain probe alignment control data. By using the output pressure data processing device, the correction data in the height direction of the substrate at the probe position is automatically generated, and the stable optimum pressure value of the probe can be realized. It has the effect of preventing damage to the probe and pad.

According to a fifth aspect of the present invention, there is provided a probing apparatus which is capable of detecting the probing of a waveform measurement target pad as image data and a visual sensor which is connected to the visual sensor and which inputs image data to obtain probe alignment control data. Image data processing device to output, a pressure sensor that can detect the probing to the pad whose waveform is to be measured as pressure data, and a pressure that is connected to the pressure sensor and that inputs pressure data and outputs probe alignment control data. By using a data processor, probing alignment can be automated, and a stable optimum pressure value for the probe can be achieved, preventing probing mistakes, improving probing accuracy, and preventing probe and pad damage. effective.

The probing device according to the sixth aspect is an automatic
A device capable of simultaneous probing of more than one point can more than double the efficiency of waveform measurement.

[Brief description of drawings]

FIG. 1 is a diagram showing a probing device according to a first embodiment of the present invention.

FIG. 2 is a flow chart diagram for explaining the operation of the probing apparatus in the first embodiment of the present invention.

FIG. 3 is an enlarged view of the visual camera and the piezoelectric element section according to the first embodiment of the present invention.

FIG. 4 is a diagram showing before and after probing operation according to the first embodiment of the present invention.

FIG. 5 is a diagram of a probe gripping state of the probe alignment apparatus according to the first embodiment of the present invention.

FIG. 6 is a diagram showing a probing operation in the first embodiment of the present invention.

FIG. 7 is a calibration diagram of the CAD origin and the actual substrate origin in the first embodiment of the present invention.

FIG. 8 is a diagram showing a probing state in Embodiment 2 of the present invention.

FIG. 9 is a diagram showing a conventional probing device.

FIG. 10 is a diagram showing an operation flow of a conventional probing device.

[Explanation of symbols]

1 printed wiring board and thin film multilayer substrate, 2 electronic parts, 3 electronic parts mounting pad, 3a electronic parts mounting pad, 3b electronic parts mounting pad, 3c electronic parts mounting pad, 4 signal wiring, 5 contact probe, 6
Probe alignment device, 7 CAD, 8 probe alignment control device, 9 interface cable,
10 waveform measuring device with waveform display function, 11 waveform measuring cable, 12 waveform data collecting device, 13 waveform data collecting cable, 14 visual camera, 15 image data processing device, 16 piezoelectric element, 17 pressure data processing device, 18 Probe contact part, 19 probe origin, 2
0 measurer's eyes, 21 high-speed probe, 22a high-precision probe, 22b high-precision probe, 23 high-speed probe pad, 24 CAD board origin, 25 actual board origin, 26 board end point A, 27 board end point B.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical display location H01L 21/66 B 7514-4M // G06F 17/50 (72) Inventor Eiji Mukai Kamakura City Ofunago 1-1-1 Mitsubishi Electric Co., Ltd. Information Systems Research Center (72) Inventor Yuichi Sasaki 5-1-1 Ofuna, Kamakura City Mitsubishi Electric Co. Ltd. Information System Research Center (72) Inventor Akihiro Miura 5-chome, Ofuna Kamakura City No. 1 Mitsubishi Electric Corp. Information Systems Research Center

Claims (6)

[Claims] 1. A probing device comprising the following (a) to (g): (A) A probe capable of contacting a pad that is a contact portion between the circuit board and the electronic component for measuring a waveform of the electronic component mounted on the circuit board; and (b) a probe that holds the probe and is capable of three-dimensional operation. A positioning device, (c) a probe positioning control device for controlling the probe positioning device, (d) a CAD device having a probe positioning control device and a data interface, and having layout and wiring design data of a circuit board; e) a waveform measuring device connected to the probe and displaying a waveform, and (f) connected to the waveform measuring device,
A waveform data acquisition device for processing waveform measurement data,
(G) Batch automatic conversion processing means for converting circuit board layout / wiring design data by CAD into probe alignment control data, 2. A probing device comprising the following (a) to (g). (A) A probe capable of contacting a pad that is a contact portion between the circuit board and the electronic component for measuring a waveform of the electronic component mounted on the circuit board; and (b) a probe that holds the probe and is capable of three-dimensional operation. A positioning device, (c) a probe positioning control device for controlling the probe positioning device, (d) a CAD device having a probe positioning control device and a data interface, and having layout and wiring design data of a circuit board; e) a waveform measuring device connected to the probe and displaying a waveform, and (f) connected to the waveform measuring device,
A waveform data acquisition device for processing waveform measurement data,
(G) Automatic conversion processing means for converting in real time only data in which signal wirings or pads for waveform measurement are selected on the layout and wiring design data of the circuit board by CAD to probe alignment control data. 3. A probing device comprising the following (a) to (i). (A) A probe capable of contacting a pad that is a contact portion between the circuit board and the electronic component for measuring a waveform of the electronic component mounted on the circuit board; and (b) a probe that holds the probe and is capable of three-dimensional operation. A positioning device, (c) a probe positioning control device for controlling the probe positioning device, (d) a CAD device having a probe positioning control device and a data interface, and having layout and wiring design data of a circuit board; e) a waveform measuring device connected to the probe and displaying a waveform, and (f) connected to the waveform measuring device,
A waveform data acquisition device for processing waveform measurement data,
(G) A visual sensor for detecting probing of a waveform measurement target pad as visual information (hereinafter referred to as image data), and (h) connected to the visual sensor to input image data and output probe alignment control data. An image data processing device, and (i) a batch automatic conversion processing means for converting the layout and wiring design data of the circuit board by CAD into the data for probe alignment control, or the waveform measurement target on the layout and wiring design data of the circuit board by CAD. An automatic conversion processing means for converting only data selected from signal wiring or pads into probe alignment control data in real time, 4. A probing device comprising the following (a) to (i). (A) A probe capable of contacting a pad that is a contact portion between the circuit board and the electronic component for measuring a waveform of the electronic component mounted on the circuit board; and (b) a probe that holds the probe and is capable of three-dimensional operation. A positioning device, (c) a probe positioning control device for controlling the probe positioning device, (d) a CAD device having a probe positioning control device and a data interface, and having layout and wiring design data of a circuit board; e) a waveform measuring device connected to the probe and displaying a waveform, and (f) connected to the waveform measuring device,
A waveform data acquisition device for processing waveform measurement data,
(G) a pressure sensor that detects probing of a waveform measurement target pad as pressure data; and (h) a pressure data processing device that is connected to the pressure sensor and that inputs pressure data and outputs probe alignment control data. (I)
Batch automatic conversion processing means for converting the layout and wiring design data of the circuit board by CAD into the data for controlling the probe alignment, or only the data in which the signal wiring or pad of the waveform measurement target is selected on the layout and wiring design data of the circuit board by CAD An automatic conversion processing means for converting the data into probe alignment control data in real time, 5. A probing device comprising the following (a) to (k): (A) A probe capable of contacting a pad that is a contact portion between the circuit board and the electronic component for measuring a waveform of the electronic component mounted on the circuit board; and (b) a probe that holds the probe and is capable of three-dimensional operation. A positioning device, (c) a probe positioning control device for controlling the probe positioning device, (d) a CAD device having a probe positioning control device and a data interface, and having layout and wiring design data of a circuit board; e) a waveform measuring device connected to the probe and displaying a waveform, and (f) connected to the waveform measuring device,
A waveform data acquisition device for processing waveform measurement data,
(G) A visual sensor for detecting probing of a waveform measurement target pad as visual information (hereinafter referred to as image data), and (h) connected to the visual sensor to input image data and output probe alignment control data. An image data processing device, and (i) a pressure sensor for detecting probing of a waveform measurement target pad as pressure data,
(J) A pressure data processing device that is connected to a pressure sensor and inputs pressure data and outputs probe alignment control data; and (k) Converts circuit board layout and wiring design data by CAD into probe alignment control data. A batch automatic conversion processing means, or an automatic conversion processing means for converting in real time only data in which signal wiring or pads for waveform measurement are selected on the layout and wiring design data of the circuit board by CAD to probe alignment control data; 6. A probing device comprising the following (a) to (g): (A) To simultaneously measure a plurality of waveforms of electronic components mounted on a circuit board, a plurality of probes capable of contacting a pad, which is a contact portion between the circuit board and the electronic component, and (b) gripping the probe, A plurality of probe alignment devices capable of three-dimensional operation, (c) a probe alignment controller for controlling the plurality of probe alignment devices, (d) a probe alignment controller and a data interface,
CAD having layout and wiring design data of the circuit board,
(E) A waveform measuring device connected to a probe for displaying a waveform, (f) a waveform data collecting device connected to the waveform measuring device for processing waveform measurement data, and (g) a circuit board layout and wiring design by CAD. Batch automatic conversion processing means for converting data to probe alignment control data, or C
Automatic conversion processing means for converting in real time only data in which signal wirings or pads for waveform measurement are selected on the circuit board layout and wiring design data by AD to probe positioning control data;