JP2019090626A - Substrate automatic analysis system - Google Patents

Abstract

To provide a substrate automatic analysis apparatus capable of preventing human error in analysis of measurement results and improving efficiency of analysis work and improvement of analysis accuracy.SOLUTION: The substrate automatic analysis apparatus includes: a CAD device 6 having component data 13A during measurement and component position coordinate data 13B of a measurement point on a measured substrate 1; a measuring device 9 for acquiring a waveform or constant measurement result of the measurement point on the measured substrate 1; an analyzer 10 for performing analysis using measurement results of the measuring device 9; and result collectors 11 and 12 for storing the analysis results of the analyzer 10 and the measurement results of the measuring device 9.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a technique for performing quality confirmation of a substrate to be measured.

  At the development stage of a circuit board, it is practiced to test the quality of a circuit board under development (substrate to be measured) by trial manufacture. At this time, constant value measurement and waveform measurement of a large number of parts on the substrate to be measured are performed using a probe device. The operator uses the obtained measurement results to determine whether each part on the substrate to be measured is normal or abnormal, and feeds it back to development and design.

  As background art of this technical field, there is disclosed a technique of automatically generating probe alignment data by batch automatic conversion processing means from layout and wiring design data of a circuit board by CAD to data for probe alignment control (for example, patent) Literature 1).

  In addition, in the electrical property test of electronic parts that require multi-point waveform measurement, it has an inexpensive configuration and simple control, automatically even without a problem of contact, even if the distance between measured points of the measured object is narrow. A technique that enables probing is disclosed (eg, Patent Document 2).

JP-A-8-50163 JP 2012-194191 A

  Conventionally, the above-described determination as to whether the input / output of each component on the measurement substrate is normal or abnormal is performed by the operator. This may cause human error. In addition, since workers analyze the measurement results, it takes a lot of working time to analyze the measurement results obtained from parts of several thousand orders.

  Although the techniques described in Patent Documents 1 and 2 can obtain good measurement results, the above-mentioned problems are caused because the judgment / analysis of normality / abnormality using the measurement results is still performed by the worker. Has not been able to

  Therefore, an object of the present invention is to provide a technique capable of preventing the human error in the analysis of the measurement result and improving the efficiency of the analysis operation and the analysis accuracy.

  In order to solve the above problems, a typical substrate automatic analysis system of the present invention is designed to store CAD data having coordinate data of measurement points on a substrate to be measured and part data of parts related to the measurement points. A data holding unit, an analysis data holding unit that stores analysis data related to a component disposed on the substrate to be measured in association with the component data, and coordinate data of CAD data stored in the design data holding unit According to the measurement unit for acquiring the value of the waveform or constant measurement at the measurement point on the substrate to be measured, and the measurement result obtained by the measurement unit, and the analysis data is obtained from the analysis data holding unit. And an analysis unit for performing an analysis process including a process of determining for each part whether or not the part disposed on the substrate to be measured satisfies the specification of the part based on the above, and the solution It has a result collecting unit which stores the analysis result and the measurement of the measurement section results parts, the.

According to the present invention, it is possible to prevent human error in the analysis of measurement results and to improve the efficiency of analysis and the accuracy of analysis.
Problems, configurations, and effects other than those described above will be clarified by the description of the embodiments below.

It is a block block diagram of a substrate automatic analysis system by a 1st embodiment. It is a figure showing an example of hardware constitutions of an analyzer by an embodiment. It is a block block diagram which shows schematic structure of the CAD apparatus in the board | substrate automatic analysis system shown in FIG. It is a block block diagram which shows schematic structure of the components library in the board | substrate automatic analysis system shown in FIG. It is a flowchart which shows the processing operation of the board | substrate automatic analysis system shown in FIG. It is the figure which illustrated the input specification of a certain electronic component. It is a figure which shows the specification value of a certain electronic component, a measurement result, and the determination result. It is a figure which shows an example of an output waveform. It is a block block diagram of a substrate automatic analysis system by a 2nd embodiment.

  Hereinafter, the first and second embodiments of the present invention will be described based on the drawings.

First Embodiment
FIG. 1 is a block diagram of an automatic substrate analysis system according to the first embodiment. A large number of mounted electronic components 3 provided with exposed pads 2 are formed on the substrate 1 to be measured. The probe drive control device 4 is provided with a probe 5 which contacts the pad 2 and designates a constant of the electronic component 3 or measures a waveform of a signal flowing to the pad 2 when the pad 2 or the electronic component 3 is designated as a measurement target. ing. Here, a flying tester is used as the probe drive control device 4, and the probe position control device 4A controls and drives the probe 5 using position coordinate data, and the probe 5 is brought into contact with the pad 2 to be measured. ing.

  The probe drive control device 4 is connected to a CAD device 6 storing CAD drawing data at the time of design of the measurement target substrate 1 although details will be described later. Further, a component library 7 functioning in conjunction with the CAD device 6 is also provided in the substrate automatic analysis system. Similarly, the details of the component library 7 will be described later.

  A measuring instrument 9 is connected to the probe 5 using a measuring cable 8, and the measuring instrument 9 generates a constant value or waveform of the electronic component 3 at a measuring point formed on the substrate 1 to be measured. It has a configuration that can be extracted.

  An analyzer 10 is connected to the CAD device 6, the component library 7 and the measuring device 9. When a signal specifying the pad 2 or the electronic component 3 to be measured is given to the CAD device 6, this analyzer 10 extracts the constant value or the waveform of the electronic component 3 at the measurement point through the measuring device 9 eventually. The analyzer 10 also extracts analysis component data corresponding to the measurement target component stored in the component library 7. Thereafter, the analyzer 10 performs predetermined waveform quality confirmation analysis using the extracted constant value or waveform and the analysis component data.

  A measurement result collector 11 for collecting measurement results by the measurement device 9 is connected to the measuring device 9, and an analysis result collector for collecting the analysis results analyzed by the analyzer 10 is connected to the analyzer 10. 12 are connected.

  FIG. 2 is a diagram showing an example of the hardware configuration of the analyzer 10. As shown in FIG. The analyzer 10 is a computer having a controller 101 and peripherals of an input device 110 and an output device 111.

  The controller 101 controls each piece of hardware operating inside the analyzer 10. The controller 101 has the following configuration.

  The CPU 102 (CPU: Central Processing Unit) is a processing device that develops a program stored in the ROM 104 or the HDD 105 in the RAM 103 and executes calculation. The CPU 102 centrally controls each piece of hardware in the controller 101 by executing a program. The RAM 103 is a volatile memory and is a work memory when the CPU 102 processes. The RAM 103 temporarily stores necessary data while the CPU 102 executes the program.

  The ROM 104 is a non-volatile memory, and stores a BIOS (Basic Input / Output System) executed by the CPU 102 when the analyzer 10 is activated, and firmware. The HDD 105 (HDD: Hard Disk Drive) is an auxiliary storage device for storing data in a non-volatile manner. The HDD 105 stores programs executed by the CPU 102 for calculation and control data.

  A network I / F 106 (I / F: Interface) is an interface board responsible for control of data communication performed with an external device.

  The input I / F 107 is an interface that controls input and output of signals with the input device 110. The output I / F 108 receives an instruction from the CPU 102 and causes the output device 111 to draw an image.

  The input device 110 is an input unit such as a keyboard or a mouse, and the output device 111 is a display unit such as a monitor or a display.

  The probe position control device 4A, the CAD device 6, the measuring instrument 9, the measurement result collector 11, and the analysis result collector 12 are also computers, and the hardware configuration of these is also the hardware configuration of the analyzer 10 shown in FIG. Is the same as The component library 7 is implemented as a single computer, but may be built inside the CAD device 6 or another device as a database system.

  FIG. 3 is a block diagram showing a schematic configuration of the CAD apparatus 6 described above. The CAD device 6 connected to the probe drive control device 4 stores CAD drawing data 13 at the time of design of the substrate to be measured 1. In the CAD drawing data 13, every electronic component on the substrate to be measured 1 is stored. Component data 13A and component position coordinate data 13B. Therefore, when the pad 2 or the electronic component 3 to be measured is designated by the analyzer 10, the CAD apparatus 6 determines position coordinate data of the pad 2 or the electronic component 3 corresponding to the designated electronic component 3 as a component It extracts from position coordinate data 13B. The probe position control device 4A of the probe drive control device 4 drives and controls the probe 5 using the extracted position coordinate data, and brings the probe 5 into contact with the corresponding pad 2. The analyzer 10 outputs a measurement start command to the measuring device 9, and the measuring device 9 obtains a measured value at a measurement point located in the coordinate data.

  FIG. 4 is a block diagram showing a schematic configuration of the component library 7 described above. The component library 7 stores analysis component data 14. The analysis component data 14 is used for analysis of the absolute maximum rating 14A, the electrical characteristics 14B, etc., which will be used at the time of analysis, for each component of the component data 13A used at the time of designing the CAD drawing at the time of design It is a data association.

  For example, in the case of a waveform quality confirmation test for confirming whether the output voltage of the digital IC satisfies the allowable value, the MIN (minimum value) and MAX (maximum) of the power supply voltage VCC as input specifications for each component of the component data 13A. Value), the MIN and MAX data of the input voltage VI are included. Also, data such as MIN of the high level input voltage and MAX of the low level input voltage VIL are included.

  Therefore, the analyzer 10 carries out analysis by taking in the measurement result of the electronic component to be measured from the measuring instrument 9 and taking in the analysis component data 14 of the electronic component to be measured from the component library 7 Can.

  FIG. 5 is a flowchart showing the procedure of the waveform quality check test. A waveform quality confirmation test program is stored in the above-mentioned analyzer 10, and the waveform quality confirmation test program repeats a series of processes for all measurement points of the substrate 1 to be tested. Has been created.

  First, in step S 1, an instruction regarding the first measurement point on the measurement target substrate 1 is given to the flying tester as the probe drive control device 4. Then, the probe drive control device 4 drives the probe 5 to make contact with the pad 2 at a predetermined first measurement point. Thereafter, in step S2, a measurement command is given to the measuring instrument 9, and the waveform or constant value is measured from the probe 5. In step S3 where the measurement is completed, the measuring instrument 9 stores the measurement result in the measurement result collector 11.

  In the subsequent step S4, the analyzer 10 acquires component data 13A from the CAD apparatus 6 including the analysis component data 14 corresponding to the electronic component 3 under measurement. In step S5, the analyzer 10 analyzes by acquiring the analysis part data corresponding to the acquired part under measurement, the measurement result from the measuring instrument 9, and the like. A concrete example of this analysis will be described later. Thereafter, in step S6, the analyzer 10 stores the analysis result in the analysis result collector 12.

  Thereafter, in step S7, it is determined whether measurement at all measurement points on the measurement target substrate 1 is completed, and if it is not completed, the process from step S1 is repeated for a new second measurement point. On the other hand, if it completes, it will end.

  Next, according to the flowchart shown in FIG. 5, the processing operation at the time of performing the waveform quality check operation will be specifically described.

  The waveform quality confirmation work is a test to confirm whether the input voltage of a digital IC meets the specification tolerance of the IC. In the step S1, the analyzer 10 gives the CAD apparatus 6 an instruction on the first measurement point on the measurement substrate 1 as described above by the waveform quality confirmation test program. Then, the CAD device 6 extracts the corresponding coordinate data from the component position coordinate data 13 B and supplies it to the probe position control device 4 A of the probe drive control device 4. Conventionally, the position on the substrate 1 to be measured is displayed using the circuit diagram and CAD drawing data, and the worker can find out on the actual substrate 1 to be measured the signal to be measured and the GND corresponding to the signal. It was visually observed to identify the measurement point. On the other hand, in this work, it can carry out by full automation, without the worker being involved.

  The probe position control device 4A of the probe drive control device 4 drives the probe 5 to a predetermined position while controlling and driving the probe 5 using the acquired coordinate data, and brings the probe 5 into contact with the corresponding pad 2. Conventionally, the operator manually contacts the probe 5 with the measurement point specified as described above. On the other hand, in the present embodiment, when an instruction of the first measurement point is given to the probe drive control device 4, the probe 5 can be automatically brought into contact with the pad 2 at a predetermined position, and a stable contact state Can be secured.

  Thereafter, the measuring instrument 9 having received the contact completion signal measures a waveform or a constant value from the probe 5 in step S2. In the past, the operator manually measured using an oscilloscope, but in this case, it is possible to perform highly accurate and stable measurement while eliminating variations in the contact state depending on the operator's skill level .

  Next, in step S3, the measurement result from the measuring instrument 9 is automatically stored in the measurement result collector 11. Conventionally, the worker manually performs the storage operation, but the measurement result can be automatically stored in the measurement result collector 11 this time.

  On the other hand, the component library 7 is the same measurement point as given to the CAD apparatus 6 among the analysis component data 14 for each electronic component formed on the measurement substrate 1 as shown in FIG. The analysis component data of the electronic component 3 corresponding to is extracted. Thereafter, in step S5, the analyzer 10 takes in part data 13A including a part name and part identification information corresponding to the electronic part 3 under measurement. Further, the analyzer 10 analyzes the part data for analysis corresponding to the measurement point from the CAD drawing data 13 of the part library 7 and the measurement result from the measuring device 9 based on the part data 13A. Since the analysis at this time is automatic analysis according to a predetermined algorithm, the result is always stable, and is implemented without a worker's mistake or the like. The analyzer 10 stores the analysis result in the analysis result collector 12 in step S6.

  Also in this point, conventionally, the operator visually determines the measurement result, but in the present embodiment, as will be described later, in order to perform automatic analysis, it is confirmed whether the measurement result satisfies the corresponding input specification It is enough.

  Thereafter, in step S7, the waveform quality confirmation test program determines whether measurement has been performed on all the measurement points on the measurement target substrate 1. As a result, if it has not been completed, step S1 from the second measurement point is performed. Repeat the process of On the other hand, if it completes, it will end.

  FIG. 6 illustrates an input specification of a certain electronic component 3. The items include data such as MIN and MAX of the power supply voltage VCC, MIN and MAX of the input voltage VI, MIN of the high level input voltage, and MAX of the low level input voltage VIL. In this specification, MIN at the power supply voltage VCC is “−0.5 V” and MAX is “7.0 V”, and MIN at the input voltage VI is “−0.5 V” and MAX is “5.5 V”. In addition, MIN of the high level input voltage is “3.15 V”, and MAX of the low level input voltage is “1.65 V”.

  FIG. 7 shows the measurement results corresponding to the electronic component 3. The measurement items are the input voltages VIMIN and VIMAX, the high level input voltage, the low level input voltage, and the like. In an example of this measurement result, the input voltage VIMIN is "-0.32 V" with respect to the specification value "-0.5 V", and the input voltage VIMAX is "5.0 V" with respect to the specification value "5.5 V". It has become. The high level input voltage is "4.8 V" with respect to the specification value "3. 15 V", and the low level input voltage is "0.0 V" with respect to the specification value "1.65 V".

  The analyzer 10 performs automatic analysis according to a predetermined algorithm stored in advance in step S5 of FIG. 5 described above, and compares the specification value of each item with the measurement value. Then, as shown in FIG. 7, the analyzer 10 writes “OK” in the judgment column 15 if the specification value is satisfied in any case. The output device 111 of the analyzer 10 displays the list shown in FIG. 7 for each part. By displaying the result on the output device 111 of the analyzer 10, the operator can confirm on the spot.

  As described above, from the step of bringing the probe 5 into contact with the predetermined position of the electronic component 3 to be measured, the analysis result of the measurement result of the measuring instrument 9 and the component data for analysis of the corresponding electronic component 3 to be measured are analyzed. It can be incorporated into 10, and it can be automated until comparison and analysis are performed. As a result, it is possible to perform a more accurate waveform quality confirmation test by eliminating variations in the measurement results due to the worker's level of proficiency, so that a highly reliable substrate can be obtained.

  In addition, when there is a worker who monitors the analyzer 10, it is possible to easily check whether the measurement result satisfies the corresponding input specification simply by checking the judgment field 15 by automatic analysis. On the other hand, the measurement result collector 11 stores the measurement result measured by the measuring instrument 9, and the analysis result collector 12 stores the analysis result analyzed by the analyzer 10. Therefore, it becomes possible to perform confirmation and examination on another day, another place, etc. from measurement.

  Here, the waveform quality confirmation test program treats all measurement points of the substrate 1 until analysis is completed as a series of processes. The present invention is not limited to this, and the operator may give a timing that is not related to the variation of the measurement result due to the proficiency level, such as the operator giving a process start signal to each measurement point.

  The analyzer 10 also performs waveform trace processing to trace measured values at intervals of the specified cycle based on the values (voltage values) measured by the probe 5 and the measuring instrument 9 at specified cycles, and outputs this trace result as an output device It can be displayed on 111. FIG. 8 illustrates this trace result. 8A shows an example of a normal waveform, FIG. 8B shows an example of overshoot, FIG. 8C shows an example when waveform rounding occurs, and FIG. 8D shows a stepped waveform. It is an example. Only the waveform in FIG. 8A is a normal waveform, and the others are abnormal waveforms. Note that these are merely examples, and other waveform patterns exist.

  The analyzer 10 performs analysis processing on the waveform traced in this manner to make a judgment of pass / fail. In the present embodiment, the analyzer 10 compares the measured value of one cycle before with the measured value of the time of interest and confirms the increase or decrease thereof, thereby monotonously increasing, monotonically decreasing, non-monotonous, not increasing or decreasing, maximum value, It is determined which waveform state is the minimum value. The analyzer 10 determines that the measurement point is defective when the obtained increase / decrease value is out of the specified allowable range, that is, when the waveform is greatly different from the normal waveform. The data of the normal waveform is defined, for example, in the electrical characteristic 14 B of the component library 7 or the like.

Second Embodiment
FIG. 9 is a block diagram of an automatic substrate analysis system according to another embodiment of the present invention.

  In the first embodiment, a flying tester is used as the probe drive control device 4, and the position coordinate data is used to control and drive the probe 5, and the probe 5 is brought into contact with the pad 2 to be measured. In the second embodiment, an in-circuit tester is used as the probe drive control device 4. The in-circuit tester uses a pin board 16 created based on position coordinate data of CAD drawing data at the time of design of the measurement target substrate 1 stored in the CAD apparatus 6 and a probe 17 attached to the pin board 16 ing. The other configuration is the same as that of the first embodiment, so the same units are denoted with the same reference numerals and the detailed description will be omitted.

  Also in the case of using the probe drive control device 4 by the flying tester, in the step of bringing the probe 5 into contact with the predetermined position of the electronic component 3 to be measured, the measurement result and the corresponding component data for analysis are It is possible to automate up to loading, comparison and analysis. As in the first embodiment described above, it is possible to perform a more accurate waveform quality confirmation test by eliminating variations in measurement results due to workers' familiarity, so it is possible to obtain a highly reliable substrate.

  Further, in any of the embodiments, the analyzer 10 pulls out, from the component library 7, analysis component data corresponding to the CAD drawing data 13 manufactured at the time of substrate design. In addition, the analyzer 10 is configured to take in the measurement result from the measuring instrument 9 and perform analysis by comparing analysis part data with the measurement result. Therefore, the CAD drawing data 13 can be used to automatically and easily and reliably extract analysis part data and measurement results that have a correspondence relationship.

  Further, the analyzer 10 measures at least component data to be measured, analysis component data to be measured corresponding to that to be stored in advance in the component library 7, and measurement results of waveforms or constants measured by the measuring instrument 9, and Displays the analysis result comparing and analyzing the measurement result and the analysis part data. Therefore, it is possible to perform a more accurate waveform quality confirmation test by eliminating the variation due to the worker's skill level. In particular, when an analysis result is stored in the analysis result collector 12 connected to the analyzer 10, even if analysis or examination is performed thereafter, the same accurate waveform is obtained using the analysis result extracted from the analysis result collector 12 It can be a quality confirmation test, and a highly reliable substrate can be obtained.

  In the first and second embodiments, the probe position control device 4A, the CAD device 6, the measuring instrument 9, the measurement result collector 11, and the analysis result collector 12 are described as separate cases, but some functions Alternatively, all the functions may be integrated into one case. In addition, the substrate automatic analysis system described in this embodiment may be provided as a system having a function provided by each device without specifying the device configuration. As an example in this case, the CAD apparatus 6 is a design data holding unit, the component library 7 is an analysis data holding unit, the measuring instrument 9 is a measuring unit, the analyzer 10 is an analyzing unit, the measurement result collector 11 and the analysis result collector 12 Is provided as a result collection unit (measurement result collection unit, analysis result collection unit) or the like. The functions of other devices may also be provided as functional units.

  Further, in the present embodiment, the storage unit for storing each result is divided and stored in the measurement result collector 11 and the analysis result collector 12 according to the type of the result. By dividing and storing data in this way, for example, one of them is stored only in the server as a carry-out prohibition, and the other is allowed to be stored in a portable storage device with a handle that can be carried out. Handling can be differentiated, which increases convenience.

  As described in detail above, according to the present embodiment, it is possible to prevent human error in the analysis of the measurement result and to improve the efficiency of analysis and the accuracy of analysis.

  The present invention is not limited to the above-described embodiment, but includes various modifications. For example, the above-described embodiment is described in detail to explain the present invention in an easy-to-understand manner, and is not necessarily limited to one having all the described configurations. Further, part of the configuration of one embodiment can be replaced with the configuration of another embodiment, and the configuration of another embodiment can be added to the configuration of one embodiment. Moreover, it is possible to add, delete, and replace other configurations for part of the configurations of the respective embodiments. Further, each of the configurations, functions, processing units, processing means, etc. described above may be realized by hardware, for example, by designing part or all of them with an integrated circuit. Further, each configuration, function, etc. described above may be realized by software by the processor interpreting and executing a program that realizes each function. Information such as a program, a table, and a file for realizing each function can be placed in a memory, a hard disk, a recording device such as an SSD (Solid State Drive), or a recording medium such as an IC card, an SD card, or a DVD.

1: measured substrate 2: pad 3: electronic component 4: probe drive control device 4A: probe position control device 5: probe 6: CAD device 7: component library 8: measuring cable 9: measuring instrument 10: analyzer 11: Measurement result collector 12: Analysis result collector

Claims (6)

Automatic substrate analysis system,
A design data holding unit that stores CAD data including coordinate data of measurement points on a measurement target substrate and part data of parts related to the measurement points;
An analysis data holding unit that stores analysis data related to a component placed on the measurement target substrate in association with the component data;
A measurement unit that acquires a value of waveform or constant measurement at a measurement point on the measurement target substrate according to coordinate data of CAD data stored in the design data holding unit;
The measurement result in the measurement unit is acquired, the analysis data is acquired from the analysis data holding unit, and based on these, whether or not the component disposed on the substrate to be measured satisfies the specification of the component An analysis unit that performs an analysis process including a process of performing the determination of each
A result collection unit that stores the analysis result of the analysis unit and the measurement result of the measurement unit;
Substrate automatic analysis system having. The analysis unit compares the measurement result of the measurement unit with the analysis component data acquired from the analysis data holding unit to perform the analysis process.
The substrate automatic analysis system according to claim 1. The analysis data includes data of an absolute maximum rating and an electrical property of the component.
The substrate automatic analysis system according to claim 1 or 2. Furthermore, for each part data, an analysis result comparing and analyzing the analysis data corresponding to the part data, the measurement result corresponding to the part data measured by the measurement unit, the measurement result, and the analysis data And a display unit for displaying
The substrate automatic analysis system according to any one of claims 1 to 3. The result collection unit
A measurement result collection unit that stores the measurement results of the measurement unit;
An analysis result collection unit for storing analysis results by the analysis unit;
The substrate automatic analysis system according to any one of claims 1 to 4, comprising: Automatic substrate analysis system,
An analysis data holding unit that stores analysis data related to a component placed on a measurement target substrate in association with component data included in CAD data;
According to the coordinate data of the measurement point on the measurement substrate included in the CAD data, the measurement result which is the value of the waveform or constant measurement at the measurement point on the measurement substrate is acquired, and the analysis data holding unit The analysis data is acquired from the above, and based on these, the analysis processing including the processing of performing, for each component, whether or not the component arranged on the substrate to be measured satisfies the specification of the component is performed. Analysis department,
A result collection unit that stores the analysis result of the analysis unit and the measurement result;
Substrate automatic analysis system having.