JP2012194191A - Probing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a probing device capable of automatically probing with an inexpensive configuration and simple control with no problem even when an interval between measurement points of objects to be measured is a narrow pitch in the electric characteristics test of an electronic component in need of multipoint waveform measuring.SOLUTION: The lower ends of multiple both-end contact probes 3 that are vertically fixed and supported onto a support structure 5 are set in contact onto a number of measurement points 2 of an object to be measured that an object 1 to be measured owns, and the upper ends are set in contact onto an S face pad 9 of a measurement circuit substrate 8. C face signal pads 10a and 10c and C face GND pads 11a and 11b in the both ends in Y axis direction of the measurement circuit substrate 8 are provided for a predetermined number in X axis direction. Probes 12a and 12b that probe them and contact probes 13a and 13b are subjected to movement control at least in Z axis direction in two axes, X axis and Z axis. The measurement circuit substrate 8 has a circuit configuration capable of transmitting an electrical signal at the measurement point transmitted to an arbitrary S face pad 9 to a surface signal pad.

Description

  The present invention relates to a probing apparatus used in an electrical characteristic test that requires multipoint waveform measurement of a printed wiring board (so-called circuit board) on which electronic components are mounted, and more particularly to automatic probing of adjacent narrow pitch measurement points. The present invention relates to a suitable probing apparatus.

  For example, in Patent Document 1, in order to eliminate the human error in the electrical characteristic test of a circuit board that requires multipoint waveform measurement, to improve the efficiency of waveform measurement work and to improve the waveform measurement accuracy, Probing devices that automate the probing of touch setting are proposed.

  That is, the probing device disclosed in Patent Document 1 includes (1) a probe that can contact a pad that is a contact portion between an electronic component and a circuit board on a circuit board that is an object to be measured; A probe alignment device that can be gripped and operated three-dimensionally; (3) a probe alignment control device that controls the probe alignment device; and (4) a circuit board arrangement having a probe alignment control device and a data interface. A CAD having wiring design data; (5) a waveform measuring device connected to the probe for performing waveform measurement and display; (6) a waveform data collecting device connected to the waveform measuring device for processing the waveform measurement data; 7) a visual sensor that detects probing of the waveform measurement target pad by the probe alignment device as image data that is visual information; 8) an image data processing device that outputs probe alignment control data based on the image data input from the visual sensor; (9) a pressure sensor that detects probing of the waveform measurement target pad as pressure data; 10) a pressure data processing device that outputs probe alignment control data based on the pressure data input from the pressure sensor.

  In the probing device disclosed in Patent Document 1, the probe alignment control device first generates probe alignment control data based on the layout wiring data of the circuit board designed by CAD, and the probe alignment is based on the generated data. Probing to the destination by controlling the device.

  Then, since an image is acquired by the visual sensor, the probe alignment control device generates correction data for the substrate parallel plane at the probe position based on the probe alignment control data generated by the image data processing device. In addition, since the probe pressurization amount is acquired by the pressure sensor, the probe alignment control device generates correction data in the height direction of the probe position based on the probe alignment control data generated by the pressure data processing device. To do.

  The probe alignment control device again controls the probe alignment device based on the correction data of the substrate parallel surface at the probe position and the correction data in the height direction generated as described above. This operation is repeated until the probing state becomes the optimum state.

  In the state in which the probing state is optimized, the waveform measurement device measures the electrical signal waveform acquired from the probe, and the waveform data collection device stores the waveform measurement data.

JP-A-8-50163

  However, in the conventional probing device described above, since probing is performed using two or more probe alignment devices capable of X, Y, and Z axial movement, when measuring adjacent narrow pitch measurement points, There is a problem that the probe alignment devices contact each other and cannot be probed.

  Further, the conventional probing apparatus described above is expensive because it requires a visual sensor and an image data processing apparatus, a pressure sensor and a pressure data processing apparatus. In addition, since correction processing is required many times in order to obtain an optimal probing state, there is a problem that the control becomes complicated.

  The present invention has been made in view of the above, and in an electrical characteristic test of an electronic component that requires multi-point waveform measurement, a narrow pitch is provided between measurement points of an object with an inexpensive configuration and simple control. Even so, an object is to obtain a probing apparatus that can automatically perform probing without a problem of contact.

  In order to achieve the above-described object, the probing apparatus according to the present invention includes a plurality of measurement object measurement points on a measurement object circuit board positioned and placed on an arrangement surface that is an XY surface of a measurement base. A plurality of contact probes fixed and supported perpendicular to the Z-axis direction with the lower end in contact with each other, and a back pad on the back surface in a one-to-one relationship with the measurement points of the object to be measured. A predetermined number of first surface signal pads and first surface GND pads are arranged along the X axis direction on one end side in the Y axis direction of the second surface signal pad and second surface signal pads and second surface pads on the other end side in the Y axis direction of the surface. A measurement circuit board in which a predetermined number of two front surface GND pads are arranged along the X-axis direction, and the plurality of back surface pads are arranged so as to be in contact with upper ends of the plurality of both-end contact probes. With circuit board The first probe and the first contact probe for probing the first surface signal pad and the first surface GND pad on the one end side in the Y-axis direction on the arrangement surface of the measurement base are the X axis and the Z axis. And a second moving surface GND pad and a second moving surface GND pad on the other end side in the Y axis direction on the arrangement surface of the measurement base. A second moving mechanism comprising a second probe for probing and a second contact probe configured to be movable in two axial directions of the X axis and the Z axis, the first probe, and the second probe, The waveform measurement device for measuring at least the waveform of the electrical signal respectively acquired, and the first and The first probe and the first contact probe are moved in at least the Z-axis direction of the X-axis and the Z-axis, and the second probe and the second contact probe are moved in the X-axis and the Z-axis. And at least a control unit that outputs a waveform measurement instruction to the waveform measuring apparatus.

  According to the present invention, in an electrical property test of an electronic component that requires multipoint waveform measurement, even with a narrow pitch between measured object measurement points, the problem of contact can be achieved with an inexpensive configuration and simple control. There is an effect that probing becomes possible automatically.

FIG. 1 is a diagram showing an overall mechanical and electrical configuration of a probing apparatus according to an embodiment of the present invention. FIG. 2 is a diagram showing a configuration example of a portion related to this embodiment of the Z-axis air cylinder shown in FIG. FIG. 3 is a plan view for explaining the arrangement contents of pads and the like on the S surface (back surface) of the measurement circuit board shown in FIG. FIG. 4 is a plan view for explaining the arrangement contents of pads and the like on the C surface (front surface) of the circuit board for measurement shown in FIG. FIG. 5 is a plan view for explaining the positional displacement of the pad in the X-axis direction on the C surface (front surface) of the measurement circuit board shown in FIG. FIG. 6 is a flowchart for explaining a procedure for generating the measurement circuit board CAD drawing shown in FIG.

  Exemplary embodiments of a probing apparatus according to the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a diagram showing an overall mechanical and electrical configuration of a probing apparatus according to an embodiment of the present invention. In FIG. 1, the horizontal direction on the paper is the Y-axis direction, the vertical direction on the paper is the Z-axis direction, and the vertical direction on the paper is the X-axis direction.

(Features of the probing device 100)
The probing apparatus 100 shown in FIG. 1 has a large number (several to several hundreds) of measured objects that the measured object 1 has when performing an electrical characteristic test of the measured object 1 that requires multipoint waveform measurement. Instead of directly setting the probes individually in contact with the measurement points 2 using a probe alignment device as in the conventional example, a method in which the contact probes 3 at both ends are set in contact in advance, so that a large number of measurement points are measured. Even if the distance between the measurement points of the object to be measured is a narrow pitch, it is possible to automatically perform probing without any problem of contact so that all the measurement points can be continuously measured.

(Configuration of probing device 100)
In FIG. 1, a device under test 1 is a circuit board (circuit board for device under test) on which electronic components are mounted. The DUT 1 is positioned and placed on the arrangement surface (XY plane) of the measurement base 4. On the arrangement surface of the measurement base 4, a support structure 5 having a predetermined height is arranged on the outer periphery surrounding the positioning placement area of the DUT 1.

  Inside the support structure 5, a rectangular plate-shaped both-end contact probe holder 7 that fixes and supports the both-end contact probes 3 vertically is fixed at a position where the side wall of the support structure 5 is divided into two in the height direction. Has been. The measurement circuit board 8 is placed and fixed in the upper end opening of the support structure 5.

  The support structure 5 can be lifted up by the operation lever 6 to create a gap in which the DUT 1 can be inserted at the lower end, and can be fixedly disposed on the outer periphery surrounding the positioning placement area of the DUT 1 by being pushed down. It is a configuration. This fixed arrangement state is maintained unless an external factor such as a release operation by the operator lever 6 is applied.

  On the back surface of the measurement circuit board 8 (hereinafter referred to as “S surface”), a large number of S surface pads 9 are arranged. The arrangement mode and the number of the S-surface pads 9 are basically provided in a one-to-one relationship according to the arrangement mode and the number of the measurement object measurement points 2 required for the measurement object 1.

  When the measurement circuit board 8 is placed and fixed in the upper end opening of the support structure 5, the upper end of the both-end contact probe 3 is configured to contact the S-plane pad 9. In this state, when the support structure 5 is fixedly arranged on the outer periphery surrounding the positioning placement region of the object 1 to be measured, the lower end of the both-end contact probe 3 is set in contact with the object measurement point 2. .

  On the surface of the measurement circuit board 8 (hereinafter referred to as “C plane”), the C plane signal pad 10a and the C plane GND pad 11a are close to each other along the X axis direction on one end side in the Y axis direction. The C-plane signal pad 10b and the C-plane GND pad 11b are adjacent to each other on the other end side in the Y-axis direction, and the predetermined number is 1: 1 along the X-axis direction. They are juxtaposed with each other.

  Then, on both sides of the support structure 5 in the Y-axis direction, a pair of “signal pad 10a and GND pad 11a” and a pair of “signal pad 10b and GND pad 11b” provided on the C surface of the measurement circuit board 8 are probed. A moving mechanism (first and first) that moves the pair of “probe 12a and contact probe 13a” and the pair of “probe 12b and contact probe 13b” separately in the X-axis and Z-axis directions. 2 movement mechanisms) are provided.

(Configuration of moving mechanism (first moving mechanism) on one end side of support structure 5 in the Y-axis direction)
The first moving mechanism includes the probe holder 14a, the Z-axis air cylinder 19a, the Z-axis holder 20a, and the X-axis slider 25a. Hereinafter, those related configurations will be described.

  That is, on one end side of the support structure 5 in the Y-axis direction, the probe 12a for probing the C-plane signal pad 10a and the contact probe 13a for probing the C-plane GND pad 11a are respectively L-shaped probe holders 14a. The horizontal portion is vertically fixed and held vertically. The upper end portion of the probe 12a is connected to one signal input end of the waveform measuring device 18 through the signal cable 17a.

  The probe 12a is fixed and held so that the probe GND 15a is positioned on the horizontal portion of the L-shaped probe holder 14a. In this embodiment, since the L-shaped probe holder 14a is formed of a non-conductive member, the probe GND 15a is connected to the contact probe 13a by the probe GND line 16a to ensure electrical continuity. . In the case where the L-shaped probe holder 14a is formed of a conductive member, the probe GND wire 16a can be used only when the L-shaped probe holder 14a can secure the same electrical continuity as the probe GND wire 16a. Connection can be omitted.

  The vertical portion of the L-shaped probe holder 14a is fixedly supported by the up and down movable portion 19a2 of the Z-axis air cylinder 19a, and the body portion 19a1 of the Z-axis air cylinder 19a is fixedly supported by the columnar Z-axis holder 20a. . The Z-axis holder 20a is fixedly supported in an upright state on the upper surface of the X-axis slider movable portion 25a2 of the X-axis slider 25a. The X-axis slider movable portion 25a2 of the X-axis slider 25a is supported by the X-axis slider body portion 25a1 so as to be movable on the arrangement surface in the X-axis direction. The X-axis slider body portion 25a1 is positioned and fixed to the measurement base 4.

  Here, a specific configuration of the Z-axis air cylinder 19a will be described with reference to FIG. FIG. 2 is a diagram showing a configuration example of a portion related to this embodiment of the Z-axis air cylinder 19a. The Z-axis air cylinder 19b has the same configuration.

  As shown in FIG. 2, the up and down movable portion 19 a 2 has a left-right inverted L shape, and is fixedly supported by a rod 40 with respect to the body portion 19 a 1. The stopper 39 is fixedly supported on one surface in the X-axis direction by the exterior of the up and down movable portion 19a2, and the vertical portion of the L-shaped probe holder 14a is fixedly supported on the rear surface in the Y-axis direction. In addition, a small position detecting magnet 32a is provided at a predetermined location in the interior of the vertically movable portion 19a2, and a shock absorbing spring is provided between the left and right inverted L-shaped lower end portion and the rod 40. The vertically movable portion 19a2 is configured to move up and down while being guided by the body portion 19a1 in conjunction with the upward and downward movement of the piston mechanism built in the body portion 19a1.

  In the body portion 19a1, the position detecting electronic device 33a shown in FIG. 1 is arranged on the upper end side, and an upper end stopper 36a with an adjuster is further arranged on the upper side. Further, the body portion 19a1 is provided with the position detecting electronic device 33c shown in FIG. 1 on the lower end side, and further on the lower side with a lower end stopper 36b with an adjuster. Furthermore, compressed air input / output ports 35a and 35b are provided in the body portion 19a1. Further, a rod 40 for moving the piston mechanism up and down is disposed.

  The upper end stopper 36a and the lower end stopper 36b have the same configuration. When the vertically movable portion 19a2 descends and stops, the lower end stopper 36b comes into contact with the lower end of the stopper 39 and stops. Further, when the vertically movable portion 19a2 rises and stops, the upper end of the vertically movable portion 19a2 comes into contact with the upper end stopper 36a and stops. The upper end stopper 36a and the lower end stopper 36b define a stop position when the vertical movable portion 19a2 moves to the uppermost end side and a stop position when it moves to the lowermost end side, and can finely adjust the stop position. It has become. The stop positions on the uppermost end side and the lowermost end side are set in advance at the time of setup before starting measurement.

  Each of the position detection electronic devices 33a and 33c is a sensor, a switch, or the like that detects the presence of the position detection small magnet 32a located in the proximity position, and the attachment position can be arbitrarily adjusted. At the time of setup before starting the measurement, the position detection electronic device 33a is adjusted and set to a position facing the position detection small magnet 32a when the vertically movable portion 19a2 is raised and stopped by contacting the upper end stopper 36a. . The position detecting electronic device 33c is adjusted and set to a position facing the position detecting small magnet 32a when the vertically movable portion 19a2 descends and the lower end stopper 36b comes into contact with the lower end of the stopper 39 and stops.

  The position detection electronic devices 33a and 33c shown in FIG. 2 are connected to the position detection monitor end on one end side of the air control device 22 via the position detection lead wires 34a and 34c shown in FIG. The compressed air input / output ports 35a and 35b shown in FIG. 2 are respectively connected to the control compressed air input / output ends on one end side of the air control device 22 via the air tubes 21a and 21c shown in FIG. .

(Configuration of the moving mechanism (second moving mechanism) on the other end side in the Y-axis direction of the support structure 5)
The second moving mechanism includes the probe holder 14b, the Z-axis air cylinder 19b, the Z-axis holder 20b, and the X-axis slider 25b. Hereinafter, those related configurations will be described.

  That is, on the other end side of the support structure 5 in the Y-axis direction, the probe 12b for probing the C-plane signal pad 10b and the contact probe 13b for probing the C-plane GND pad 11b are respectively L-shaped probe holders 14b. The horizontal portion is vertically fixed and held vertically. The upper end portion of the probe 12b is connected to the other signal input end of the waveform measuring device 18 through the signal cable 17b.

  The probe 12b is fixed and held so that the probe GND 15b is positioned on the horizontal portion of the L-shaped probe holder 14b. In this embodiment, since the L-shaped probe holder 14b is formed of a non-conductive member, the probe GND 15b is connected to the contact probe 13b by the probe GND line 16b to ensure electrical continuity. . In the case where the L-shaped probe holder 14b is formed of a conductive member, the probe GND wire 16b can be used only when the L-shaped probe holder 14b can secure the same electrical continuity as the probe GND wire 16b. Connection can be omitted.

  Similar to the Z-axis air cylinder 19a, the Z-axis air cylinder 19b has the configuration shown in FIG. The vertical portion of the L-shaped probe holder 14b is fixedly supported by the up and down movable portion 19b2 of the Z-axis air cylinder 19b, and the body portion 19b1 of the Z-axis air cylinder 19b is fixedly supported by the columnar Z-axis holder 20b. . The Z-axis holder 20b is fixedly supported in an upright state on the upper surface of the X-axis slider movable portion 25b2 of the X-axis slider 25b. The X-axis slider movable portion 25b2 of the X-axis slider 25b is supported by the X-axis slider body portion 25b1 so as to be movable in the X-axis direction on the arrangement surface. The X-axis slider body 25b1 is positioned and fixed to the measurement base 4.

  The vertically movable part 19b2 of the Z-axis air cylinder 19b has an impact absorbing function and a small magnet 32b for position detection. The body portion 19b1 of the Z-axis air cylinder 19b has an upper end stopper with an adjuster that can finely adjust the uppermost end stop position of the vertically movable portion 19b2 and a position detection electronic device 33b on the upper end side, and a position detection on the lower end side. 33d for electronic devices and the lower end stopper with an adjuster which can finely adjust the lowest end stop position of the up-and-down movable part 19b2. The uppermost end stop position and the lowermost end stop position of the vertically movable portion 19b2 are set at the time of setup before measurement. Further, the position detection electronic devices 33b and 33d can be arbitrarily adjusted in mounting position. At the time of setup before measurement, the position detecting electronic device 33b is set to a position facing the position detecting small magnet 32b with the vertically movable portion 19b2 in contact with the upper end stopper, and the position detecting electronic device 33d is The vertically movable portion 19b2 is set at a position facing the small magnet 32b for position detection with the lower end stopper in contact with the lower end of the stopper.

  The position detection electronic devices 33b and 33d are connected to a position detection monitor end on the other end side of the air control device 22 via position detection lead wires 34b and 34d, respectively. The compressed air input / output port provided in the body portion 19b1 is connected to the control compressed air input / output end on the other end side of the air control device 22 via the air tubes 21b and 21d. The Z-axis holder 20b is fixedly supported in an upright state on the upper surface of the X-axis slider movable portion 25b2 of the X-axis slider 25b. The X-axis slider movable portion 25b2 of the X-axis slider 25b is supported by the X-axis slider body portion 25b1 so as to be movable in the X-axis direction on the arrangement surface. The X-axis slider body 25b1 is positioned and fixed to the measurement base 4.

(Configuration of moving mechanism control device)
The moving mechanism control device includes an air control device 22, an air pressure adjustment device 23, an air compression device 24, and a drive shaft control device 27. The compressed air input end of the air control device 22 is connected to the compressed air ejection end of the air pressure adjusting device 23 through the air tube 21e. The compressed air input end of the air pressure adjusting device 23 is connected to the compressed air ejection end of the air compressing device 24 through the air tube 21f. One control output end of the drive shaft control device 27 is connected to the X-axis slider body portion 25a1 via the control cable 26a, and the other control output end is connected to the X-axis slider body portion 25b1 via the control cable 26b. Has been.

  The waveform measuring device 18, the air control device 22, and the drive shaft control device 27 operate according to control instructions from the computer 28, respectively. Further, the air pressure adjusting device 23 has a function of adjusting the pressure of the compressed air supplied from the air compressing device 24 through the air tube 21f, and the compressed air having the uniform pressure after adjusting the compressed air pressure is supplied to the air tube. It supplies to the air control apparatus 22 via 21e.

  The storage device 29 included in the computer 28 stores a measurement circuit board CAD drawing 30 and test target measurement pad information 31. The measurement circuit board CAD drawing 30 is for extracting the pad position coordinates on the C-plane of the measurement circuit board 8. The test target measurement pad information 31 is for extracting test target pad information on the C plane corresponding to each test item of the measurement circuit board 8.

(Operation of the probing apparatus 100)
The vertically movable portions 19a2 and 19b2 of the Z-axis air cylinders 19a and 19b are retracted to a stop position by an upper end stopper provided on the upper end side of the body portions 19a1 and 19b1 in the initial state or at the end of measurement.

  First, in the support structure 5 on which the measurement circuit board 8 is placed and fixed, the upper end of the both-end contact probe 3 that is vertically held inside is set in contact with the S-surface pad 9 of the measurement circuit board 8. The operation lever 6 is operated to lift the support structure 5, the object to be measured 1 is inserted from the gap formed below the lower end, set in the positioning placement region of the measurement base 4, and the operation lever 6 is operated. The support structure 5 is pushed down and fixedly arranged on the arrangement surface of the measurement base 4. Then, the lower end of the both-end contact probe 3 is brought into contact with the measurement object measurement point 2 of the measurement object 1. In this state, the computer 28 is caused to start an electrical characteristic test of the DUT 1. Here, in order to facilitate understanding, it is assumed that the moving mechanisms provided on both sides in the Y-axis direction are driven simultaneously at the same time.

  The computer 28 reads the measurement circuit board CAD drawing 30 and the test target measurement pad information 31 stored in the storage device 29, and performs C corresponding to each test item of the measurement circuit board 8 extracted from the test target measurement pad information 31. In accordance with the test target pad information on the surface, the pad position coordinates on the C surface of the measurement circuit board 8 are extracted from the measurement circuit board CAD drawing 30, and based on this, first, the drive axis control device 27 is instructed to control the moving mechanism.

  That is, the computer 28 outputs a control instruction to the drive axis controller 27 so that the probes 12a and 12b can move on the test object measurement pad. The drive axis control device 27 drives the X-axis sliders 25a and 25b in accordance with instructions from the computer 28. When the Z-axis holders 20a and 20b move in the X-axis direction and the probes 12a and 12b arrive on the test object measurement pad, The driving of the X-axis sliders 25a and 25b is stopped, and the computer 28 is notified of the completion.

  Next, the computer 28 instructs the air control device 22 to control the moving mechanism. The air control device 22 pressure-feeds compressed air taken from the air pressure adjusting device 23 to the body portions 19a1 and 19b1 of the Z-axis air cylinders 19a and 19b via the air tubes 21a and 21b in accordance with instructions from the computer 28. Compressed air sent from the body portions 19a1 and 19b1 of the Z-axis air cylinders 19a and 19b via 21c and 21d is released. As a result, the vertically movable portions 19a2 and 19b2 of the Z-axis air cylinders 19a and 19b descend vertically. That is, the probes 12a and 12b and the contact probes 13a and 13b descend toward the C-plane signal pads 10a and 10b and the C-plane GND pads 11a and 11b of the measurement circuit board 8.

  First, the contact probes 13a and 13b come into contact with the C-plane GND pads 11a and 11b of the measurement circuit board 8, and then the probes 12a and 12b contact the C-plane signal pads 10a and 10b of the measurement circuit board 8. When contacted, the vertically movable portions 19a2 and 19b2 of the Z-axis air cylinders 19a and 19b continue to descend while absorbing the impact, and the lower ends of the stoppers come into contact with the lower end stoppers of the body portions 19a1 and 19b1 to stop. As a result, the position detecting small magnets 32a and 32b are located at positions where the position detecting electronic devices 33c and 33d can be captured, so that the position detecting electronic devices 33c and 33d are lowered by the Z-axis air cylinders 19a and 19b. Completion is detected, and the air controller 22 detects completion of lowering via the position detection leads 34c and 34d.

  When the air control device 22 receives the notification of the completion of the descent, the air control device 22 notifies the computer 28. Then, the computer 28 issues a control instruction to stop the compressed air from being pumped and released to the air control device 22. The air control device 22 stops the flow of the compressed air according to the instruction, and causes the Z-axis air cylinders 19a and 19b to hold the descent stop position.

  When the computer 28 receives the completion notification from the air control device 22, it outputs a waveform measurement instruction to the waveform measurement device 18. In this state, a power supply and an electric signal are supplied to the device under test 1 from the outside. The electrical signal that appears at the measurement object measuring point 2 that is the test target measurement pad is transmitted to the S-plane pad 9 of the measurement circuit board 8 via the both-end contact probe 3. In the circuit board 8 for measurement, the electrical signals transmitted to the S-plane pad 9 are transmitted to the C-plane signal pads 10a and 10b shown in FIG. The probes 12a and 12b that are in contact with the pads 10a and 10b capture electric signals and send them to the waveform measuring device 18 via the signal cables 17a and 17b. As a result, the waveform measuring device 18 performs waveform measurement and display based on the signal at the measurement object measurement point 2 of the measurement object 1 input from the probes 12 a and 12 b, and provides measurement data to the computer 28. By repeating the above operation, all the target measurement points can be measured continuously.

  On the other hand, the return of the Z-axis air cylinders 19a and 19b after waveform measurement is started when the computer 28 instructs the air control device 22 to control the moving mechanism. That is, the air control device 22 takes compressed air from the air compression adjusting device 23 in accordance with an instruction from the computer 28, and pumps the compressed air to the Z-axis air cylinders 19a and 19b via the air tubes 21c and 21d. The compressed air sent from 19a, 19b via the air tubes 21a, 21b is released. As a result, the vertically movable portions 19a2 and 19b2 of the Z-axis air cylinders 19a and 19b rise vertically, and first, the probes 12a and 12b are detached from the C-plane signal pads 10a and 10b of the measurement circuit board 8. Second, the contact probes 13a and 13b are detached from the C-plane GND pads 11a and 11b of the measurement circuit board 8.

  When the vertically movable portions 19a2 and 19b2 of the Z-axis air cylinders 19a and 19b reach the upper end stopper, the position detecting small magnets 32a and 32b are located at positions where the position detecting electronic devices 33a and 33b can be captured. The position detection electronic devices 33a and 33b detect the completion of the upward movement of the vertically movable portions 19a2 and 19b2 of the Z-axis air cylinders 19a and 19b and complete the lift to the air control device 22 via the position detection lead wires 34a and 34b. To be notified. When the air control device 22 receives the notification of the completion of the rise, the air control device 22 notifies the computer 28. Then, the computer 28 issues a control instruction to stop the compressed air from being pumped and released to the air control device 22. In accordance with the instruction, the air control device 22 stops the flow of the compressed air and causes the Z-axis air cylinders 19a and 19b to hold the predetermined height position where the ascent is stopped.

(Configuration of measurement circuit board 8)
FIG. 3 is a plan view for explaining the arrangement contents of pads and the like on the S surface (back surface) of the measurement circuit board shown in FIG. FIG. 4 is a plan view for explaining the arrangement contents of pads and the like on the C surface (front surface) of the circuit board for measurement shown in FIG. FIG. 5 is a plan view for explaining a positional shift in the X-axis direction of pads arranged on the C surface (front surface) of the measurement circuit board shown in FIG.

  As shown in FIGS. 3 and 4, vias or through holes 42 a and 42 b in the X-axis direction along the substrate center line 41 that bisects the width in the Y-axis direction as a signal path between the S surface and the C surface. , 42c are provided at predetermined intervals. The vias or through holes 42a, 42b, 42c are connected to the signal wiring 46 on the C surface.

  On the S surface of the measurement circuit board 8 shown in FIG. 3, five S surface pads 9a to 9e are shown. Among them, the S surface pads 9a, 9b, and 9c are signal pads, and the S surface pads 9d and 9e are GND pads. Both of these have an area that can contact the upper end of the probe contact 3 at both ends.

  Of the three signal pads, the S-surface pads 9b and 9c are provided at positions away from the vias or the through holes 42b and 42c, and are thus connected by the signal wiring 46. Since the S surface pad 9a is disposed on the via or the through hole 42a, no signal wiring is required. Thus, in principle, the signal pads provided on the S surface are connected to the corresponding vias or through holes by the signal wiring.

  Further, the C plane of the measurement circuit board 8 is configured symmetrically about the board center line 41 except for vias or through holes 42a, 42b, and 42c. On the left side from the substrate center line 41, on the left end side (one end side in the Y-axis direction), a signal pad center line 44a is defined on the inner side, and a GND pad center line 45a is defined on the outer side. Similarly, on the right side from the substrate center line 41, on the right end side (the other end side in the Y-axis direction), a signal pad center line 44b is defined on the inner side, and a GND pad center line 45b is defined on the outer side.

  On the left side of the substrate center line 41, C-plane signal pads 10a, 10c, and 10e are provided at predetermined intervals in the X-axis direction along the signal pad center line 44a. In addition, C-plane GND pads 11a, 11c, and 11e are provided at predetermined intervals in the X-axis direction along the GND pad center line 45a. An open point 43a is provided between the C-plane signal pads 10a, 10c, 10e and the vias or through-holes 42a, 42b, 42c to enable open or short circuit processing. Further, if necessary, a pseudo load 48a is provided between, for example, the C-plane signal pad 10a and the open point 43a.

  Connection between the C-side signal pad 10a and the pseudo load 48a, connection between the pseudo load 48a and the open point 43a, connection between the C-side signal pads 10c and 10e and the open point 43a, and the open point 43a and the via or through hole 42a, Connection to 42b and 42c is performed using a signal wiring 46, respectively.

  Further, on the right side of the substrate center line 41, C-plane signal pads 10b, 10d, and 10f are provided at predetermined intervals in the X-axis direction along the signal pad center line 44b. In addition, C-plane GND pads 11b, 11d, and 11f are provided at predetermined intervals in the X-axis direction along the GND pad center line 45b. An open point 43b is provided between the C-plane signal pads 10b, 10d, and 10f and the vias or through holes 42a, 42b, and 42c. Further, if necessary, a pseudo load 48b is provided between, for example, the C-plane signal pad 10b and the open point 43b.

  Connection between the C-plane signal pad 10b and the pseudo load 48b, connection between the pseudo load 48b and the open point 43b, connection between the C-plane signal pads 10d and 10f and the open point 43b, and the open point 43b and the via or through hole 42a, Connection to 42b and 42c is performed using a signal wiring 46, respectively.

  Next, regarding the GND pads provided on the S plane, for example, the S plane pad 9d is provided with vias or through holes 42d in the S plane pad 9d, and through the inner layer of the measurement circuit board 8, the C plane GND pads 11a to 11d. 11f is connected to a predetermined location. The S-surface pad 9e is connected to the via or the through hole 42e by the GND wiring 47. The via or through hole 42 e is connected to the C-plane GND pads 11 a to 11 f through the inner layer of the measurement circuit board 8.

  By the way, the positional relationship in the X-axis direction between the C-plane signal pad 10 (af) and the C-plane GND pad 11 (af) may not be on the same line and may be displaced. Therefore, as shown in FIG. 5, the X1 coordinate of the center base point 49 of the C-plane signal pad 10 disposed on the signal pad center line 44 and the center base point of the C-plane GND pad 11 disposed on the GND center line 45. The X-coordinate change amount between 50 X2 coordinates is associated with the pad between the C-plane signal pad 10 and the C-plane GND pad 11 so that the C-plane signal pad 10 and the C-plane GND pad 11 are arranged. It is.

(Operation and effect by configuring the measurement circuit board 8 as described above)
(1) Contact with the double-sided contact probe 3 is made by S-surface pads 9a to 9e having probable areas, and the double-sided contact probe 3 does not penetrate the measurement circuit board 8, so , A pad region, a signal wiring region, and the like can be sufficiently secured.

  (2) Since the double-sided contact probe 3 is used, the cable wiring required when using the single-sided contact probe becomes unnecessary, and the length of the line for transmitting an electric signal is shortened. In addition, since the impedance-designed signal wiring is possible on the C surface of the measurement circuit board 8, waveform deterioration can be prevented.

  (3) The C-plane of the circuit board 8 for measurement is configured symmetrically with respect to the substrate center line 41 except for vias or through holes 42 (ac), and vias or through holes on the substrate center line 41 are configured. Since the open points 43a and 43b are provided through the signal wiring 46 from 42 (a to c), the C-side signal pad 10 (a to f) can be opened, and the pseudo loads 48a and 48b provided as necessary. Opening is obtained.

  Specifically, how to use the open points 43a and 43b will be described. For example, in waveform measurement of test items, measurement points are identified for all required test items and the measurement points are examined. As a result, when the C-plane signal pad 10c is used for probing as a waveform measurement, but the C-plane signal pad 10d is not used for probing, the open point 43a connected to the C-plane signal pad 10c and the signal wiring 46 is short-circuited in advance. The C-plane signal pad 10c is directly connected to the via or through hole 42b. On the other hand, the open point 43b connected to the C-side signal pad 10d by the signal wiring 46 is left open as it is. Then, the waveform measured at the C-plane signal pad 10c can suppress the waveform deterioration as compared with the case where the open point 43b connected to the C-plane signal pad 10d and the signal wiring 46 is short-circuited.

  (4) The C-plane signal pad 10 (af) having a probable area is arranged on the signal pad center lines 44a and 44b at the pad center, and can be probed on the GND center lines 45a and 45b. Since the C-plane GND pad 11 (af) having an area is arranged at the center of the pad, measurement on the same axis becomes possible.

  (5) The X-coordinate change amount, which is a shift in the X-axis direction between the C-plane signal pad and the C-plane GND pad, is associated between the pads of the C-plane signal pad 10 and the C-plane GND pad 11 to Since the pad 10 and the C-plane GND pad 11 are arranged, the probe holders 14a and 14b can easily perform the probing operation while holding the probes 12a and 12b and the contact probes 13a and 13b vertically only by the Z axis. be able to.

  (6) Even when there are adjacent measurement points such as the S-plane pads 9a and 9b, the signal pad center line 44 (through the vias or through holes 42 (ac) along the substrate center line 41 is finally obtained. In a form along a, b), the S surface pad 9a is connected to the C surface signal pad 10 (a, b), and the S surface pad 9b is connected to the C surface signal pad 10 (c, d). Therefore, measurement points that are not adjacent to each other can be obtained. In other words, it is possible to perform probing without contact even at a measurement point with a narrow pitch.

(Generation of a measurement circuit board CAD drawing 30 to be stored in the storage device 29)
FIG. 6 is a flowchart for explaining the generation procedure of the measurement circuit board CAD drawing 30 shown in FIG. In FIG. 6, the measurement circuit board design 67 of the measurement circuit board 8 includes a measurement object circuit board drawing 62 after the measurement object circuit board design 61 of the measurement object 1, and both end contact probes of the both end contact probes 3. The length data 63, both-end contact probe stroke length data 64 of the both-end contact probe 3, the line length condition data 65 for each measurement point, and the wiring interval condition for each measurement point as constraints in the electrical characteristic test of the DUT 1 Data 66 is input and designed.

  The measurement circuit board design 67 inputs the measurement object circuit board drawing 62 to the CAD so that the position information of the measurement object measurement point 2 of the measurement object 1 is obtained from the S surface pad 9 of the measurement circuit board 8. It can be copied and designed as position information.

  The measurement circuit board design 67 is designed with CAD for both-end contact probe length data 63, both-end contact probe stroke length data 64, line length condition data 65 for each measurement point, and wiring interval condition data 66 for each measurement point. By inputting as information, it is possible to design the measurement circuit board 8 that suppresses waveform quality deterioration in waveform measurement with the probing apparatus 100. At this time, confirmation and fine adjustment can be performed by linking with simulation and transmission line analysis.

  After the measurement circuit board design 67, the measurement circuit board CAD drawing 30 is output and input to the storage device 29 included in the computer 28. Accordingly, the measurement circuit board CAD drawing 30 can be used for probing control as position information of the C-plane pad 10 of the measurement circuit board 8 installed in the probing apparatus 100.

  As described above, according to this embodiment, in the electrical property test of a measurement object having a plurality of measurement object measurement points, two axes of the X axis and the Z axis can be used even at adjacent narrow pitch measurement points. Automatic probing is possible by movement. Further, since the measurement circuit board can be designed to suppress the waveform quality deterioration in the waveform measurement using the both-end contact probe, the waveform measurement with high accuracy becomes possible.

  In addition, since a visual sensor and an image data processing device, a pressure sensor and a pressure data processing device as in the prior art are not required, an inexpensive device can be realized, and correction processing for obtaining optimal probing is required. Therefore, probing can be performed with simple control.

  This probing device is arranged in the Z-axis direction in a state where the lower end is in contact with each of a large number of measurement object measurement points on the measurement object circuit board positioned and placed on the arrangement surface which is the XY plane of the measurement base. A plurality of contact probes that are fixedly supported perpendicularly to each other and a back surface pad on the back surface in a one-to-one relationship with the measurement points of the object to be measured. A predetermined number of signal pads and first surface GND pads are arranged along the X-axis direction, and a second surface signal pad and second surface GND pad are arranged along the X-axis direction on the other end side in the Y-axis direction of the surface. A predetermined number of measurement circuit boards, wherein the plurality of back pads are arranged such that the plurality of back surface pads are in contact with the upper ends of the plurality of both-end contact probes; One in the Y-axis direction On the end side, a first probe for probing the first surface signal pad and the first surface GND pad and a first contact probe are configured to be movable in two axial directions of the X axis and the Z axis. And a second probe and a second contact probe for probing the second surface signal pad and the second surface GND pad on the other end side in the Y-axis direction on the arrangement surface of the measurement base The second moving mechanism having a configuration that enables the X-axis and the Z-axis to move in two axial directions, and the first moving mechanism and the second moving mechanism are separately controlled independently, A moving mechanism control device for moving the shaft and the Z-axis in the two-axis direction, and a waveform measuring device for measuring at least the waveform of the electrical signals respectively acquired by the first probe and the second probe , Outputs a control instruction to the moving mechanism control device based on the pad position coordinates on the surface of the measurement circuit board obtained from the measurement circuit board CAD drawing stored in the storage device, and also measures the waveform to the waveform measurement device And a computer that outputs instructions.

  As described above, the probing device according to the present invention has an inexpensive configuration and simple control, even in a narrow pitch between measurement points, in an electrical characteristic test of an electronic component that requires multipoint waveform measurement. It is useful for automating probing without problems.

100 Probing device 1 Device under test (circuit board for device under test)
2 Measurement object measurement point 3 Both end contact probe 4 Measurement base 5 Support structure 6 Operation lever 7 Both end contact probe holder 8 Circuit board for measurement 9, 9a to 9d S surface pad 10, 10a to 10f C surface signal pad 11, 11a to 11f C-plane GND pad 12a, 12b Probe 13a, 13b Contact probe 14a, 14b Probe holder 15a, 15b Probe GND
16a, 16b Probe GND wire 17a, 17b Signal cable 18 Waveform measuring device 19a, 19b Z-axis air cylinder 19a1, 19b1 Body portion 19a2, 19b2 Vertical movable portion 20a, 20b Z-axis holder 21a-21f Air tube 22 Air control device 23 Air Pressure adjustment device 24 Air compression device 25a, 25b X-axis slider 25a1, 25b1 X-axis slider body portion 25a2, 25b2 X-axis slider movable portion 26a, 26b Control cable 27 Drive shaft control device 28 Computer 29 Storage device 30 Measurement circuit board CAD Drawing 31 Test object measurement pad information 32a, 32b Position detection small magnet 33a-33d Position detection electronic device 34a-34d Position detection lead wire 35a, 35b Compressed air input / output port 36a With adjuster Upper end stopper 36b Lower end stopper with adjuster 39 Stopper 40 Rod 41 Substrate center line 42a to 42e Via or through hole 43a, 43b Opening point 44, 44a, 44b Signal pad center line 45, 45a, 45b GND pad center line 46 Signal wiring 47 GND wiring 48a, 48b Pseudo load 49 C plane signal pad center base point 50 C plane GND pad center base point

Claims (2)

Fixed and supported perpendicularly to the Z-axis direction with the lower end in contact with each of a number of measurement object measurement points on the measurement circuit board positioned and placed on the XY plane of the measurement base A number of double-ended contact probes,
A back surface pad is disposed on the back surface in a one-to-one relationship with the plurality of measured object measurement points, and a first surface signal pad and a first surface GND pad are disposed in the X axis direction on one end side in the Y axis direction of the surface. And a predetermined number of second surface signal pads and second surface GND pads are arranged along the X-axis direction on the other end side in the Y-axis direction of the surface. A circuit board for measurement arranged so that a large number of back pads are in contact with the upper ends of the large number of both-end contact probes;
The first probe and the first contact probe for probing the first surface signal pad and the first surface GND pad on the one end side in the Y-axis direction on the arrangement surface of the measurement base are the X axis and the Z axis. A first moving mechanism having a configuration that enables movement in the two-axis directions of
The second probe and the second contact probe for probing the second surface signal pad and the second surface GND pad on the other end side in the Y-axis direction on the arrangement surface of the measurement base are the X axis and the Z axis. A second moving mechanism having a configuration that enables movement in the two-axis directions;
A waveform measuring device for measuring at least a waveform of an electrical signal acquired by each of the first probe and the second probe;
The first and second moving mechanisms are controlled based on the pad position coordinates on the surface of the circuit board for measurement acquired from the storage device, and the first probe and the first contact probe are moved out of the X axis and the Z axis. A control unit that moves at least in the Z-axis direction and moves the second probe and the second contact probe in at least the Z-axis direction of the X-axis and the Z-axis, and outputs a waveform measurement instruction to the waveform measuring apparatus. When,
A probing device comprising:   The probing device according to claim 1, wherein the control unit includes an air pressure adjusting device and an air compression device.

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