JPH0845992A - Resilient pressure contact terminal connection method - Google Patents
Resilient pressure contact terminal connection methodInfo
- Publication number
- JPH0845992A JPH0845992A JP18113994A JP18113994A JPH0845992A JP H0845992 A JPH0845992 A JP H0845992A JP 18113994 A JP18113994 A JP 18113994A JP 18113994 A JP18113994 A JP 18113994A JP H0845992 A JPH0845992 A JP H0845992A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- terminal
- elastic
- circuit board
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、弾性端子部材の曲げ弾
性を利用して弾性端子部材の一端を導体面に分離可能に
接触する弾性加圧接触式端子接続方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an elastic pressure contact type terminal connection method in which one end of an elastic terminal member is detachably contacted with a conductor surface by utilizing the bending elasticity of the elastic terminal member.
【０００２】[0002]
【従来技術】従来、回路基板上の接触導体部にリード又
はワイヤ又はターミナルとも呼ばれる線状の端子を接続
するには、ワイヤボンディングやろう付けや溶接などの
固着方法とともに、弾性端子部材の曲げ弾性により所定
の接触圧を維持しつつ分離可能に両者の接触を行う弾性
加圧接触方法が知られている。2. Description of the Related Art Conventionally, in order to connect a linear terminal also called a lead, a wire or a terminal to a contact conductor portion on a circuit board, a fixing method such as wire bonding, brazing or welding, and bending elasticity of an elastic terminal member are used. There is known an elastic pressure contact method in which both are separably contacted while maintaining a predetermined contact pressure.
【０００３】[0003]
【発明が解決しようとする課題】上記弾性加圧接触方法
は、上記固着方法に比べて熱ストレスに強く耐久性に富
む点、分離が可能である点などの利点を有するが、その
一方、接触部分の抵抗すなわち接触抵抗が上記固着方法
に比べて大きいという問題があった。本発明は上記問題
点に鑑みなされたものであり、接触抵抗の低減が可能な
弾性加圧接触方法を提供することを、その目的としてい
る。The elastic pressure contact method has the advantages over the fixing method in that it is more resistant to heat stress, has greater durability, and is separable. There is a problem that the resistance of the part, that is, the contact resistance is higher than that of the fixing method. The present invention has been made in view of the above problems, and an object thereof is to provide an elastic pressure contact method capable of reducing contact resistance.
【０００４】[0004]
【課題を解決するための手段】本発明は、支持部材に支
持される弾性端子部材の接触面を前記弾性端子部材の曲
げ弾性により回路基板上の接触導体部の接触面に押接し
て前記両接触面を電気的に接続する弾性加圧接触式端子
接続方法において、用意した治具の先端を前記弾性端子
部材を介して前記接触導体部の接触面に押し付けるとと
もに前記両接触面が摩擦接合されない範囲内で前記治
具、前記支持部材及び前記回路基板の一部を残部に対し
て相対変位させることを特徴としている。According to the present invention, the contact surface of an elastic terminal member supported by a support member is pressed against the contact surface of a contact conductor portion on a circuit board by the bending elasticity of the elastic terminal member. In the elastic pressure contact type terminal connection method for electrically connecting the contact surfaces, the tip of the prepared jig is pressed against the contact surface of the contact conductor portion through the elastic terminal member, and the both contact surfaces are not frictionally joined. It is characterized in that the jig, the supporting member, and a part of the circuit board are displaced relative to the rest within the range.
【０００５】本発明の好適な態様において、互いに結合
された前記支持部材及び前記回路基板に対して前記治具
を相対振動又は相対回転させるか、又は、前記治具の先
端により前記弾性端子部材に打撃が与えられる。In a preferred aspect of the present invention, the jig is relatively vibrated or relatively rotated with respect to the support member and the circuit board coupled to each other, or the elastic terminal member is attached to the elastic terminal member by a tip of the jig. A blow is given.
【０００６】[0006]
【発明の効果】本発明によれば、治具の先端を弾性端子
部材を介して前記接触導体部の接触面に押し付けるとと
もに治具、支持部材及び回路基板の一部をその残部に対
して相対変位させる。例えば、治具及び回路基板の接触
導体部材により弾性端子部材を挟圧した状態を保ちつ
つ、支持部材及び回路基板に対して治具を相対振動又は
相対回転させる。又は、治具の先端が回路基板の接触導
体部上の弾性端子部材を打撃する。その他、上記挟圧状
態で回路基板を例えば超音波振動子で微小振動させても
よく、あるいは、治具及び回路基板に対して支持部材を
微小振動させてもよい。According to the present invention, the tip of the jig is pressed against the contact surface of the contact conductor portion through the elastic terminal member, and the jig, the supporting member and a part of the circuit board are placed relative to the rest. Displace. For example, the jig is relatively vibrated or relatively rotated with respect to the support member and the circuit board while the elastic terminal member is kept pressed by the jig and the contact conductor member of the circuit board. Alternatively, the tip of the jig hits the elastic terminal member on the contact conductor portion of the circuit board. In addition, the circuit board may be microvibrated by, for example, an ultrasonic vibrator in the pinched state, or the support member may be microvibrated with respect to the jig and the circuit board.
【０００７】要するに、上記治具、支持部材及び回路基
板の一部をその残部に対して相対変位させることによ
り、接触導体部の接触面に対し弾性端子部材の接触面を
押接状態で力を加える。力は、接触面に平行でもよく
（相対回転又は相対振動の場合）、接触面に略直角でも
よく（打撃の場合）でもよい。このようにすれば、両接
触面の密着度が向上するので、接触抵抗が減少する。In short, by displacing the jig, the supporting member and a part of the circuit board relative to the rest, a force is applied to the contact surface of the contact conductor portion while the contact surface of the elastic terminal member is being pressed. Add. The force may be parallel to the contact surface (in the case of relative rotation or relative vibration), or may be substantially perpendicular to the contact surface (in the case of striking). By doing so, the degree of contact between both contact surfaces is improved, and the contact resistance is reduced.
【０００８】すなわち、接触導体部に対して弾性端子部
材に相対的な振動又は回転を与えたり又は打撃を与える
ことにより、両接触面の微小な凹凸が減磨したり、又
は、一方の接触面の凹凸に合わせて他方の凹凸面が塑性
変形したりして、実質的な接触面積が増大する。更に、
両接触面を被覆する酸化膜が破壊されて弾性端子部材及
び接触導体部の金属面同士が相対的に微小振動しつつ密
着するので接触抵抗が低減される。That is, when the elastic terminal member is subjected to relative vibration or rotation or impact with respect to the contact conductor portion, fine irregularities on both contact surfaces are reduced or one contact surface is contacted. The other concavo-convex surface is plastically deformed in accordance with the concavo-convex pattern, and the substantial contact area increases. Furthermore,
The oxide film covering both contact surfaces is destroyed, and the metal surfaces of the elastic terminal member and the contact conductor portion are brought into close contact with each other while slightly vibrating, so that the contact resistance is reduced.
【０００９】なお、超音波ボンダを採用し、その超音波
出力を制御すれば、回路基板上の回路素子などの超音波
ボンディング工程とこの弾性加圧接触式の端子接続工程
とを同一設備で行うことができ、作業が簡単である。
る。If an ultrasonic bonder is used and its ultrasonic output is controlled, the ultrasonic bonding process for the circuit elements on the circuit board and this elastic pressure contact type terminal connecting process can be performed in the same equipment. It is possible and easy to work with.
It
【００１０】[0010]
【実施例】本発明の弾性加圧接触式端子接続方法を図１
及びその要部拡大断面図である図２を参照して説明す
る。樹脂ケース（本発明でいう支持部材）２は図中、上
下に開口する枠体形状を有し、その下端開口に底板３が
嵌合、固定されている。底板３の図中、上面には回路基
板４が接着されており、回路基板４の上面には各種回路
素子が配設されるとともに配線パタンも印刷されてい
る。更に、回路基板４の上面には、所定パタン形状の導
体層からなる接触導体部５が印刷されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The elastic pressure contact type terminal connection method of the present invention is shown in FIG.
Also, description will be given with reference to FIG. 2, which is an enlarged cross-sectional view of a main part thereof. The resin case (support member in the present invention) 2 has a frame shape that opens vertically in the figure, and the bottom plate 3 is fitted and fixed to the lower end opening. A circuit board 4 is adhered to the upper surface of the bottom plate 3 in the drawing, and various circuit elements are arranged on the upper surface of the circuit board 4 and wiring patterns are also printed. Further, on the upper surface of the circuit board 4, a contact conductor portion 5 made of a conductor layer having a predetermined pattern shape is printed.
【００１１】樹脂ケース２の図中、右端部は雌コネクタ
をなす凹部２１が形成されており、凹部２１には、高弾
性導電材（例えばりん青銅）からなる端子１の一端が図
中、横方向に突出している。この端子１の中央部は樹脂
ケース２にインサート成形により固定されて横方向に延
設されており、端子１の他端部は接触導体部５の表面
（接触面）に自己の曲げ弾性により押圧されている。In the figure, a right end portion of the resin case 2 is formed with a concave portion 21 forming a female connector. In the concave portion 21, one end of the terminal 1 made of a highly elastic conductive material (for example, phosphor bronze) is laterally shown in the figure. Protruding in the direction. The center portion of the terminal 1 is fixed to the resin case 2 by insert molding and extends in the lateral direction, and the other end portion of the terminal 1 is pressed against the surface (contact surface) of the contact conductor portion 5 by its own bending elasticity. Has been done.
【００１２】これにより、端子１は接触導体部５に分離
可能に押圧される。次に本実施例の特徴をなす端子接続
方法を説明する。樹脂ケース２に底板３を固定すれば、
予め位置合わせされている端子１及び接触導体部５は所
定の曲げ弾性力で互いに接触する。次に、この状態で、
超音波ボンダ６の先端を垂下して端子１の表面に所定の
圧力で当接させ、この状態で超音波ボンダ６の上部の超
音波振動素子（図示せず）を作動させて超音波ボンダ６
の先端を横方向に振動させる。なお、端子１と接触導体
部５とは後で分離可能なように超音波溶接されないもの
とする。As a result, the terminal 1 is separably pressed against the contact conductor portion 5. Next, a method of connecting terminals, which is a feature of this embodiment, will be described. If the bottom plate 3 is fixed to the resin case 2,
The terminal 1 and the contact conductor portion 5 which are aligned in advance contact each other with a predetermined bending elastic force. Then, in this state,
The tip of the ultrasonic bonder 6 is hung down and brought into contact with the surface of the terminal 1 with a predetermined pressure. In this state, an ultrasonic vibrating element (not shown) above the ultrasonic bonder 6 is operated to activate the ultrasonic bonder 6.
The tip of is vibrated laterally. The terminal 1 and the contact conductor portion 5 are not ultrasonically welded so that they can be separated later.
【００１３】これにより、端子１は接触導体部５に対し
て押し付けられつつ接触面と平行に振動されるので、両
接触面の一方の微小な凹凸に合わせて他方の接触面が変
形し、又は、上記微小な凹凸が潰れ、両接触面の有効な
接触面積が増加する。したがって、両接触面における接
触抵抗を減少することができる。更に、このようにすれ
ば、両接触面を被覆する酸化膜層を破壊し、端子（弾性
端子部材）１及び接触導体部５の金属面同士が相対的に
微小振動しつつ密着させることができるので、接触抵抗
を更に一層減少することができることになる。As a result, the terminal 1 is oscillated parallel to the contact surface while being pressed against the contact conductor portion 5, so that the other contact surface is deformed in accordance with the minute unevenness of one of the contact surfaces, or The minute irregularities are crushed and the effective contact area of both contact surfaces is increased. Therefore, the contact resistance on both contact surfaces can be reduced. Further, in this way, the oxide film layer covering both contact surfaces can be destroyed, and the metal surfaces of the terminal (elastic terminal member) 1 and the contact conductor portion 5 can be brought into close contact with each other while vibrating slightly. Therefore, the contact resistance can be further reduced.
【００１４】なお、上記実施例では、超音波ボンダ６に
より端子１に振動を与えたが、スピンドルモータ（図示
せず）により回転する回転棒の先端を端子１に押し付け
ても同様の効果を得られ、更に小型のエアシリンダ又は
電磁シリンダのピストンロッドの先端を所定の押圧力で
端子１に押し付けても同様の効果を得られる。更に、本
実施例では、弾性端子部材をなす端子１の弾性押圧力が
小さくても充分に小さい接触抵抗を得ることができ、端
子の小型化、多極化を容易に実現することができる。Although the ultrasonic bonder 6 vibrates the terminal 1 in the above embodiment, the same effect can be obtained by pressing the tip of the rotating rod rotated by the spindle motor (not shown) against the terminal 1. The same effect can be obtained by pressing the tip of the piston rod of a smaller air cylinder or electromagnetic cylinder against the terminal 1 with a predetermined pressing force. Furthermore, in the present embodiment, even if the elastic pressing force of the terminal 1 forming the elastic terminal member is small, a sufficiently small contact resistance can be obtained, and downsizing of the terminal and multipolarization can be easily realized.
【００１５】なお、超音波ボンダ６を用いる代わりに、
それに相当するボンダを端子１に押し付け、樹脂ケース
２及び回路基板４を振動させてもよい。また、超音波ボ
ンダ６を用いる代わりに、それに相当するポンチ状のハ
ンマで接触導体部５上の端子１の部位を打撃しても同様
の効果が得られる。また、超音波ボンダ６を用いる代わ
りに、それに相当するポンチ状の治具と接触導体部５で
端子１を挟圧した状態で、回路基板４及び端子１の一方
を他方に対して相対振動させても同様の効果を奏するこ
とができる。Instead of using the ultrasonic bonder 6,
A bonder corresponding thereto may be pressed against the terminal 1 to vibrate the resin case 2 and the circuit board 4. Further, instead of using the ultrasonic bonder 6, the same effect can be obtained by hitting the portion of the terminal 1 on the contact conductor portion 5 with a punch-shaped hammer corresponding thereto. Further, instead of using the ultrasonic bonder 6, one of the circuit board 4 and the terminal 1 is vibrated relative to the other in a state where the terminal 1 is sandwiched between the punch-shaped jig and the contact conductor portion 5 corresponding thereto. However, the same effect can be obtained.
【図１】本発明の弾性加圧接触式端子接続方法の一実施
例を示す要部模式断面図である。FIG. 1 is a schematic cross-sectional view of an essential part showing an embodiment of the elastic pressure contact type terminal connection method of the present invention.
【図２】図１の要部拡大断面図である。FIG. 2 is an enlarged sectional view of a main part of FIG.
１は端子（弾性端子部材）、２は樹脂ケース（本発明で
いう支持部材）、４は回路基板（回路基板）、５は接触
導体部、６は超音波ボンダ（治具）。1 is a terminal (elastic terminal member), 2 is a resin case (supporting member in the present invention), 4 is a circuit board (circuit board), 5 is a contact conductor portion, and 6 is an ultrasonic bonder (jig).
Claims (2)
面を前記弾性端子部材の曲げ弾性により回路基板上の接
触導体部の接触面に押接して前記両接触面を電気的に接
続する弾性加圧接触式端子接続方法において、 用意した治具の先端を前記弾性端子部材を介して前記接
触導体部の接触面に押し付けるとともに前記両接触面が
摩擦接合されない範囲内で前記治具、前記支持部材及び
前記回路基板の一部を残部に対して相対変位させること
を特徴とする弾性加圧接触方式端子接続方法。1. A contact surface of an elastic terminal member supported by a supporting member is pressed against a contact surface of a contact conductor portion on a circuit board by bending elasticity of the elastic terminal member to electrically connect the both contact surfaces. In the elastic pressure contact type terminal connection method, the tip of the prepared jig is pressed against the contact surface of the contact conductor portion through the elastic terminal member, and the jig is provided within a range in which the both contact surfaces are not frictionally joined. An elastic pressure contact type terminal connecting method, wherein a supporting member and a part of the circuit board are displaced relative to the rest.
路基板に対して前記治具を相対振動又は相対回転させる
か、又は、前記治具の先端により前記弾性端子部材に打
撃を与える請求項１記載の弾性加圧接触式端子接続方
法。2. The relative vibration or relative rotation of the jig with respect to the support member and the circuit board coupled to each other, or the tip of the jig strikes the elastic terminal member. The elastic pressure contact type terminal connection method described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18113994A JP3332185B2 (en) | 1994-08-02 | 1994-08-02 | Elastic pressure contact type terminal connection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18113994A JP3332185B2 (en) | 1994-08-02 | 1994-08-02 | Elastic pressure contact type terminal connection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0845992A true JPH0845992A (en) | 1996-02-16 |
| JP3332185B2 JP3332185B2 (en) | 2002-10-07 |
Family
ID=16095576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18113994A Expired - Fee Related JP3332185B2 (en) | 1994-08-02 | 1994-08-02 | Elastic pressure contact type terminal connection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3332185B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000195598A (en) * | 1998-12-25 | 2000-07-14 | Fujitsu Ten Ltd | Connection structure of connector and substrate |
-
1994
- 1994-08-02 JP JP18113994A patent/JP3332185B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000195598A (en) * | 1998-12-25 | 2000-07-14 | Fujitsu Ten Ltd | Connection structure of connector and substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3332185B2 (en) | 2002-10-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2003023031A (en) | Resonator for ultrasonic wire bonding | |
| JP2006019474A (en) | Bonding method and bonding apparatus of semiconductor chip | |
| US7150388B2 (en) | Method of bonding and bonding apparatus for a semiconductor chip | |
| JPH0845992A (en) | Resilient pressure contact terminal connection method | |
| KR101058304B1 (en) | Electromechanical motor and assembly method thereof | |
| JP3655179B2 (en) | Semiconductor chip element | |
| JP3492298B2 (en) | Ultrasonic vibration bonding tool and supporting device | |
| JP3566039B2 (en) | Bonding equipment | |
| JPH08181175A (en) | Wire bonding method | |
| JP4288363B2 (en) | Ultrasonic mounting tool and electronic component mounting apparatus | |
| JP3397136B2 (en) | Bonding tools and bonding equipment | |
| JP3288983B2 (en) | Ultrasonic vibration joining method | |
| JPH04372146A (en) | Wire bonding device | |
| JP3409688B2 (en) | Bonding tool and bonding device for electronic components | |
| JPH10323620A (en) | Ultrasonic vibration device | |
| JP3441789B2 (en) | Connector terminal joining method and connector terminal structure | |
| JP2002158252A (en) | Wire-bonding apparatus and method therefor | |
| JPH09326424A (en) | Wire bonding apparatus | |
| JPS6178128A (en) | Bonding tool for manufacture of semiconductor device | |
| JPH03250640A (en) | Ultrasonic wire bonding device | |
| JP2003258042A (en) | Method for wire bonding | |
| JPS5917849B2 (en) | How to recycle semiconductor devices | |
| JPS6387734A (en) | Ultrasonic wire bonder | |
| JP2004134563A (en) | Ultrasonic horn, method of retaining tool thereof, and bump bonding apparatus using the same | |
| JPH0799219A (en) | Method and system for manufacturing semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20110726 |
|
| LAPS | Cancellation because of no payment of annual fees |