JPH084226Y2 - 常温固相接合装置 - Google Patents
常温固相接合装置Info
- Publication number
- JPH084226Y2 JPH084226Y2 JP1990127983U JP12798390U JPH084226Y2 JP H084226 Y2 JPH084226 Y2 JP H084226Y2 JP 1990127983 U JP1990127983 U JP 1990127983U JP 12798390 U JP12798390 U JP 12798390U JP H084226 Y2 JPH084226 Y2 JP H084226Y2
- Authority
- JP
- Japan
- Prior art keywords
- materials
- room temperature
- inert gas
- pair
- sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000007787 solid Substances 0.000 title description 3
- 239000000463 material Substances 0.000 claims description 60
- 230000004913 activation Effects 0.000 claims description 38
- 239000011261 inert gas Substances 0.000 claims description 20
- 230000003213 activating effect Effects 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 13
- 239000004809 Teflon Substances 0.000 claims description 11
- 229920006362 Teflon® Polymers 0.000 claims description 11
- 239000003082 abrasive agent Substances 0.000 claims description 11
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 9
- 229910052760 oxygen Inorganic materials 0.000 claims description 9
- 239000001301 oxygen Substances 0.000 claims description 9
- 238000005304 joining Methods 0.000 description 22
- 238000000034 method Methods 0.000 description 19
- 230000007246 mechanism Effects 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000008859 change Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 238000004137 mechanical activation Methods 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000007790 solid phase Substances 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 239000012190 activator Substances 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990127983U JPH084226Y2 (ja) | 1990-11-30 | 1990-11-30 | 常温固相接合装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990127983U JPH084226Y2 (ja) | 1990-11-30 | 1990-11-30 | 常温固相接合装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0483487U JPH0483487U (enrdf_load_stackoverflow) | 1992-07-21 |
| JPH084226Y2 true JPH084226Y2 (ja) | 1996-02-07 |
Family
ID=31875463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990127983U Expired - Lifetime JPH084226Y2 (ja) | 1990-11-30 | 1990-11-30 | 常温固相接合装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH084226Y2 (enrdf_load_stackoverflow) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6396703B2 (ja) * | 2014-07-08 | 2018-09-26 | トヨタ自動車株式会社 | 半導体素子用放熱部品の製造方法 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS48632U (enrdf_load_stackoverflow) * | 1971-05-20 | 1973-01-08 | ||
| JPS593741B2 (ja) * | 1972-05-30 | 1984-01-25 | キヤノン株式会社 | 電子写真用感光材料 |
| JPS5124160A (enrdf_load_stackoverflow) * | 1974-08-21 | 1976-02-26 | Nippon Musical Instruments Mfg | |
| JPH07115216B2 (ja) * | 1987-05-20 | 1995-12-13 | 石川島播磨重工業株式会社 | 摩擦溶接方法 |
| JPH02224882A (ja) * | 1989-02-23 | 1990-09-06 | Ishikawajima Harima Heavy Ind Co Ltd | 常温固相接合法 |
-
1990
- 1990-11-30 JP JP1990127983U patent/JPH084226Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0483487U (enrdf_load_stackoverflow) | 1992-07-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |