JPH0837398A - Method of mounting electronic component, and device therefor - Google Patents

Abstract

PURPOSE:To eliminate waiting time of a mounting means for feeding, positioning and discharging a circuit board. CONSTITUTION:Circuit boards 6 being fed are positioned at each board mounting position by board positioning means 2b-1 and 2b-2, and electronic parts are mounted on the circuit boards 6 by a single mounting means. The circuit boards 6 from the previous step are fed from a board feeding means 2a to the board positioning means 2b-1 and 2b-2 in order of completion of the mounting. The circuit boards 6 on which the parts are mounted are discharged from the board positioning means 2b-1 and 2b-2 in order of completion of the mounting by a board discharging part 2c. Therefore, while electronic parts are mounted on a board 6 by one of the board positioning means, the discharging of the circuit board 6 mounted with electronic parts, the feeding and positioning of the next circuit board 6 are performed by other board positioning means.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method and apparatus for mounting electronic components on a circuit board.

[0002]

2. Description of the Related Art A conventional example of an electronic component mounting method and apparatus thereof will be described with reference to FIGS.

FIG. 5 shows a conventional example of an electronic component mounting apparatus. The mounting method is as follows.
Of the circuit board 6 supplied to the board mounting position by the carrier unit 2 by the mounting unit 1 moved by the robot unit 4 to take out the electronic component from the component supplying unit 3. The mounting process of mounting the electronic component at the predetermined coordinate position and the discharging process of discharging the circuit board 6 having been mounted by the transport unit 2 to the next process are repeated in this order.
Each process starts after confirming the end of the previous process.

Reference numeral 5 denotes an operation panel for inputting mounting NC data, instructing production start and end, and the like.

The above flow chart is shown in FIG.

In FIG. 6, steps # 51, # 52,
In the board supply step of # 53, waiting for the circuit board 6 to arrive from the previous step, waiting for the completion of mounting the circuit board 6 currently being mounted, and after the waiting time ends, The circuit board 6 from is supplied to the board mounting position.

In the mounting process of steps # 54 and # 55, the electronic board is provided with the electronic component at the board mounting position.
To implement.

In the board discharging step of steps # 56 and # 57, the circuit board 6 which has been mounted is discharged, and it is judged whether or not the production schedule is finished. If not finished, the procedure returns to step # 51 and is finished. If so, end.

[0009]

However, in the configuration of the above-mentioned conventional example, each process starts after confirming the end of the previous process, and the mounting means is actually used for mounting electronic parts. In addition to the time required, the time required to supply and position the circuit board and the time to discharge the completed circuit board to the next process are required as waiting times. However, there is a problem that it becomes the biggest factor that hinders the reduction of tact time.

SUMMARY OF THE INVENTION It is an object of the present invention to solve the above problems and provide an electronic component mounting method and apparatus for eliminating the waiting time of mounting means for supplying, positioning and discharging a circuit board. To do.

[0011]

In order to solve the above problems, the electronic component mounting method of the first invention of the present application positions a supplied circuit board at each board mounting position by a plurality of board positioning means. , The positioned circuit boards are sequentially mounted by one mounting means, and the board supply means sets the plurality of board positioning means in the order in which the board mounting is completed.
Supply the circuit board from the previous process, and by the board discharge means,
By ejecting the mounting-completed circuit boards from the plurality of board positioning means in the order in which the board mounting is completed, while the boards are mounted by any of the board positioning means, the mounting is completed by the other board positioning means. It is characterized in that the circuit board is discharged, the next circuit board is supplied, and the circuit board is positioned.

The electronic component mounting method of the first invention of the present application is
In order to solve the above problems, it is preferable that a plurality of substrate positioning means are fixedly arranged and the substrate supply means and the substrate discharge means are moved.

The electronic component mounting method of the first invention of the present application is
In order to solve the above problems, the substrate supply unit and the substrate discharge unit are offset and opposed to each other and fixedly arranged, and a plurality of substrate positioning units are provided between the substrate supply unit and the substrate discharge unit as a forward path. It is preferable that the return path is made to pass each other and the circular path is moved.

In order to solve the above-mentioned problems, an electronic component mounting apparatus according to a second aspect of the present invention includes a plurality of board positioning means for positioning the supplied circuit boards at respective board mounting positions, and a board of the board positioning means. One mounting means for sequentially mounting the circuit boards positioned at the mounting position, a board supply means for supplying the circuit boards from the previous process to the plurality of board positioning means in the board mounting completion order, and the plurality of boards. From the positioning means to the board mounting completion order, the board discharging means for discharging the mounting completed circuit boards and the board positioning means for mounting the board in any one of the plurality of board positioning means ,
It is characterized in that it has a control unit for discharging the mounting-completed circuit board, supplying the next circuit board, and positioning the circuit board.

The electronic component mounting apparatus of the second invention of the present application is
In order to solve the above problems, it is preferable that the plurality of substrate positioning means are fixedly arranged, and the substrate discharging means and the substrate supplying means move.

The electronic component mounting apparatus of the second invention of the present application is
In order to solve the above-mentioned problems, the substrate supply means and the substrate discharge means are offset and fixedly arranged so as to face each other, and the plurality of substrate positioning means have a forward path between the substrate supply means and the substrate discharge means. It is preferable to move circularly by passing each other on the return path.

[0017]

According to the first and second aspects of the present invention, a plurality of board positioning means position the supplied circuit boards at respective board mounting positions, and the positioned circuit boards are sequentially mounted by one mounting means. Since the circuit boards from the previous process are supplied from the supply means to the plurality of board positioning means in the order in which the board mounting is completed, while the board is mounted by any of the board positioning means, The board positioning means can complete the supply of the circuit board and the positioning of the circuit board. Therefore, the waiting time for the circuit board supply and positioning of the one mounting means is eliminated.

While the board is mounted by any of the board positioning means, the board discharging means discharges the mounting completed circuit boards from the other board positioning means in the order in which the board mounting is completed. Therefore, there is no waiting time for the one mounting means to carry out the mounting-completed circuit board.

Further, a plurality of board positioning means are fixedly installed, and the board discharging means and the board supplying means are moved so that the board is mounted on any of the board positioning means while the other board positioning means is being mounted. In, it is possible to eject the mounting-completed circuit board, supply the next circuit board, and position the circuit board.

Further, the substrate supply means and the substrate discharge means are offset and faced to each other and fixedly installed, and a plurality of substrate positioning means are provided between the substrate supply means and the substrate discharge means along a forward path and a backward path. By cyclically moving differently, while one of the board positioning means mounts the board, another board positioning means discharges the mounting-completed circuit board, supplies the next circuit board, and the circuit thereof. The substrate can be positioned.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. 1 and 3 to 5.

The construction of this embodiment is such that the carrying section 2 of the conventional electronic component mounting apparatus shown in FIG. 5 is replaced by the board supplying means 2a, the first positioning means 2b-1, and the second positioning means 2 shown in FIG.
b-2, which is replaced with the substrate discharging means 2c,
Moreover, one mounting means 1 is the first positioning means 2b-1.
Also on the circuit board positioned by the second positioning means 2b.
-Allows mounting on a circuit board positioned at -2. Further, on the operation panel 5, the first positioning means 2b-
While the board is mounted by the board positioning means of any one of the first and second positioning means 2b-2, another board positioning means discharges the mounting completed circuit board, supplies the next circuit board, and the circuit board thereof. A control unit is provided for positioning.

FIG. 1 is a plan view, and the board supplying means 2a receives the circuit board from the previous step and horizontally reciprocates in the direction of arrow A to selectively move the circuit board 6 to the first direction.
Positioning means 2b-1 or second positioning means 2b-
Supply to 2.

The first positioning means 2b-1 and the second positioning means 2b-2 position the supplied circuit board 6 at the board mounting position. In this case, the mounting means 1 shown in FIG.
Alternately mounts the circuit board 6 positioned by the first positioning means 2b-1 and the circuit board 6 positioned by the second positioning means 2b-2.

The board discharging means 2c horizontally reciprocates in the direction of arrow B to complete the mounting of the circuit board 6.
Selectively, the first positioning means 2b-1 or the second
It is received from the positioning means 2b-2 and discharged to the next process.

The operation of this embodiment will be described with reference to the flowchart of FIG.

In FIG. 3, the first positioning means repeats steps # 1 to # 9, and the second positioning means repeats steps # 10 to # 18.

In step # 1, the completion of mounting by the second positioning means 2b-2 is received, but at this point, in step # 9, the first positioning means 2b-1 has already been received.
Positioning of the substrate at is completed.

In step # 2, the mounting means moves to the first positioning means 2b-1.

In step # 3, the mounting means mounts components on the board 6 positioned by the first positioning means 2b-1.

In step # 4, the completion of mounting by the first positioning means 2b-1 is transmitted to the board supplying means 2a, the second positioning means 2b-2 and the board discharging means 2c, and the second positioning means 2b-2 is operated. In step # 16, the completion of mounting by the first positioning means 2b-1 is received, and the next steps # 17, 18 are started to mount the board 6 positioned by the second positioning means 2b-2.

In step # 5, in parallel with the mounting on the board 6 positioned by the second positioning means 2b-2, in steps # 5 to 8, the board discharging means 2c and the board supplying means 2a perform the first positioning. After moving to the means 2b-1, the mounting-completed circuit board is discharged and the next circuit board is supplied.

In step # 9, the circuit board supplied by the first positioning means 2b-1 is positioned by the time the mounting on the board 6 positioned by the second positioning means 2b-2 is completed. It returns and waits for the transmission of the completion of mounting to the substrate 6 positioned by the second positioning means 2b-2.

On the other hand, the second positioning means 2b-2 receives the completion of mounting on the board 6 positioned by the first positioning means 2b-1 in step # 16 as described above, and in the next step # 17. The mounting means has moved to the second positioning means 2b-2, and the mounting of step # 18 has started.

Second positioning means 2b in step # 18
2 is completed, the process returns to step # 10 and the second positioning means 2b-
The completion of mounting on the board 6 positioned in 2 is transmitted,
In step # 1 of the first positioning means 2b-1, the completion of mounting on the board 6 positioned by the second positioning means 2b-2 is received, and the next step # 2 starts.

In the second positioning means 2b-2, the process proceeds from step # 10 to steps # 11 to 14 in which the substrate discharging means 2c and the substrate supplying means 2a are the second positioning means 2b-.
2, the mounting-completed circuit board is discharged, and the next circuit board is supplied.

In step # 15, the second positioning means 2b-2 positions the supplied circuit board, and the process proceeds to step # 16, in which the mounting completion is transmitted to the board 6 positioned by the first positioning means 2b-1. To wait.

According to the above, one mounting means 1 is the first
Either one of the positioning means 2b-1 and the second positioning means 2b-2 always carries out the mounting work, and on the other hand, the mounted circuit board is discharged, and then the next circuit board is supplied and positioned. In the positioned state, the other side waits for the completion of mounting, so that one mounting means 1
However, the mounting work can be performed without waiting time for supplying, positioning and discharging the circuit board, and the productivity can be improved.

In the flow chart of FIG. 3, as soon as the mounting is completed, the mounted circuit board is ejected regardless of the board supply, and the board supply is performed separately, but unlike this, when the mounting is completed. , The substrate may be discharged and supplied at the same time with the same timing. In this case, the flowchart of FIG. 4 is used.

The flow chart of FIG. 4 differs from the flow chart of FIG. 3 only in that when the mounting is completed, the discharge and the supply of the substrate are simultaneously performed at the same timing, and the description thereof will be omitted.

A second embodiment of the present invention will be described with reference to FIGS.

The configuration of this embodiment is such that the carrying section 2 of the conventional electronic component mounting apparatus shown in FIG. 5 is replaced by the board supply means 3a, the first positioning means 3b-1, and the second positioning means 3 shown in FIG.
b-2, which is replaced with the substrate discharging means 3c,
Moreover, one mounting means 1 is the first positioning means 3b-1.
Also on the circuit board 6 positioned by the second positioning means 3
The circuit board 6 positioned at b-2 can be mounted.

FIG. 2 is a plan view showing that the board supply means 3a is fixedly arranged and receives the circuit board 6 from the previous step.
First positioning means 3b-1 and second positioning means 3b-2
On the other hand, the circuit board 6 is supplied to the person who comes to his position.

When the first positioning means 3b-1 and the second positioning means 3b-2 come to the position of the board supply means 3a and the circuit board 6 is supplied, the supplied circuit board 6 is moved to the component mounting position. The mounted and completed circuit board 6 is horizontally moved to the position of the board discharging means 3c in the direction of arrow C while mounting the mounted circuit board 6 on the mounting means 1 to complete the mounting.
Is discharged to the substrate discharging means 3c at the position of the substrate discharging means 3c. Then, after the circuit board 6 is discharged to the board discharging means 3c at the position of the board discharging means 3c, as shown by an arrow D, the circuit board 6 detours downward and returns to the position of the board supplying means 3a.

The substrate discharging means 3c is fixedly arranged offset from the substrate supplying means 3a, and the first positioning means 3b-1 or the second positioning means 3b which has come to its own position.
-2, receive the circuit board 6 that has been mounted,
Discharge to the next step.

The operation and flow chart of this embodiment are the same as those of the first embodiment except for the above-described movements of the first positioning means 3b-1, the second positioning means 3b-2, the substrate supply means 3a and the substrate discharge means 3c. Since it is the same as, it is omitted.

[0047]

According to the electronic component mounting method and apparatus of the present invention, a single mounting means, substrate supply means, substrate discharge means, and a plurality of substrate positioning means are combined,
In parallel with the mounting by one mounting means by any of the board positioning means, the board supply means and the board discharge means perform the supply and discharge of the circuit board with respect to the other board positioning means. Circuit board supply, positioning,
There is an effect that high productivity can be obtained by eliminating the waiting time of the mounting means for the discharging operation.

[Brief description of drawings]

FIG. 1 is a plan view showing a main part of the configuration and operation of a first embodiment of the present invention.

FIG. 2 is a plan view showing a main part of the configuration and operation of a second embodiment of the present invention.

FIG. 3 is a first flowchart showing the operation of the first embodiment of the present invention.

FIG. 4 is a second flowchart showing the operation of the first embodiment of the present invention.

FIG. 5 is a perspective view of an electronic component mounting apparatus.

FIG. 6 is a flowchart showing an operation of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mounting means 2a Board | substrate supply means 2b-1 1st positioning means 2b-2 2nd positioning means 2c Board | substrate discharge means 3a Board | substrate supply means 3b-1 1st positioning means 3b-2 2nd positioning means 3c Board | substrate discharge means

Claims (6)

[Claims] 1. A plurality of board positioning means positions the supplied circuit boards at respective board mounting positions, the mounted circuit boards are sequentially mounted by one mounting means, and the plurality of board positioning means mount the plurality of circuit boards. For board positioning means,
The circuit boards from the previous process are supplied in the order in which the board mounting is completed, and the board discharging means discharges the mounting completed circuit boards in the order in which the board mounting is completed from the plurality of board positioning means. In the board positioning means, while mounting the board in any one of the board positioning means, in another board positioning means, the mounting completed circuit board is discharged, the next circuit board is supplied, and the circuit board is positioned. An electronic component mounting method characterized by the above. 2. The electronic component mounting method according to claim 1, wherein a plurality of board positioning means are fixedly arranged, and the board supply means and the board discharge means are moved. 3. The electronic component mounting method according to claim 1, wherein the board supply means and the board discharge means are offset and fixed to face each other, and a plurality of board positioning means are provided for the board supply means and the board. An electronic component mounting method in which an outgoing path and a return path are passed between the discharging means and the moving means is cyclically moved. 4. A plurality of board positioning means for positioning the supplied circuit boards at respective board mounting positions, and one mounting means for sequentially mounting the circuit boards positioned at the board mounting positions of the board positioning means, A board supply means for supplying the circuit boards from the previous step to the plurality of board positioning means in the board mounting completion order, and a board discharge for discharging the mounting completed circuit boards in the board mounting completion order from the plurality of board positioning means. And a board positioning means for mounting the board in any one of the plurality of board positioning means, the other board positioning means discharges the mounting-completed circuit board, supplies the next circuit board, and the circuit board. And a control unit for positioning the electronic component mounting apparatus. 5. The plurality of substrate positioning means are fixedly arranged, and the substrate discharging means and the substrate supplying means move.
The electronic component mounting apparatus described in. 6. The substrate supply means and the substrate discharge means are offset and opposed to each other and are fixedly arranged, and the plurality of substrate positioning means move forward and backward between the substrate supply means and the substrate discharge means. The electronic component mounting apparatus according to claim 4, wherein the electronic component mounting apparatus moves differently and cyclically.