JPH08340167A - Clock use circuit board and manufacture thereof - Google Patents

Abstract

PURPOSE: To provide a clock use circuit board, which can be subjected to punching work with good accuracy and easily, and a method of manufacturing the board. CONSTITUTION: In an insulating board 7, a plating hole 12 is bored in an electrode formation part 1 of a clock use circuit board 701. Then, a panel plating is applied to the surface of the board 7 and the inner wall of the hole 12. Then, the hole 12 and a circuit pattern formation part are covered with a resist film to form an electrode use plated film 100 on the inner wall of the hole 12 and to form a circuit pattern on the surface of the board 7. Then, the resist film is peeled off and after that, one part of the hole 12 with the film 100 formed on its inner wall is left to cut off an unnecessary part 702 of the board 7, whereby an electrode 10 is formed. In the case of the cut-off of the part 702, doglegged recess parts 11 made to recess into a doglegged shape are respectively formed in side parts 792, which are positioned at the parts of both sides of the electrode 10 formed on the inner wall of the hole 12.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a timepiece circuit board having electrodes on its side surfaces and a method for manufacturing the same.

[0002]

2. Description of the Related Art A circuit board for electronic timepieces is provided inside an electronic timepiece (see FIG. 2 described later). For example, as shown in FIG. 15, the electrode 50 of the timepiece circuit board 701 is provided on the side surface 79 thereof.

As a method of manufacturing the above-mentioned timepiece circuit board 701, there is a method disclosed in, for example, Japanese Patent Publication No. 56-54648. The outline will be described below. First, as shown in FIG. 9, a pair of small holes 91 are bored by an end mill in the insulating substrate 7 having copper foil adhered on both sides. The small hole 91 is provided in order to prevent the plating film of the electrode from peeling off when the outer shape is punched out in a later step.
Next, as shown in FIG. 10, a large hole 92 having a diameter that covers a part of each small hole 91 is bored by an end mill.

Next, as shown in FIGS. 11 and 12, panel plating 61 is applied to the entire surface of the insulating substrate 7 including the insides of the small holes 91 and the large holes 92. Next, FIG. 12 and FIG.
As shown in FIG. 5, the surface of the small hole 91 and the large hole 92, and the surface of the circuit forming portion are covered with a resist film 95 and subjected to etching treatment. Next, the resist film 95 is removed. As a result, as shown in FIG.
And the circuit pattern 52 is formed. A land 951 is formed around the electrode plating film 500.

After that, the large hole 9 in which the electrode 50 is to be formed
As shown in FIGS. 14 and 15, leaving part of No. 2 and part of the small hole 91, the insulating substrate 7 is punched along the cutting line 791 by external press punching, and the unnecessary portion 702 is removed.
Excise. At the same time, as shown in FIG. 14, a mounting hole 73 for mounting an electronic component and an opening hole 74 are formed. As a result, the timepiece circuit board 701 having the arc-shaped electrode 50 on the side surface 79 is obtained. Incidentally, FIG. 11 and FIG.
In 3, the reference numeral 62 indicates a copper foil.

[0006]

However, in the above-described conventional method for manufacturing a timepiece circuit board, it is necessary to open the small hole 91 and the large hole 92 in two steps. Therefore, the drilling position is likely to be displaced, and the shape of the electrode 50 may be deformed, which causes a problem in accuracy. In addition, the work process becomes long. Further, even if the resist film formation position is slightly deviated in the circuit forming process, the upper and lower openings of the small hole 91 are not covered with the resist film 95, and the etching solution penetrates through the gap to form the electrode plating film 500. May be damaged.

Therefore, the large hole 9 is formed without opening the small hole 91.
It is conceivable to form only 2. However, in this case, as shown in FIG. 15, during punching of the insulating substrate 7, a portion where the side surface 79 formed by the machining intersects with the inner wall of the large hole 92 formed in advance is obtusely projecting. Part 98. Therefore, due to the compressive stress from the punching die, the side surface 79 near the large hole 92 is burred, or
The plating film may peel off on the side surface 79 near the small hole 91.

In view of the above problems of the prior art, the present invention is to provide a timepiece circuit board and a method of manufacturing the same that can be punched with high precision and ease.

[0009]

According to the present invention, an insulating substrate for forming a timepiece circuit board is prepared, and then a plating hole is formed in the electrode forming portion of the timepiece circuit board on the insulating substrate, and then a plating hole is formed. , The surface of the insulating substrate and the inner wall of the plating hole are subjected to panel plating, and then the plating hole and the circuit pattern forming portion are covered with a resist film to carry out an etching treatment so that the inner wall of the plating hole has an electrode. Forming a circuit pattern on the surface of the insulating substrate, then removing the resist film, and then leaving a part of the plating hole in which the electrode plating film is formed, leaving the insulating substrate A method of manufacturing a circuit board for a watch, wherein an electrode is formed by cutting off an unnecessary portion of the insulating substrate, which is formed on the inner wall of the plating hole when the unnecessary portion of the insulating substrate is cut off. On the side located on both sides of the electrode, in the manufacturing method of the timepiece circuit board and forming a shape in Ku-shaped recess which is recessed in the "V".

What is most noticeable in the present invention is that the electrode is formed on the inner wall of the plating hole by cutting off the insulating substrate leaving a part of the plating hole for panel plating, and This is to form a dogleg-shaped recess by cutting so that the side portions located on both sides are recessed in a dogleg shape.

The V-shaped concave portion is composed of two surfaces that intersect in a V-shape on the side portions located on both sides of the electrode. These two surfaces are formed when the insulating substrate is cut off.

The angle of the V-shaped recess is preferably 70 to 110 degrees. If it is less than 70 degrees, cracks may occur in the insulating substrate. On the other hand, if it exceeds 110 degrees, burrs may occur on both sides of the electrode.

The plating hole is preferably circular. This is because the positioning at the time of forming the plating holes is easy, and the accuracy of forming the plating holes is high. Further, the shape of the plating hole may be square or three.

The inner wall of the plating hole is provided with an electrode plating film formed by panel plating. Further, it is preferable to form the land formed by leaving the panel plating not only on the inner wall of the plating hole but also on the peripheral portions of the upper and lower openings thereof. As a result, peeling of the electrode plating film covering the inner wall of the plating hole can be prevented.

The timepiece circuit board manufactured by the above manufacturing method is, for example, a timepiece circuit board having electrodes and circuit patterns, and the electrodes are plated for electrodes formed on the side surface of the timepiece circuit board. There is a circuit board for a timepiece, which is formed of a film and has a V-shaped concave recessed in a V-shape on the side portions located on both sides of the electrode.

The angle of the V-shaped recess is preferably 70 to 110 degrees for the same reason as above.

[0017]

In the method of manufacturing a timepiece circuit board according to the present invention, the insulating substrate is cut off while leaving a part of the panel-plated plating hole, and the electrode formed on the inner wall of the plating hole is removed. The side portions located on both sides are cut out to form a dogleg shape so as to form a dogleg shape. Therefore, it is possible to prevent burrs from being generated on both sides of the electrode.

Further, since there is no small hole protruding from the plating hole as in the conventional case, the upper and lower parts of the plating hole are completely covered even if the formation position of the resist film covering the plating hole is slightly displaced. It Therefore, when forming a circuit pattern,
It is possible to prevent the electrode plating film covering the inner wall of the plating hole from being damaged by the etching process. Therefore, the electrode can be formed on the inner wall of the plating hole without damage.

Further, in the present invention, the plating hole is formed by performing the hole only once. Therefore, it is not necessary to perform the drilling work twice as in the conventional case. Therefore, punching is easy. In addition, the formation position of the plating hole is determined only by performing the alignment once. Therefore, there is little error in the forming position. Therefore, the electrode formed on the inner wall of the plating hole is not deformed. In addition, the accuracy of the electrode formation position is also improved.

Next, in the timepiece circuit board of the present invention, V-shaped recesses are formed on the side portions located on both sides of the electrodes formed on the side surfaces of the timepiece circuit board. Therefore, as described above, the occurrence of burrs can be prevented, and the electrode forming position accuracy is high.

According to the present invention, it is possible to provide a timepiece circuit board which can be punched with high precision and easily, and a manufacturing method thereof.

[0022]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A timepiece circuit board according to an embodiment of the present invention will be described with reference to FIGS. The timepiece circuit board 701 of this example has three electrodes 10 and a circuit pattern 52, as shown in FIG. As shown in FIG. 1, the electrode 10 is formed by an electrode plating film 100 formed in an arc shape on the side surface 79 of the timepiece circuit board 701. The side portions 792 located on both side portions of the electrode 10 are formed with a V-shaped concave portion 11 that is recessed in a V shape.

Next, a method of manufacturing the above-mentioned timepiece circuit board will be described with reference to FIGS. 1 and 3 to 8. First, Fig. 4
As shown in FIG. 3, an insulating substrate 7 for forming a timepiece circuit board is prepared. This insulating substrate 7 has copper foil 6 on both front and back surfaces.
2 is a glass epoxy resin substrate to which is attached. Then,
As shown in FIG. 3, a hole 12 for plating is formed by an end mill in the electrode forming portion 1 of the circuit board 701 for a timepiece on the insulating substrate 7. The plating hole 12 has a diameter of 3.0
It has a circular shape of mm.

Next, as shown in FIG. 4, panel plating 61 is applied to the surface of the insulating substrate 7 and the inner wall of the plating hole 12. Next, as shown in FIG. 5, the plating hole 12 and the circuit pattern forming portion are covered with a resist film 35, and an etching process is performed. As a result, as shown in FIG.
While leaving the panel plating 61 and the copper foil 62 on the inner wall of the plating hole 12 and the peripheral portions of the upper and lower openings thereof and the circuit pattern forming portion, the other portions of the panel plating 61 and the copper foil 62 are etched.

After that, the resist film 35 is removed. As a result, as shown in FIGS. 7 and 8, the electrode plating film 100 is formed on the inner wall of the plating hole 12, the ring-shaped lands 51 are formed on the upper and lower peripheral edges of the plating hole 12, and the insulating substrate 7 is formed.
A circuit pattern 52 is formed on the surface of the.

After that, as shown in FIGS. 8 and 3, the unnecessary portion 702 of the insulating substrate 7 is cut along the cutting line 791 by a punching die. At this time, as shown in FIG. 1, the electrode 10 is formed while leaving a part of the plating hole 12 in which the electrode plating film 100 is formed, and the electrode 10 is formed on both sides of the electrode 10 formed on the inner wall of the plating hole 12. The side portion 792 located is formed with a V-shaped recess 11 recessed in a V shape. The angle α of the V-shaped concave portion 11 is 70 to 110 degrees. The angle θ of the center O of the arc-shaped plating hole 12 forming the electrode 10 is 57 °.

Further, by the above cutting, the circuit board 7 for the timepiece is
A side surface 79 is formed on the outer periphery of 01, and a mounting hole 73 and an opening hole 74 are formed inside thereof. As a result, as shown in FIG. 2, the timepiece circuit board 701 having the three arc-shaped electrodes 10 is obtained.

Next, the function and effect of this example will be described.
In the method of manufacturing a circuit board for a timepiece of this example, as shown in FIG. 1, the insulating substrate 7 is cut off while leaving a part of the plating hole 12 on which the panel plating is applied, and the plating hole 1
The electrode 10 formed on the inner wall of 2 is cut out so that the side portions located on both sides of the electrode 10 have a V-shape to form a V-shaped recess 11. Therefore, it is possible to prevent burrs from being generated on both sides of the electrode.

Further, as shown in FIGS. 1 and 6, since there is no small hole protruding from the plating hole as in the conventional case, even when the formation position of the resist film 35 covering the plating hole 12 is slightly shifted. The top and bottom of the plating hole 12 are completely covered. Therefore, it is possible to prevent the electrode plating film 100 covering the inner wall of the plating hole 12 from being damaged by the etching process when the circuit pattern 52 is formed. Therefore, the electrode 10 can be formed on the inner wall of the plating hole 12 without damage.

Further, the plating hole 12 is formed by performing the drilling only once. Therefore, it is not necessary to perform the drilling work twice as in the conventional case. Therefore, punching can be easily performed. Further, the formation position of the plating hole 12 is determined only by performing the alignment once. Therefore, there is little error in the forming position. Therefore, the electrode 10 formed on the inner wall of the plating hole 12 is not deformed. Moreover, the accuracy of the formation position of the electrode 10 is also improved.

Further, in the above-mentioned timepiece circuit board 701, the V-shaped concave portion 11 is formed on the side portions 792 located on both side portions of the electrode 10 formed on the side surface 79 thereof. Therefore, as described above, it is possible to prevent the occurrence of burrs, and the formation position accuracy of the electrode 10 is high.

[Brief description of drawings]

FIG. 1 is an explanatory view showing an electrode forming portion in a timepiece circuit board according to an embodiment.

FIG. 2 is a plan view of the timepiece circuit board according to the embodiment.

FIG. 3 is a plan view of an insulating substrate in which a plating hole is formed according to the embodiment.

FIG. 4 is a cross-sectional view of an insulating substrate that is panel-plated according to an embodiment.

FIG. 5 is a cross-sectional view of an insulating substrate covered with a resist film according to an example.

FIG. 6 is a cross-sectional view of an insulating substrate that has been subjected to an etching process according to an example.

FIG. 7 is a cross-sectional view of an insulating substrate from which a resist film is removed according to an example.

FIG. 8 is a plan view of the insulating substrate according to the embodiment before cutting and removing unnecessary portions.

FIG. 9 is a plan view of an insulating substrate of the related art in which small holes for electrode formation are formed.

FIG. 10 is a plan view of a conventional example of an insulating substrate having large holes for electrode formation.

FIG. 11 is a sectional view of a conventional example of an insulating substrate plated with a panel.

FIG. 12 is a plan view of a conventional insulating substrate covered with a resist film.

FIG. 13 is a cross-sectional view of a conventional insulating substrate covered with a resist film.

FIG. 14 is a plan view of an insulating substrate of a conventional example before punching.

FIG. 15 is an explanatory view showing an electrode formation portion in a conventional timepiece circuit board.

[Explanation of symbols]

 1. ． ． Electrode forming portion, 10. ． ． Electrode, 100. ． ． Electrode plating film, 11. ． ． V-shaped recess, 12. ． ． Plating hole, 51. ． ． Land, 52. ． ． Circuit pattern, 7. ． ． Insulating substrate, 79. ． ． Side, 792. ． ． Side, 701. ． ． Circuit board for watch, 702. ． ． Unnecessary part,

Claims (6)

[Claims] 1. An insulating substrate for forming a timepiece circuit board is prepared, and then a plating hole is formed in an electrode forming portion of the timepiece circuit board on the insulating substrate, and then,
Panel plating is applied to the surface of the insulating substrate and the inner wall of the plating hole, and then the plating hole and the circuit pattern formation portion are covered with a resist film for etching, so that the inner wall of the plating hole is used for electrodes. Plating film
A circuit pattern is formed on the surface of the insulating substrate, the resist film is then peeled off, and then unnecessary portions of the insulating substrate are cut off, leaving a part of the plating hole in which the electrode plating film is formed. A method for manufacturing a circuit board for a watch, wherein electrodes are formed by forming a side surface on both sides of the electrode formed on the inner wall of the plating hole when removing an unnecessary portion of the insulating substrate. A method for manufacturing a timepiece circuit board, characterized in that a V-shaped concave portion that is recessed in a V shape is formed in the portion. 2. The method for manufacturing a timepiece circuit board according to claim 1, wherein lands formed by leaving the panel plating are provided at upper and lower peripheral edges of the plating hole. 3. The method for manufacturing a timepiece circuit board according to claim 1, wherein an angle of the V-shaped recess is 70 to 110 degrees. 4. The method according to claim 1, wherein
A method for manufacturing a timepiece circuit board, wherein the insulating substrate is cut off by a punching die. 5. A watch circuit board provided with electrodes and a circuit pattern, wherein the electrodes are formed by an electrode plating film formed on a side surface of the watch circuit board and located on both sides of the electrodes. A circuit board for a watch, characterized in that a side face is formed with a concave V-shaped recess. 6. The timepiece circuit board according to claim 5, wherein the angle of the V-shaped recess is 70 to 110 degrees.