JPH0832290A - Ic parts mounter and mounting method - Google Patents

Abstract

PURPOSE:To clean the suction face of a tool for sucking an IC part automatically without lowering the rate of operation by providing a resilient plate member for stripping off the dust from the suction face of the tool. CONSTITUTION:After repeating the operation for mounting an IC part by a prescribed number of times, a tool 6 is shifted to the position of a cleaning means 10. An operation for moving the IC part suction face of the tool 6 while pressing against the upper edge of a resilient plate member 11 is then repeated by several times thus removing dust adhered to the tool 6. Since the resilient plate member 11 is disposed to press the suction face of the tool 6, dust can be removed from the suction face without requiring any manpower and thereby the IC part can be bonded stably.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC component mounting apparatus for picking up an IC component with a tool and mounting it at an IC component mounting position, which can reliably remove dust adhering to the tool and does not reduce the operating rate. The present invention relates to a component mounting device and method.

[0002]

2. Description of the Related Art One type of IC component mounting device is a device for mounting bare IC components on a carrier tape.
The component mounter will be described with reference to FIG.

In FIG. 7, 21 is a parts cassette for supplying IC parts, 22 is a carrier tape, 23 is a drive system for pitch-feeding the carrier tape 22, 24 is a tool in contact with the active surface side of the IC parts, and 25 is a tool 24. Table for driving the IC up and down, left and right, 26 is a tool for picking up and transferring the inactive surface side of the IC component, and 27 is a tool 2
It is a robot that moves 6 vertically and horizontally. Also 28
Is a recognition camera for recognizing the position of the carrier tape 23 attached to the robot 27, and 29 is a recognition camera for recognizing the suction position of the IC component attached to the table 25.

The operation of the IC component mounting apparatus configured as described above will be described below. Robot 2
7, the tool 26 vacuum-sucks the IC component from the parts cassette 21. Then, the recognition position of the IC component is recognized by the recognition camera 29. At the same time, the drive system 23 feeds the carrier tape 22 and the recognition camera 28
Thus, the IC component mounting position of the carrier tape 22 is recognized. Here, the IC component and the carrier tape 22 are aligned with each other in the IC component mounting position based on the two recognition results, and the tool 24 is aligned with the position directly below the IC component. Then, the IC 24 and the carrier tape 22 are joined by moving the tool 24 upward and the tool 26 downward. After that, the above operation is repeated.

[0005]

However, in the above structure, dust such as chips of IC components is easily attached to the tool 26 that sucks the inactive surface of the IC component. There is a problem that the parallelism between the picked-up IC component and the tool 24 in contact with the active surface side of the IC component cannot be ensured, resulting in defective joining. For this purpose, the tool 2 is manually
Since it is necessary to clean the suction surface of No. 6, it is troublesome and there is a problem that the operation rate is lowered due to the cleaning work.

In view of the above conventional problems, it is an object of the present invention to provide an IC component mounting apparatus and method for cleaning the suction surface of a tool for automatically sucking IC components without lowering the operating rate. There is.

[0007]

The IC component mounting apparatus of the present invention is equipped with a cleaning means having an elastic plate member for squeezing off dust adhering to the IC component suction surface of a tool for sucking the IC component. And

Preferably, the cleaning means is formed by stacking a plurality of elastic plate-like members, and the cleaning means comprises an IC component supply section and an I
Vertical drive means is provided which is disposed in the middle of the movement path of the tool between the C component mounting positions and which vertically moves a plurality of stacked elastic plate members.

Further, the IC component mounting method of the present invention is
It is characterized in that the dust adhering to the IC component suction surface of the tool for sucking the component is squeezed off by the elastic plate member during the movement operation from the IC component mounting position of the tool to the IC component supply unit.

[0010]

According to the IC component mounting apparatus and method of the present invention,
The dust adhering to the IC component suction surface of the IC component suction tool is squeezed off by the elastic plate member, so that the dust adhering to the suction surface can be reliably and securely applied to the suction surface using the warp of the elastic plate member. It can be removed without damaging it and automatically without lowering the operation rate without human intervention.

Further, when the cleaning means is constructed by stacking a plurality of elastic plate-like members, dust can be surely removed by passing the tool only once in one direction, and a plurality of elastic plate-like members can be further stacked. When the tool is moved from the IC component mounting position to the IC component supplying unit by being arranged in the middle of the tool movement path between the IC component supplying unit and the IC component mounting position and moved up and down by the vertical drive means. It is possible to remove dust reliably and without reducing the operating rate at all.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An IC component mounting apparatus according to a first embodiment of the present invention will be described below with reference to FIGS.

In FIG. 1, 1 is a parts cassette for supplying IC parts, 2 is a carrier tape, 3 is a drive system for pitch-feeding the carrier tape 2, 4 is a tool in contact with the active surface side of the IC parts, and 5 is a tool 4. Is a table for driving the IC up and down, left and right, 6 is a tool for picking up and transferring the inactive surface side of the IC component, and 7 is a robot for moving the tool 6 up, down, left and right. Further, 8 is a recognition camera for recognizing the IC component mounting position of the carrier tape 3 mounted on the robot 7, and 9 is a recognition camera for recognizing the suction position of the IC component mounted on the table 5. Reference numeral 10 is a cleaning means composed of one elastic plate-shaped member 11, and is installed at an appropriate position in the apparatus so that the upper edge of the elastic plate-shaped member 11 is in pressure contact with the suction surface of the tool 6. FIG. 2 shows a state in which the upper end of the elastic plate member 11 is elastically deformed and pressed against the suction surface of the tool 6 to remove the dust 20 adhering to the suction surface.

The operation of the IC component mounting apparatus configured as described above will be described below with reference to FIGS. 1, 2 and 3. The robot 7 causes the tool 6 to suck the IC component from the parts cassette 1 in a vacuum, so that the IC component is supplied (step # 1). Next, the suction position of this IC component is recognized by the recognition camera 9 (step # 2). At the same time, the drive system 3 feeds the carrier tape 2 (step # 3), and the recognition camera 8 recognizes the IC component mounting position of the carrier tape 2 (step # 4). Here, the IC component adsorbed by the tool 6 and the IC component mounting position of the carrier tape 2 are aligned based on the results of the two recognitions, the tool 4 is aligned directly below the IC component, and alignment is performed ( Step # 5). Then, the IC component and the carrier tape 2 are joined by moving the tool 4 upward and the tool 6 downward (step # 6). After that, the above operation is repeated.

When the mounting operation of the IC component is repeated a prescribed number of times (step # 7), the tool 6 is moved to the position of the cleaning means 10, and the suction surface of the IC component of the tool 6 is elasticized as shown in FIG. By repeating the operation of moving the plate-shaped member 11 while pressing it against the upper edge of the plate-shaped member several times, the tool 6
The dust 20 attached to is removed and cleaning is performed (step # 8).

As described above, according to the present embodiment, the elastic plate member 11 is installed so as to be in pressure contact with the suction surface of the tool 6, thereby removing the dust 20 adhering to the suction surface without manpower. As a result, stable joining of IC components can be performed.

Next, an IC component mounting apparatus according to the second embodiment of the present invention will be described with reference to FIG. The same components as those of the first embodiment shown in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

In the present embodiment, the cleaning means 10 is constructed by stacking a plurality of elastic plate-like members 11, and the upper surface of the elastic plate-like members 11 is arranged so that the suction surface of the tool 6 is in pressure contact. Has been done.

In this embodiment, the dust adhering to the tool 6 is simply moved once in one direction while pressing the IC component suction surface of the tool 6 against the upper edges of the elastic plate-like members 11. 20 can be reliably removed. By thus arranging the plurality of elastic plate-like members 11 in a stacked manner, it is possible to remove the dust 20 in a shorter time and perform stable joining. As a concrete example, as the elastic plate-shaped member 11, a plate material made of polytetrafluoroethylene having a thickness of 0.5 mm was used, and a good cleaning effect was obtained by stacking four plates.

Next, an IC component mounting apparatus according to the third embodiment of the present invention will be described with reference to FIGS. The same components as those of the first embodiment shown in FIG. 1 are designated by the same reference numerals and the description thereof will be omitted.

In this embodiment, as shown in FIG.
The cleaning means 10 can move a stack of a plurality of elastic plate-shaped members 11 up and down by the up-and-down driving means 12 and the suction surface of the tool 6 is in contact with the upper edge of these elastic plate-shaped members 11 in the raised position. The cleaning means 10 is arranged on the moving path of the tool 6 returning from the IC component mounting position to the parts cassette 1.

In this embodiment, as shown in FIG. 6, step # 7 of FIG. 3 in the first embodiment is omitted, and the suction surface of the tool 6 is cleaned every mounting operation.

That is, after joining the IC component and the carrier tape 2, the elastic plate member 1 is moved by the vertical driving means 12.
1 is lifted, and in that state, the tool 6 moves while moving from the IC component mounting position toward the parts cassette 1.
Of the elastic plate-like members 11 move while being in pressure contact with each other, and the dust 20 adhering to the IC component suction surface of the tool 6 is removed. By installing a stack of a plurality of elastic plate-shaped members 11 that can move up and down in this way in the movement path of the tool 6, the dust 20 can be removed and stable bonding can be performed without reducing the mounting tact. it can.

[0024]

According to the IC component mounting apparatus and method of the present invention, as is clear from the above description, the elastic plate-like member is used to squeeze dust adhering to the IC component adsorption surface of the tool for adsorbing IC components. By dropping, the dust adhering to the suction surface can be reliably removed by using the warp of the elastic plate-like member, without scratching the suction surface, and automatically without lowering the operation rate without manual labor. be able to.

Further, when the cleaning means is constructed by stacking a plurality of elastic plate-like members, the dust can be surely removed by passing the tool once in one direction.

Further, when the cleaning means is arranged in the middle of the tool movement path between the IC component supply unit and the IC component mounting position, dust is removed when the tool is moved from the IC component mounting position to the IC component supply unit. Therefore, it is possible to prevent the mounting tact from becoming long due to the dust removing operation.

Further, when a plurality of elastic plate-shaped members are arranged in the middle of the moving path of the tool and a vertical drive means for moving up and down is provided, the tool does not perform any operation for removing dust, The dust can be automatically and surely removed only by performing the normal mounting operation, and the mounting tact can be shortened.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of an IC component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is an explanatory diagram of an operation of removing dust adhering to the tool suction surface in the embodiment.

FIG. 3 is a flowchart of an IC component mounting operation in the embodiment.

FIG. 4 is a perspective view showing a schematic configuration of an IC component mounting apparatus according to a second embodiment of the present invention.

FIG. 5 is a perspective view showing a schematic configuration of an IC component mounting apparatus according to a third embodiment of the present invention.

FIG. 6 is a flowchart of an IC component mounting operation in the embodiment.

FIG. 7 is a perspective view showing a schematic configuration of an IC component mounting apparatus of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Parts cassette 2 Carrier tape 6 Tool 10 Cleaning means 11 Elastic plate-like member 12 Vertical drive means

Claims (5)

[Claims] 1. An IC component mounting apparatus comprising: a cleaning means having an elastic plate member for squeezing off dust adhering to an IC component suction surface of a tool for sucking an IC component. 2. The IC according to claim 1, wherein the cleaning means is configured by stacking a plurality of elastic plate members.
Component mounting equipment. 3. The IC component mounting apparatus according to claim 1, wherein the cleaning means is arranged in the middle of the tool movement path between the IC component supply section and the IC component mounting position. 4. The IC component mounting apparatus according to claim 3, wherein the cleaning means is composed of a plurality of elastic plate-like members that are stacked and a vertical drive means that vertically moves the elastic plate-like members. 5. An elastic plate-shaped member is used to remove dust adhering to the IC component suction surface of a tool that sucks IC components from the IC component mounting position of the tool to the IC component supply section by an elastic plate member. IC component mounting method.