JPH08318228A - Substrate cleaning method and rotary type substrate cleaning device used therefor - Google Patents

Abstract

PURPOSE: To increase cleaning treatment efficiency by rapidly returning a cleaning tool from the peripheral edge part to the center part of rotation on a substrate. CONSTITUTION: In the case of moving a cleaning tool 12 from the stand-by position apart from the upper part of a substrate W to the cleaning position of the center part of rotation of the substrate W and in the case of returning the cleaning tool 12 from the cleaning position of the peripheral edge part of the substrate W to the stand-by position, the cleaning tool 12 is fully raised and lowered so as to exceed a cup 5. In a cleaning process, in the case of returning the cleaning tool 12 from the outer peripheral edge part of the substrate W to the central part of rotation of the substrate, the cleaning tool 12 is raised to such a position as it is not acted on the substrate W. The cleaning tool 12 is raised and lowered at a small stroke of this position and the position acting on the substrate W.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display device,
In order to supply a cleaning liquid such as pure water to a substrate such as a substrate for an optical disc to perform a cleaning process, a substrate holding unit is rotatably held around a vertical axis from a standby position deviated from above the substrate. The cleaning start step of moving the cleaning tool to the center of rotation of the substrate and lowering the cleaning tool at the center of rotation of the substrate, and causing the cleaning tool to act on the substrate and move it to the outer peripheral edge of the substrate, from which the cleaning tool is moved to the substrate. After repeating the cleaning process that moves the cleaning tool up to the position where it does not affect the substrate to the rotation center position of the substrate and the cleaning process multiple times, raise the cleaning tool at the peripheral edge position of the substrate and then return to the standby position. The present invention relates to a substrate cleaning method including a cleaning end step and a rotary substrate cleaning apparatus used therefor.

[0002]

2. Description of the Related Art When cleaning a surface of a substrate with a cleaning tool while rotating the substrate, generally, for example, an actual flat plate 1-1 is used.
As disclosed in Japanese Patent Publication No. 07129, an air cylinder raises a cleaning tool (cleaning tool) from a standby position outside a cup that prevents scattering of cleaning liquid, and from there to a position above the center of rotation of the substrate. After moving, it descends and moves along the substrate surface to the outer peripheral edge of the substrate, and at the time of moving, while supplying the cleaning liquid to the substrate surface while rotating the substrate around the vertical axis, The adhered particles and dust are peeled off, and the cleaned and removed substances such as the peeled particles and dust are made to flow out of the substrate together with the cleaning liquid by utilizing the centrifugal force generated by the rotation of the substrate. Further, after the cleaning is completed, the cleaning tool is lifted and then displaced to a position above the standby position, and thereafter, lowered to the standby position.

[0003]

By the way, conventionally,
After moving the cleaning tool to the outer peripheral edge of the substrate, raise the cleaning tool to a position where it does not act on the substrate, and then return it to the center of rotation of the substrate and then lower it until the outer peripheral edge of the substrate from the center of rotation of the substrate. The cleaning tool is repeatedly moved 2 to 4 times for cleaning.

However, conventionally, an air cylinder that moves up and down when the substrate is moved between the standby position and the cleaning position is used to lift and lower the cleaning tool from the peripheral edge position to the rotation center position on the substrate. I have to.
For this reason, despite not having to cross the cup,
There is a drawback that the lifting stroke of the cleaning tool is large, it takes time to return the cleaning tool from the outer peripheral edge position to the rotation center position on the substrate, and the cleaning processing efficiency decreases.

The present invention has been made in view of such circumstances, and the substrate cleaning method according to the first aspect of the present invention quickly returns the cleaning tool from the outer peripheral edge portion to the rotation center portion on the substrate. In order to improve the cleaning processing efficiency, the rotary substrate cleaning apparatus of the invention according to claim 2 is an apparatus effective for carrying out the substrate cleaning method of the invention according to claim 1. The purpose is to be able to provide.

[0006]

The invention according to claim 1 is
In order to achieve the above-mentioned object, the cleaning tool is moved from a standby position deviated from above the substrate held rotatably around a vertical axis by the substrate holding means to a rotation center position of the substrate and the substrate is rotated. The cleaning start step of lowering the cleaning tool at the center of rotation of the substrate, moving the cleaning tool to the substrate and moving it to the outer peripheral edge of the substrate, and raising the cleaning tool to a position where it does not affect the substrate, and rotating the center of rotation of the substrate. In the substrate cleaning method, a cleaning step of moving the cleaning tool to a cleaning step and a cleaning end step of returning the cleaning tool to the standby position after raising the cleaning tool at the peripheral edge of the substrate after repeating the cleaning step a plurality of times. The lifting stroke of the cleaning tool in step 1 is smaller than that in each of the cleaning start step and the cleaning end step.

Further, in order to achieve the above-mentioned object, the rotary substrate cleaning apparatus according to the second aspect of the present invention includes a substrate holding means for holding the substrate rotatably around a vertical axis, and a substrate. A cleaning tool for cleaning the surface, a cleaning tool moving means for displacing the cleaning tool between a cleaning position on the substrate and a standby position off the substrate, and an operating position for cleaning the cleaning tool by acting on the substrate, In a rotary substrate cleaning apparatus including a cleaning tool elevating means for elevating and lowering to a non-acting position higher than its operating position, and a cleaning liquid supply means for supplying a cleaning liquid to a cleaning position on the substrate surface by the cleaning tool, a cleaning tool elevating means A first cleaning tool elevating means for moving the cleaning tool up and down when the cleaning tool is moved between the cleaning position and the standby position,
The second cleaning tool elevating means moves the cleaning tool up and down with a stroke smaller than that of the first cleaning tool elevating means with the cleaning tool in the cleaning position.

[0008]

According to the structure of the substrate cleaning method of the present invention, when the cleaning tool is moved from the standby position deviated from above the substrate to the cleaning position at the rotation center of the substrate, and the outer peripheral edge of the substrate When returning the cleaning tool from the cleaning position to the standby position in each case, while returning the cleaning tool from the outer peripheral edge position of the substrate to the rotation center position of the substrate in the cleaning process while sufficiently moving the cleaning tool up and down so as to cross the cup, Focusing on the fact that it is not necessary to cross the cup, the cleaning tool can be raised to a position where it does not act on the substrate, and can be raised and lowered with a small stroke between that position and the position where it acts on the substrate.

According to the structure of the rotary type substrate cleaning apparatus of the second aspect of the present invention, the cleaning tool is moved from the standby position deviated from above the substrate to the cleaning position at the center of rotation of the substrate, and In each case of returning from the cleaning position of the outer peripheral edge portion of the substrate to the standby position, the cleaning tool is moved up and down by the first cleaning tool elevating means to move over the cup while rotating the substrate from the outer peripheral edge portion of the substrate in the cleaning step. When returning the cleaning tool to the central portion, the second cleaning tool elevating means can move the cleaning tool up and down with a stroke smaller than that of the first cleaning tool elevating means.

[0010]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a schematic vertical cross-sectional view of an essential part showing a first embodiment of the rotary substrate cleaning apparatus of the present invention, and FIG. 2 is a plan view.
A rotary table 3 for vacuum-holding a substrate W is integrally rotatably attached to an upper end of a rotary shaft 2 that rotates around a vertical axis by driving an electric motor 1 so that the substrate W can be rotated around the vertical axis. Substrate holding means 4 for rotatably holding is configured.

In the present embodiment, the substrate holding means 4 is constructed by using the rotary table 3 as a vacuum suction type, but the present invention is not limited to this. For example, the substrate W can be placed on the rotary table 3. A plurality of substrate supporting members that support the outer edge are provided, and a positioning pin that regulates the horizontal position of the substrate W is provided at the upper end of the substrate supporting member to configure the substrate holding means. It may be rotatably held in a separated state.

The periphery of the substrate holding means 4 and the substrate W held thereby is covered with a cup 5 which can be moved up and down by an elevating drive mechanism (not shown). Nozzles 6 are provided on the lateral outer side of the cup 5 as cleaning liquid supply means for ejecting a cleaning liquid such as pure water or a mixture of pure water and a chemical liquid toward the center of rotation of the substrate W.

Further, on the lateral outer side of the cup 5, a rotary support shaft 8 of an angle-shaped support arm 7 is provided on a base 9 as shown in a schematic side view of a partly cutaway of FIG. 1
0 is rotatably provided around the first axis P1 in the vertical direction and the vertical direction (see FIGS. 1 and 2), and the base 9
A rotary cylinder 11 rotatably attached to the upper end of the support arm 7 has a tip arm portion 7a.
A cleaning tool 12 for cleaning the substrate surface is provided in the lower part of the substrate so as to be rotatable around the second axis P2 in the vertical direction (see FIGS. 1 and 2).

A first air cylinder 13 is provided at the lower end of the rotary support shaft 8 as a first cleaning tool elevating means. An electric motor 15 is linked to the rotary cylinder 11 via a belt 14. In the figure, 16 indicates that the cleaning tool 12 is a rotation center portion A of the substrate W, an outer peripheral edge portion B of the substrate W, and
The position detection mechanism for detecting which one of the standby positions C, which is deviated from above the substrate W and is in the non-cleaning state, is shown.

A balance arm 17 is provided on the support 10 so as to be swingable about a horizontal axis, and the balance arm 1
First and second contact rollers 18 and 19 are provided at both ends of 7.

A receiving plate 20 is provided at an intermediate position of the rotary support shaft 8, a weight stand 22 is provided on a support column 21 projecting from the base 9 so as to be able to move up and down, and a weight stand 22 is externally fitted to the support column 21. Weights 23 ... Are placed on the weight base 22. The first contact roller 18 is provided on the lower surface of the receiving plate 20.
While the second contact roller 19 is in contact with the lower surface of the weight base 22. The weight of the weights 23 ... Is set to be slightly smaller than the weight of the rotary support shaft 8, the support arm 7, the cleaning tool 12, and the like.

A second air cylinder 25 as a second cleaning tool elevating means is provided on a support member 24 provided upright on the base 9, and the cylinder rod 2 of the second air cylinder 25 is provided.
The tip of 5a is in contact with the upper surface of the weight base 22.
Further, a stopper 26 is provided on the support member 24, and the tip of the stopper 26 comes into contact with the upper surface of the weight base 22, so that the cleaning tool 12 is moved to the cleaning position from the rotation center position A of the substrate W to the outer peripheral position B of the substrate W. It is configured to set the most lowered position at a certain time. A micrometer 27 is attached to the stopper 26 so that the most lowered position to be set can be adjusted.

As shown in FIGS. 1 and 2, a standby pot 28 is provided on the lateral outer side of the cup 5 in the horizontal direction so as to cover the periphery of the cleaning tool 12 at the standby position C, and inside the standby pot 28. Nozzles 29 for supplying a cleaning liquid such as pure water or a mixture of the cleaning liquid 12 to the cleaning tool 12 inserted in the standby pot 28 or a cleaning liquid such as ultrasonic water are provided at each of a pair of opposing corners of the ing.

The lifting stroke of the first air cylinder 13 causes the cleaning tool 12 inserted in the standby pot 28 to
It is set so as to be able to rise above the upper end surface of the cup 5 in a state where it covers the horizontal lateral outside of the substrate W and prevents the cleaning liquid from scattering. On the other hand, the lifting stroke of the second air cylinder 25 causes the cleaning tool 12 to move to the substrate W.
It is set so as to be able to rise from the position where it acts on the substrate W to a position where it does not work apart from the substrate W upward and the lower end of the cleaning tool 12 is below the upper end surface of the cup 5.

Next, a substrate cleaning method using the rotary substrate processing apparatus having the above structure will be described with reference to the operation explanatory diagram of FIG. (1) Cleaning start step As shown in FIG. 4A, at the standby position C, which is separated from the upper side of the substrate W, the first air cylinder 13 is extended to reach the position beyond the cup 5 from inside the standby pot 28. After raising the cleaning tool 12, the electric motor 15 is driven to move the cleaning tool 12 to the rotation center portion A of the substrate W, and thereafter,
The first and second air cylinders 13 and 25 are shortened and lowered to a position where they act on the substrate W.

(2) Cleaning Step As shown in FIG. 4B, while rotating the substrate W,
The electric motor 15 is driven to move the cleaning tool 12 from the rotation center portion A of the substrate W to the outer peripheral edge portion B of the substrate W. After that, as shown in FIG. 4 (c), the second air cylinder 25 is extended so that the second air cylinder 25 is spaced apart from the substrate W upward and does not work, and the lower end of the cleaning tool 12 is higher than the upper end surface of the cup 5. Also moves the cleaning tool 12 up to a position where the cleaning tool 12 is moved downward to move the cleaning tool 12 to the rotation center point A of the substrate W, and then the second air cylinder 25.
Is shortened and lowered to a position where it acts on the substrate W. Then, in the same manner as described above, as shown in FIG.
2 from the rotation center portion A of the substrate W to the outer peripheral edge portion B of the substrate W
Move up to. The process of moving the cleaning tool 12 to the substrate W from the rotation center portion A to the outer peripheral edge portion B of the substrate W is repeated 2 to 4 times. The position from the rotation center portion A to the outer peripheral edge portion B of the substrate W in this cleaning step is referred to as a cleaning position.

(3) Cleaning Finishing Step As shown in FIG. 4D, at the outer peripheral edge portion B of the substrate W, the first and second air cylinders 13 and 25 are extended to a position beyond the cup 5. After raising the cleaning tool 12, the electric motor 15 is driven to move the cleaning tool 12 to the standby position C.
Above the first air cylinder 13
And the cleaning tool 12 is lowered to a position where the cleaning tool 12 is inserted into the standby pot 28.

With the above construction, the lifting stroke of the cleaning tool 12 in the cleaning process can be shortened, the processing time in the cleaning process can be shortened, and the cleaning process time as a whole can be shortened.

FIG. 5 is a partial cutaway side view showing the second embodiment. The difference from the first embodiment is as follows.

That is, the lower end of the rotary support shaft 8 is received and supported by the support bracket 30, the support bracket 30 is externally fitted and screwed to the screw shaft 31, and is guided to the guide rod 32 so that it can only be moved up and down. An electric pulse motor 34 capable of forward and reverse rotation is interlockingly connected to 31 via a timing belt 33.

The electric pulse motor 34 has a controller 3
5 is connected. In the controller 35, large and small rotation speeds are set in advance, and the smaller rotation speed is commanded to the electric pulse motor 34 in the cleaning step, while the larger rotation speed is given in each of the cleaning start step and the cleaning end step. The number is commanded to the electric pulse motor 34, and the cleaning tool 12 is moved up and down with a small stroke during the cleaning process, and with a large stroke during the cleaning start process and the cleaning end process, respectively, as in the first embodiment. The cleaning tool 12 is configured to move up and down. The other structure is the same as that of the first embodiment, and the description thereof is omitted by giving the same drawing numbers.

In the above-described second embodiment, the controller 3 is arranged to move the cleaning tool 12 up and down with a large stroke at each of the cleaning start step and the cleaning end step.
The control configuration for instructing and driving the electric pulse motor 34 with the higher rotational speed of 5 is referred to as first cleaning tool elevating means. In addition, a control configuration for instructing and driving the electric pulse motor 34 with a smaller rotation number to the controller 35 so that the cleaning tool 12 is moved up and down with a small stroke during the cleaning process is referred to as second cleaning tool elevating means. To call.

In the second embodiment, the rotation speed of the electric pulse motor 34 is changed so that, for example, there is no problem of scratches due to collision with the substrate W, and the rising speed of the cleaning tool 12 and the standby position C are changed. Each of the descending speeds is always faster than the descending speed in the cleaning process, and the descending speed to a predetermined position close to the substrate W at the rotation center point A of the substrate W prior to the start of cleaning is increased, and thereafter, The substrate W may be configured to operate at a low speed.

In the above embodiment, the cleaning tool 12 is moved up and down so that the entire support arm 7 is moved up and down. However, only during the cleaning step, or during the cleaning start step and the cleaning end step, respectively. In either case, only the cleaning tool 12 may be lifted and lowered by the tip of the support arm 7.

As the above-mentioned cleaning tool 12, such as nylon brush, mohair brush, sponge, felt, etc.,
Not only when using a soft material, but also when using a plastic material.

Further, in the above embodiment, in order to horizontally displace the cleaning tool 12 along the surface of the substrate W, the support arm 7 is rotated by the electric motor 15 around the first axis P1 in the vertical direction. However, the support arm 7 may be moved linearly by an air cylinder or the like, and the support arm 7 and the electric motor may be configured or the support arm 7 and the air cylinder may be configured. Etc. and collectively referred to as a cleaning tool moving means.

The present invention can be applied not only to the circular substrate as in the above-mentioned embodiment but also to a rotary substrate cleaning apparatus for a square substrate.

[0033]

As described above, according to the substrate cleaning method of the first aspect of the present invention, in the cleaning step, when the cleaning tool is returned from the outer peripheral edge portion of the substrate to the rotation center portion of the substrate, Since the cleaning tool is moved up and down with a stroke smaller than when moving the cleaning tool between the standby position and the cleaning position, the cleaning tool can be quickly returned from the outer peripheral edge position to the rotation center position cleaning position on the substrate, and the cleaning processing efficiency is improved. Can be improved.

According to the rotary type substrate cleaning apparatus of the second aspect of the present invention, when the substrate is moved between the standby position and the cleaning position, the raising and lowering is performed by the first cleaning tool elevating means and in the cleaning step. The raising and lowering when returning the cleaning tool from the peripheral edge portion of the substrate to the rotation center position of the substrate is performed by the second cleaning tool elevating means set to a smaller elevating stroke than that by the first cleaning tool elevating means. Therefore, it is possible to provide a convenient apparatus for carrying out the substrate cleaning method according to the first aspect of the invention.

[Brief description of drawings]

FIG. 1 is a schematic vertical cross-sectional view of essential parts showing a first embodiment of a rotary substrate cleaning apparatus of the present invention.

FIG. 2 is a plan view.

FIG. 3 is a schematic side view of a partially cutaway whole.

FIG. 4 is an operation explanatory diagram.

FIG. 5 is a schematic side view of the entire partially cutaway structure of the second embodiment.

[Explanation of symbols]

 4 ... Substrate holding means 6 ... Nozzle as cleaning liquid supply means 12 ... Cleaning tool 13 ... First air cylinder 15 ... Electric motor as cleaning tool moving means 25 ... Second air cylinder 34 ... Electric pulse motor 35 ... Controller A ... Center of rotation B ... Outer peripheral edge C ... Standby position W ... Substrate

Claims (2)

[Claims] 1. A cleaning tool is moved from a standby position deviated from above a substrate rotatably held about a vertical axis by a substrate holding means to a rotation center position of the substrate and a rotation center position of the substrate. In the cleaning start step of lowering the cleaning tool with, the cleaning tool is moved to the outer peripheral edge of the substrate while acting on the substrate, and then the cleaning tool is raised to a position where it does not act on the substrate, Substrate comprising a cleaning step of moving the cleaning tool to a rotation center position, and a cleaning ending step of returning the cleaning tool to the standby position after raising the cleaning tool at an outer peripheral edge position of the substrate after repeating the cleaning step a plurality of times. In the cleaning method, the lifting stroke of the cleaning tool in the cleaning step is smaller than that in each of the cleaning start step and the cleaning end step. Substrate cleaning method according to symptoms. 2. A substrate holding means for holding the substrate rotatably around a vertical axis, a cleaning tool for cleaning the surface of the substrate, and the cleaning tool detached from the cleaning position on the substrate and on the substrate. A cleaning tool moving means that displaces over a standby position; a cleaning tool elevating means that moves up and down across an operating position where the cleaning tool acts on the substrate to clean it; and a non-operating position that is higher than the operating position; and a substrate surface A rotary substrate cleaning apparatus including a cleaning liquid supply means for supplying a cleaning liquid to a cleaning position by the cleaning tool, wherein the cleaning tool elevating means performs the cleaning when the cleaning tool is moved between a cleaning position and a standby position. First cleaning tool elevating means for elevating and lowering the tool, and second cleaning tool elevating and lowering the cleaning tool with a stroke smaller than that of the first cleaning tool elevating means with the cleaning tool in a cleaning position A rotary substrate cleaning apparatus comprising: an elevating means.