JPH0831689B2 - 半田付け装置 - Google Patents

半田付け装置

Info

Publication number
JPH0831689B2
JPH0831689B2 JP3-517225A JP51722591A JPH0831689B2 JP H0831689 B2 JPH0831689 B2 JP H0831689B2 JP 51722591 A JP51722591 A JP 51722591A JP H0831689 B2 JPH0831689 B2 JP H0831689B2
Authority
JP
Japan
Prior art keywords
heat
printed circuit
circuit board
resistant sheet
solder paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP3-517225A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO1992010078A1 (ja
JPH0831689B1 (enExample
Inventor
寅之輔 川口
Original Assignee
日本アルミット株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2052191A external-priority patent/JPH04239447A/ja
Application filed by 日本アルミット株式会社 filed Critical 日本アルミット株式会社
Priority to JP3-517225A priority Critical patent/JPH0831689B2/ja
Publication of JPWO1992010078A1 publication Critical patent/JPWO1992010078A1/ja
Publication of JPH0831689B2 publication Critical patent/JPH0831689B2/ja
Publication of JPH0831689B1 publication Critical patent/JPH0831689B1/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP3-517225A 1990-11-28 1991-10-31 半田付け装置 Expired - Lifetime JPH0831689B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3-517225A JPH0831689B2 (ja) 1990-11-28 1991-10-31 半田付け装置

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2-327421 1990-11-28
JP32742190 1990-11-28
JP3-20521 1991-01-21
JP2052191A JPH04239447A (ja) 1991-01-21 1991-01-21 衣類用収納容器及び衣類の収納方法
JP3-20512 1991-01-21
JP15397991 1991-05-29
JP3-153979 1991-05-29
JP3-517225A JPH0831689B2 (ja) 1990-11-28 1991-10-31 半田付け装置

Publications (3)

Publication Number Publication Date
JPWO1992010078A1 JPWO1992010078A1 (ja) 1992-11-05
JPH0831689B2 true JPH0831689B2 (ja) 1996-03-27
JPH0831689B1 JPH0831689B1 (enExample) 1996-03-27

Family

ID=27457404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3-517225A Expired - Lifetime JPH0831689B2 (ja) 1990-11-28 1991-10-31 半田付け装置

Country Status (1)

Country Link
JP (1) JPH0831689B2 (enExample)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5586190A (en) * 1978-12-25 1980-06-28 Fujitsu Ltd Method of soldering lead terminal
JPS591466B2 (ja) * 1981-10-09 1984-01-12 巽製粉株式会社 手延べそうめんの製造方法
JPS5994572A (ja) * 1982-11-22 1984-05-31 Nec Corp 半田リフロ−装置
JPS61208291A (ja) * 1985-03-12 1986-09-16 パイオニア株式会社 面実装型ｌｓｉの半田付け装置
JPS61276767A (ja) * 1985-05-31 1986-12-06 Sharp Corp 部品接続装置

Also Published As

Publication number Publication date
JPH0831689B1 (enExample) 1996-03-27

Similar Documents

Publication Publication Date Title
US4515304A (en) Mounting of electronic components on printed circuit boards
US5435732A (en) Flexible circuit member
US5862588A (en) Method for restraining circuit board warp during area array rework
US5207372A (en) Method for soldering a semiconductor device to a circuitized substrate
US4934582A (en) Method and apparatus for removing solder mounted electronic components
US20060065431A1 (en) Self-reflowing printed circuit board and application methods
EP0453559A1 (en) PROCESS FOR PRODUCING A WELDED ARTICLE.
US7156279B2 (en) System and method for mounting electronic components onto flexible substrates
US4771159A (en) Method of soldering leadless component carriers or the like
EP0104565B1 (en) Mounting of electronic components on printed circuit boards
JPH0831689B2 (ja) 半田付け装置
CN101489358B (zh) 软性电路板的元件表面实装方法
US5639010A (en) Simultaneous process for surface mount adhesive cure and solder paste reflow for surface mount technology devices
JP2002280721A5 (enExample)
JPWO1992010078A1 (ja) 半田付け装置
JP2002280721A (ja) ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置
WO1992010078A1 (fr) Dispositif de brasage
JP2000351063A (ja) 鉛フリー半田用リフロー半田付け装置及び半田付け方法、並びに接合体
JPH11239866A (ja) 低温半田付け法
US6730173B2 (en) Method and apparatus of manufacturing electronic circuit module, and method and apparatus of manufacturing semiconductor module
CN1985551B (zh) 低耐热性表面安装部件以及与其进行凸点连接的安装基板
JPH1012992A (ja) 実装方法及び電子部品収容パレツト
JP4615496B2 (ja) 電子部品実装基板の製造方法
KR20240157856A (ko) 솔더 리플로우 장치 및 이를 이용한 전자 장치의 제조 방법
JPH0344433B2 (enExample)