JPH083019Y2 - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPH083019Y2 JPH083019Y2 JP6310489U JP6310489U JPH083019Y2 JP H083019 Y2 JPH083019 Y2 JP H083019Y2 JP 6310489 U JP6310489 U JP 6310489U JP 6310489 U JP6310489 U JP 6310489U JP H083019 Y2 JPH083019 Y2 JP H083019Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- work
- lead
- wide
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】 〔産業上の利用分野〕 本考案は電子部品等のワークにリード端子を接続する
際に使用されるリードフレームの構造に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION [Industrial field of application] The present invention relates to the structure of a lead frame used for connecting lead terminals to a work such as an electronic component.
〔従来の技術〕 従来、電子部品を製造する場合には、第３図のように
単一の金属板から複数本のリード端子11を帯部12によっ
て連結した状態にリードフレーム10をプレス加工し、４
本一組のリード端子11にワーク13を半田接続するととも
に、ワーク13の周囲を外装樹脂14で覆い、その後、各リ
ード端子11を帯部12から切り離すことにより、製品を完
成している。[Prior Art] Conventionally, in the case of manufacturing an electronic component, as shown in FIG. 3, the lead frame 10 is pressed in a state in which a plurality of lead terminals 11 are connected by a band portion 12 from a single metal plate. Four
The work 13 is soldered to the set of lead terminals 11 and the periphery of the work 13 is covered with the exterior resin 14, and then each lead terminal 11 is separated from the band portion 12 to complete the product.
上記リードフレーム10は、生産設備に載せて１ピッチ
ずつ搬送され、半田接続，樹脂封止，切り離し等の各種
工程を順次行うようになっている。しかしながら、リー
ドフレーム10を直線状態のまま搬送すると、設備の全長
寸法が長くなり、面積生産性が悪いという問題がある。The lead frame 10 is placed on a production facility and conveyed one pitch at a time so that various steps such as solder connection, resin sealing, and disconnection are sequentially performed. However, if the lead frame 10 is conveyed in a straight state, there is a problem that the total length of the equipment becomes long and the area productivity is poor.
そこで、第４図のようにリードフレーム10を設備内で
板厚方向へ湾曲させ、搬送方向を変更しながら各種工程
を行うことにより、設備の面積生産性を向上させること
が考えられる。Therefore, as shown in FIG. 4, it is conceivable to improve the area productivity of the equipment by bending the lead frame 10 in the thickness direction of the equipment and performing various steps while changing the conveying direction.
ところが、上記のようにリードフレーム10を湾曲させ
ると、帯部12の曲げ歪がリード端子11を介してワーク13
に波及し、ワーク13に第４図矢印方向に応力が加わる。
その結果、ワーク13に割れやクラックが発生したり、リ
ード端子11とワーク13との接続部に半田剥離や電極剥離
が発生するという問題があった。なお、リードフレーム
10を平面方向に湾曲させる場合も、同様にワーク13に応
力が加わることになる。However, when the lead frame 10 is bent as described above, the bending strain of the band portion 12 causes the work 13 through the lead terminals 11.
And the work 13 is stressed in the direction of the arrow in FIG.
As a result, there is a problem that cracks or cracks are generated in the work 13, and solder peeling or electrode peeling occurs in the connection portion between the lead terminal 11 and the work 13. Note that the lead frame
When the 10 is curved in the plane direction, stress is similarly applied to the work 13.
そのため、従来ではリードフレーム10の曲率半径Ｒを
さほど小さくすることができず、設備を小型化する場合
に制約があった。Therefore, conventionally, the radius of curvature R of the lead frame 10 could not be made so small, and there was a restriction when downsizing the equipment.
そこで、本考案の目的は、リードフレームを湾曲させ
ても、ワークに加わる応力を実質的に無視できる程度に
低減できるリードフレームを提供することにある。Therefore, an object of the present invention is to provide a lead frame in which the stress applied to the work can be reduced to a substantially negligible amount even when the lead frame is curved.
上記目的を達成するために、本考案のリードフレーム
は、各ワークに接続される複数本のリード端子の根本部
を共通に支持する幅広部を設けるとともに、該幅広部と
帯部との間に帯部から幅広部への歪の波及を抑制するた
めの幅狭部を設けたものである。In order to achieve the above-mentioned object, the lead frame of the present invention is provided with a wide portion commonly supporting the root portions of a plurality of lead terminals connected to each work, and between the wide portion and the strip portion. A narrow portion is provided to suppress the spread of strain from the strip portion to the wide portion.
即ち、リードフレームを湾曲させた場合、帯部に曲げ
歪が発生するが、この曲げ歪は幅狭部によって吸収さ
れ、幅広部には殆ど波及しない。そのため、リードフレ
ームの曲率半径Ｒを小さくしてもワークの割れやクラッ
ク、あるいは接続部の半田剥離や電極剥離を防止でき、
設備を大幅に小型化することが可能となる。That is, when the lead frame is bent, bending strain is generated in the band portion, but this bending strain is absorbed by the narrow portion and hardly spreads to the wide portion. Therefore, even if the radius of curvature R of the lead frame is reduced, it is possible to prevent cracks or cracks in the work, or solder peeling or electrode peeling at the connection portion
It is possible to significantly reduce the size of equipment.
なお、幅狭部の幅を出来るだけ狭くした方が歪の波及
を阻止する効果が大きいが、反面、リード端子の支持剛
性が小さくなり、帯部に対してリード端子が撓みやすく
なる欠点がある。そのため、幅狭部の幅寸法は歪波及阻
止効果と支持剛性とを勘案して決定する必要がある。It should be noted that the narrower the width of the narrow portion is, the greater the effect of preventing the spread of strain is, but on the other hand, the supporting rigidity of the lead terminal is reduced and the lead terminal is easily bent with respect to the band portion. . Therefore, the width dimension of the narrow portion needs to be determined in consideration of the strain ripple preventing effect and the supporting rigidity.
第１図，第２図は本考案にかかるリードフレーム１の
一例を示す。1 and 2 show an example of the lead frame 1 according to the present invention.
このリードフレーム１は、従前と同様に単一の金属板
からプレス機にて打ち抜かれたもので、一定幅の帯部２
によって複数本のリード端子３を連結した状態に形成し
てある。なお、帯部２には搬送機のピンと嵌合するパイ
ロット孔2aが一定ピッチ毎に設けられている。４本１組
のリード端子３の先端部には電子素子等のワーク４が半
田付け等にて接続される。各ワーク４に接続される４本
のリード端子３の根本部は幅広部５によって共通に支持
されており、幅広部５と帯部２との間には幅狭部６が形
成されている。The lead frame 1 is punched from a single metal plate by a press machine as in the conventional case, and has a band portion 2 having a constant width.
Is formed in a state in which a plurality of lead terminals 3 are connected. The band 2 is provided with pilot holes 2a that fit with the pins of the carrier at regular intervals. A work 4 such as an electronic element is connected to the tip of the lead terminal 3 of a set of four by soldering or the like. The root portions of the four lead terminals 3 connected to each work 4 are commonly supported by the wide portion 5, and a narrow portion 6 is formed between the wide portion 5 and the band portion 2.
上記リードフレーム１にワーク４を接続した後、各ワ
ーク４の周囲が外装樹脂７にて封止され、その後、リー
ド端子３の根本部が第１図二点鎖線で示すように切断さ
れ、完成品となる。After connecting the works 4 to the lead frame 1, the periphery of each work 4 is sealed with an exterior resin 7, and then the root part of the lead terminal 3 is cut as shown by the two-dot chain line in FIG. It becomes an article.
上記のように半田接続，樹脂封止，切り離し等の各工
程を搬送中に、リードフレーム１を第２図のように板厚
方向に湾曲させると、帯部２には曲げ歪が発生し、ワー
ク４に歪が波及するおそれがある。特に、設備の小型化
のためにリードフレーム１の曲率半径Ｒを小さくする
と、尚更リード端子３やワーク４に及ぼす歪の影響が大
きくなる。しかしながら、本考案ではリード端子３を支
持した幅広部５と帯部２との間に幅狭部６が形成されて
いるので、帯部２の曲げ歪が幅狭部６で吸収されて幅広
部５にまで殆ど波及していない。そのため、リード端子
３およびワーク４には応力が殆ど加わらず、ワーク４の
割れやクラック、あるいは接続部の半田剥離や電極剥離
を確実に防止できる。When the lead frame 1 is curved in the plate thickness direction as shown in FIG. 2 during the transportation of the respective steps such as solder connection, resin sealing, and disconnection as described above, bending strain occurs in the band portion 2. Distortion may spread to the work 4. In particular, if the radius of curvature R of the lead frame 1 is reduced in order to downsize the equipment, the influence of the strain on the lead terminals 3 and the work 4 is further increased. However, in the present invention, since the narrow portion 6 is formed between the wide portion 5 supporting the lead terminal 3 and the strip portion 2, the bending strain of the strip portion 2 is absorbed by the narrow portion 6 and the wide portion 6 is absorbed. Almost no spread to 5. Therefore, almost no stress is applied to the lead terminals 3 and the work 4, and cracks or cracks in the work 4, or solder peeling or electrode peeling at the connection portion can be reliably prevented.
なお、ワーク４としてはあらゆる電子部品が適用でき
るが、特に圧電素子の場合には薄肉な圧電セラミック基
板を使用する関係で、製造途中で基板に割れやクラック
が生じやすく、歩留りを低下させる問題がある。この
点、本考案では幅狭部６で基板への応力波及を阻止でき
るので、製品の歩留りを格段に向上させることが可能と
なる。Although any electronic component can be applied to the work 4, particularly in the case of a piezoelectric element, since a thin piezoelectric ceramic substrate is used, cracks or cracks are likely to occur in the substrate during manufacturing, which causes a problem of reducing yield. is there. In this respect, in the present invention, since the narrow portion 6 can prevent the stress from spreading to the substrate, it is possible to significantly improve the product yield.
また、リードフレーム１の曲率半径Ｒを小さくできる
ことに伴い、限られたスペース内に半田付け機，樹脂封
止機，プレス機等の各種設備を効率良く配列できるの
で、設備の全長の短縮、設備費の削減、面積生産性の向
上を実現できる。Further, since the radius of curvature R of the lead frame 1 can be reduced, various equipment such as a soldering machine, a resin sealing machine, and a pressing machine can be efficiently arranged in a limited space, so that the total length of the equipment can be shortened. Cost reduction and area productivity improvement can be realized.
なお、本考案のリードフレームは実施例のような形状
に限らないことは勿論であり、幅広部によって支持され
るリード端子の本数、つまり１個のワークに接続される
リード端子の本数も４本に限らない。The lead frame of the present invention is not limited to the shape as in the embodiment, and the number of lead terminals supported by the wide portion, that is, the number of lead terminals connected to one work is four. Not limited to
また、上記実施例ではリードフレームを板厚方向に湾
曲させる場合について説明したが、リードフレームを平
面方向に湾曲させる場合にも幅狭部が有効である。Further, in the above embodiment, the case where the lead frame is curved in the plate thickness direction has been described, but the narrow portion is also effective when the lead frame is curved in the plane direction.
以上の説明で明らかなように、本考案によればリード
フレームに各ワークに接続される複数本のリード端子の
根本部を共通に支持する幅広部と、帯部から幅広部への
歪の波及を抑制するための幅狭部とを設けたので、リー
ドフレームを湾曲させた場合、帯部に発生した曲げ歪が
幅狭部によって吸収され、ワークには殆ど波及しない。
そのため、リードフレームの曲率半径Ｒを小さくしても
ワークの割れやクラック、あるいは接続部の半田剥離や
電極剥離を防止でき、設備を大幅に小型化することがで
きる。As is apparent from the above description, according to the present invention, the lead frame has a wide portion that commonly supports the root portions of a plurality of lead terminals connected to each work, and the spread of strain from the strip portion to the wide portion. Since the narrow width portion is provided for suppressing the bending, the bending strain generated in the band portion is absorbed by the narrow width portion when the lead frame is bent, and hardly spreads to the work.
Therefore, even if the radius of curvature R of the lead frame is reduced, it is possible to prevent cracks or cracks in the work, or peeling of solder or electrodes from the connecting portion, and the equipment can be significantly downsized.
第１図は本考案にかかるリードフレームの一例にワーク
を取り付けた状態の正面図、第２図はこのリードフレー
ムを湾曲させた状態の斜視図、第３図は従来のリードフ
レームにワークを取り付けた状態の正面図、第４図はこ
のリードフレームを湾曲させた状態の斜視図である。 １……リードフレーム、２……帯部、３……リード端
子、４……ワーク、５……幅広部、６……幅狭部。FIG. 1 is a front view showing a state in which a work is attached to an example of a lead frame according to the present invention, FIG. 2 is a perspective view in which the lead frame is bent, and FIG. 3 is a state in which the work is attached to a conventional lead frame. FIG. 4 is a perspective view of the lead frame in a bent state, and FIG. 4 is a perspective view of the lead frame in a bent state. 1 ... Lead frame, 2 ... Strip, 3 ... Lead terminal, 4 ... Work, 5 ... Wide part, 6 ... Narrow part.
Claims (1)
部によって連結した状態に形成し、これらリード端子の
先端部にワークを接続するようにしたリードフレームに
おいて、 各ワークに接続される複数本のリード端子の根本部を共
通に支持する幅広部を設けるとともに、該幅広部と帯部
との間に帯部から幅広部への歪の波及を抑制するための
幅狭部を設けたことを特徴とするリードフレーム。1. A lead frame in which a plurality of lead terminals are formed from a single metal plate in a state in which they are connected by a band portion, and work pieces are connected to the tip portions of these lead terminals. A wide part that commonly supports the root parts of a plurality of lead terminals is provided, and a narrow part is provided between the wide parts to suppress the spread of strain from the wide part to the wide part. A lead frame characterized by that.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6310489U JPH083019Y2 (en) | 1989-05-30 | 1989-05-30 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6310489U JPH083019Y2 (en) | 1989-05-30 | 1989-05-30 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH032657U JPH032657U (en) | 1991-01-11 |
| JPH083019Y2 true JPH083019Y2 (en) | 1996-01-29 |
Family
ID=31592855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6310489U Expired - Lifetime JPH083019Y2 (en) | 1989-05-30 | 1989-05-30 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083019Y2 (en) |
-
1989
- 1989-05-30 JP JP6310489U patent/JPH083019Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH032657U (en) | 1991-01-11 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |