JPH083018Y2 - 半導体パッケージ用連結型リードフレーム - Google Patents
半導体パッケージ用連結型リードフレームInfo
- Publication number
- JPH083018Y2 JPH083018Y2 JP4284489U JP4284489U JPH083018Y2 JP H083018 Y2 JPH083018 Y2 JP H083018Y2 JP 4284489 U JP4284489 U JP 4284489U JP 4284489 U JP4284489 U JP 4284489U JP H083018 Y2 JPH083018 Y2 JP H083018Y2
- Authority
- JP
- Japan
- Prior art keywords
- external lead
- metal layer
- insulating
- lead frame
- semiconductor package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 28
- 229910052751 metal Inorganic materials 0.000 description 33
- 239000002184 metal Substances 0.000 description 33
- 238000005219 brazing Methods 0.000 description 24
- 239000000758 substrate Substances 0.000 description 19
- 239000000463 material Substances 0.000 description 12
- 210000000078 claw Anatomy 0.000 description 8
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 6
- 229910002804 graphite Inorganic materials 0.000 description 6
- 239000010439 graphite Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000011572 manganese Substances 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910018054 Ni-Cu Inorganic materials 0.000 description 1
- 229910018481 Ni—Cu Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012777 electrically insulating material Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000003870 refractory metal Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4284489U JPH083018Y2 (ja) | 1989-04-12 | 1989-04-12 | 半導体パッケージ用連結型リードフレーム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4284489U JPH083018Y2 (ja) | 1989-04-12 | 1989-04-12 | 半導体パッケージ用連結型リードフレーム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02132958U JPH02132958U (enrdf_load_stackoverflow) | 1990-11-05 |
| JPH083018Y2 true JPH083018Y2 (ja) | 1996-01-29 |
Family
ID=31554742
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4284489U Expired - Lifetime JPH083018Y2 (ja) | 1989-04-12 | 1989-04-12 | 半導体パッケージ用連結型リードフレーム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH083018Y2 (enrdf_load_stackoverflow) |
-
1989
- 1989-04-12 JP JP4284489U patent/JPH083018Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02132958U (enrdf_load_stackoverflow) | 1990-11-05 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |