JPH083018Y2 - 半導体パッケージ用連結型リードフレーム - Google Patents

半導体パッケージ用連結型リードフレーム

Info

Publication number
JPH083018Y2
JPH083018Y2 JP4284489U JP4284489U JPH083018Y2 JP H083018 Y2 JPH083018 Y2 JP H083018Y2 JP 4284489 U JP4284489 U JP 4284489U JP 4284489 U JP4284489 U JP 4284489U JP H083018 Y2 JPH083018 Y2 JP H083018Y2
Authority
JP
Japan
Prior art keywords
external lead
metal layer
insulating
lead frame
semiconductor package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4284489U
Other languages
English (en)
Japanese (ja)
Other versions
JPH02132958U (enrdf_load_html_response
Inventor
幸男 田原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP4284489U priority Critical patent/JPH083018Y2/ja
Publication of JPH02132958U publication Critical patent/JPH02132958U/ja
Application granted granted Critical
Publication of JPH083018Y2 publication Critical patent/JPH083018Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
JP4284489U 1989-04-12 1989-04-12 半導体パッケージ用連結型リードフレーム Expired - Lifetime JPH083018Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4284489U JPH083018Y2 (ja) 1989-04-12 1989-04-12 半導体パッケージ用連結型リードフレーム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4284489U JPH083018Y2 (ja) 1989-04-12 1989-04-12 半導体パッケージ用連結型リードフレーム

Publications (2)

Publication Number Publication Date
JPH02132958U JPH02132958U (enrdf_load_html_response) 1990-11-05
JPH083018Y2 true JPH083018Y2 (ja) 1996-01-29

Family

ID=31554742

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4284489U Expired - Lifetime JPH083018Y2 (ja) 1989-04-12 1989-04-12 半導体パッケージ用連結型リードフレーム

Country Status (1)

Country Link
JP (1) JPH083018Y2 (enrdf_load_html_response)

Also Published As

Publication number Publication date
JPH02132958U (enrdf_load_html_response) 1990-11-05

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term