JPH08288599A - Printed substrate device - Google Patents
Printed substrate deviceInfo
- Publication number
- JPH08288599A JPH08288599A JP9069295A JP9069295A JPH08288599A JP H08288599 A JPH08288599 A JP H08288599A JP 9069295 A JP9069295 A JP 9069295A JP 9069295 A JP9069295 A JP 9069295A JP H08288599 A JPH08288599 A JP H08288599A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- electronic component
- back surface
- ground pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電力増幅器などの発熱す
る電子部品を実装するために使用するプリント基板装置
に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board device used for mounting electronic components that generate heat such as a power amplifier.
【０００２】[0002]
【従来の技術】以下、従来のプリント基板装置について
説明する。2. Description of the Related Art A conventional printed circuit board device will be described below.
【０００３】従来のプリント基板装置は図４に示すよう
に、裏面に放熱部１を有する電子部品２が装着されるプ
リント基板３を有し、このプリント基板３の表面４と裏
面５には放熱用のアースパターン６ａと６ｂとが設けら
れていた。そして放熱部１は、プリント基板３の表面４
に形成されたアースパターン６ａに直接半田付されてい
た。そして、このアースパターン６ａは放熱部１の近傍
の裏面アースパターン６ｂにスルーホールで接続されて
いた。As shown in FIG. 4, a conventional printed circuit board device has a printed circuit board 3 on which an electronic component 2 having a heat radiating portion 1 is mounted. The printed circuit board 3 has a front surface 4 and a back surface 5 which radiate heat. There were provided earth patterns 6a and 6b. The heat dissipation part 1 is provided on the surface 4 of the printed circuit board 3.
It was directly soldered to the ground pattern 6a formed on. The ground pattern 6a is connected to the back surface ground pattern 6b near the heat dissipation portion 1 by a through hole.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、この様
な従来の構成では、電子部品２の裏面に放熱部１があ
り、この裏面に設けられた放熱部１を半田付けしている
ため、電子部品２の取りはずしや、付け替えをすること
が非常に困難であった。However, in such a conventional structure, the heat dissipation portion 1 is provided on the back surface of the electronic component 2, and the heat dissipation portion 1 provided on the back surface is soldered, so that the electronic component is mounted. It was very difficult to remove and replace item 2.
【０００５】本発明はこの様な問題点を解決するもの
で、裏面に放熱部を有する電子部品の取りはずしや、付
け替えなどの作業性を容易に行う事ができるプリント基
板装置を提供することを目的としたものである。The present invention solves such a problem, and an object of the present invention is to provide a printed circuit board device capable of easily performing workability such as removal and replacement of electronic parts having a heat dissipation portion on the back surface. It is what
【０００６】[0006]
【課題を解決するための手段】この目的を達成するため
に本発明のプリント基板装置は、電子部品の放熱部の下
側にプリント基板の表面と裏面とを導通させる大型のス
ルーホールを設ける構成としたものである。In order to achieve this object, the printed circuit board device of the present invention is provided with a large through hole for conducting the front surface and the back surface of the printed circuit board under the heat dissipation portion of the electronic component. It is what
【０００７】[0007]
【作用】この構成により、電子部品の裏面にある放熱部
の半田付けや、半田吸い取りがプリント基板装置の裏面
から大型のスルーホールを通して行うことができ、従来
困難であった電子部品の手半田付作業が容易に行う事が
できる。With this structure, the heat radiation portion on the back surface of the electronic component can be soldered and the solder can be sucked from the back surface of the printed circuit board device through a large through hole, and thus it is difficult to solder the electronic component by hand. Work can be done easily.
【０００８】[0008]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。図１は本発明の一実施例におけるプ
リント基板装置の断面図である。図１において、本発明
のプリント基板装置は、裏面に放熱部１を有する電子部
品２が装着されるプリント基板１１と、このプリント基
板１１の表面１２と裏面１３とに設けられた放熱用のア
ースパターン１４ａ，１４ｂとを備え、前記電子部品２
の放熱部１の下側に前記プリント基板１１の表面１２と
裏面１３とを導通させる大型のスルーホール１５を設け
ている。この大型のスルーホール１５は、前記電子部品
２の裏面にある放熱部１と同一径以下の直径を有し、放
熱部１とプリント基板１１の裏面１３側のアースパター
ン１４ｂとの半田付けをプリント基板１１の裏面からで
きるようになっている。従って、この放熱部１がプリン
ト基板１１の表面のアースパターン１４ａと裏面のアー
スパターン１４ｂのそれぞれのアースパターンへ最短距
離にて放熱ができ放熱効果も大きくなる。また、前記電
子部品２の裏面にある放熱部１の半田付状態の確認も容
易になり、一定した半田付状態が確保でき安定した放熱
効果が得られる。An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view of a printed circuit board device according to an embodiment of the present invention. In FIG. 1, a printed circuit board device of the present invention includes a printed circuit board 11 on which an electronic component 2 having a heat dissipation part 1 is mounted, and a heat dissipation ground provided on a front surface 12 and a rear surface 13 of the printed circuit board 11. The electronic component 2 including patterns 14a and 14b
A large through hole 15 is provided below the heat radiating portion 1 for electrically connecting the front surface 12 and the back surface 13 of the printed circuit board 11. The large through hole 15 has a diameter equal to or smaller than that of the heat radiating portion 1 on the back surface of the electronic component 2, and the soldering of the heat radiating portion 1 and the ground pattern 14b on the back surface 13 side of the printed circuit board 11 is printed. It can be done from the back surface of the substrate 11. Therefore, the heat radiating portion 1 can radiate heat to the respective ground patterns 14a on the front surface and the ground pattern 14b on the rear surface of the printed circuit board 11 in the shortest distance, and the heat radiating effect is increased. Further, it becomes easy to confirm the soldering state of the heat radiating portion 1 on the back surface of the electronic component 2, a constant soldering state can be secured, and a stable heat radiating effect can be obtained.
【０００９】尚、図２、図３に示すように、この大型ス
ルーホール１５の近傍に複数個の小型のスルーホール１
９を設ける事により、より一層の放熱効果を増す事がで
きる。本実施例において、大型スルーホールの直径は
２．０mmとし小型スルーホールの直径は０．５mmとして
いる。As shown in FIGS. 2 and 3, a plurality of small through holes 1 are provided in the vicinity of the large through hole 15.
By providing 9, the heat dissipation effect can be further enhanced. In this embodiment, the large through hole has a diameter of 2.0 mm and the small through hole has a diameter of 0.5 mm.
【００１０】更に、電子部品２は、プリント基板１１の
側面１１ｂの近傍に装着するとともに、このプリント基
板１１の側面１１ｂには金属製のフレーム１７と半田付
する半田付け部１８を放熱用のアースパターン１４ｂ上
に設けている。これにより、プリント基板１１上でアー
スパターン１４ｂの放熱効果に増して金属製のフレーム
１７の放熱効果が加わり更に放熱効果の大きなものにな
る。Further, the electronic component 2 is mounted in the vicinity of the side surface 11b of the printed circuit board 11, and the side surface 11b of the printed circuit board 11 is provided with a metal frame 17 and a soldering portion 18 for soldering to the heat radiation ground. It is provided on the pattern 14b. As a result, the heat dissipation effect of the metal frame 17 is added to the heat dissipation effect of the ground pattern 14b on the printed circuit board 11, and the heat dissipation effect is further increased.
【００１１】さらに、プリント基板１１の裏面１３は、
全面アースパターン１４ｂとするとともに、表面１２の
アースパターン１４ａと、電子部品２のアース端子２ａ
とは直接アースパターン１４ｂで接続されている。これ
により前記大型スルーホール１５部を介して半田付され
ていた電子部品２の放熱部１は、プリント基板１１の裏
面１３から熱を与える事により、この電子部品２のアー
ス端子２ａへも熱が伝わりやすくなり、この電子部品２
の取りはずしが容易になる。Further, the back surface 13 of the printed circuit board 11 is
The ground pattern 14b is formed on the entire surface, and the ground pattern 14a on the surface 12 and the ground terminal 2a of the electronic component 2 are used.
Is directly connected to the ground pattern 14b. As a result, the heat radiating portion 1 of the electronic component 2 that has been soldered through the large-sized through hole 15 gives heat from the back surface 13 of the printed board 11 so that heat is also applied to the ground terminal 2a of the electronic component 2. This electronic component 2 is easier to reach
Can be easily removed.
【００１２】[0012]
【発明の効果】以上のように本発明によれば、電子部品
の放熱部の下側にプリント基板の表面と裏面とを導通さ
せる大型のスルーホールを設ける事で、電子部品の裏面
にある放熱部の半田付けや半田吸い取りが、プリント基
板装置の裏面から行う事ができ、従来困難であった電子
部品の手半田付け作業が容易に行う事ができるという効
果がある。As described above, according to the present invention, a large through-hole is provided below the heat dissipation portion of the electronic component so that the front surface and the back surface of the printed circuit board are electrically connected to each other. Soldering and desoldering of the parts can be performed from the back surface of the printed circuit board device, and there is an effect that manual soldering work of electronic components, which has been difficult in the past, can be easily performed.
【図１】本発明の一実施例によるプリント基板装置の断
面図FIG. 1 is a sectional view of a printed circuit board device according to an embodiment of the present invention.
【図２】同、プリント基板装置の表面側からのパターン
図FIG. 2 is a pattern diagram from the front side of the printed circuit board device.
【図３】同、プリント基板装置の裏面側からのパターン
図FIG. 3 is a pattern diagram of the same from the back side of the printed circuit board device.
【図４】従来のプリント基板装置の断面図FIG. 4 is a sectional view of a conventional printed circuit board device.
１ 放熱部 ２ 電子部品 １１ プリント基板 １２ 表面 １３ 裏面 １４ａ アースパターン １４ｂ アースパターン １５ 大型のスルーホール 1 Heat Dissipation Part 2 Electronic Component 11 Printed Circuit Board 12 Front Surface 13 Back Surface 14a Ground Pattern 14b Ground Pattern 15 Large Through Hole
Claims (4)
れるプリント基板と、このプリント基板の表面と裏面と
に設けられた放熱用のアースパターンとを備え、前記電
子部品の放熱部の下側に前記プリント基板の表面と裏面
とを導通させる大型のスルーホールを設けたプリント基
板装置。1. A printed board on which an electronic component having a heat radiating portion is mounted on a back surface, and a heat radiating ground pattern provided on a front surface and a back surface of the printed circuit board are provided below the heat radiating portion of the electronic component. A printed circuit board device in which a large through hole is provided on the side for conducting the front surface and the back surface of the printed circuit board.
のスルーホールを設けた請求項１記載のプリント基板装
置。2. The printed circuit board device according to claim 1, wherein a plurality of small through holes are provided in the vicinity of the large through hole.
するとともに、このプリント基板側面には金属製のフレ
ームと半田付する半田付部を放熱用のアースパターン上
に設けた請求項１記載のプリント基板装置。3. The print according to claim 1, wherein the electronic component is mounted near a side surface of the printed board, and a soldering portion for soldering with a metal frame is provided on the side surface of the printed board on a ground pattern for heat dissipation. Substrate device.
ンとするとともに前記プリント基板の表面のアースパタ
ーンと電子部品のアース端子とは直接接続された請求項
１記載のプリント基板装置。4. The printed circuit board device according to claim 1, wherein the back surface of the printed circuit board has an entire ground pattern, and the ground pattern on the front surface of the printed circuit board is directly connected to the ground terminal of the electronic component.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9069295A JPH08288599A (en) | 1995-04-17 | 1995-04-17 | Printed substrate device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9069295A JPH08288599A (en) | 1995-04-17 | 1995-04-17 | Printed substrate device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08288599A true JPH08288599A (en) | 1996-11-01 |
Family
ID=14005588
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9069295A Pending JPH08288599A (en) | 1995-04-17 | 1995-04-17 | Printed substrate device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08288599A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006049412A (en) * | 2004-08-02 | 2006-02-16 | Mitsumi Electric Co Ltd | Heat radiating structure for electronic component |
| JP2013229400A (en) * | 2012-04-24 | 2013-11-07 | Toshiba Corp | Electronic apparatus and module |
| JP2013239552A (en) * | 2012-05-15 | 2013-11-28 | Mitsubishi Electric Corp | Electronic component module, and method for manufacturing electronic component module |
-
1995
- 1995-04-17 JP JP9069295A patent/JPH08288599A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006049412A (en) * | 2004-08-02 | 2006-02-16 | Mitsumi Electric Co Ltd | Heat radiating structure for electronic component |
| JP2013229400A (en) * | 2012-04-24 | 2013-11-07 | Toshiba Corp | Electronic apparatus and module |
| JP2013239552A (en) * | 2012-05-15 | 2013-11-28 | Mitsubishi Electric Corp | Electronic component module, and method for manufacturing electronic component module |
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