JPH08286203A - Liquid crystal display device - Google Patents

Abstract

PURPOSE: To lower the resistance of input signals to a semiconductor device for driving liquid crystals by narrowing the area of the margins in parts exclusive of the display part of a liquid crystal panel and forming this panel in such a manner that the input signals to the semiconductor device for driving liquid crystals pass the inside of the wirings in a multilayered substrate. CONSTITUTION: This liquid crystal display device has a first wiring layer which consists of metal, such as aluminum or copper, an insulating layer which is disposed on this first wiring layer and consists of a resin material, a second wiring layer 21 which is disposed on this insulating layer and the multilayered substrate 14 which is made of glass consisting of through-holes for conducting the first wiring layer and the second wiring layer 21 in the insulating layer as a substrate. The semiconductor device 13 for driving liquid crystals is mounted by a joining agent contg. conductive particles onto the multilayered substrate 14. The multilayered substrate 14 is connected to the liquid crystal panel by the joining agent contg. the conductive particles.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connection structure for a liquid crystal driving semiconductor device in a liquid crystal panel, and more particularly to connecting a liquid crystal driving semiconductor device on a multilayer substrate and further providing a wiring pattern in the multilayer substrate to provide a liquid crystal driving semiconductor. The present invention relates to a structure of a liquid crystal display device configured to input a signal to the device.

[0002]

2. Description of the Related Art A flexible printed circuit board in which a liquid crystal driving semiconductor device is connected to a substrate of a liquid crystal panel by a conductive adhesive and a signal input to the semiconductor device is formed with a conductive pattern on a resin film at a substrate end. (Hereinafter FP
(Hereinafter abbreviated as “C”) has been put into practical use by bonding it with a conductive bonding agent.

A liquid crystal display device according to this prior art is shown in FIG.
Will be described with reference to the plan view of FIG. In addition,
FIG. 7 shows a cross section taken along the line BB of FIG. Below, FIG.
And FIG. 7 will be alternately referred to for description.

A wiring pattern 17 for sending a signal to the liquid crystal display section is provided in the margins 22 of the first substrate 11 and the second substrate 12 of the liquid crystal panel, and the liquid crystal driving semiconductor device is provided on the wiring pattern 17. 13 and an FPC 19 for sending a signal to the semiconductor device.

A transparent conductive film of indium tin oxide (hereinafter abbreviated as ITO) is used as a material of the wiring pattern 17 on the blank portion 22.

The liquid crystal driving semiconductor device 13 mounted on the margin portion 22 and the FPC 19 for sending a signal to the liquid crystal driving semiconductor device 13 are bonded by a conductive bonding agent 15.

A signal for driving the liquid crystal is input from an external device through the FPC 19, passes through the wiring pattern 17, passes through the liquid crystal driving semiconductor device 13, and passes through the wiring pattern 17 to the liquid crystal display section. Connected to be transmitted.

[0008]

In the liquid crystal display device shown in FIGS. 6 and 7, the liquid crystal driving semiconductor device 13 and the FPC 19 are used.
The area of the margin portion 22 can be reduced by collecting the circuits formed in the above in one substrate.

The multi-layer substrate on which the liquid crystal driving semiconductor device 13 is mounted is connected to the wiring pattern 17 with a conductive bonding agent to perform electrical conduction and adhesion.

The input terminals of the liquid crystal driving semiconductor device 13 mounted on the multilayer substrate are connected to the wiring patterns in the multilayer substrate by through holes. The wiring pattern in the multilayer substrate is connected to the end of the substrate, and signals are input in this portion.

According to the conventional means, the liquid crystal driving semiconductor device 1 is used.
3 is mounted in the margin portion 22, and the FPC 19 having a circuit for supplying a signal to the liquid crystal panel is also connected to the margin portion 22, so that the area of the margin portion 22 becomes large.

Further, ITO of the material of the wiring pattern 17 connecting the liquid crystal display section and the liquid crystal driving semiconductor device 13 and the liquid crystal driving semiconductor device 13 and the FPC 19 has a larger resistance than aluminum or copper, and the liquid crystal driving semiconductor device 13 is And F
There is a problem that electrical continuity cannot be established between the PCs 19.

In order to solve the above-mentioned problems, an object of the present invention is to mount a liquid crystal driving semiconductor device on a multi-layer substrate and reduce the area of a blank portion. Furthermore, regarding the input portion of the liquid crystal driving semiconductor device, Is to provide a liquid crystal display device in which a signal has a low resistance because it does not pass through ITO wiring but through metal wiring.

[0014]

In order to achieve the above object, the liquid crystal display device of the present invention adopts the following constitution.

In the liquid crystal display device of the present invention, the first wiring layer and the second wiring layer made of aluminum or copper are electrically connected to each other in the first wiring layer, the insulating layer, the second wiring layer and the insulating layer. The invention is characterized in that a multi-layer substrate including through holes is provided, a liquid crystal driving semiconductor device is connected to the multi-layer substrate, and the multi-layer substrate is connected to a substrate of a liquid crystal panel.

In the liquid crystal display device of the present invention, the first wiring layer and the second wiring layer made of aluminum or copper are electrically connected to each other in the first wiring layer, the insulating layer, the second wiring layer and the insulating layer. It is equipped with a multi-layer substrate made of glass made of through holes, and a liquid crystal driving semiconductor device is connected to the multi-layer substrate.
Further, the multi-layer substrate is connected to the substrate of the liquid crystal panel.

In the liquid crystal display device of the present invention, the first wiring layer and the second wiring layer made of aluminum or copper are electrically connected to each other in the first wiring layer, the insulating layer, the second wiring layer and the insulating layer. A multi-layer substrate composed of through-holes is provided, and a liquid crystal driving semiconductor device is connected to the multi-layer substrate by a bonding agent containing conductive particles, and further the multi-layer substrate is connected to a liquid crystal panel substrate by a bonding agent containing conductive particles. Is characterized by.

[0018]

According to the present invention, a liquid crystal driving semiconductor device and a multilayer substrate on which the liquid crystal driving semiconductor device is mounted are provided, and a bonding agent containing conductive particles for connecting the multilayer substrate and the ITO wiring pattern from the display section is provided. ing.

The liquid crystal driving semiconductor device and the first of the multi-layer substrates
For connection with the wiring layer, a through hole is provided in the insulating layer, and the input terminal of the liquid crystal driving semiconductor device connected to the surface of the substrate is connected to the first wiring layer.

Further, the first wiring layer connected to the input terminal of the liquid crystal driving semiconductor device by using the through hole extends to the end face of the multi-layer substrate, and the signal input to the liquid crystal driving semiconductor device is at this portion. It can be carried out.

In the present invention, by using the multi-layer substrate, the wiring circuit and the portion on which the liquid crystal driving semiconductor device is mounted can be integrated, and the area other than the display portion of the liquid crystal panel can be reduced.

Further, the input terminal of the liquid crystal driving semiconductor device does not pass through the ITO wiring as in the prior art. For this reason,
The liquid crystal display device of the present invention can have a low resistance circuit.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The structure of a liquid crystal display device according to an embodiment of the present invention will be described below with reference to the drawings. 1 is a plan view showing a liquid crystal display device according to an embodiment of the present invention, and FIG.
3 is a cross-sectional view taken along line AA of FIG. FIG. 5 is a plan view of the multilayer substrate. Hereinafter, description will be made by alternately using FIGS. 1, 2, and 5.

As shown in FIG. 1, the first substrate 11 and the second substrate 11
The multi-layer substrate 14 on which the liquid crystal driving semiconductor device 13 is mounted is connected to the wiring pattern 17 of the margin 22 of the liquid crystal panel which is configured by the substrate 12 of FIG.

The material of the base substrate of the multi-layer substrate 14 is the same glass as the glass of the substrate material of the liquid crystal panel so as to have the same coefficient of thermal expansion, and the thickness thereof is 2 to 3 mm.

As shown in FIGS. 2 and 5, for connecting the first wiring layer 20, the insulating layer having the through holes 18 and the wiring pattern 17 with aluminum on the glass substrate which is the base of the multilayer substrate 14. The second wiring layer 21 is provided. Then, the liquid crystal driving semiconductor device 13 is configured to be connected to the through hole 18 and the second wiring layer 21.

The multi-layer substrate 14 is made of aluminum having a coefficient of thermal expansion close to that of glass as the first wiring layer 20 on a glass substrate serving as a base, and a circuit for transmitting an input signal from an external device has a thickness of 5 to 5 by a vacuum deposition method. 10 μm is formed, and a nickel film having a large electric conductivity is plated on the surface to form a film of 1-2.
μm is formed. As described above, the multilayer substrate 14 of the present invention has two
It has a layered structure.

A circuit is formed on the first wiring layer 20 using a photosensitive resin material of polyimide as an insulating layer, exposed and developed in a photolithography process, and a second wiring circuit 21 is formed thereon. Through hole for connecting 1
8 is formed.

The second wiring circuit 2 shown in FIG. 5, which is connected to the wiring pattern 17 on the liquid crystal panel side, is formed on the insulating film.
1 is formed by plating 1 layer of copper having a thickness of about 18 μm, or a circuit having a two-layer structure in which gold (Au) having a thickness of 1 to 2 μm is formed on the copper layer by plating is formed. 14

The liquid crystal driving semiconductor device 13 is a multilayer substrate 14.
The conductive bonding agent 15 is used for adhesion to the above, and conduction and adhesion are performed at the same time.

The conductive bonding agent 15 is, as shown in FIG.
A sheet-like conductive joint in which metal particles such as silver or solder having a diameter of 5 to 10 μm or plastic resin particles having gold (Au) plating on the surface thereof are mixed in order to make the epoxy adhesive sheet have conductivity. Agent 23 may be used.

The sheet-shaped conductive bonding agent 23 is sandwiched between the multi-layer substrate 14 and the liquid crystal driving semiconductor device 13 mounted thereon, and is pressure-bonded while being heated to a temperature of 160 to 180 ° C.
Conduction is achieved by sandwiching conductive particles between the electrode terminals of the liquid crystal driving semiconductor device 13 and the circuit on the side of the multilayer substrate 14, and the liquid crystal driving semiconductor device 13 is bonded by an adhesive component.
And install.

In the multi-layer substrate 14 on which the liquid crystal driving semiconductor device 13 is mounted, the second wiring layer 21 is the blank portion 2 of the liquid crystal panel.
Conductive bonding agent 1 so as to be connected to the wiring pattern 17 of 2.
5 or the sheet-shaped conductive bonding agent 23 containing the above-mentioned conductive particles is used for adhesion.

The liquid crystal driving semiconductor device 13 is a multilayer substrate 14.
Then, the epoxy resin encapsulant 16 is formed so as to protect the liquid crystal driving semiconductor device 13.

In the above description of the embodiments, the encapsulant 16 seals only the driving semiconductor device. However, the encapsulant 16 is applied after the multilayer substrate 14 is connected to the liquid crystal panel. The sealing agent 16 is formed on the multilayer substrate 14 as shown in FIG.
It may be formed so as to extend over both the liquid crystal panel substrate and the liquid crystal panel substrate.

[0036]

As is apparent from the above description, in the present invention, the liquid crystal driving semiconductor device is mounted on a separately manufactured substrate without directly connecting the liquid crystal driving semiconductor device to the frame portion of the liquid crystal panel. In addition, the substrate on which the liquid crystal driving semiconductor device is mounted is multi-layered, and the circuit conventionally formed in the FPC is also formed in this substrate.

Therefore, the area of the margin portion of the liquid crystal panel other than the display portion can be reduced unlike the conventional means. Further, in the past, the input signal to the liquid crystal driving semiconductor device passed through the ITO wiring,
According to the present invention, the resistance of the input signal to the liquid crystal driving semiconductor device can be reduced because it passes through the metal wiring in the multilayer substrate.

[Brief description of drawings]

FIG. 1 is a plan view showing a liquid crystal display device in an example of the present invention.

FIG. 2 is a cross-sectional view showing a liquid crystal display device in an example of the present invention.

FIG. 3 is a sectional view showing a liquid crystal display device in an example of the present invention.

FIG. 4 is a cross-sectional view showing a liquid crystal display device in an example of the present invention.

FIG. 5 is a plan view showing a structure of a multi-layer substrate applied to the liquid crystal display device in the example of the present invention.

FIG. 6 is a plan view showing a liquid crystal display device in a conventional example.

FIG. 7 is a cross-sectional view showing a liquid crystal display device in a conventional example.

[Explanation of symbols]

 11 First Substrate 12 Second Substrate 13 Liquid Crystal Driving Semiconductor Device 14 Multilayer Substrate 15 Conductive Adhesive 20 First Wiring Layer 21 Second Wiring Layer 22 Blank Area

Claims (3)

[Claims] 1. A multi-layer substrate comprising a first wiring layer made of aluminum or copper, an insulating layer, a second wiring layer, and a through hole for electrically connecting the first wiring layer and the second wiring layer in the insulating layer. And a liquid crystal driving semiconductor device is connected to the multilayer substrate, and the multilayer substrate is further connected to a substrate of a liquid crystal panel. 2. A glass made of a through hole for electrically connecting the first wiring layer and the second wiring layer in the first wiring layer, the insulating layer, the second wiring layer and the insulating layer made of aluminum or copper. A liquid crystal display device comprising: a multi-layer substrate made of substrates; a liquid crystal driving semiconductor device being connected to the multi-layer substrate; and the multi-layer substrate being connected to a substrate of a liquid crystal panel. 3. A multilayer substrate comprising a first wiring layer made of aluminum or copper, an insulating layer, a second wiring layer, and a through hole for electrically connecting the first wiring layer and the second wiring layer in the insulating layer. And a liquid crystal driving semiconductor device is connected to the multilayer substrate with a bonding agent containing conductive particles, and the multilayer substrate is connected to a substrate of a liquid crystal panel with a bonding agent containing conductive particles. apparatus.