JPH0828400B2 - Electric circuit member - Google Patents

Description

TECHNICAL FIELD The present invention relates to an electric circuit member.

[Prior Art] Conventionally, the following technology has been known as a technology relating to an electric circuit member configured by electrically connecting electric circuit components to each other.

Wire Bonding Method, FIGS. 13 and 14 show a typical example of a semiconductor device which is connected and sealed by the wire bonding method, and the wire bonding method will be described below with reference to FIGS. 13 and 14. .

In this method, the semiconductor element 4 is fixedly supported on the element mounting portion 2 using Ag paste 3 or the like, and then the connecting portion 5 of the semiconductor element 4 and the desired connecting portion 6 of the lead frame 1 are made of a fine metal such as gold. This is a method of electrically connecting using the metal wire 7.

After the connection, the semiconductor element 4 and the lead frame 1 are sealed with a resin 8 by a method such as a transfer molding method, and then an unnecessary portion of the lead frame 1 extending from the resin sealing portion is cut. The bent semiconductor device 9 is formed into a desired shape.

TAB (Tape Automated Bonding) method.
FIG. 15 shows a typical example of a semiconductor device connected and sealed by the TAB method.

This method is an automatic bonding method using a tape carrier method. That is, referring to FIG. 15, after positioning the carrier film substrate 16 and the semiconductor element 4, the inner lead portion of the carrier film substrate 16 is positioned.
In this method, 17 and the connection portion 5 of the semiconductor element 4 are connected by thermocompression bonding. After the connection, the semiconductor device 9 is sealed with resin 20 to resin 21.

CCB (Controlled Collapse Bonding) method (for example, JP-B-42-2096 and JP-A-60-57944) FIG. 16 shows a typical example of a semiconductor device connected and sealed by the CCB method. This method will be described with reference to FIG. This method is also called a flip chip bonding method.

The solder bumps 31 are provided in advance on the connecting portions 5 of the semiconductor element 4,
The semiconductor element 4 provided with the solder bumps 31 is connected to the circuit board 32.
Position and mount on top. Thereafter, the semiconductor element 4 is connected to the circuit board 32 by heating and melting the solder, and the semiconductor device 9 is manufactured by sealing after flux cleaning.

17 and 18, that is, an insulating film 71 made of polyimide or the like is formed on a portion other than the connection portion 5 of the first semiconductor element 4, and a metal material 70 made of Au or the like is provided on the connection portion 5. , Then metal material 70
And the exposed surfaces 73, 72 of the insulating film 71 are flattened. Meanwhile, the second
An insulating film 71 'made of polyimide or the like is formed on a portion of the semiconductor element 4'other than the connecting portion 5', and Au is formed on the connecting portion 5 '.
And the like, and then the exposed surfaces 73 'and 72' of the metal material 70 'and the insulating film 71' are flattened.

Then, as shown in FIG. 18, the first semiconductor element 4 and the second semiconductor element 4 ′ are positioned, and after positioning, thermocompression bonding is performed to connect the first semiconductor element 4 and the second semiconductor element 4 ′ with the second semiconductor element 4. The connecting portion 5'of the semiconductor element 4'is connected through the metal members 70, 70 '.

The method shown in FIG. 19, that is, an anisotropic conductive film 78 in which conductive particles 79 are dispersed in an insulating material 77 is interposed between the first circuit substrate 75 and the second circuit substrate 75 ′, First circuit board 75 and second circuit board
After positioning 75 ', pressurization or pressurization / heating is performed to connect the connecting portion 76 of the first circuit board 75 and the second circuit board 75'.
This is a method of connecting the connection portion 76 'of.

20. That is, an elastic connector 83 in which a metal wire 82 of Fe, Cu or the like is arranged in a certain direction in an insulating substance 81 between a first circuit substrate 75 and a second circuit substrate 75 '. The first circuit board 75 and the second circuit board 75 'are positioned with the interposition of, and then pressure is applied to connect the first circuit board 75 to the connection part 76 of the first circuit board 75 and the second circuit board 7'.
This is a method of connecting the 5'connection portion 76 '.

[Problems to be Solved by the Invention] The conventional bonding method described above has the following problems.

Wire Bonding Method When the connecting portion 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the ultrafine metal wire 7 has an extremely small wire diameter, and therefore the outer peripheral edge portion 10 of the semiconductor element 4 or the lead frame 1 is formed. It becomes easy to contact the outer peripheral edge portion 11 of the element mounting portion 2. When the ultrafine metal wire 7 contacts these outer peripheral edge portions 10 to 11, a short circuit occurs. Further, the length of the ultrafine metal wire 7 must be increased, and if the length is increased, the ultrafine metal wire 7 is easily deformed during transfer molding.

Therefore, the connecting portion 5 of the semiconductor element 4 needs to be arranged on the periphery of the semiconductor element 4, and the circuit design must be restricted.

In the wire bonding method, in order to avoid contact between adjacent ultrafine metal wires 7 or the like, the pitch dimension of the connection portions 5 on the semiconductor element 4 (distance between centers of adjacent connection portions)
There is no choice but to take some distance. Therefore, if the size of the semiconductor element 4 is determined, the maximum number of the connecting portions 5 is inevitably determined. However, in the wire bonding method, since the pitch dimension is as large as about 0.2 mm, the connecting portion 5
There is no choice but to reduce the number of.

The height h of the ultrafine metal wire 7 measured from the connecting portion 5 on the semiconductor element 4 is usually 0.2 to 0.4 mm, but it is relatively difficult to reduce the height to 0.2 mm or less, and thus it cannot be made thin.

Wire bonding work takes time. Particularly, if the number of connection points is large, the bonding time becomes long and the production efficiency deteriorates.

If the transfer mold condition range is exceeded for some reason, the ultrafine metal wire 7 is deformed or, in the worst case, cuts.

Further, in the connection portion 5 on the semiconductor element 4, Al that is not alloyed with the ultrafine metal wire 7 is exposed, so that Al corrosion is likely to occur and the reliability is deteriorated.

TAB method When the connecting portion 5 of the semiconductor element 4 is designed to be inside the semiconductor element 4, the inner lead portion 17 of the carrier film substrate 16 has a long length l.
17 is easily deformed, and the inner lead part is connected to the desired connection part 5.
Or the inner lead portion 17 comes into contact with a portion of the semiconductor element 4 other than the connecting portion 5. In order to avoid this, it is necessary to bring the connecting portion 5 of the semiconductor element 4 to the periphery of the semiconductor element 4, which is a design limitation.

Also in the TAB method, the pitch dimension of the connection portions on the semiconductor element 4 needs to be set to about 0.09 to 0.15 mm. Therefore, similarly to the problem of the wire bonding method, it is difficult to increase the number of connection portions.

In order to prevent the inner lead portion 17 of the carrier film substrate 16 from coming into contact with the portion other than the connecting portion 5 of the semiconductor element 4, a desired connection shape of the inner lead portion 17 is required, which results in high cost.

In order to connect the connection portion 5 of the semiconductor element 4 and the inner lead portion 17, it is necessary to attach a gold bump to the connection portion 5 of the semiconductor element 4 or the connection portion of the inner lead portion 17, resulting in a high cost.

CCB method Since the solder bumps 31 must be formed on the connecting portions 5 of the semiconductor element 4, the cost becomes high.

If there is a large amount of solder on the bumps, adjacent solder bumps and bridges (a phenomenon in which adjacent solder bumps contact each other) occur,
On the contrary, if the number is small, the connection part 5 of the semiconductor element 4 and the connection part of the substrate 32
33 is not connected and electrical continuity is lost. That is, the reliability of the connection is reduced. Furthermore, there is a problem that the amount of solder and the solder shape of the connection affect the reliability of the connection (Brazing Technology Study Group Technical Data, No.017-'84, Brazing Technology Study Group issue).

As described above, the amount of solder bumps 31 affects the reliability of the connection, so that it is necessary to control the amount of solder bumps 31.

If the solder bumps 31 are present inside the semiconductor element 4, it becomes difficult to perform a visual inspection as to whether or not the connection is made well.

Poor heat dissipation characteristics of semiconductor devices (Reference: Electronic
Packaging Technology 1987, 1 (Vol.3, No.1) P.66〜7
1 NIKKEI MICRODEVICES, 1986 May. P.97-108)
A great deal of work is required to achieve good heat dissipation characteristics.

The technique shown in FIGS. 17 and 18 The exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 70, and the exposed surface 72 'of the insulating film 71' and the exposed surface 73 'of the metal material 70' must be flattened. It is necessary to increase the number of man-hours and the cost for that.

When the exposed surface 72 of the insulating film 71 and the exposed surface 73 of the metal material 70 or the exposed surface 72 'of the insulating film 71' and the exposed surface 73 'of the metal material 70' have irregularities, the metal material 70 and the metal material 70 'are separated from each other. The connection is lost and reliability is reduced.

Technology shown in Fig. 19 When pressure is applied between the connection part 76 and the connection part 76 'after positioning, pressure is less likely to be applied constantly, resulting in variations in the connection state, resulting in contact at the connection part. The variation in resistance value increases. Therefore, the reliability of the connection becomes poor. Further, when a large amount of current is passed, a phenomenon such as heat generation occurs, which is not suitable when a large amount of current is desired to be passed.

Even if a constant pressure is applied, the dispersion of the resistance value increases due to the arrangement of the conductive particles 79 of the anisotropic conductive film 78. Therefore, the reliability of the connection becomes poor. Moreover, it is not suitable for a connection that requires a large current capacity.

If the pitch of the adjacent connecting portions (the distance between the centers of the connecting portions adjacent to the connecting portions) is narrowed, the resistance value between the adjacent connecting portions becomes small, which is not suitable for high-density connection.

Since the resistance value changes due to the variation in the protrusion amount h1 of the connection portions 76 and 76 'of the circuit substrates 75 and 75', it is necessary to accurately suppress the variation amount of h1.

Furthermore, an anisotropic conductive film is used to connect the semiconductor element to the circuit substrate,
Further, when it is used for connecting the first semiconductor element and the second semiconductor element, in addition to the above-mentioned drawbacks, a bump must be provided at the connecting portion of the semiconductor element, resulting in a high cost. .

Technology shown in Fig. 20 Pressurization is required, and a pressure jig is required.

The metal wire 82 of the elastic connector 83 and the first circuit board
The contact resistance of the connection part 75 of the second circuit substrate 75 'with the connection part 76' of the second circuit substrate 75 'varies depending on the pressing force and the surface condition, so that the connection reliability is poor.

Since the metal wire 82 of the elastic connector 83 is a rigid body, if the pressing force is large, the elastic connector 83, the first
There is a high possibility that the surfaces of the circuit base material 75 and the second circuit base material 75 'will be damaged. Further, if the applied pressure is small, the reliability of the connection becomes poor.

Further, the protrusion amount h2 of the connecting portions 76, 76 'of the circuit board 75, 75', and the protrusion amount h3 of the metal wire 82 of the elastic connector 83 and its variation affect the resistance value change and damage. A device to reduce the number is required.

Further, when the elastic connector is used for connecting the semiconductor element and the circuit substrate, and for connecting the first semiconductor element and the second semiconductor element, the same drawbacks as the above occur.

The present invention solves all the above problems,
It proposes a new electrical circuit member with high density, high reliability, and low cost. Not only can the conventional connection method be replaced, but high density multi-point connection can be obtained and various characteristics such as heat can be improved. It can be done.

[Means for Solving the Problems] The present invention electrically connects a first electric circuit component having a connecting portion and a second electric circuit component having a connecting portion to both electric circuit components. In the electric circuit member configured by interposing the electric connecting member of 1 between the two and connecting at the connection portion of both electric circuit components, the electric connecting member is a plurality of metal members made of metal or alloy. , Exposing one end of the metal member to the first electric component side and exposing the other end of the metal member to the second electric circuit component side so that the respective metal members are electrically insulated from each other. As described above, one or both of powder and fibers made of an inorganic material are dispersed in the insulator, and the first electric circuit component is connected to the insulator. Section and one end of the metal member exposed on the side of the first electric circuit component An electric circuit characterized in that the connection is made by converting into gold and the connection portion of the second electric circuit component and one end of the metal member exposed on the second electric circuit component side are alloyed to be connected. It has its gist as a member.

Examples of the electric circuit component in the present invention include a circuit board such as a semiconductor element, a resin circuit board, a ceramic board, a metal board (hereinafter may be simply referred to as a circuit board), and a lead frame. That is, any of these components may be used as the first electrical circuit component, and any of these components may be used as the second electrical circuit component.

A component having a connecting portion as an electric circuit component is an object of the present invention. The number of connecting portions is not limited, but the effect of the present invention becomes more remarkable as the number of connecting portions increases.

Further, the location of the connection portion does not matter, but the effect of the present invention becomes more remarkable as the location inside the electric circuit component.

In the present invention, the first electric circuit component and the second electric circuit component are connected using the electric connection member.

The electrical connection member according to the present invention is configured by embedding a plurality of metal members in an insulator. The metal members are insulated from each other by an insulator, one end of the metal member is exposed to the first electric circuit component side, and the other end is exposed to the second electric circuit component side. Further, one or both of powder and fibers made of an inorganic material are dispersed in the insulator.

Here, gold is preferable as the material of the metal member,
Any metal or alloy other than gold can also be used. For example, Cu, Al, Sn, Pb-Sn, and other metals or alloys can be used.

Furthermore, the cross section of the metal member can be circular, square, or any other shape.

Further, the thickness of the metal member is not particularly limited. The pitch may be 20 μmφ or more or 20 μmφ or less in consideration of the pitch of the connection portion of the electric circuit component.

The exposed portion of the metal member may be flush with the insulator, or may be protruded from the insulator surface. This protrusion may be on one side or both sides. If it is further projected, it may be formed into a bump shape.

The spacing between the metal members may be the same as the spacing between the connecting portions of the electric circuit component, or may be narrower than that. When the distance is narrow, the electric circuit component and the electric connecting member can be connected without positioning the electric circuit component and the electric connecting member.

Further, the metal member does not need to be vertically arranged in the insulator, and may be slanted from the first electric circuit component side toward the second electric circuit component side.

Further, the electrical connecting member may be composed of one layer or a multilayer of two or more layers.

In the present invention, one or both of powder and fibers made of an inorganic material are dispersed in the insulator.

Here, the inorganic material means a material other than a metal material and an organic material, for example, SiC, BeO, B ₂ C, TaC, TiB ₂ , CrB.
Examples thereof include ceramics such as ₂ , ₂ , TiN, BP, BN, AlN, Si ₃ N ₄ and SiO ₂ , diamond, C, B and glass. One or more kinds of powders or fibers made of these inorganic materials may be used. Moreover, only one of the powder and the fiber may be used, or both may be used.

The size and shape of the powder and fibers to be dispersed, and the distribution position and number in the insulator, the metal members embedded in the insulator may contact or short-circuit due to the powder or the fiber, It is arbitrary as long as it is not cut.
However, the size of the powder and the fiber is preferably smaller than the distance between the adjacent metal members. That is, it is preferable that the metal members do not come into contact with each other even through the powder and the fiber. Further, the powder and fibers may or may not be exposed to the outside of the insulator. Further, the powder and the fibers may or may not be in contact with each other.

The insulator of the electrical connection member is not particularly limited as long as it is an insulating substance. For example, an insulating resin may be used. Furthermore, when a resin is used, the type of resin does not matter. Either a thermosetting resin or a thermoplastic resin may be used. For example, polyimide resin, polyphenylene sulfide resin, polyether sulfone resin, polyether imide resin, polysulfone resin, silicone resin, fluororesin, polycarbonate resin, polydiphenyl ether resin, polybenzyl imidazole resin, phenol resin, urea resin, melamine resin , Alkyd resin, epoxy resin, polyamideimide resin, polypropylene resin, polyvinyl chloride resin, polystyrene resin and other resins can be used.

When the above resin is used as the material of the insulator, the powder or fiber may be dispersed in the insulator by adding the powder or fiber to the resin and stirring the resin. Of course, the powder or the fibers may be dispersed in the insulator by any other method than the above method.

It is more preferable to use a resin having good thermal conductivity from these resins, because even if the semiconductor element has heat, the heat can be radiated through the resin. Furthermore, if a resin having the same or similar coefficient of thermal expansion as the circuit board is selected as the resin, it is possible to further prevent the deterioration of the reliability of the device due to the thermal expansion / contraction.

In the present invention, further, the connection portion of the first electric circuit component and the one end of the metal member of the electric connection member exposed on the first electric circuit component side are connected by alloying, and the second electric circuit is connected. The connection portion of the component and the one end of the metal member of the electric connection member exposed on the second electric circuit component side are connected by alloying. That is, in the present invention, both the first electric circuit component and the second electric circuit component are alloyed.

As an alloying method, for example, heating may be performed at an appropriate temperature after the corresponding connecting portions are brought into contact with each other. The heating causes diffusion of atoms and the like in the connection portion, a layer made of a solid solution or an intermetallic compound is formed on the surface of the connection portion, and the connection portions are alloyed. When Au is used for the metal member of the electrical connecting member and Al is used for the connecting portion of the electric circuit component, the heating temperature of 200 to 350 ° C. is preferable.

[Operation] In the present invention, since the above-described electrical connection member is used, it is possible to dispose the connection portion of the electric circuit component inside, so that the number of connection portions can be increased, which in turn increases the density. Can be realized.

Also, the electrical connection member can be thin,
From this aspect, it is possible to reduce the thickness.

Furthermore, since the amount of the metal member used for the electrical connection member is small, the cost is low even if expensive gold is used as the metal member.

In the present invention, both of the electric circuit parts are alloyed via the electric connecting member and the electric circuit parts are firmly (strongly strong) and surely connected to each other, so that they are mechanically strong,
An electric circuit member having an extremely low defect rate can be obtained.

Further, since both of the electric circuit parts are alloyed via the electric connection member, it is not necessary to hold the electric circuit parts by using a jig or the like during and after the process of forming the electric circuit member, It is easy to create an electric circuit member and manage it after creation.

Since both of the electric circuit components are alloyed via the electrical connecting member, the contact resistance between the electric circuit components is smaller than that in the case where only one of them is alloyed.

In the present invention, since the powder or fibers are dispersed in the insulator of the electrical connection member, the thermal conductivity from the first electrical circuit component to the second electrical circuit component and the second electrical circuit component are improved. The thermal conductivity from the circuit component to the first electric circuit component is improved. That is, the thermal conductivity of the electrical connection member is good,
If an electric circuit component having a large heat generation amount is used as the first electric circuit component and an electric circuit component having a small heat effect is selected as the second electric circuit component, the heat generated from the first electric circuit component is , Is quickly conducted to the second electric circuit component through the electric connection member, and this heat is radiated from the second electric circuit component. Therefore, it becomes possible to obtain an electric circuit member having excellent heat dissipation characteristics.

[Embodiment] (First Embodiment) A first embodiment of the present invention will be described with reference to FIGS. 1 and 2.

In this embodiment, a circuit board 101, which is a first electric circuit component having a connecting portion 102, and a circuit board 104, which is a second electric circuit component having a connecting portion 105, are electrically connected to each other. In an electric circuit member configured by interposing an electric connecting member 125 for connection between the two, and connecting at the connecting portions 102, 105 of both circuit boards 101, 104, the electric connecting member 125 is made of metal or alloy. The plurality of metal members 107 are electrically insulated from each other, and one end of the metal members 107 is exposed to the first circuit board 101 side, while the other metal members 107 are The end is exposed to the side of the second circuit board 104 and is embedded in the insulator 111, and the insulator 111 is composed of powder or fibers made of a plurality of inorganic materials (not shown). One or both of them are dispersed, and are connected to the connecting portion 102 of the circuit board 101 of FIG. Circuit board 10 of the
The one end of the metal member 107 exposed on the 1 side is connected by alloying, and the connecting portion 105 of the second circuit board 104 and the one end of the metal member 107 exposed on the second circuit board 104 side are connected. They are connected by alloying.

 This embodiment will be described in more detail below.

First, the electrical connection member 125 will be described while describing an example of manufacturing the electrical connection member 125.

 FIG. 2 shows one manufacturing example.

First, as shown in FIG. 2 (a), a metal wire 121 made of a metal or alloy such as gold having a diameter of 20 μm is provided with a pitch of 40 μm.
As a wire, the metal wire 121 is embedded in a resin 123 such as polyimide after winding. Before embedding, a powder of Sia ₂ is mixed in the resin 123 and stirred to disperse the powder in the resin. After embedding, the resin 123 is cured. The cured resin 123 becomes an insulator. Then the dotted line 1
Slice cutting is performed at the position of 24 to make the electrical contact member 125. The electrical connection member 125 thus produced is shown in FIGS. 2 (b) and 2 (c).

In this example, the resin is stirred to disperse the powder, but the powder may be dispersed by another method.

Further, in the present example, the powder made of SiO ₂ is dispersed in the resin 123, but powder or fibers made of an inorganic material other than SiO ₂ may be dispersed.

In the electrical connection member 125 created in this way,
The metal wire 121 constitutes the metal member 107, and the resin 123 is the insulator 111.
Is configured.

In the electrical connection member 125, the metal wires 121, which are metal members, are electrically insulated by the resin 123.
Further, one end of the metal wire 121 is exposed on the circuit board 101 side, and the other end is exposed on the circuit board 104 side. The exposed portions become connection portions 108 and 109 with the circuit boards 101 and 104, respectively.

Next, the first circuit board 101, the electrical connection member 125, the second
The circuit board 104 of is prepared. Circuit board 10 used in this example
As shown in FIG. 1, the 1,104 has a large number of connecting portions 102,105 therein.

The connection portion 102 of the first circuit board 101 is the connection portion 105 of the second circuit board 104 and the connection portion 10 of the electrical connection member 125.
Metal is exposed at the positions corresponding to 8,109.

The connecting portion 102 of the first circuit board 101 and the electrical connecting member 12
5 or the connecting portion 1 of the second circuit board 104.
Positioning is performed so that 05 and the connection portion 109 of the electrical connection member 125 correspond, and after positioning, both are alloyed and connected.

Here, the first circuit board 101, the electrical connection member 12
5. The following three methods exist for connecting the second circuit board 104, but any of these methods may be used.

After positioning the first circuit board 101, the electrical connection member 125, and the second circuit board 104, the connection portion of the first circuit board 101
102 and the connecting portion 108 of the electrical connecting member 125, and the connecting portion 1 5 of the second circuit board 104 and the electrical connecting member 125.
The first circuit board 101 and the electrical connection member 125 are positioned by alloying with 09 at the same time, and the connection portion 102 of the first circuit board 101 and the electrical connection member 12 are positioned.
A method of alloying and connecting the connection part 108 of 5 and then positioning the second circuit board 104, and alloying and connecting the connection part 109 of the electrical connection member 125 and the connection part 105 of the second circuit board 104. .

The second circuit board 104 and the electrical connection member 125 are positioned, and the connection portion 105 of the second circuit board 104 and the electrical connection member 12 are positioned.
After alloying and connecting with the connection portion 109 of 5, the first circuit board 101 is positioned, and the connection portion 108 of the electrical connection member 125 and the connection portion 102 of the first circuit board 101 are alloyed and connected. Method.

When the connectivity of the electrical circuit member produced as described above was examined, it was found to be connected with high reliability.

 The heating characteristics were also good.

(Second Embodiment) FIG. 3 shows a second embodiment.

In this example, the circuit board 51 is used as the first electric circuit component having the connecting portion 52, and the semiconductor element 4 having a large number of connecting portions 5 therein is used as the second electric circuit component.

The alloying is performed between the connection portion 5 of the semiconductor element 4 and the connection portion 52 of the circuit board 51 and the connection portion 54 of the electrical connection member 125 in which one or both of the powder and the fibers made of an inorganic material are dispersed. I did.

As the electrical connection member 125 in which one or both of the powder and the fiber made of an inorganic material are dispersed, one having a size corresponding to the semiconductor element 4 was used.

After alloying and connection, the lead frame 55 was connected to the lower surface of the circuit board 51.

 The other points are similar to those of the first embodiment.

Also in this example, the connection portion was connected with high reliability.

 Also, the heat dissipation characteristics were good.

(Third Embodiment) FIG. 4 shows a third embodiment.

In this example, the first electric circuit component is the semiconductor element 4,
This is an example in which the second electric circuit component is the circuit board 51.

After connection, the lead frame 1 is placed on the upper surface of the circuit board 51.
Were connected and sealed with a sealing material 63.

 The other points are similar to those of the first embodiment.

Also in this example, the connection portion was connected with high reliability.

 Also, the heat dissipation characteristics were good.

(Fourth Embodiment) FIG. 5 shows a fourth embodiment.

This example is an example in which the first electric circuit component is the semiconductor element 4'and the second electric circuit component is the semiconductor element 4. In this example, the dimensions corresponding to the semiconductor element 4 are used as the electrical connection members. The lead frame 1 is connected to the metal member exposed on the first semiconductor element 4 ′ side of the electrical connection member 125.

 Others are the same as the third embodiment.

Also in this example, the connection portion was connected with high reliability.

 Also, the heat dissipation characteristics were good.

(Fifth Embodiment) FIG. 6 shows a fifth embodiment.

The fifth embodiment is an example in which, as the first electric circuit component and the second electric circuit component, circuit boards 101 and 104 in which portions other than the connection portions are covered with insulating films 103 and 106 are used.

As the electrical connecting member, the one shown in FIG. 7 was used. That is, in the electrical connection material 125 in which one or both of the powder and the fibers made of an inorganic material are dispersed in the insulator 111 shown in FIG. Protruding from. The electrical connection member 125 as described above may be produced, for example, by the following method.

First, the electrical connection member shown in FIGS. 2B and 2C is prepared by the method described in the first embodiment. Next, both surfaces of this electrical connection member may be etched until the metal wire 121 protrudes from the polyimide resin 123 by about 10 μm.

Although the amount of protrusion of the metal wire 121 is 10 μm in this embodiment, any amount may be used.

Further, the method of projecting the metal wire 121 is not limited to etching, and other chemical method or mechanical method may be used.

 The other points are similar to those of the first embodiment.

It should be noted that the protruding portion may be sandwiched in a mold having a recess at the position of the metal wire 121 and the protrusion 126 of the metal wire 121 may be crushed to form a bump 150 as shown in FIG. Good. In this case, the metal wire 121 is less likely to fall off the insulator 111.

Also in this example, the metal wire 121 constitutes the metal member 107,
Further, the resin 123 constitutes the insulator 111.

In order to create bumps, the protrusions are melted by heat,
Bumps may be created or any other method.

Also in this example, the connection portion was connected with high reliability.

 Also, the heat dissipation characteristics were good.

(Sixth Embodiment) FIG. 9 shows a sixth embodiment.

In this example, the semiconductor element 4 is used as the first electric circuit component, and the lead frame 1 is used as the second electric component.

 The other points are the same as in the fifth embodiment.

Also in this example, the connection portion was connected with high reliability.

 Also, the heat dissipation characteristics were good.

(Seventh Embodiment) FIG. 10 shows a seventh embodiment.

In this example, the electrical connecting member 125 is different from the electrical connecting member shown in the fifth embodiment. That is, in the electrical connection member 125 of this example, the pitch between the metal members is narrower than that shown in the fifth embodiment. That is, in this example, the pitch between the metal members 107 is set to be narrower than the distance between the first circuit board connecting portions.

That is, in the fifth embodiment, the first circuit board 101 and the second circuit board 101
Since the connection position of the electrical connection member 125 is arranged at the connection position with the circuit board 104, it is necessary to position the electrical connection member 125. However, in this example, the first circuit board 101 and the second
Although the positioning with respect to the circuit board 104 is necessary, the positioning with the electrical connection member 125 is not necessary. Therefore, the first
Dimensions of the circuit board 101 and the second circuit board 104 (d11, P1
It is also possible to connect without positioning by selecting appropriate values for the connection dimensions (d12, P12) of 1) and the electrical connection member.

Also in this example, the connection portion was connected with high reliability.

 Also, the heat dissipation characteristics were good.

(Eighth Embodiment) FIG. 11 shows an electrical connecting member used in the eighth embodiment.

FIG. 11 (a) is a perspective view of the electrical connecting member, and FIG. 11 (b) is a sectional view of the electrical connecting member.

 An example of making such an electrical connection member will be described below.

First, by the manufacturing method shown in the first embodiment, three electrical connecting members 128, 129, and 130 in which one or both of powder and fibers made of an inorganic material are dispersed in an insulator are prepared.

The position of the metal wire 121 of the first sheet 128 is at the m-th row and the n-th column, ma, nb
Only displaced from the center. The position of the metal wire 121 of the second sheet 129 is displaced from the center by mac and nbc at the m-th row and the n-th column.
The position of the metal wire 121 of the third sheet 130 is displaced from the center by mad, nbd in m rows and n columns. The values of a, b, c, and d are such that the upper and lower metals 121 are conductive, but the left and right metals 121 are not electrically conductive with each other. The three electrical connecting members are positioned and laminated by a method such as thermocompression bonding to form the electrical connecting member 125.

In addition, in this example, the position of the metal of the electrical connection member is selected according to a rule such as m rows and n columns.
It may be random as long as the upper and lower metals are electrically connected and the left and right metals are not electrically connected to each other.

In addition, although the case where three layers are stacked is described in this example,
Any number may be used as long as it is two or more. Moreover, although it has been described that the layers are laminated by using a thermocompression bonding method, a method such as pressure bonding or adhesion may be used. Further, the electrical connection member of this example may be processed to provide protrusions as shown in FIG. 7, or bumps 150 as shown in FIG.

Also in this example, the connection portion was connected with high reliability.

 Also, the heat dissipation characteristics were good.

(Ninth Embodiment) FIG. 12 shows an electrical connecting member used in the ninth embodiment.

FIG. 12 (a) is a cross-sectional view of the electrical connecting member during manufacture,
FIG. 12 (b) is a perspective view of the electrical connecting member, and FIG. 12 (c) is the above sectional view.

First, the metal wire guide plates 131 and 132 are prepared. Then, the metal wire 121 is passed through the desired holes 133 and 134 formed in the metal wire guide plates 131 and 132 and stretched with a desired tension. Then, the resin 123 is poured between the metal wire guide plates 131 and 132 to be cured. Before pouring the resin 123, powder or fibers are added to the resin 123 in advance and the powder or fibers are dispersed in the resin. After that, the guide plate is removed and the electrical connection member 12
Create 5.

Further, the electrical connection member of this example may be processed to provide a protrusion as shown in FIG. 7 or a bump 150 as shown in FIG.

Each of the first circuit component and the second electric circuit component of this embodiment is one of circuit substrates such as a semiconductor element, a circuit board, and a lead frame. Also in this example, the connection portion was connected with high reliability.

 Also, the heat dissipation characteristics were good.

[Effects of the Invention] Since the present invention is configured as described above, the following various effects can be obtained.

1. Reliable connection can be obtained regarding the connection between the semiconductor element and the circuit substrate such as the circuit board and the lead frame. Therefore,
It is possible to replace the conventionally used wire bonding method, TAB method, and CCB method.

2. According to the present invention, since the connection portion of the electric circuit component can be arranged at any position (especially inside), it is possible to connect more points than the wire bonding method and the TAB method, and a method suitable for a high pin count connection. Becomes

Furthermore, since there is an insulating substance between the adjacent metals of the electrical connection member, there is no electrical continuity between the adjacent metals.
It enables more multi-point connection than the CCB method.

3. Since the amount of the metal member used in the electrical connection member is smaller than that of the conventional one, even if an expensive metal such as gold is used for the metal member, the cost will be lower than the conventional one.

4. High-density semiconductor devices can be obtained.

5. Both of the electric circuit parts are alloyed through the electric connection member, and the electric circuit parts are connected firmly (strong in strength) and securely, so they are mechanically strong and the defect rate is extremely low. An electric circuit member can be obtained.

6.Since both of the electric circuit parts are alloyed via the electric connection member, there is no need to hold the electric circuit parts with a jig or the like during and after the process of forming the electric circuit member, It is easy to create an electric circuit member and manage it after creation.

7. Since both of the electric circuit parts are alloyed via the electrical connection member, the contact resistance between the electric circuit parts is smaller than that in the case where only one is alloyed.

8. By selecting a material having good thermal conductivity as the electrically insulating material of the electrical connection member, the heat dissipation from the electric circuit component is improved, and a semiconductor device with good heat dissipation can be obtained.

9. Since the powder or fiber made of an inorganic material is dispersed in the insulator of the electrical connection member, electrical connection is achieved even if heat is generated in the first electrical circuit component or the second electrical circuit component. The heat is radiated to the outside through the member. Therefore, an electric circuit member having good heat dissipation can be obtained.

10. It is possible to obtain a highly reliable electric circuit member, and eventually a semiconductor device, in which thermal stress is less likely to occur even when heat is applied.

Of course, a highly reliable semiconductor device can be obtained by selecting a material having the same or similar coefficient of thermal expansion as the semiconductor element and the circuit substrate as the electrically insulating material of the electrical connection member.

By embedding or stacking another substance in the insulator of the electrical connection member, it is possible to obtain an electric circuit member with good heat dissipation, low stress, and shield efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a sectional view showing a first embodiment. Fig. 1 (a)
Shows the state before connection, and FIG. 2 (b) shows the state after connection. FIG. 2 is a view for explaining an example of a manufacturing method of the electrical connecting member used in the first embodiment, and FIG.
Is a sectional view, FIG. 2 (b) is a perspective view, and FIG. 2 (c) is a sectional view. FIG. 3 shows a second embodiment, FIG. 3 (a) is a perspective view, and FIG. 3 (b) is a sectional view. FIG. 4 is a sectional view showing the third embodiment. FIG. 5 is a sectional view showing the fourth embodiment. FIG. 6 shows a fifth embodiment, and FIG. 6 (a)
Is a sectional view showing a state before connection, and FIG. 6 (b) is a sectional view showing a state after connection. 7 and 8 are also fifth
FIG. 7 (a) and FIG. 8 (a) are perspective views, and FIGS. 7 (b) and 8 (b) are sectional views showing an embodiment. FIG. 9 shows a sixth embodiment, FIG. 9 (a) is a perspective view showing a state before connection, and FIG. 9 (b) is a sectional view showing a state after connection. FIG. 10 is a sectional view showing a seventh embodiment, FIG. 10 (a) shows a state before connection, and FIG. 10 (b) shows a state after connection. FIG. 11 shows an electrical connecting member according to the eighth embodiment, FIG. 11 (a) is a perspective view, and FIG. 11 (b) is a sectional view. FIG. 12 shows a manufacturing example of the electrical connecting member according to the ninth embodiment, wherein FIGS. 12 (a) and 12 (c) are sectional views and FIG. 12 (b) is a perspective view. FIG. 13 to FIG. 20 show a conventional example and are sectional views except FIG. 14, and FIG. 14 is a plan perspective view. 1 ... Lead frame, 2 ... Lead frame element mounting part, 3 ... Silver paste, 4, 4 '... Semiconductor element, 5,
5 '... semiconductor element connection part, 6 ... lead frame connection part, 7 ... extra fine metal wire, 8 ... resin, 9 ... semiconductor device, 10 ... outer peripheral edge part of semiconductor element, 11 ... 16 ... Carrier film substrate, 17 ... Inner lead part of carrier film substrate, 20 ... Resin, 21 ... Resin, 31 ... Solder bump, 32 ...
… Board, 33 …… Board connection, 51 …… Circuit board, 52 ……
Circuit board connection, 54 ... Electrical connection member connection, 55
...... Lead frame, 63 …… Encapsulation material, 70,70 ′ …… Metal material, 71,71 ′ ... Insulation film, 72,72 ′ ... Exposed surface of insulation film,
73,73 ′ …… Exposed surface of metal material, 75,75 ′ …… Circuit base material, 7
6,76 ′ …… Connecting parts of circuit substrate, 77 …… Insulating material of anisotropic conductive film, 78 …… Anisotropic conductive film, 79 …… Conductive particles, 81 ……
Insulating material for elastic connectors, 82 …… Metal wire for elastic connectors, 83 …… Elastic connectors, 101
...... Circuit board, 102 ...... Connection part, 103 ...... Insulation film, 106 ...
... Insulating film, 104 ... Circuit board, 105 ... Connection part, 107 Metal member, 108 ... Connection part, 109 ... Connection part, 111 ... Insulator, 121 ... Metal wire, 122 ... Rod, 123 …… Resin, 124 ……
Dotted line, 125 ... Electrical connection member, 126 ... Protrusion, 128,129,
130 …… Electrical connection member, 131,132 …… Metal wire guide plate, 15
0 ... bump.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Yasuteru Ichida 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (72) Masaaki Konishi 3-30-2 Shimomaruko, Ota-ku, Tokyo Canon Inc. (56) Reference JP 61-272941 (JP, A) JP 53-53261 (JP, A) JP 56-93337 (JP, A) JP 60-100441 ( JP, A) JP 60-123093 (JP, A) JP 62-234804 (JP, A) JP 62-237739 (JP, A) JP 51-22367 (JP, A) Sho 58-159741 (JP, U)

Claims (2)

[Claims] 1. A first electric circuit component having a connecting portion and a second electric circuit component having a connecting portion are provided with an electric connecting member for electrically connecting both electric circuit components. And a plurality of metal members made of a metal or an alloy, wherein one end of each of the metal members is a first electric member. Of the metal member while exposing the other end of the metal member to the second electric circuit component side so that the metal members are electrically insulated from each other. One of or both of powder and fiber made of an inorganic material are dispersed in the insulator, and the insulator is connected to the connection portion of the first electric circuit component and the first electric circuit component. Connected by alloying with one end of the metal member exposed on the side And an electrical circuit member and one end of the second electric circuit components of the connecting portion and the second electrical circuit components exposed to the side metal member is characterized in that connected by alloying. 2. The electric circuit according to claim 1, wherein each of the first electric circuit component and the second electric circuit component is one of circuit substrates such as a semiconductor element, a circuit board and a lead frame. Element.