JPH08274449A - Manufacture of plated printed wiring board - Google Patents

Abstract

PURPOSE: To simplify a conductor pattern check in a manufacturing process of a plated printed wiring board and to improve separation from a plate when lead patterns for use in electrolytic plating are printed. CONSTITUTION: First, conductor patterns 2a, 2b which will become a product, and lead patterns 3a, 3b, 3c for use in electrolytic plating, having the shape of parts of a frame and being contiguous to both ends of the conductor patterns 2a, 2b, are printed simultaneously, and then lead patterns 4a, 4b, 4c for use in electrolytic plating, having the shape of remaining parts of the frame, are printed in the shape of the frame such that ends of these patterns partly overlap the lead patterns 3a, 3b, 3c for use in electrolytic plating, having the shape of parts of the frame, and such that they are connected to the both ends of the conductor patterns 2a, 2b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed plated wiring board used for wiring connections of various circuits inside various electronic devices.

[0002]

2. Description of the Related Art As shown in FIG. 4, a conventional printed-plated wiring board is composed of a film base 41, a conductor pattern 42 formed by printing on the film base 41, and a lead pattern 43 for electrolytic plating. The manufacturing method is the same as the conductor pattern 42 and the conductor pattern 42.
Electrolytic plating lead patterns 43 for forming a metal layer thereon by electrolytic plating are formed on the same surface of the film base 41 by frame printing so as to be connected to both ends of the conductor pattern 42. The chain double-dashed line 44 is the outer shape of the product.

[0003]

In the above-mentioned conventional printed plated wiring board, as shown in FIG.
Since the electroplating lead patterns 43 are simultaneously printed in a frame shape so as to be connected to both ends of 2, the conductor pattern check (pattern continuity check) at the time of printing becomes electrically impossible, and the printed conductor pattern 42 is printed. Since a visual check is performed for the presence or absence of wire breakage, and a conductor pattern check is performed for the final product shape, requiring a lot of man-hours. In addition, when the conductor pattern 42 is cracked or broken during printing and cannot be removed by visual inspection, a metal layer 45 is formed on the conductor pattern 42 by electrolytic plating as shown in FIG. 5B. When the crack and the line width are narrow, the metal layer 45 conducts electricity and the electrical characteristics are good. Figure 5
5A shows a broken state of the conductor pattern 42, and FIG. 5B shows a state in which the broken portion 46 is plated.

As shown in FIG. 5, when the conductor pattern 42 on the film base 41 is subjected to the plating process in the state where the disconnection point 46 is generated, the metal layer 45 is formed on the conductor pattern 42. The disconnection point 46 is covered and it is electrically judged as a good product. However, such a connection results in a product having low mechanical strength and low bending resistance. After forming the metal layer 45, it is very difficult to visually identify the location.

Further, when the frame-shaped electrolytic plating lead pattern 43 is printed together with the conductor pattern 42 at the same time, masking is made in the central portion of the plate by the frame shape of the electrolytic plating lead pattern 43. When printing, the air flow becomes insufficient in the center of the plate,
There is also a problem in that the film base 41 is adsorbed to the printing plate and the plate separation becomes worse.

It is an object of the present invention to eliminate the above-mentioned conventional defects and provide a method for producing a printed plated wiring board capable of checking cracks and breaks in a conductor pattern during printing.

[0007]

In order to achieve the above object, a method for producing a printed plated wiring board according to the present invention comprises forming a conductive pattern on a film base by printing, and forming a metal layer on the conductive pattern by electrolytic plating. In the method of manufacturing a printed plating wiring board to be formed, on the film base,
First, the conductor pattern to be a product and a part of the frame shape of the electroplating lead pattern are simultaneously printed in the vicinity of both ends of the conductor pattern, and then the rest of the frame-shaped electroplating lead pattern is subjected to the electroplating. The end portion is partially overlapped with a part of the frame shape of the lead pattern for use, and is further printed in the frame shape so as to be connected to both ends of the conductor pattern. In addition, a conductor pattern in which conductor pattern check lands are formed on both ends and a part of the frame shape of the electroplating lead pattern are printed at the same time, and then the conductor pattern is checked by the conductor pattern check lands. is there.

[0008]

By the above manufacturing method, on the film base,
First, the conductor pattern and a part of the frame shape of the electroplating lead pattern are simultaneously printed in the vicinity of both ends of the conductor pattern, and then the remaining frame-shaped electroplating lead pattern of the electroplating lead pattern is formed. When printing the lead pattern for electrolytic plating of the remaining frame shape, printing ink is printed by printing the frame shape so that the edge part is partially overlapped with a part of the frame shape and further connected to the end part of the conductor pattern. The air flow from the portion corresponding to a part of the frame shape of the electroplating lead pattern in which there is no airflow toward the central portion of the plate is improved, and the plate separation from the film base can be improved. further,
After the conductor pattern in which the conductor pattern check lands are formed on both terminals and a part of the frame shape of the lead pattern for electrolytic plating are printed at the same time, it is possible to check the continuity of the conductor pattern. Since the occurrence of the noise can be detected by checking the conductor pattern, a metal layer is formed at the disconnection point by electrolytic plating, and this metal layer conducts electricity, resulting in good electrical characteristics, but partially with poor bending resistance It is possible to prevent the generation of plates.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method for manufacturing a printed plated wiring board according to an embodiment of the present invention will be described below with reference to the drawings.

As shown in FIG. 2, the method for manufacturing a printed plated wiring board of the present embodiment is as follows. First, a conductor pattern 2 having conductor pattern check lands 2a and 2b on both terminals to be a product on a film base 1 and a conductor pattern. A part 3a of the frame shape of the lead pattern for electroplating near the both ends of 2,
3b and 3c are printed at the same time, and then, as shown in FIG. 3, the remaining frame-shaped electroplating lead patterns 4a, 4b,
4c, as shown in FIG. 1, part of the lead pattern for electrolytic plating is overlapped with part 3a, 3b, 3c of the frame shape,
Further, the frame is formed by printing so as to connect to both ends of the conductor pattern 2. The chain double-dashed line 5 is the outer shape of the product.

According to the above-described manufacturing method, first, the conductor pattern 2 and the frame portions 3a, 3b, 3c of the lead pattern for electrolytic plating are printed at the same time, and then the conductor pattern check lands 2a, 2b. By conducting the continuity check of the conductor pattern 2, it is possible to reliably detect the presence or absence of disconnection.

Next, when printing the remaining frame-shaped electrolytic plating lead patterns 4a, 4b, 4c shown in FIG.
A portion 6 corresponding to the frame-shaped portions 3a, 3b, 3c of the electroplating lead pattern in which no printing ink is present.
Air from the a, 6b, and 6c flows into the central portion of the plate well, and the deterioration of the plate separation can be prevented.

[0013]

As is apparent from the above description, according to the method for manufacturing a printed plated wiring board of the present invention, a conductor pattern check (pattern continuity check) can be performed after the conductor pattern is printed. In the process, disconnection etc. can be surely detected before the plating process, so that it is possible to provide a highly reliable plated wiring board with no deterioration in bending resistance and to improve plate separation at the time of printing. Is.

[Brief description of drawings]

FIG. 1 is a plan view of a print pattern synthesized by two print patterns by a method for manufacturing a printed plated wiring board according to an embodiment of the present invention.

FIG. 2 is a plan view of a printing pattern for printing a part of the frame shape of the conductor pattern and the lead pattern for electrolytic plating at the same time.

FIG. 3 is a plan view of a print pattern of the remaining frame-shaped electroplating lead pattern printed on the print pattern of FIG.

FIG. 4 is a plan view of a print pattern produced by a conventional method for producing a printed wiring board.

5A is a cross-sectional view of a conductor pattern after printing in the same disconnection state. FIG. 5B is a cross-sectional view showing a state in which a metal layer is formed on the conductor pattern of FIG. 5A.

[Explanation of symbols]

1 Film base 2 Conductor pattern 2a, 2b Conductor pattern check land 3a, 3b, 3c Part of frame shape of lead pattern for electrolytic plating 4a, 4b, 4c Lead pattern for electrolytic plating of remaining frame shape 5 Product external shape

Claims (2)

[Claims] 1. A method for producing a printed plating wiring board, comprising forming a conductor pattern on a film base by printing and forming a metal layer on the conductor pattern by electrolytic plating, wherein a product is first formed on the film base. A conductor pattern and a part of the frame shape of the electroplating lead pattern are printed at the same time so as to be in contact with both ends of the conductor pattern, and then the remaining frame-shaped electroplating lead pattern is replaced by the electroplating lead pattern. A method for manufacturing a printed plated wiring board, wherein a part of a frame shape is partially overlapped with an end thereof, and the frame is printed so as to be connected to both ends of a conductor pattern. 2. A conductor pattern in which conductor pattern check lands are formed on both ends and a part of a frame shape of a lead pattern for electrolytic plating are printed at the same time, and then the conduction check of the conductor pattern is performed by the conductor pattern check lands. The method for producing a printed plated wiring board according to claim 1.