JPH08268519A - Sheet carrying and processing device - Google Patents

Abstract

PURPOSE: To provide a sheet carrying and processing device capable of improving operability while keeping sheet processability. CONSTITUTION: An etching machine as a sheet carrying and processing device is provided with a lower side roll group R1 formed by arraying rolls 5 having a plurality of disk 8 and an upper side roll group R2 formed by arraying rolls 6 in the upper side thereof. Etching liquid is jetted from a spray nozzle 11 as a supply port constituting a part of a fluid supplying means to a copper- plated laminate plate 3 as a sheet during carrying. The disks 8 of the lower side roll group R1 are arranged in a zigzag manner along the arraying direction A1 of the rolls 5. The disks 8 of the rolls 5 and 6 and the disks 8 of the other rolls 5 and 6 existing in the vicinity thereof are arranged by shifting these from one another so as to prevent these from being placed on the same straight line L1 extending in the arraying direction A1. The disks 8 and the spray nozzle 11 positioned in the end of the copper-plated laminate plate 3 are arranged relatively densely compared with the center part of the copper-plated laminate plate 3.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thin plate transfer processing apparatus, and more particularly to a thin plate transfer processing represented by an etching machine or the like for carrying out etching while transferring a thin copper clad laminate or the like when manufacturing a printed wiring board. It relates to the device.

[0002]

2. Description of the Related Art In manufacturing a printed wiring board by a subtractive process, a step of etching a copper foil on the surface of a copper clad laminate in a pattern is carried out. In recent years, in order to perform this type of process efficiently and labor-savingly, a device called an etching machine is usually used.

FIGS. 8 to 10 show an example of a conventional etching machine. This apparatus is a so-called automatic horizontal spray etching machine 31.
One or a plurality of etching chambers 32 constituting the etching machine 31 are provided with a conveyor section 34 for horizontally transporting the copper clad laminate 33. The conveyor unit 34 includes a lower roll group R1 and a lower roll group R1.
And an upper roll group R2 located above 1. 9 and 10 show the arrangement of the rolls 35 that form the lower roll group R1 described above. These rolls 35
A plurality of disks 37 are fixed to each roll shaft 36 at equal intervals (for example, at a pitch of about 50 mm). Therefore, the roll shaft 36 and each disk 37 are integrally rotated by the driving force of the driving means (not shown). The disks 37 are arranged in a zigzag pattern along the arrangement direction of the rolls 35, which is the transport direction. Further, the disks 37 are regularly arranged so as to ride on the same straight line L1 extending in the arrangement direction. This also applies to the upper roll group R2. Below the lower roll group R1 and above the upper roll group R2, there is a shower tube 3 forming a part of fluid supply means.
8 are provided. Each of these shower tubes 38 is provided with a plurality of spray nozzles 39 at substantially equal intervals.

The etching machine 31 constructed as described above
Then, the copper-clad laminate 33 is conveyed while being sandwiched by both roll groups R1 and R2. At that time, the copper foil of the copper-clad laminate 33 is continuously removed by the etching liquid sprayed from the spray nozzle 39.

[0005]

By the way, in recent years, there is an increasing demand for downsizing and thinning of printed wiring boards.
It is becoming extremely thin and flexible with a thickness of 0.1 mm or less.

However, when the thin copper clad laminate 33 is flowed through the conventional etching machine 31, the liquid weight accumulated on the upper surface of the copper clad laminate 33 and the spray pressure cause both ends thereof to bend, which causes bending. The probability of bending and bending increases. Therefore, in this case, the transportability of the copper clad laminate 33 is deteriorated.

Therefore, in order to solve the deterioration of the transportability, it is conceivable to increase the number of the disks 37 in the same roll 35 by, for example, narrowing the interval between the disks 37. However, if this measure is taken, it becomes difficult for the etching solution to sufficiently spread over the etching surface, and the marks of the rolls 35 may be left on the same surface in a streaky pattern.
Problems such as uneven processing are likely to occur. As described above, in the related art, when trying to improve the transportability, there is also a problem that the etching performance is adversely affected.

The present invention has been made to solve the above problems, and an object of the present invention is to provide a thin plate transporting / processing apparatus capable of improving the transportability of thin plates while maintaining the processability of the thin plates by the processing fluid. To provide.

[0009]

In order to solve the above problems, in the invention described in claim 1, a lower roll group formed by arranging rolls having a plurality of discs, and the lower roll group. An upper roll group formed by arranging the rolls above, and a fluid supply means for supplying a treatment fluid to the thin plates sandwiched by the two roll groups, and arranging the rolls while treating the thin plates with the treatment fluid. In the thin plate transporting apparatus for transporting along the direction, the disks of the lower roll group are arranged in a zigzag manner along the arrangement direction of the rolls, and a specific one of the rolls constituting the lower roll group is specified. When the roll is used as a reference, the disc of the specific roll and at least the disc of another roll existing in the vicinity of the specific roll are placed on the same straight line extending in the arrangement direction of the rolls. No way, the sheet conveying apparatus which is arranged by shifting the disc to each other and the gist thereof.

According to a second aspect of the present invention, in the first aspect, among the plurality of disks existing in the same roll,
The disk holding the end portion of the thin plate is arranged relatively denser than the disk holding the central portion of the thin plate, and the treatment is performed at the end portion of the thin plate among the supply ports of the fluid supply means. The gist of the invention is that the supply port for supplying the fluid is arranged in the central portion of the thin plate relatively densely than the supply port for supplying the processing fluid.

According to a third aspect of the present invention, in the first or second aspect, the interval between the rolls forming the upper roll group is made larger than the interval between the rolls forming the lower roll group. And

According to a fourth aspect of the present invention, in the third aspect, at least a part of the discs of the rolls forming the upper roll group is sparsely divided by the discs of the rolls forming the lower roll group. The gist is that it is placed in the place.

[0013]

According to the first to fourth aspects of the invention, the disks of the lower roll group are arranged so as to be offset from each other so as not to be on the same straight line. Therefore, unlike the case where the disks are arranged in a perfect staggered pattern, the disks do not come into contact with only a specific portion of the thin plate many times. therefore,
The etching liquid is evenly spread over the etching surface, and it is less likely that streak-like roller marks, process unevenness, and the like will be generated.

According to the invention as set forth in claim 2, since the disks are densely arranged at the end portions of the thin plate and the number of places for holding the portions is relatively increased, the end portions of the thin plate are not bent. Hard to happen. Further, since the supply port is also densely arranged at the end of the thin plate, the processing fluid does not get out of reach of that part.

According to the third aspect of the present invention, the processing fluid is more easily distributed to the upper side surface of the thin plate because the number of obstacles such as the disk is reduced. According to the fourth aspect of the present invention, a predetermined portion of the upper surface of the thin plate is pressed by the disc, so that partial blowing up of the thin plate is prevented.

[0016]

【Example】

Example 1 Hereinafter, an automatic horizontal spray etching machine 1 used in the printed wiring board manufacturing process of the present invention 1
An embodiment of the present invention will be described in detail with reference to FIGS.

The etching machine 1 is constructed by arranging a plurality of box-shaped metal etching chambers 2 in series. A water washing chamber (not shown) or the like is usually installed behind these etching chambers 2. As shown in FIGS. 1 (a) and 1 (b), the upper half of the etching chamber 2 is a conveyor unit 4 for horizontally transporting a copper clad laminate 3 as a thin plate. On the other hand, the lower half of the etching chamber 2 is a liquid reservoir (not shown) for temporarily storing the sprayed etching liquid.

As shown in FIGS. 1, 3 and 4, the conveyor section 4 includes a lower roll group R1 and an upper roll group R2.
Consists of The individual rolls 5 constituting the lower roll group R1 are horizontally arranged along the longitudinal direction of the etching chamber 2 so that they all have the same height. The individual rolls 6 forming the upper roll group R2 are horizontally arranged above the rolls 5 forming the lower roll group R1 so that they are all at the same height along the longitudinal direction of the etching chamber 2. Has been done.

A plurality of polyethylene discs 8 are provided on the metal roll shaft 7 constituting each of the rolls 5 and 6. Also, this roll shaft 7
It is rotatably inserted by a bearing provided on the wall surface of the etching chamber 2. A gear 9 is fixed to one end of the roll shaft 7. This gear 9
A pulley (not shown) for transmitting the driving force to the roll shaft 7 is wound around the roll shaft 7. Therefore, when the roll shaft 7 rotates, each disk 8 also rotates integrally with it. As shown in FIG. 1 (a), the copper-clad laminate 3 includes a roll 5 of the lower roll group R1 and an upper roll group R1.
It is conveyed in the horizontal direction while being sandwiched between the rolls 6 and 2.

As shown in FIGS. 1 (a) and 1 (b), a fluid for supplying an etching liquid as a processing fluid is provided below the lower roll group R1 and above the upper roll group R2, respectively. Supply means are provided. The fluid supply means in this embodiment includes a plurality of shower tubes 10, a plurality of spray nozzles 11 serving as supply ports fixed to the shower tubes 10, and a pump (not shown). As shown schematically in FIG. 3, there are a total of seven shower tubes 10 above and below,
They are parallel to each other. Further, each of the shower tubes 10 has a predetermined angle (3 in the present embodiment) with respect to the longitudinal direction of the etching chamber 2 which is the transport direction.
°).

As shown schematically in FIG. 3, the two outer shower tubes 10 are provided with three spray nozzles 11. The other five nozzles are provided with nine spray nozzles 11. The spray nozzles 11 existing on the same shower tube 10 are all arranged at equal intervals (at a pitch of 130 mm in this embodiment). Further, the spray nozzles 11 existing on different shower tubes 10 are also aligned along the direction orthogonal to the transport direction A1. There are five or six spray nozzles 11 on the same straight line, and all of them are arranged at equal intervals (at a pitch of 130 mm in this embodiment).

The etching liquid pressure-fed in the shower tube 10 is ejected from the spray nozzle 11. At that time, the sprayed etching liquid is evenly poured onto the etching surface by the oscillation (swing) of the spray nozzle 11. After that, the etching liquid is temporarily held in the liquid reservoir, sucked up by a pump, and again fed under pressure into the shower tube 10. Examples of the etching solution include aqueous solutions of cupric chloride, ferric chloride, persulfates, hydrogen peroxide / sulfuric acid, and alkali etchant.

Next, the dimensions and arrangement of each member constituting the conveyor section 4 of this embodiment will be described in detail. First, the rolls 5 forming the lower roll group R1 will be described. As shown in FIGS. 2A and 4, the disks 8 of these rolls 5 are the rolls 5 which are in the transport direction.
Staggered along the arrangement direction A1 of
They are placed slightly offset from each other. Therefore, it is different from the conventional perfect staggered arrangement method.

Here, in FIG. 2A, the conveying direction A
A straight line L1 orthogonal to 1 is hypothesized, and a specific roll 5A among a plurality of rolls 5 is selected as a reference. In this case, the following relationships are established among the disks 8. That is, the disc 8 of the specific roll 5A and the discs 8 of the other rolls 5B and 5C existing in the vicinity of the roll 5A do not ride on the same straight line L1. In the case of the present embodiment, such a relationship holds for at least five rolls 5 adjacent to the specific roll 5A.

In this embodiment, the disk 8 has a width of 4 mm.
Is set to The diameter of the disk 8 is set to 40 mm (by comparison, 50 mm in the past). Roll shaft 7
Spacing is 35mm (by comparison, 45mm in the past), diameter is 1
It is set to 3 mm. The overlap amount w3 of the disc 8 between the adjacent rolls 5 is set to 5 mm. The interval w1 between the disks 8 existing in the same roll 5 is uniformly set to 50 mm. Further, the shift amount of the disks 8 on the adjacent rolls 5 is set to 5 mm. Therefore, the amount of this shift is larger than that of the disk 8
Will be slightly larger than the width.

Next, the rolls 6 constituting the upper roll group R2 will be described. As shown in FIG. 2 (b), the disks 8 of these rolls 6 are also arranged in a zigzag pattern along the arrangement direction A1 of the rolls 6, which is the transport direction, and are arranged in a state of being slightly offset from each other. Has been done. However, the distance w2 between the disks 8 existing in the same roll 6 is larger than that of the lower roll group R1 and is 75
is set to mm. The other dimensions are the same as those of the lower roll group R1.

In the etching machine 1 of this embodiment, the disks 8 are arranged in a zigzag pattern and in a state of being slightly shifted as described above. Therefore, the respective disks 8 barely ride on the straight line L1 along the arrangement direction A1 of the rolls 5 and 6. On the other hand, in the conventional etching machine, the disks 8 are also arranged in a staggered manner, but the respective disks 8 are regularly arranged so as to ride on the straight line L1. For this reason, the disk 8 is conventionally characterized in that the disk 8 contacts a specific portion of the copper-clad laminate 3 many times. Therefore, there is a difference in the degree of distribution of the etching solution between a portion where the contact frequency is high and a portion where the contact frequency is low, and this causes streaky roller marks and uneven processing. On the other hand,
In the embodiment, the disk 8 is repeatedly placed on a specific portion of the copper clad laminate 3.
Since they do not come into contact with each other, the etching liquid can be evenly spread over the etching surface. Therefore,
Compared with the conventional one in which the disks 8 are arranged in a completely staggered pattern,
Scratch-like roller marks and processing unevenness are less likely to occur. As a result, a suitable etching property is maintained. Furthermore, the improved method that mainly changes the arrangement of the disks 8 as in the present embodiment has the advantage that it is relatively easy to implement because it does not involve major modification of existing equipment.

Next, the method and results of the evaluation test using the above etching machine 1 will be described. In this evaluation test, the transportability was investigated using the test copper clad laminate 3 on which a comb tooth pattern of L / S = 100 μm / 100 μm was formed. The size of the copper clad laminate 3 is 340 mm x 5
The thickness was 10 mm, and the thickness of the copper foil was 35 μm. The thickness of the copper clad laminate 3 was set in three levels (0.8 mm, 0.4 mm, 0.1 mm). Here, in judging the quality of transport,
Two points were taken into consideration: the presence / absence of a pattern disconnection and the presence / absence of breakage / breakage due to bending of the end 3a. The results are shown in Table 1. The etching property was set to be constant (pattern formation accuracy σ _n-1 = 6.3 μm, average value of roughness difference = 10 μm). The difference in density means the difference in thickness between the copper foil in a place where the space between the wiring patterns is dense and the copper foil in a place where the space is sparse. Other operating conditions of the etching machine 1 are as follows.

Oscillation frequency: maximum 50 rpm, spray flow rate: 5.2 liters / minute, total flow rate: 547 liters / minute, spray pressure: 2 kgf / cm ² , line speed:
2.8 m / min.

[0030]

[Table 1] As is clear from Table 1, according to this etching machine 1, even when the plate thickness is 0.1 mm, pattern disconnection and breakage / breakage do not occur, and suitable transportability is secured. It was As described above, according to this embodiment, the transportability can be improved while maintaining the etching property. [Second Embodiment] FIGS. 5 to 7 show an automatic horizontal spray etching machine 21 of the second embodiment. This etching machine 21 also includes four etching chambers 2 as in the first embodiment. Here, the description will focus on the differences from the first embodiment, and common parts will be denoted by the same member numbers and detailed description thereof will be omitted. In addition, of the four etching chambers 2, mainly the latter two configurations will be described.

In the case of the etching machine 21 of the second embodiment, the dimensions and arrangement of each member constituting the conveyor section 22 are the same as those of the first embodiment.
It is different from the case. First, the rolls 5 forming the lower roll group R1 will be described. As shown in FIG. 7, the disks 8 of these rolls 5 are arranged in a zigzag pattern along the arrangement direction A1 of the rolls 5, which is the conveying direction, and are arranged in a state of being slightly offset from each other. . In this respect, there is no difference from Example 1.

However, in the present embodiment, among the plurality of disks 8 existing in the same roll 5, the disk 8 holding the end portion 3a of the copper-clad laminate 3 is the central portion 3 of the copper-clad laminate 3.
They are arranged relatively denser than the disk 8 holding b. Specifically, as shown in FIGS. 5B and 7, the gap w1 between the rolls 5 of the disk 8 holding the end 3a of the copper clad laminate 3 is set to 25 mm. On the other hand, the distance w between the disks 8 holding the central portion 3b of the copper clad laminate 3
1 is set to 50mm or 55mm. Therefore, the disk 8 in the portion holding the end portion 3a of the copper clad laminate 3 is
The disk 8 of the portion holding the central portion 3b of the copper clad laminate 3
This means that they are installed at about twice the density. This arrangement method may or may not be adopted for each roll 6 forming the upper roll group R2. In this embodiment, the arrangement method is basically adopted (Fig. 5 (b)).
reference).

Further, as shown in FIG. 5A, every other roll 6 constituting the upper roll group R2 is thinned out. The reason is to more reliably maintain the etching property on the upper surface side. The lower roll group R1
No such thinning has been done for In addition, the thinning-out in the upper roll group R2 is performed only for the first two of the four etching chambers 2 and not for the second two. this is,
This is because a slight change occurs in the state of the copper-clad laminate 3 being conveyed between the former stage and the latter stage of the etching machine 21.
That is, the copper foil becomes thinner and the copper-clad laminate 3 is more easily bent and deformed because the etching progresses toward the later stage.

Next, the fluid supply means in this embodiment will be described. This etching machine 21 is also provided with a fluid supply means composed of seven upper and lower shower tubes 10, a plurality of spray nozzles 11 fixed to each shower tube 10, and a pump (not shown). This point is the same as in the first embodiment.

However, in this embodiment, the arrangement of the spray nozzles 11 in the shower tube 10 provided below the conveyor section 22 is changed. That is, as schematically shown in FIG. 6, nine spray nozzles 11 are provided at equal intervals in the inner three of the shower tubes 10 as in the first embodiment. The spray nozzles 11 existing in these shower tubes 10 have a pitch of 130 mm. Each of the spray nozzles 11 sprays the etching liquid mainly to the central portion 3b of the copper-clad laminate 3 from its installation position. On the other hand, the other four shower tubes 10
, 17 spray nozzles 11 are provided at equal intervals. The pitch of the spray nozzles 11 existing on these shower tubes 10 is about 70 mm. Each of the spray nozzles 11 mainly sprays the etching liquid onto both end portions 3a of the copper-clad laminate 3 from its installation position. Therefore, as schematically shown in FIG. 5B, the spray nozzles 11 are arranged at both end portions of the etching chamber 2 more densely than at the central portion thereof. in this case,
The amount of the etching liquid supplied to the end portion 3a of the copper-clad laminate 3 per unit time is relatively larger than that supplied to the central portion of the copper-clad laminate 3.

Since the etching machine 21 of the second embodiment as described above has the same basic structure as that of the first embodiment, it goes without saying that the same effects are obtained. Further, according to this embodiment, the disks 8 for holding the both ends 3a of the copper clad laminate 3 are arranged relatively densely. Therefore, the number of places holding both ends 3a is larger than that in the first embodiment. Therefore, both ends 3a are surely prevented from bending, and as a result, the transportability of the copper clad laminate 3 is further improved. Further, in this embodiment, not only the disks 8 are densely arranged on both end portions 3a, but also the spray nozzles 11 are densely arranged on the portions. Therefore, even if the number of obstacles increases due to the addition of the disks 8, no particular problem occurs. That is, the spray nozzle 1
As a result of the addition of 1
Can be fully distributed. Therefore, the suitable etching property is reliably maintained. Further, in the present embodiment, the upper roll group R2 is thinned out to about half, so that the etching liquid spreads to the upper surface side accordingly. This means that the etching property is maintained on the upper surface side,
Furthermore, it has a positive effect on the improvement.

Subsequently, the results of an evaluation test carried out in accordance with the method of Example 1 using this etching machine 21 are shown in Table 2.
Shown in

[0038]

[Table 2] As is clear from Table 2, according to this etching machine 21, even when the plate thickness is 0.1 mm or 0.06 mm,
There was no pattern disconnection or breakage / breakage, and suitable transportability was secured. As described above, according to this embodiment, it is possible to further improve the transportability while maintaining the etching property.

The present invention can be modified as follows, for example. (1) When the specific roll 5A is used as a reference in Example 1, the rolls 5 existing at least two adjacent to the roll 5A
Discs 8 on the same straight line L1 only for B and 5C
It is also possible to shift each disk 8 so as not to ride. Even in this case, the effect similar to that of the first embodiment can be obtained. It is most preferable that the above relationship is satisfied for all of the plurality of rolls 5.

(2) As the supply port which is a part of the fluid supply means, other than the spray nozzle 11 may be used. Further, even when the spray nozzle 11 is used, for example, the installation density is kept as it is, and only the amount of the etching liquid sprayed on both ends 3a of the copper clad laminate 3 per unit time is relatively increased. Good.

(3) In Example 2, the upper roll group R
The rolls 6 forming 2 may be thinned out every two or three rolls. Such a structure leads to further maintenance and improvement of the etching property on the upper surface side. Further, in the first embodiment, the rolls 6 of the upper roll group R2 may be thinned out.

(4) At least a part of the disks 8 of the rolls 6 constituting the upper roll group R2 is a part where the disks 8 of the rolls 5 constituting the lower roll group R1 are sparse (that is, the same). Adjacent disks 8 in roll 5
It is preferable that they are arranged corresponding to (gap). By doing so, the upper surface of the copper-clad laminate 3 is pressed by the disk 8, so that partial blow-up of the copper-clad laminate 3 by the etching liquid sprayed from below is reliably prevented. Therefore, the transportability can be improved.

(5) In the second embodiment, the disks 8 at dense locations may be thinned out for each axis or only for two axes. With such a configuration, the liquid can be sufficiently spread by thinning, and the etching property can be maintained / improved more reliably.

(6) In Example 2, the upper roll group R
The pitch of the roll 6 constituting the disk 2 in the sparse portion of the disk 8 is not limited to 50 mm and 55 mm, and may be, for example, 75 mm.

(7) The processing fluid is not limited to the etching liquid as in the first and second embodiments, and other liquids such as gas or gas may be used depending on the purpose of the processing. is there.

(8) The present invention can be applied not only to the etching machines other than the automatic horizontal spray etching machines 1 and 21 shown in Embodiments 1 and 2, but also to other etching machines such as developing devices. It can also be applied to an automatic horizontal spray processing device.

Here, in addition to the technical ideas described in the claims, the technical ideas grasped by the above-described embodiments and other examples will be listed below together with their effects. (1) A lower roll group formed by arranging rolls having a plurality of discs, an upper roll group formed by arranging the rolls above the lower roll group, and a thin plate sandwiched by both roll groups. In a thin plate transporting and processing apparatus for transporting the thin plates along the arrangement direction of the rolls, which comprises a fluid supply means for supplying a processing fluid, among the plurality of disks existing in the same roll, holding the end of the thin plate. A disk for holding the central portion of the thin plate relatively denser than the disk for holding the central portion of the thin plate,
Of the processing fluid supplied to the end of the thin plate by the first fluid supply region, and the amount of the processing fluid supplied per unit time to the center of the thin plate by the second fluid supply region. A thin plate transporting / processing apparatus set to be relatively larger than the amount of the processing fluid per unit time. With this configuration, the transportability can be improved while maintaining the processability.

(2) In Claims 1 to 4 and the technical idea (1), the thin plate conveying / processing apparatus wherein the fluid supply means comprises a plurality of shower tubes and spray nozzles provided therein. (3) In Claim 3, the thin plate conveyance processing apparatus which thinned out every other roll that constitutes the upper roll group. With this configuration, the processability on the upper surface side can be further improved.

The technical terms used in this specification are defined as follows. “Treatment fluid: A liquid or gas for treating a thin plate that is an object to be transported, including, for example, an etching solution and a developing solution.”

[0050]

As described in detail above, according to the inventions described in claims 1 to 4, the thin plate transporting process can improve the transportability of the thin plate while maintaining the processability of the thin plate by the processing fluid. A device can be provided. In particular, according to the invention described in claim 2, the transportability can be further improved. According to the invention described in claim 4, it is possible to further improve the transportability.

[Brief description of drawings]

1A is a partial schematic front view showing a main part of an automatic horizontal spray etching machine according to a first embodiment, and FIG. 1B is a partial schematic side view of the same.

FIG. 2A is a partially enlarged view showing a lower roll group,
(B) The elements on larger scale which show an upper side roll group.

FIG. 3 is a schematic plan view for explaining the arrangement of spray nozzles of the etching machine.

FIG. 4 is a partial schematic plan view for explaining an arrangement of disks of a lower roll group in the etching machine.

5A is a partial schematic front view showing a main part of the automatic horizontal spray etching machine of Embodiment 2, and FIG. 5B is a partial schematic side view of the same.

FIG. 6 is a schematic plan view for explaining the arrangement of spray nozzles of the etching machine.

FIG. 7 is a partial schematic plan view for explaining the arrangement of disks of a lower roll group in the etching machine.

FIG. 8A is a partial schematic front view showing a main part of a conventional automatic horizontal spray etching machine, and FIG. 8B is a partial schematic side view of the same.

FIG. 9 is a partial schematic plan view for explaining the arrangement of the disks of the lower roll group in the conventional etching machine.

FIG. 10 is a partially enlarged view showing a lower roll group of a conventional etching machine.

[Explanation of symbols]

1, 21 ... Automatic horizontal spray etching machine as a thin plate conveying / processing device, 3 ... Copper clad laminate as a thin plate, 3a ... Edge of thin plate, 3b ... Central part of thin plate, 5, 6 ... Roll, 8 ...
Disk, 11 ... Spray nozzle as fluid supply means, A1 ... Roll arranging direction, w1 ... Roll interval (composing lower roll group), w2 ... Roll interval (composing upper roll group), R1 ... Lower roll group, R2 ... Upper roll group, L1 ... Straight line.

Claims (4)

[Claims] 1. A lower roll group formed by arranging rolls having a plurality of discs, an upper roll group formed by arranging the rolls above the lower roll group, and sandwiched by both roll groups. A thin plate transporting and processing apparatus that transports the thin plate with a fluid supply unit that supplies a processing fluid along the array direction of the rolls while treating the thin plate with the processing fluid; Along the arrangement direction of the rolls in a zigzag manner, when a specific roll among the rolls constituting the lower roll group is used as a reference, in the vicinity of the disc of the specific roll and at least the specific roll. Discs of other rolls that exist,
A thin plate transport / processing apparatus in which the disks are arranged so as not to be on the same straight line extending in the arrangement direction of the rolls. 2. Among a plurality of disks existing in the same roll, a disk holding an end portion of the thin plate is arranged relatively denser than a disk holding a central portion of the thin plate, and the fluid is used. The supply port for supplying the processing fluid to the end portion of the thin plate among the supply ports of the supply means is arranged relatively denser than the supply port for supplying the processing fluid to the central portion of the thin plate. 1. The thin plate transport processing device described in 1. 3. The thin plate transporting / processing apparatus according to claim 1, wherein an interval between rolls forming the upper roll group is larger than an interval between rolls forming the lower roll group. 4. The roll according to claim 3, wherein at least a part of the disks of the rolls forming the upper roll group is arranged at a position where the disks of the rolls forming the lower roll group are sparse. Thin plate processing equipment.