JPH08264823A - Photocoupler - Google Patents
PhotocouplerInfo
- Publication number
- JPH08264823A JPH08264823A JP3501295A JP3501295A JPH08264823A JP H08264823 A JPH08264823 A JP H08264823A JP 3501295 A JP3501295 A JP 3501295A JP 3501295 A JP3501295 A JP 3501295A JP H08264823 A JPH08264823 A JP H08264823A
- Authority
- JP
- Japan
- Prior art keywords
- light
- light emitting
- recess
- chip
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
- H01L2924/15156—Side view
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Light Receiving Elements (AREA)
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、発光チップと受光チッ
プとを光学的に結合するよう配置してなる光結合素子
（フォトカプラ）に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling element (photocoupler) in which a light emitting chip and a light receiving chip are arranged so as to be optically coupled.
【０００２】[0002]
【従来の技術】図１９は、従来の光結合素子を示す縦断
面図である。2. Description of the Related Art FIG. 19 is a vertical sectional view showing a conventional optical coupling element.
【０００３】該光結合素子は、２層モールドタイプの光
結合素子であって、発光側リードフレーム１及び受光側
リードフレーム２と、該両リードフレーム１，２の一端
側にそれぞれ個別に搭載される発光チップ３及び受光チ
ップ４と、前記発光チップ３を被覆し発光チップ３を保
護するプリコート樹脂５と、前記発光チップ３と受光チ
ップ４とを光学的に結合するよう対向配置し前記両リー
ドフレーム１，２の外部接続用端子の接続部を除いてこ
れらを１次モールドする透光性樹脂６と、該透光性樹脂
６を２次モールドする遮光性樹脂７とからなる構成であ
る。The optical coupling element is a two-layer mold type optical coupling element, and is individually mounted on the light emitting side lead frame 1 and the light receiving side lead frame 2, and on one end sides of the lead frames 1 and 2, respectively. The light emitting chip 3 and the light receiving chip 4, the precoat resin 5 that covers the light emitting chip 3 and protects the light emitting chip 3, and the light emitting chip 3 and the light receiving chip 4 are arranged to face each other so as to optically couple the leads. The frame 1 and the frame 2 are composed of a light-transmissive resin 6 which is primarily molded except for the connection portion of the external connection terminals, and a light-shielding resin 7 which is secondarily molded from the light-transmissive resin 6.
【０００４】前記プリコート樹脂５は例えばシリコーン
樹脂よりなり、前記透光性樹脂６及び遮光性樹脂７は例
えばエポキシ樹脂よりなる。The precoat resin 5 is made of, for example, a silicone resin, and the translucent resin 6 and the light shielding resin 7 are made of, for example, an epoxy resin.
【０００５】以下に、該光結合素子の製造方法につい
て、図２０の製造工程フローチャートにしたがって説明
する。A method of manufacturing the optical coupling element will be described below with reference to the manufacturing process flowchart of FIG.
【０００６】まず、あらかじめ対向するように折り曲げ
された金属性のリードフレーム１，２の一端側に発光チ
ップ３及び受光チップ４をそれぞれ個別にダイボンド
し、発光チップ３及び受光チップ４と外部接続用端子と
を金線８にてワイアボンドを施す。次に、前記発光チッ
プ３には、応力緩和のために透明のプリコート樹脂５に
てプリコートを施す。First, the light emitting chip 3 and the light receiving chip 4 are individually die-bonded to one end sides of the metallic lead frames 1 and 2 which are bent so as to face each other in advance, and the light emitting chip 3 and the light receiving chip 4 are externally connected. Wire bonding is applied to the terminal with the gold wire 8. Next, the light emitting chip 3 is precoated with a transparent precoat resin 5 for stress relaxation.
【０００７】その後、これらをスポット溶接、あるいは
ローディングフレームにセットすること等により発光チ
ップ３及び受光チップ４を対向させ、光学的に結合する
よう透光性樹脂６にて１次トランスファーモールドを行
い、更に、ばり取りを施した後、遮光性樹脂７にて２次
トランスファーモールドを行う。After that, the light emitting chip 3 and the light receiving chip 4 are opposed to each other by spot welding or setting them on a loading frame, and primary transfer molding is performed with a transparent resin 6 so as to optically couple them. After deburring, the light-shielding resin 7 is subjected to secondary transfer molding.
【０００８】その後、外装めっき、フォーミング、絶縁
耐圧試験、電気的特性検査、外観検査、梱包の工程を経
て出荷される。After that, the product is shipped through the steps of exterior plating, forming, dielectric strength test, electrical characteristic inspection, visual inspection, and packaging.
【０００９】図２１は、他の従来の光結合素子を示す縦
断面図である。FIG. 21 is a longitudinal sectional view showing another conventional optical coupling element.
【００１０】該光結合素子は、１層モールドタイプの光
結合素子であって、発光側リードフレーム１及び受光側
リードフレーム２と、該両リードフレーム１，２の一端
側にそれぞれ個別に搭載される発光チップ３及び受光チ
ップ４と、前記発光チップ３と受光チップ４とを光学的
に結合するよう対向配置して両リードフレーム１，２を
ドッキングする透光性樹脂９と、両リードフレーム１，
２の外部接続用端子の接続部を除いてこれらを２次モー
ルドする遮光性樹脂７とからなる構成である。前記透光
性樹脂９は、例えばシリコーン樹脂よりなる。The optical coupling element is a one-layer mold type optical coupling element, and is individually mounted on the light emitting side lead frame 1 and the light receiving side lead frame 2, and one end sides of the both lead frames 1 and 2, respectively. A light emitting chip 3 and a light receiving chip 4, a translucent resin 9 for docking the lead frames 1 and 2 with the light emitting chip 3 and the light receiving chip 4 facing each other so as to optically couple with each other, and the lead frame 1. ，
2 except for the connecting portions of the external connection terminals, and a light-shielding resin 7 for secondary molding of these. The translucent resin 9 is made of, for example, silicone resin.
【００１１】以下に、該光結合素子の製造方法につい
て、図２２の製造工程フローチャートにしたがって説明
する。A method of manufacturing the optical coupling element will be described below with reference to the manufacturing process flow chart of FIG.
【００１２】まず、あらかじめ対向するように折り曲げ
された金属性のリードフレーム１，２の一端側に発光チ
ップ３及び受光チップ４をそれぞれ個別にダイボンド
し、発光チップ３及び受光チップ４と外部接続用端子と
を金線８にてワイアボンドを施す。その後、これらをス
ポット溶接、あるいはローディングフレームにセットす
ること等により発光チップ３及び受光チップ４を対向さ
せ、光学的に結合するよう透光性樹脂９にてドッキング
を施し、更に、遮光性樹脂７にて２次モールドを行う。First, the light emitting chip 3 and the light receiving chip 4 are individually die-bonded to one end sides of the metallic lead frames 1 and 2 which are bent so as to face each other in advance, and the light emitting chip 3 and the light receiving chip 4 are externally connected. Wire bonding is applied to the terminal with the gold wire 8. After that, the light emitting chip 3 and the light receiving chip 4 are opposed to each other by spot welding or setting them on a loading frame, and docking is performed with a translucent resin 9 so as to be optically coupled. Secondary molding is performed at.
【００１３】その後、外装めっき、フォーミング、絶縁
耐圧試験、電気的特性検査、外観検査、梱包の工程を経
て出荷される。After that, the products are shipped through the steps of exterior plating, forming, withstand voltage test, electrical characteristic inspection, visual inspection, and packaging.
【００１４】上述した光結合素子の実装面積は、現状で
７．０×３．６ｍｍ（２５．２ｍｍ2 ）程度である。The mounting area of the above-mentioned optical coupling element is currently about 7.0 × 3.6 mm (25.2 mm 2 ).
【００１５】近年においては、２層モールドタイプの光
結合素子が主流となってきている。In recent years, a two-layer mold type optical coupling element has become the mainstream.
【００１６】[0016]
【発明が解決しようとする課題】近年、光結合素子（フ
ォトカプラ）に対する市場の要望は厳しく、ＤＩＰ型フ
ォトカプラの普及は上昇の一途であるが、電子部品の小
型化，薄型化が進むに連れて面実装タイプの需要も加わ
り、小型のＳＭＤタイプが開発され普及しつつある。更
に、コストダウン、納期の短縮の要望も高まっている。In recent years, the market demand for optical coupling elements (photocouplers) has been strict, and the spread of DIP type photocouplers has been increasing, but the miniaturization and thinning of electronic components have been progressing. Along with the demand for surface mount type, small SMD type has been developed and is becoming popular. Furthermore, there are increasing demands for cost reduction and shorter delivery times.
【００１７】また、前述した小型化，薄型化のパッケー
ジ要望は更に進み、ＳＭＤタイプの小型化も形状的に
は、先に述べた従来のリードフレームのトランスファー
モールドタイプでは限界に達しており、リードレス化の
要望も強くなっている。In addition, the demand for the above-mentioned miniaturized and thinned packages has further advanced, and the miniaturization of the SMD type has reached the limit in the shape of the transfer mold type of the conventional lead frame described above. There is also a strong demand for less use.
【００１８】本発明は、上記課題に鑑み、超小型化のリ
ードレス光結合素子の提供を目的とするものである。The present invention has been made in view of the above problems, and an object thereof is to provide an ultra-miniaturized leadless optical coupling element.
【００１９】[0019]
【課題を解決するための手段】本発明よりなる請求項１
記載の光結合素子は、受発光チップ収納用凹部を備え表
面にめっきパターンが形成された射出立体配線成形樹脂
基板と、該樹脂基板の前記凹部におけるめっきパターン
上に搭載される発光チップ及び受光チップと、該発光チ
ップ及び受光チップを被覆する第１透光性樹脂と、該第
１透光性樹脂を被覆する遮光性樹脂とを有してなること
を特徴とするものである。Claims 1 according to the present invention
The optical coupling element described is an injection three-dimensional wiring molding resin substrate having a recess for receiving a light emitting and receiving chip and a plating pattern formed on the surface, and a light emitting chip and a light receiving chip mounted on the plating pattern in the recess of the resin substrate. And a first light-transmitting resin that covers the light-emitting chip and the light-receiving chip, and a light-shielding resin that covers the first light-transmitting resin.
【００２０】請求項２記載の光結合素子は、前記射出立
体配線成形樹脂基板裏面に動作確認用発光チップを備
え、該動作確認用発光チップを第２透光性樹脂にて被覆
してなることを特徴とするものである。An optical coupling element according to a second aspect is provided with an operation confirmation light emitting chip on the back surface of the injection three-dimensional wiring molded resin substrate, and the operation confirmation light emitting chip is covered with a second translucent resin. It is characterized by.
【００２１】請求項３記載の光結合素子は、受発光チッ
プ収納用凹部及び動作確認用発光チップ収納用凹部を備
え表面にめっきパターンが形成された射出立体配線成形
樹脂基板と、該樹脂基板の前記受発光チップ収納用凹部
におけるめっきパターン上に搭載される発光チップ及び
受光チップと、該発光チップ及び受光チップを被覆する
第１透光性樹脂と、該第１透光性樹脂を被覆する遮光性
樹脂と、前記動作確認用発光チップ収納用凹部における
めっきパターン上に搭載される動作確認用発光チップ
と、該動作確認用発光チップを被覆する第２透光性樹脂
とを有してなることを特徴とするものである。An optical coupling element according to a third aspect of the present invention includes an injection three-dimensional wiring molded resin substrate having a recess for receiving a light emitting and receiving chip and a recess for receiving a light emitting chip for operation confirmation, and a plating pattern formed on the surface, and the resin substrate. The light emitting chip and the light receiving chip mounted on the plating pattern in the recess for receiving the light emitting and receiving chip, the first light transmitting resin that covers the light emitting chip and the light receiving chip, and the light shielding that covers the first light transmitting resin Functional resin, an operation confirming light emitting chip mounted on the plating pattern in the operation confirming light emitting chip accommodating recess, and a second translucent resin covering the operation confirming light emitting chip. It is characterized by.
【００２２】請求項４記載の光結合素子は、請求項１又
は３記載の光結合素子において前記発光チップと受光チ
ップとの間に内部沿面距離調整手段を有してなることを
特徴とするものである。An optical coupling element according to a fourth aspect is the optical coupling element according to the first or third aspect, characterized by including an internal creepage distance adjusting means between the light emitting chip and the light receiving chip. Is.
【００２３】請求項５記載の光結合素子は、請求項１又
は３記載の光結合素子において前記受発光チップ収納用
凹部は第１凹部と該第１凹部よりも深さの深い第２凹部
とからなり、前記第１凹部の底面に発光チップが搭載さ
れ、前記第２凹部の底面に受光チップが搭載されるとと
もに、前記第１透光性樹脂と遮光性樹脂の境界面を第１
凹部側から第２凹部側に傾斜させてなることを特徴とす
るものである。An optical coupling element according to a fifth aspect of the present invention is the optical coupling element according to the first or third aspect, in which the recess for receiving the light emitting and receiving chip is a first recess and a second recess having a depth deeper than the first recess. A light-emitting chip is mounted on the bottom surface of the first recess, a light-receiving chip is mounted on the bottom surface of the second recess, and a boundary surface between the first translucent resin and the light-shielding resin is first
It is characterized in that it is inclined from the concave side to the second concave side.
【００２４】請求項６記載の光結合素子は、請求項１又
は３記載の光結合素子において前記受発光チップ収納用
凹部は第１凹部と該第１凹部よりも深さの深い第２凹部
とからなり、前記第２凹部の底面に発光チップ及び受光
チップが搭載され、前記第２凹部に第１透光性樹脂が充
填され、前記第１凹部に遮光性樹脂が充填されるととも
に、前記第１透光性樹脂と遮光性樹脂の境界面を凸曲面
状としてなることを特徴とするものである。According to a sixth aspect of the present invention, there is provided an optical coupling element according to the first or third aspect, wherein the light receiving and emitting chip accommodating recess is a first recess and a second recess having a depth deeper than the first recess. A light emitting chip and a light receiving chip are mounted on the bottom surface of the second recess, the second recess is filled with a first light-transmissive resin, and the first recess is filled with a light-shielding resin. 1) The boundary surface between the light-transmissive resin and the light-shielding resin is a convex curved surface.
【００２５】請求項７記載の光結合素子は、請求項２又
は３記載の光結合素子において前記動作確認用発光チッ
プは、動作状態検出用発光チップ及び非動作状態検出用
発光チップの複数からなることを特徴とする。According to a seventh aspect of the present invention, there is provided the optical coupling element according to the second or third aspect, wherein the operation confirming light emitting chip comprises a plurality of operating state detecting light emitting chips and non-operating state detecting light emitting chips. It is characterized by
【００２６】請求項８記載の光結合素子は、発光チップ
収納用凹部を備え表面にめっきパターンが形成された発
光側射出立体配線成形樹脂基板と、受光チップ収納用凹
部を備え表面にめっきパターンが形成された受光側射出
立体配線成形樹脂基板と、該両樹脂基板の凹部における
めっきパターン上にそれぞれ個別に搭載される発光チッ
プ及び受光チップと、該発光チップ及び受光チップをそ
れぞれ被覆する透光性樹脂とを有し、前記発光側樹脂基
板と受光側樹脂基板とを対向させて前記発光チップと受
光チップとが光学的に結合するよう一体化してなること
を特徴とするものである。The optical coupling element according to the present invention comprises a light emitting side injection three-dimensional wiring molded resin substrate having a recess for accommodating a light emitting chip and a plating pattern formed on the surface, and a recess for accommodating a light receiving chip and a plating pattern on the surface. The formed light receiving side injection three-dimensional wiring molded resin substrate, the light emitting chip and the light receiving chip individually mounted on the plating patterns in the recesses of the both resin substrates, and the translucency that covers the light emitting chip and the light receiving chip, respectively. A resin, and the light emitting side resin substrate and the light receiving side resin substrate are opposed to each other and the light emitting chip and the light receiving chip are integrated so as to be optically coupled to each other.
【００２７】請求項９記載の光結合素子は、請求項８記
載の光結合素子において少なくとも前記発光チップ収納
用凹部の側面を該凹部の底面から上方にかけて広がる傾
斜面としてなることを特徴とするものである。An optical coupling element according to a ninth aspect is the optical coupling element according to the eighth aspect, characterized in that at least the side surface of the recess for accommodating the light emitting chip is an inclined surface that spreads upward from the bottom surface of the recess. Is.
【００２８】[0028]
【作用】上記構成によれば、本発明の請求項１記載の光
結合素子は、樹脂基板表面のめっきパターンを外部への
接続用端子とし、従来のリードフレームを不要とするこ
とによって光結合素子としての小型化が可能である。According to the above structure, the optical coupling element according to claim 1 of the present invention uses the plating pattern on the surface of the resin substrate as a terminal for connection to the outside and eliminates the conventional lead frame. Can be downsized.
【００２９】また、本発明の請求項２、３又は７記載の
光結合素子は、動作状態確認用発光チップ，非動作状態
確認用発光チップ等の動作確認用発光チップを備えてな
る構成なので、光結合素子の動作状態を該動作確認用発
光チップの点灯，消灯にて行うことが可能である。さら
に請求項７の構成においては、両方の動作確認用発光チ
ップが消灯することにより、光結合素子の異常を検出す
ることができる。Since the optical coupling element according to claim 2, 3 or 7 of the present invention is configured to include an operation confirmation light emitting chip such as an operation state confirmation light emitting chip and a non-operation state confirmation light emitting chip, The operation state of the optical coupling element can be performed by turning on and off the operation confirmation light emitting chip. Furthermore, in the structure of claim 7, by turning off both the light emitting chips for operation confirmation, it is possible to detect the abnormality of the optical coupling element.
【００３０】更に、本発明の請求項４記載の光結合素子
は、発光チップと受光チップとの間に内部沿面距離調整
手段を有してなる構成なので、発光チップと受光チップ
との内部沿面距離を長く調節することが可能である。Further, since the optical coupling element according to claim 4 of the present invention has a structure in which the internal creepage distance adjusting means is provided between the light emitting chip and the light receiving chip, the internal creepage distance between the light emitting chip and the light receiving chip. Can be adjusted long.
【００３１】加えて、本発明の請求項５記載の光結合素
子は、受発光チップ収納用凹部が第１凹部と該第１凹部
よりも深さの深い第２凹部とからなり、前記第１凹部の
底面に発光チップが搭載され、前記第２凹部の底面に受
光チップが搭載されるとともに、前記第１透光性樹脂と
遮光性樹脂の境界面を第１凹部側から第２凹部側に傾斜
させてなる構成なので、発光チップ側面からの光が第１
透光性樹脂と遮光性樹脂との界面にて反射されて受光チ
ップの受光面に伝達され光伝達率の向上が可能であると
ともに、第１凹部と第２凹部との深さの差の分だけ内部
沿面距離を長くすることが可能である。In addition, in the optical coupling element according to a fifth aspect of the present invention, the light receiving and emitting chip accommodating recess comprises a first recess and a second recess having a depth deeper than the first recess. A light-emitting chip is mounted on the bottom surface of the recess, a light-receiving chip is mounted on the bottom surface of the second recess, and the boundary surface between the first light-transmissive resin and the light-shielding resin is moved from the first recess side to the second recess side. Since the structure is tilted, the light from the side surface of the light emitting chip is the first
It is reflected at the interface between the light-transmitting resin and the light-shielding resin and is transmitted to the light-receiving surface of the light-receiving chip to improve the light transmissibility. It is possible to increase the internal creepage distance only.
【００３２】加えて、本発明の請求項６記載の光結合素
子は、受発光チップ収納用凹部が第１凹部と該第１凹部
よりも深さの深い第２凹部とからなり、前記第２凹部の
底面に発光チップ及び受光チップが搭載され、前記第２
凹部に第１透光性樹脂が充填され、前記第１凹部に遮光
性樹脂が充填されるとともに、前記第１透光性樹脂と遮
光性樹脂の境界面を凸曲面状としてなる構成なので、前
記境界面がおわん状の反射面となり、発光チップからの
光を効率よく反射させて受光チップに伝達することが可
能である。In addition, in the optical coupling element according to a sixth aspect of the present invention, the recess for receiving and emitting the light emitting chip comprises a first recess and a second recess deeper than the first recess, and the second recess is provided. The light emitting chip and the light receiving chip are mounted on the bottom surface of the recess, and
Since the concave portion is filled with the first light-transmitting resin, the first concave portion is filled with the light-shielding resin, and the boundary surface between the first light-transmitting resin and the light-shielding resin is formed into a convex curved surface, The boundary surface becomes a bowl-shaped reflecting surface, and light from the light emitting chip can be efficiently reflected and transmitted to the light receiving chip.
【００３３】加えて、本発明の請求項８記載の光結合素
子は、樹脂基板表面のめっきパターンを外部への接続用
端子とし、従来のリードフレームを不要とすることによ
って光結合素子としての小型化が可能であるとともに、
発光チップと受光チップとの内部沿面距離を充分長く設
定することが可能である。In addition, in the optical coupling element according to claim 8 of the present invention, the plating pattern on the surface of the resin substrate is used as a terminal for connection to the outside, and the conventional lead frame is not required. Is possible,
It is possible to set the internal creepage distance between the light emitting chip and the light receiving chip to be sufficiently long.
【００３４】加えて、本発明の請求項９記載の光結合素
子は、少なくとも発光チップ収納用凹部の側面を該凹部
の底面から上方にかけて広がる傾斜面としてなる構成な
ので、発光チップからの間接光が前記傾斜面にて反射さ
れて効率よく受光チップに伝達され、光伝達率の向上が
可能である。In addition, in the optical coupling element according to claim 9 of the present invention, since at least the side surface of the recess for accommodating the light emitting chip is an inclined surface that spreads upward from the bottom surface of the recess, indirect light from the light emitting chip is prevented. The light is reflected by the inclined surface and efficiently transmitted to the light receiving chip, so that the light transmission rate can be improved.
【００３５】[0035]
【実施例】図１は、本発明の第一実施例よりなる光結合
素子を示す縦断面図である。図２は、図１の樹脂封止前
の状態を示す斜視図である。なお、図２において内部沿
面距離調節手段は図示せず。1 is a longitudinal sectional view showing an optical coupling element according to a first embodiment of the present invention. FIG. 2 is a perspective view showing a state before resin sealing in FIG. The internal creepage distance adjusting means is not shown in FIG.
【００３６】該光結合素子は、受発光チップ収納用凹部
１３を備え表面にめっきパターン１１が形成された射出
立体配線成形樹脂基板（以下、単に「樹脂基板」と称
す。）１２と、該樹脂基板１２の前記凹部１３における
めっきパターン１１上に搭載される発光チップ１４及び
受光チップ１５と、該発光チップ１４と受光チップ１５
との間に設けられた内部沿面距離調整手段１６と、前記
凹部１３内において前記発光チップ１４及び受光チップ
１５並びに内部沿面距離調整手段１６を被覆する第１透
光性樹脂１７と、前記凹部１３内において前記第１透光
性樹脂１７を被覆する遮光性樹脂１８とを有してなる構
造である。The optical coupling element includes an injection three-dimensional wiring molded resin substrate (hereinafter simply referred to as "resin substrate") 12 having a recessed portion 13 for accommodating a light emitting and receiving chip and a plating pattern 11 formed on the surface thereof, and the resin. The light emitting chip 14 and the light receiving chip 15 mounted on the plating pattern 11 in the recess 13 of the substrate 12, and the light emitting chip 14 and the light receiving chip 15
An internal creepage distance adjusting means 16 provided between the concave portion 13 and the first translucent resin 17 for covering the light emitting chip 14, the light receiving chip 15 and the internal creepage distance adjusting means 16 in the concave portion 13, and the concave portion 13. The structure includes a light-shielding resin 18 that covers the first light-transmitting resin 17 inside.
【００３７】前記樹脂基板１２は、液晶ポリマー等によ
り射出成形された射出成形樹脂基板１２′に金，銀等か
らなるめっきパターン１１を設けてなる。The resin substrate 12 is obtained by providing a plating pattern 11 made of gold, silver or the like on an injection molded resin substrate 12 'which is injection molded from liquid crystal polymer or the like.
【００３８】前記内部沿面距離調整手段１６は例えば凸
部からなり、前記基板１２′と一体的に形成してなるも
のであっても良い。また、前記凸部に代わって内部沿面
距離調整手段１６を溝にて構成しても良い。The internal creepage distance adjusting means 16 may be, for example, a convex portion, and may be formed integrally with the substrate 12 '. Further, instead of the convex portion, the internal creepage distance adjusting means 16 may be configured by a groove.
【００３９】前記第１透光性樹脂１７は例えばシリコー
ン樹脂等からなり、遮光性樹脂１８は例えばシリコーン
樹脂、エポキシ樹脂等からなる。The first light-transmissive resin 17 is made of, for example, silicone resin, and the light-shielding resin 18 is made of, for example, silicone resin, epoxy resin or the like.
【００４０】上記光結合素子の動作を説明すると、発光
側めっきパターンより導かれた電気信号を発光チップ１
４にて光信号に変換し該発光チップ１４より光を発す
る。その光は、第１透光性樹脂１７と遮光性樹脂１８と
の界面にて反射し、受光チップ１５の受光面にて受光さ
れる。該受光チップ１５にて受光された光信号は再び電
気信号に変換され、受光側めっきパターンへと導かれて
なる。The operation of the optical coupling element will be described. An electric signal guided from the light emitting side plating pattern is applied to the light emitting chip 1.
At 4, the light is converted into an optical signal and the light is emitted from the light emitting chip 14. The light is reflected at the interface between the first light-transmissive resin 17 and the light-shielding resin 18, and is received by the light-receiving surface of the light-receiving chip 15. The optical signal received by the light receiving chip 15 is converted into an electric signal again and guided to the light receiving side plating pattern.
【００４１】該光結合素子によれば、樹脂基板１２表面
のめっきパターン１１を外部への接続用端子とし、従来
のリードフレームを不要とすることによって光結合素子
としての小型化が可能である。一例として、本実施例に
よれば実装面積が３×６．５ｍｍ（１９．５ｍｍ）程度
となり、従来の光結合素子と比較して約２０％の実装面
積の縮小が可能となる。According to the optical coupling element, the plating pattern 11 on the surface of the resin substrate 12 is used as an external connection terminal and the conventional lead frame is not required, so that the size of the optical coupling element can be reduced. As an example, according to this embodiment, the mounting area is about 3 × 6.5 mm (19.5 mm), and the mounting area can be reduced by about 20% as compared with the conventional optical coupling element.
【００４２】また、光結合素子においては、該光結合素
子を使用した機器における海外安全規格（セット規格）
により１次（発光チップ側）２次（受光チップ側）間内
部沿面距離、絶縁距離に基準が設けられているが、本実
施例の光結合素子は、発光チップ１４と受光チップ１５
との間に内部沿面距離調整手段１６を有してなる構成な
ので、発光チップ１４と受光チップ１５との内部沿面距
離を長く調節することが可能である。Regarding the optical coupling element, the overseas safety standard (set standard) for equipment using the optical coupling element
Therefore, the internal creepage distance and insulation distance between the primary (light-emitting chip side) and the secondary (light-receiving chip side) are set as references, but in the optical coupling element of this embodiment, the light-emitting chip 14 and the light-receiving chip 15 are provided.
Since the internal creepage distance adjusting means 16 is provided between and, the internal creepage distance between the light emitting chip 14 and the light receiving chip 15 can be adjusted to be long.
【００４３】以下、上述した光結合素子の製造方法につ
いて、図３及び図４を用いて説明する。A method of manufacturing the above-mentioned optical coupling element will be described below with reference to FIGS. 3 and 4.
【００４４】まず、液晶ポリマー等により射出成形され
受発光チップ収納用凹部１３を備えた射出成形樹脂基板
１２′表面にめっきパターン１１を形成し、樹脂基板１
２を形成する。ここで、両チップ１４，１５の並置方向
又は並置方向に対して垂直方向（尚、図中では並置方
向）に複数連結させて形成することにより、多連タイプ
の光結合素子の製造も容易にできる。First, a plating pattern 11 is formed on the surface of an injection-molded resin substrate 12 'which is injection-molded of liquid crystal polymer or the like and is provided with recesses 13 for receiving and emitting light-receiving chips.
Form 2 Here, by forming a plurality of chips 14 and 15 in a juxtaposed direction or in a direction perpendicular to the juxtaposed direction (the juxtaposed direction in the figure), it is possible to easily manufacture a multiple-type optical coupling element. it can.
【００４５】次に、発光チップ１４及び受光チップ１５
をそれぞれ個々のめっきパターン上に接着し、それぞれ
のチップ１４，１５と外部接続用端子となるめっきパタ
ーンとを金線１９にて接続（ワイヤボンド）する。Next, the light emitting chip 14 and the light receiving chip 15
Are bonded to each individual plating pattern, and the respective chips 14 and 15 and the plating pattern to be the external connection terminal are connected (wire bond) with a gold wire 19.
【００４６】その後、第１透光性樹脂１７及び遮光性樹
脂１８を順次凹部１３に充填し、発光チップ１４及び受
光チップ１５を封止する。After that, the first light-transmissive resin 17 and the light-shielding resin 18 are sequentially filled in the recess 13 to seal the light emitting chip 14 and the light receiving chip 15.
【００４７】この後、多連成形したものにおいては所望
のダイシングを行い個別に分割する。After that, the multi-molded product is subjected to desired dicing and divided into individual parts.
【００４８】その後、絶縁耐圧試験、電気的特性検査、
マーキング（図示せず）、外観検査、梱包の工程を経て
出荷される。After that, withstand voltage test, electrical characteristic test,
It is shipped after undergoing marking (not shown), visual inspection, and packaging.
【００４９】該製造工程は、従来の光結合素子の製造工
程よりも簡素化され、コストダウン及び納期の短縮も可
能である。The manufacturing process is simplified as compared with the conventional manufacturing process of the optical coupling element, and the cost and the delivery time can be shortened.
【００５０】以上説明した本実施例の光結合素子につい
ては、信頼性（ヒートサイクル試験、プレッシャークッ
カー試験）に関しても充分、市場の要望を満足すること
が確認されている。It has been confirmed that the optical coupling element of the present embodiment described above sufficiently satisfies the demands of the market in terms of reliability (heat cycle test, pressure cooker test).
【００５１】具体的には、図５が本実施例による光結合
素子のヒートサイクル試験結果であり、図６がプレッシ
ャークッカー試験結果である。以下、これらの縦軸につ
いて説明する。Specifically, FIG. 5 shows the result of the heat cycle test of the optical coupling element according to this example, and FIG. 6 shows the result of the pressure cooker test. Hereinafter, these vertical axes will be described.
【００５２】まず、ＶＦとは入力順電流によるアノー
ド、カソード間の電圧降下のことであり、該特性図では
初期の値に対する変動率で表している。また、ＩＣとは
入力側に電流を流した時に出力側に流れる直流電流であ
り、これもＶＦと同じく初期の値に対する変動率で表し
ている。次に、ＩＲであるがこれはアノード、カソード
間に逆電圧を印加した時に流れる直流電流であり、該特
性図では絶対値で表している。また、Ｉｃｅｏとはコレ
クタ、エミッタ間に電圧を印加したした時に出力側に流
れるコレクタ電流であり、ＩＲと同じく絶対値で表して
いる。First, VF is a voltage drop between the anode and the cathode due to an input forward current, and is represented by a variation rate with respect to an initial value in the characteristic diagram. Further, the IC is a direct current that flows to the output side when a current is supplied to the input side, and this is also expressed by a fluctuation rate with respect to an initial value, like VF. Next, IR, which is a direct current that flows when a reverse voltage is applied between the anode and the cathode, is represented by an absolute value in the characteristic diagram. Further, Iceo is a collector current flowing to the output side when a voltage is applied between the collector and the emitter, and is represented by an absolute value like IR.
【００５３】光結合素子において、これらの特性は重要
であり、変動が大きいと機器の誤動作につながる。In the optical coupling element, these characteristics are important, and a large fluctuation leads to malfunction of the equipment.
【００５４】図７は、他の実施例よりなる光結合素子を
示す縦断面図である。本実施例について、上記実施例と
相違する点のみ説明する。FIG. 7 is a vertical sectional view showing an optical coupling device according to another embodiment. Only the points of this embodiment different from the above embodiments will be described.
【００５５】該光結合素子は、前記受発光チップ収納用
凹部１３が第１凹部１３ａと該第１凹部１３ａよりも深
さの深い第２凹部１３ｂとからなり、前記第１凹部１３
ａの底面に発光チップ１４が搭載され、前記第２凹部１
３ｂの底面に受光チップ１５が搭載されるとともに、前
記第１透光性樹脂１７と遮光性樹脂１８の境界面を第１
凹部側から第２凹部側に傾斜させてなる構造である。In the optical coupling element, the light receiving and emitting chip accommodating recess 13 comprises a first recess 13a and a second recess 13b which is deeper than the first recess 13a.
The light emitting chip 14 is mounted on the bottom surface of a, and the second recess 1
The light-receiving chip 15 is mounted on the bottom surface of 3b, and the boundary surface between the first light-transmissive resin 17 and the light-shielding resin 18 is first
This is a structure that is inclined from the concave side to the second concave side.
【００５６】該構造によれば、発光チップ１４側面から
の光が第１透光性樹脂１７と遮光性樹脂１８との界面に
て反射されて受光チップ１５の受光面に伝達され光伝達
率の向上が可能であるとともに、第１凹部１３ａと第２
凹部１３ｂとの深さの差の分だけ内部沿面距離を長くす
ることが可能である。According to this structure, the light from the side surface of the light emitting chip 14 is reflected at the interface between the first light-transmissive resin 17 and the light-shielding resin 18, and is transmitted to the light-receiving surface of the light-receiving chip 15 so that the light transmissivity is increased. It is possible to improve the first concave portion 13a and the second concave portion 13a.
The internal creepage distance can be lengthened by the difference in depth from the recess 13b.
【００５７】図８は、更に他の実施例よりなる光結合素
子を示す縦断面図である。本実施例について、図１に示
す実施例と相違する点のみ説明する。FIG. 8 is a vertical sectional view showing an optical coupling device according to still another embodiment. This embodiment will be described only on the points different from the embodiment shown in FIG.
【００５８】該光結合素子は、前記受発光チップ収納用
凹部１３が第１凹部１３ａと該第１凹部１３ａよりも深
さの深い第２凹部１３ｂとからなり、前記第２凹部１３
ｂの底面に発光チップ１４及び受光チップ１５が搭載さ
れ、前記第２凹部１３ｂに第１透光性樹脂１７が充填さ
れ、前記第１凹部１３ａに遮光性樹脂１８が充填される
とともに、前記第１透光性樹脂１７と遮光性樹脂１８の
境界面を凸曲面状としてなる構造である。In the optical coupling element, the light receiving and emitting chip accommodating recess 13 comprises a first recess 13a and a second recess 13b having a depth deeper than the first recess 13a.
A light emitting chip 14 and a light receiving chip 15 are mounted on the bottom surface of b, the second recess 13b is filled with a first translucent resin 17, the first recess 13a is filled with a light shielding resin 18, and 1 The structure is such that the boundary surface between the light-transmissive resin 17 and the light-shielding resin 18 has a convex curved surface shape.
【００５９】前記凸曲面状の境界面の形成方法として
は、まず第２凹部１３ｂにおいて第１透光性樹脂１７を
多めに充填し、第１透光性樹脂１７の表面張力により該
第１透光性樹脂表面を凸曲面とする。その後、第１凹部
１３ａに遮光性樹脂１８を充填することによって、凸曲
面状の境界面が形成される。As a method of forming the convex curved boundary surface, first, a large amount of the first translucent resin 17 is filled in the second recess 13b, and the first translucent resin 17 is applied with the surface tension of the first translucent resin 17. The surface of the light-sensitive resin is a convex curved surface. Then, the light-shielding resin 18 is filled in the first concave portion 13a to form a convex curved boundary surface.
【００６０】該構造によれば、前記境界面がおわん状の
反射面となり、発光チップ１４からの光を効率よく反射
させて受光チップ１５に伝達することが可能である。According to this structure, the boundary surface serves as a bowl-shaped reflecting surface, and the light from the light emitting chip 14 can be efficiently reflected and transmitted to the light receiving chip 15.
【００６１】図９は、更に他の実施例よりなる光結合素
子を示す縦断面図である。本実施例について、図１に示
す実施例と相違する点のみ説明する。FIG. 9 is a longitudinal sectional view showing an optical coupling element according to still another embodiment. This embodiment will be described only on the points different from the embodiment shown in FIG.
【００６２】該光結合素子は、樹脂基板１２の裏面側に
動作確認用発光チップ２１を設け、該動作確認用発光チ
ップ２１を第２透光性樹脂１７′にて被覆してなる構造
である。The optical coupling element has a structure in which an operation confirming light emitting chip 21 is provided on the back surface side of the resin substrate 12, and the operation confirming light emitting chip 21 is covered with a second translucent resin 17 '. .
【００６３】該動作確認用発光チップ２１は可視光発光
ダイオードからなり、例えば図１０に示すように発光チ
ップ１４と直列接続され、光結合素子の動作状態確認用
とされてなる。即ち、光結合素子動作時に動作確認用発
光チップ２１が点灯し、停止時に動作確認用発光チップ
２１が消灯する。The operation confirming light emitting chip 21 comprises a visible light emitting diode and is connected in series with the light emitting chip 14 as shown in FIG. 10, for confirming the operation state of the optical coupling element. That is, the operation confirmation light emitting chip 21 is turned on when the optocoupler is operating, and the operation confirmation light emitting chip 21 is turned off when the optocoupler is stopped.
【００６４】前記第２透光性樹脂１７′は、例えばシリ
コーン樹脂，エポキシ樹脂等からなる。該光結合素子を
外部基板に実装する際には、動作確認用発光チップ２１
が上面にくるよう配置して実装することとする。The second translucent resin 17 'is made of, for example, silicone resin, epoxy resin or the like. When the optocoupler is mounted on an external substrate, the operation confirmation light emitting chip 21 is used.
Will be mounted so that it will be on the upper surface.
【００６５】これによって、光結合素子が動作している
か否かを検出することが可能であるとともに、上記実施
例に対して実装面積を増加させることなく動作確認用発
光チップ２１を設置できる。また、従来外付けとなって
いた動作確認用発光素子を一体化とすることが可能とな
る。As a result, it is possible to detect whether or not the optical coupling element is operating, and the operation confirmation light emitting chip 21 can be installed without increasing the mounting area as compared with the above embodiment. Further, it becomes possible to integrate the operation-confirming light emitting element which is conventionally attached externally.
【００６６】図１１は、本発明の第二実施例よりなる光
結合素子を示す縦断面図である。図１２は、図１１の樹
脂封止前の状態を示す斜視図である。なお、図１２にお
いて内部沿面距離調節手段は図示せず。FIG. 11 is a vertical sectional view showing an optical coupling element according to the second embodiment of the present invention. FIG. 12 is a perspective view showing a state before resin sealing in FIG. 11. The internal creepage distance adjusting means is not shown in FIG.
【００６７】該光結合素子は、受発光チップ収納用凹部
１３及び動作確認用発光チップ収納用凹部２２を備え表
面にめっきパターン１１が形成された射出立体配線成形
樹脂基板（以下、単に「樹脂基板」と称す。）１２と、
該樹脂基板１２の前記受発光チップ収納用凹部１３にお
けるめっきパターン１１上に搭載される発光チップ１４
及び受光チップ１５と、該発光チップ１４と受光チップ
１５との間に設けられた内部沿面距離調整手段１６と、
前記凹部１３内において前記発光チップ１４及び受光チ
ップ１５並びに内部沿面距離調整手段１６を被覆する第
１透光性樹脂１７と、前記凹部１３内において前記第１
透光性樹脂１７を被覆する遮光性樹脂１８と、前記動作
確認用発光チップ収納用凹部２２におけるめっきパター
ン１１上に搭載される動作確認用発光チップ２１と、該
凹部２２内において該動作確認用発光チップ２１を被覆
する第２透光性樹脂１７′とを有してなる構造である。The optical coupling element is an injection three-dimensional wiring molded resin substrate (hereinafter, simply referred to as "resin substrate") having a recessed portion 13 for receiving and receiving a light emitting chip and a recessed portion 22 for storing a light emitting chip for operation confirmation and having a plating pattern 11 formed on the surface thereof. 12),
A light emitting chip 14 mounted on the plating pattern 11 in the light receiving and emitting chip housing recess 13 of the resin substrate 12.
And a light receiving chip 15, and an internal creepage distance adjusting means 16 provided between the light emitting chip 14 and the light receiving chip 15.
The first light-transmissive resin 17 that covers the light emitting chip 14, the light receiving chip 15, and the internal creepage distance adjusting means 16 in the recess 13, and the first transparent resin 17 in the recess 13.
A light-shielding resin 18 covering the translucent resin 17, an operation confirmation light emitting chip 21 mounted on the plating pattern 11 in the operation confirmation light emitting chip housing recess 22, and an operation confirmation light in the recess 22. This structure has a second light-transmitting resin 17 ′ that covers the light emitting chip 21.
【００６８】これにより、上記同様光結合素子の動作確
認を行うことが可能となるとともに、従来外付けとなっ
ていた動作確認用発光素子を一体化とすることが可能と
なる。以下、上述した光結合素子の製造方法について説
明する。As a result, it becomes possible to confirm the operation of the optical coupling element in the same manner as described above, and it is possible to integrate the operation confirming light emitting element which has been conventionally attached externally. Hereinafter, a method for manufacturing the above-described optical coupling element will be described.
【００６９】まず、液晶ポリマー等により射出成形され
受発光チップ収納用凹部１３及び動作確認用発光チップ
収納用凹部２２とを備えた射出成形樹脂基板１２′表面
にめっきパターン１１を形成し、樹脂基板１２を形成す
る。ここで、各チップ１４，１５，２１の並置方向又は
並置方向に対して垂直方向に複数連結させて形成するこ
とにより、多連タイプの光結合素子の製造も容易にでき
る。First, a plating pattern 11 is formed on the surface of an injection-molded resin substrate 12 'which is injection-molded with a liquid crystal polymer or the like and has a recess 13 for receiving a light-emitting chip and a recess 22 for storing a light-emitting chip for operation confirmation. 12 is formed. Here, by forming a plurality of chips 14, 15 and 21 in a juxtaposed direction or in a direction perpendicular to the juxtaposed direction, a multiple-type optical coupling element can be easily manufactured.
【００７０】次に、発光チップ１４及び受光チップ１５
並びに動作確認用発光チップ２１をそれぞれ個々のめっ
きパターン上に接着し、それぞれのチップ１４，１５，
２１と外部接続用端子となるめっきパターンとを金線１
９にて接続（ワイヤボンド）する。Next, the light emitting chip 14 and the light receiving chip 15
In addition, the operation confirmation light emitting chip 21 is adhered onto each individual plating pattern, and the respective chips 14, 15,
21 and a plating pattern to be a terminal for external connection with a gold wire 1
Connect (wire bond) at 9.
【００７１】その後、第１透光性樹脂１７及び遮光性樹
脂１８を順次凹部１３に充填し発光チップ１４及び受光
チップ１５を封止するとともに、第２透光性樹脂１７′
を凹部２２に充填し動作確認用発光チップ２２を封止す
る。After that, the first light-transmissive resin 17 and the light-shielding resin 18 are sequentially filled in the recess 13 to seal the light emitting chip 14 and the light receiving chip 15, and at the same time, the second light transmissive resin 17 '.
Is filled in the concave portion 22 to seal the operation confirmation light emitting chip 22.
【００７２】この後、多連成形したものにおいては所望
のダイシングを行い個別に分割する。After that, the multi-molded product is subjected to desired dicing and divided into individual parts.
【００７３】その後、絶縁耐圧試験、電気的特性検査、
マーキング（図示せず）、外観検査、梱包の工程を経て
出荷される。After that, withstand voltage test, electrical characteristic test,
It is shipped after undergoing marking (not shown), visual inspection, and packaging.
【００７４】図１３は、他の実施例よりなる光結合素子
を示す縦断面図である。図１４は、該光結合素子の等価
回路図である。本実施例について、図１１に示す実施例
と相違する点のみ説明する。FIG. 13 is a vertical sectional view showing an optical coupling device according to another embodiment. FIG. 14 is an equivalent circuit diagram of the optical coupling element. This embodiment will be described only on the points different from the embodiment shown in FIG.
【００７５】該光結合素子は、上記動作確認用発光チッ
プ収納用凹部２２を複数備えてなる構成であり、一方の
凹部２２ａには例えば動作状態確認用発光チップ２１ａ
が収納され、他方の凹部２２ｂには例えば過電流検出用
発光チップ２１ｂが収納されてなる。該凹部２２ａ，２
２ｂにはそれぞれ第２透光性樹脂１７′が充填され各発
光チップ２１ａ，２１ｂが封止されてなる。The optical coupling element has a plurality of recesses 22 for accommodating the above-described light emitting chips for operation confirmation, and one recess 22a has, for example, the light emitting chip 21a for operation state confirmation.
And the other recess 22b houses, for example, an overcurrent detection light emitting chip 21b. The recesses 22a, 2
2b is filled with the second translucent resin 17 ', and the light emitting chips 21a and 21b are sealed.
【００７６】図１４に示すように、動作状態確認用発光
チップ２１ａは発光チップ１４に対して直列接続され、
非動作状態確認用用発光チップ２１ｂは発光チップ１４
に対して並列的に接続されてなる。図中、Ａは入力端子
であり、２３はインバート素子である。以下、動作を説
明すると、入力端子ＡがＨＩＧＨのとき、発光チップ１
４がＯＮし、且つ動作状態確認用発光チップ２１ａが点
灯する。非動作状態確認用発光チップ２１ｂは、インバ
ート素子２３の出力がＬＯＷとなるため消灯する。これ
により、光結合素子の動作状態を検出する。As shown in FIG. 14, the operating state confirming light emitting chip 21a is connected in series to the light emitting chip 14,
The light emitting chip 21b for non-operation state confirmation is the light emitting chip 14
Are connected in parallel to. In the figure, A is an input terminal and 23 is an inverting element. The operation will be described below. When the input terminal A is HIGH, the light emitting chip 1
4 is turned on, and the light emitting chip 21a for confirming the operation state is turned on. The light emitting chip 21b for non-operation state confirmation is turned off because the output of the inversion element 23 becomes LOW. This detects the operating state of the optical coupling element.
【００７７】また、入力端子ＡがＬＯＷのとき、発光チ
ップ１４がＯＦＦし、且つ動作状態確認用発光チップ２
１ａが消灯する。非動作状態確認用発光チップ２１ｂ
は、インバート素子２３の出力がＨＩＧＨとなるため点
灯する。これにより、光結合素子の非動作状態を検出す
る。When the input terminal A is LOW, the light emitting chip 14 is turned off and the light emitting chip 2 for checking the operating state is
1a goes out. Light emitting chip 21b for non-operating state confirmation
Lights up because the output of the inverting element 23 becomes HIGH. As a result, the non-operating state of the optical coupling element is detected.
【００７８】前述した動作確認用発光チップが１つの場
合には非動作と異常検出との区別がつかなかったが、本
実施例によれば光結合素子の異常を両動作確認用発光チ
ップ２１ａ，２１ｂの消灯をもって検出することが可能
となる。例えば、発光チップ１４のワイヤー断線等の不
具合を検出できる。In the case where there is one operation confirming light emitting chip as described above, it is impossible to distinguish between non-operation and abnormality detection. However, according to the present embodiment, the abnormality of the optical coupling element is detected by both the operation confirming light emitting chips 21a, It is possible to detect by turning off the light of 21b. For example, a defect such as a wire breakage of the light emitting chip 14 can be detected.
【００７９】これにより、光結合素子の動作状態確認及
び異常検出を行うことが可能となる。As a result, it becomes possible to check the operating state of the optical coupling element and detect an abnormality.
【００８０】図１５は、任意に多連型光結合素子を形成
できる光結合素子の製造方法を説明するための縦断面図
である。FIG. 15 is a vertical sectional view for explaining a method of manufacturing an optical coupling element capable of arbitrarily forming a multiple optical coupling element.
【００８１】前記第一実施例及び第二実施例の多連タイ
プの光結合素子の製造方法において、各樹脂基板１２間
のダイシングをハーフダイスとすることにより、ユーザ
ー自身で要望する多連型光結合素子を容易に作成するこ
とが可能となる。In the method for manufacturing the multiple-type optical coupling element of the first and second embodiments, the dicing between the resin substrates 12 is a half die, so that the multiple-type optical device desired by the user himself / herself is obtained. It becomes possible to easily manufacture the coupling element.
【００８２】図１６は、本発明の第三実施例よりなる光
結合素子を示す縦断面図である。FIG. 16 is a vertical sectional view showing an optical coupling element according to the third embodiment of the present invention.
【００８３】該光結合素子は、発光チップ収納用凹部１
３′を備え表面にめっきパターン１１が形成された発光
側射出立体配線成形樹脂基板（以下、「発光側樹脂基
板」と称す。）１２ａと、受光チップ収納用凹部１３″
を備え表面にめっきパターン１１が形成された受光側射
出立体配線成形樹脂基板（以下、「受光側樹脂基板」と
称す。）１２ｂと、該両樹脂基板１２ａ，１２ｂの各凹
部１３におけるめっきパターン１１上にそれぞれ個別に
搭載される発光チップ１４及び受光チップ１５と、前記
各凹部１３′，１３″内において前記発光チップ１４及
び受光チップ１５を被覆する第１透光性樹脂１７とを有
し、前記発光側樹脂基板１２ａと受光側樹脂基板１２ｂ
とを対向させて前記発光チップ１４と受光チップ１５と
が光学的に結合するよう一体化してなる構造である。The optical coupling element comprises a recess 1 for housing a light emitting chip.
A light emitting side injection three-dimensional wiring molded resin substrate (hereinafter, referred to as “light emitting side resin substrate”) 12a having a plating pattern 11 formed on the surface 3 ', and a light receiving chip accommodating recess 13 ″.
A light-receiving side injection three-dimensional wiring molded resin substrate (hereinafter referred to as “light-receiving side resin substrate”) 12b having a plating pattern 11 formed on the surface thereof, and the plating pattern 11 in each recess 13 of both resin substrates 12a, 12b. A light-emitting chip 14 and a light-receiving chip 15 which are individually mounted on the upper part, and a first light-transmissive resin 17 which covers the light-emitting chip 14 and the light-receiving chip 15 in the recesses 13 ′ and 13 ″. The light emitting side resin substrate 12a and the light receiving side resin substrate 12b
Are opposed to each other and the light emitting chip 14 and the light receiving chip 15 are integrated so as to be optically coupled.
【００８４】該光結合素子の動作を説明すると、発光側
めっきパターンより導かれた電気信号を発光チップ１４
にて光信号に変換し該発光チップ１４より光を発する。
発光チップ１４上面より発せられた直接光が直接受光チ
ップ１５の受光面にて受光される。該受光チップ１５に
て受光された光信号は再び電気信号に変換され、受光側
めっきパターンへと導かれてなる。The operation of the optical coupling element will be described. An electric signal derived from the light emitting side plating pattern is applied to the light emitting chip 14.
Is converted into an optical signal and the light is emitted from the light emitting chip 14.
Direct light emitted from the upper surface of the light emitting chip 14 is directly received by the light receiving surface of the light receiving chip 15. The optical signal received by the light receiving chip 15 is converted into an electric signal again and guided to the light receiving side plating pattern.
【００８５】本実施例の光結合素子は、上記第一実施例
の光結合素子と比較して約２倍の光伝達率が得られる。
これは、上記第一実施例においては樹脂の境界面での反
射を利用しているため一部の光が遮光性樹脂にて吸収さ
れるのに対し、本実施例においては直接伝達することが
可能であることによるものである。The optical coupling element of the present embodiment can obtain a light transmissivity about twice as high as that of the optical coupling element of the first embodiment.
This is because in the first embodiment, since the reflection at the boundary surface of the resin is used, a part of the light is absorbed by the light-shielding resin, but in the present embodiment, it can be directly transmitted. This is because it is possible.
【００８６】上記光結合素子によれば、両樹脂基板１２
ａ，１２ｂ表面のめっきパターン１１を外部への接続用
端子とし、従来のリードフレームを不要とすることによ
って光結合素子としての小型化が可能である。According to the above optical coupling element, both resin substrates 12 are provided.
By using the plating patterns 11 on the surfaces of a and 12b as terminals for connection to the outside and eliminating the need for a conventional lead frame, the size of the optical coupling element can be reduced.
【００８７】また、光結合素子においては、該光結合素
子を使用した機器における海外安全規格（セット規格）
により１次（発光チップ側）２次（受光チップ側）間内
部沿面距離、絶縁距離に基準が設けられているが、本実
施例の光結合素子は、発光チップ１４と受光チップ１５
との内部沿面距離が少なくとも双方の凹部の深さの和分
設定されるため特に問題はなく、また必要に応じて凹部
１３の深さを深く設定することにより発光チップ１４と
受光チップ１５との内部沿面距離を長く調節することも
可能である。Regarding the optical coupling element, the overseas safety standard (set standard) for equipment using the optical coupling element
Therefore, the internal creepage distance and insulation distance between the primary (light-emitting chip side) and the secondary (light-receiving chip side) are set as references, but in the optical coupling element of this embodiment, the light-emitting chip 14 and the light-receiving chip 15 are provided.
There is no particular problem because the internal creepage distance between and is set at least as a sum of the depths of both recesses, and by setting the depth of the recess 13 deep as necessary, the light emitting chip 14 and the light receiving chip 15 It is also possible to increase the internal creepage distance.
【００８８】以下、上述した光結合素子の製造方法につ
いて、図１７を用いて説明する。A method of manufacturing the above-mentioned optical coupling element will be described below with reference to FIG.
【００８９】まず、液晶ポリマー等により射出成形され
発光チップ収納用凹部１３′を備えた基板１２′表面に
めっきパターン１１を形成し樹脂基板１２ａを形成する
とともに、同じく液晶ポリマー等により射出成形され受
光チップ収納用凹部１３″を備えた基板１２′表面にめ
っきパターン１１を形成し樹脂基板１２ｂを形成する。
ここで、外部接続用端子が引き出されていない対向する
面の方向又はその垂直方向に複数連結させて形成するこ
とにより、多連タイプの光結合素子の製造も容易にでき
る。First, a resin pattern 12a is formed by forming a plating pattern 11 on the surface of a substrate 12 'which is injection-molded of liquid crystal polymer or the like and has a recess 13' for storing a light emitting chip. The plating pattern 11 is formed on the surface of the substrate 12 'having the chip accommodating recess 13 "to form the resin substrate 12b.
Here, by forming a plurality of external connection terminals by connecting them in the direction of the opposing surfaces where they are not drawn out or in the direction perpendicular thereto, it is possible to easily manufacture a multiple-type optical coupling element.
【００９０】次に、発光チップ１４及び受光チップ１５
をそれぞれ個々の樹脂基板１２ａ，１２ｂのめっきパタ
ーン上に接着し、それぞれのチップ１４，１５と外部接
続用端子となるめっきパターンとを金線１９にて接続
（ワイヤボンド）する。Next, the light emitting chip 14 and the light receiving chip 15
Are bonded to the plating patterns of the respective resin substrates 12a and 12b, and the chips 14 and 15 and the plating patterns to be external connection terminals are connected (wire bond) with the gold wire 19.
【００９１】その後、第１透光性樹脂１７を凹部１３に
充填し、発光チップ１４及び受光チップ１５をそれぞれ
封止する。After that, the first translucent resin 17 is filled in the recess 13 and the light emitting chip 14 and the light receiving chip 15 are sealed.
【００９２】次に、発光側樹脂基板１２ａと受光側樹脂
基板１２ｂとを対向させて前記発光チップ１４と受光チ
ップ１５とが光学的に結合するよう一体化する。例え
ば、互いの対向面の少なくとも樹脂基板表面に接着剤を
塗布して接着する。Next, the light emitting side resin substrate 12a and the light receiving side resin substrate 12b are opposed to each other, and the light emitting chip 14 and the light receiving chip 15 are integrated so as to be optically coupled. For example, an adhesive is applied and adhered to at least the surface of the resin substrate on the surfaces facing each other.
【００９３】この後、多連成形したものにおいては所望
のダイシングを行い個別に分割する。After that, the multi-molded product is subjected to desired dicing and divided into individual parts.
【００９４】その後、絶縁耐圧試験、電気的特性検査、
マーキング（図示せず）、外観検査、梱包の工程を経て
出荷される。Thereafter, withstand voltage test, electrical characteristic test,
It is shipped after undergoing marking (not shown), visual inspection, and packaging.
【００９５】該製造工程は、従来の光結合素子の製造工
程よりも簡素化され、コストダウン及び納期の短縮も可
能である。The manufacturing process is simplified as compared with the conventional manufacturing process of the optical coupling element, and the cost and the delivery time can be shortened.
【００９６】以上説明した本実施例の光結合素子につい
ても、信頼性（ヒートサイクル試験、プレッシャークッ
カー試験）に関して、充分、市場の要望を満足すること
が確認されている。It has been confirmed that the optical coupling element of the present embodiment described above also sufficiently satisfies the market demand in terms of reliability (heat cycle test, pressure cooker test).
【００９７】図１８は、他の実施例よりなる光結合素子
を示す縦断面図である。本実施例について、図１６に示
す実施例と相違する点のみ説明する。FIG. 18 is a vertical sectional view showing an optical coupling device according to another embodiment. This embodiment will be described only on the points different from the embodiment shown in FIG.
【００９８】該光結合素子は、前記凹部１３′，１３″
の側面を該凹部１３′，１３″の底面から上方にかけて
広がる傾斜面としてなる構造である。The optical coupling element includes the recesses 13 ', 13 ".
Is a structure in which the side surface of the concave portion 13 ', 13 "is an inclined surface that spreads upward from the bottom surface.
【００９９】該構造によれば、発光チップ１４側面にて
発した間接光が前記傾斜面にて反射されて効率よく受光
チップ１５に伝達され、光伝達率の向上が可能である。According to this structure, the indirect light emitted from the side surface of the light emitting chip 14 is reflected by the inclined surface and efficiently transmitted to the light receiving chip 15, and the light transmission rate can be improved.
【０１００】[0100]
【発明の効果】以上説明したように、本発明の請求項１
記載の光結合素子によれば、樹脂基板表面のめっきパタ
ーンを外部への接続用端子とし、従来のリードフレーム
を不要とすることによって光結合素子としての小型化が
可能となる。As described above, according to the first aspect of the present invention.
According to the optical coupling element described above, the plating pattern on the surface of the resin substrate is used as an external connection terminal, and the conventional lead frame is not required, so that the size of the optical coupling element can be reduced.
【０１０１】また、本発明の請求項２記載の光結合素子
によれば、実装面積を増加させることなく動作確認用発
光チップを設けることが可能となるとともに、従来外付
けとなっていた動作確認用発光素子を一体化とすること
が可能となる。更に、本発明の請求項３記載の光結合素
子によれば、樹脂基板表面のめっきパターンを外部への
接続用端子とし、従来のリードフレームを不要とするこ
とによって光結合素子としての小型化が可能となるとと
もに、光結合素子の動作確認を行うことが可能となる。
また、動作確認用発光素子の一体化が可能となる。Further, according to the optical coupling element of the second aspect of the present invention, it becomes possible to provide the operation confirmation light emitting chip without increasing the mounting area, and the operation confirmation which has been conventionally attached externally can be performed. It becomes possible to integrate the light emitting element for use. Furthermore, according to the optical coupling element of claim 3 of the present invention, the plating pattern on the surface of the resin substrate is used as a terminal for connecting to the outside, and the conventional lead frame is not required, so that the optical coupling element can be miniaturized. In addition to being possible, it is possible to confirm the operation of the optical coupling element.
Further, it becomes possible to integrate the light emitting element for operation confirmation.
【０１０２】加えて、本発明の請求項４記載の光結合素
子によれば、発光チップと受光チップとの間に内部沿面
距離調整手段を有してなる構成なので、発光チップと受
光チップとの内部沿面距離を長く調節することが可能と
なる。In addition, according to the optical coupling element of claim 4 of the present invention, since the internal creepage distance adjusting means is provided between the light emitting chip and the light receiving chip, the light emitting chip and the light receiving chip are separated from each other. It is possible to adjust the internal creepage distance longer.
【０１０３】更に、本発明の請求項５記載の光結合素子
によれば、受発光チップ収納用凹部が第１凹部と該第１
凹部よりも深さの深い第２凹部とからなり、前記第１凹
部の底面に発光チップが搭載され、前記第２凹部の底面
に受光チップが搭載されるとともに、前記第１透光性樹
脂と遮光性樹脂の境界面を第１凹部側から第２凹部側に
傾斜させてなる構成なので、発光チップ側面からの光が
第１透光性樹脂と遮光性樹脂との界面にて反射されて受
光チップの受光面に伝達され光伝達率の向上が可能とな
るとともに、第１凹部と第２凹部との深さの差の分だけ
内部沿面距離を長くすることが可能となる。加えて、本
発明の請求項６記載の光結合素子によれば、受発光チッ
プ収納用凹部が第１凹部と該第１凹部よりも深さの深い
第２凹部とからなり、前記第２凹部の底面に発光チップ
及び受光チップが搭載され、前記第２凹部に第１透光性
樹脂が充填され、前記第１凹部に遮光性樹脂が充填され
るとともに、前記第１透光性樹脂と遮光性樹脂の境界面
を凸曲面状としてなる構成なので、前記境界面がおわん
状の反射面となり、発光チップからの光を効率よく反射
させて受光チップに伝達することが可能となる。Further, according to the optical coupling element of the fifth aspect of the present invention, the light receiving and emitting chip accommodating recess is the first recess and the first recess.
A second recess having a depth deeper than that of the recess, a light emitting chip is mounted on the bottom surface of the first recess, a light receiving chip is mounted on the bottom surface of the second recess, and the first translucent resin is included. Since the boundary surface of the light-shielding resin is inclined from the first concave portion side to the second concave portion side, the light from the side surface of the light emitting chip is reflected at the interface between the first light-transmitting resin and the light-shielding resin and received. It is possible to improve the light transmission rate by being transmitted to the light receiving surface of the chip, and it is possible to increase the internal creepage distance by the difference in depth between the first recess and the second recess. In addition, according to the optical coupling element of claim 6 of the present invention, the recess for receiving and emitting a light emitting chip comprises a first recess and a second recess having a depth deeper than the first recess, and the second recess. A light emitting chip and a light receiving chip are mounted on the bottom surface of the first recess, the second recess is filled with a first light-transmissive resin, the first recess is filled with a light-shielding resin, and the first light-transmissive resin and the light-shielding resin are shielded. Since the boundary surface of the resin is a convex curved surface, the boundary surface becomes a bowl-shaped reflecting surface, and the light from the light emitting chip can be efficiently reflected and transmitted to the light receiving chip.
【０１０４】加えて、本発明の請求項７記載の光結合素
子によれば、動作確認用発光チップが動作状態確認用発
光チップ及び非動作状態確認用発光チップの複数からな
る構成なので、光結合素子の動作中，停止中，異常検出
等を該動作確認用発光チップの点灯又は消灯にて表し、
外部に知らせることが可能となる。In addition, according to the optical coupling element of claim 7 of the present invention, since the operation confirming light emitting chip is composed of a plurality of operating state confirming light emitting chips and non-operating state confirming light emitting chips, the optical coupling element is optically coupled. The operation of the element, stop, abnormality detection, etc. are represented by turning on or off the light emitting chip for operation confirmation,
It becomes possible to inform the outside.
【０１０５】加えて、本発明の請求項８記載の光結合素
子によれば、樹脂基板表面のめっきパターンを外部への
接続用端子とし、従来のリードフレームを不要とするこ
とによって光結合素子としての小型化が可能となるとと
もに、発光チップと受光チップとの内部沿面距離を充分
長く設定することが可能となる。In addition, according to the optical coupling element of claim 8 of the present invention, the plating pattern on the surface of the resin substrate is used as a terminal for connecting to the outside, and the conventional lead frame is not required, so that the optical coupling element is realized. It is possible to reduce the size and the internal creepage distance between the light emitting chip and the light receiving chip can be set to be sufficiently long.
【０１０６】加えて、本発明の請求項９記載の光結合素
子によれば、少なくとも発光チップ収納用凹部の側面を
該凹部の底面から上方にかけて広がる傾斜面としてなる
構成なので、発光チップからの間接光が前記傾斜面にて
反射されて効率よく受光チップに伝達され、光伝達率の
向上が可能となる。In addition, according to the optical coupling element of the ninth aspect of the present invention, since at least the side surface of the recess for accommodating the light emitting chip is an inclined surface that spreads upward from the bottom surface of the recess, it is indirect from the light emitting chip. Light is reflected by the inclined surface and efficiently transmitted to the light receiving chip, and the light transmission rate can be improved.
【図面の簡単な説明】[Brief description of drawings]
【図１】本発明の第一実施例よりなる光結合素子を示す
縦断面図である。FIG. 1 is a vertical sectional view showing an optical coupling element according to a first embodiment of the present invention.
【図２】図１の樹脂封止前の状態を示す斜視図である。FIG. 2 is a perspective view showing a state before resin sealing in FIG.
【図３】図１に示す光結合素子の製造フローチャートを
示す図である。FIG. 3 is a diagram showing a manufacturing flowchart of the optical coupling element shown in FIG.
【図４】図１に示す光結合素子の製造工程図である。FIG. 4 is a manufacturing process diagram of the optical coupling element shown in FIG. 1.
【図５】図１に示す光結合素子のヒートサイクル試験結
果を示す図である。5 is a diagram showing a heat cycle test result of the optical coupling element shown in FIG.
【図６】図１に示す光結合素子のプレッシャークッカー
試験結果を示す図である。FIG. 6 is a diagram showing results of a pressure cooker test of the optical coupling element shown in FIG.
【図７】他の実施例よりなる光結合素子を示す縦断面図
である。FIG. 7 is a vertical sectional view showing an optical coupling element according to another embodiment.
【図８】更に、他の実施例よりなる光結合素子を示す縦
断面図である。FIG. 8 is a vertical sectional view showing an optical coupling device according to another embodiment.
【図９】更に、他の実施例よりなる光結合素子を示す縦
断面図である。FIG. 9 is a longitudinal sectional view showing an optical coupling element according to another embodiment.
【図１０】図９に示す光結合素子の等価回路図である。10 is an equivalent circuit diagram of the optical coupling element shown in FIG.
【図１１】本発明の第二実施例よりなる光結合素子を示
す縦断面図である。FIG. 11 is a vertical sectional view showing an optical coupling element according to a second embodiment of the present invention.
【図１２】図１１の樹脂封止前の状態を示す斜視図であ
る。FIG. 12 is a perspective view showing a state before resin sealing in FIG. 11.
【図１３】他の実施例よりなる光結合素子を示す縦断面
図である。FIG. 13 is a longitudinal sectional view showing an optical coupling element according to another embodiment.
【図１４】図１３に示す光結合素子の等価回路図であ
る。14 is an equivalent circuit diagram of the optical coupling element shown in FIG.
【図１５】任意に多連型光結合素子を形成できる光結合
素子の製造方法を説明するための縦断面図である。FIG. 15 is a vertical cross-sectional view for explaining a method for manufacturing an optical coupling element capable of arbitrarily forming a multiple optical coupling element.
【図１６】本発明の第三実施例よりなる光結合素子を示
す縦断面図である。FIG. 16 is a vertical sectional view showing an optical coupling element according to a third embodiment of the present invention.
【図１７】図１６に示す光結合素子の製造フローチャー
トを示す図である。17 is a diagram showing a manufacturing flowchart of the optical coupling element shown in FIG.
【図１８】他の実施例よりなる光結合素子を示す縦断面
図である。FIG. 18 is a vertical sectional view showing an optical coupling element according to another embodiment.
【図１９】従来の光結合素子を示す縦断面図である。FIG. 19 is a vertical sectional view showing a conventional optical coupling element.
【図２０】図１９に示す光結合素子の製造フローチャー
トを示す図である。20 is a diagram showing a manufacturing flowchart of the optical coupling element shown in FIG.
【図２１】他の従来の光結合素子を示す縦断面図であ
る。FIG. 21 is a vertical cross-sectional view showing another conventional optical coupling element.
【図２２】図２１に示す光結合素子の製造フローチャー
トを示す図である。22 is a diagram showing a manufacturing flowchart of the optical coupling element shown in FIG. 21. FIG.
１１ めっきパターン １２ 射出立体配線成形基板 １２ａ 発光側射出立体配線成形基板 １２ｂ 受光側射出立体配線成形基板 １３ 受発光チップ収納用凹部 １３ａ 第１凹部 １３ｂ 第２凹部 １３′ 発光チップ収納用凹部 １３″ 受光チップ収納用凹部 １４ 発光チップ １５ 受光チップ １６ 内部沿面距離調整手段 １７ 第１透光性樹脂 １７′第２透光性樹脂 １８ 遮光性樹脂 ２１ 動作確認用発光チップ ２１ａ 動作状態確認用発光チップ ２１ｂ 非動作状態確認用発光チップ ２２，２２ａ，２２ｂ 動作確認用発光チップ用凹部 11 plating pattern 12 injection three-dimensional wiring molded substrate 12a light emitting side injection three-dimensional wiring molded substrate 12b light receiving side injection three-dimensional wiring molded substrate 13 light receiving and emitting chip storing recess 13a first recess 13b second recess 13 'light emitting chip storing recess 13 "light receiving Chip storing recess 14 Light emitting chip 15 Light receiving chip 16 Internal creepage distance adjusting means 17 First light transmitting resin 17 'Second light transmitting resin 18 Light shielding resin 21 Operation checking light emitting chip 21a Operation state checking light emitting chip 21b Non Operation status confirmation light emitting chip 22, 22a, 22b Operation confirmation light emitting chip recess
Claims (9)
っきパターンが形成された射出立体配線成形樹脂基板
と、該樹脂基板の前記凹部におけるめっきパターン上に
搭載される発光チップ及び受光チップと、該発光チップ
及び受光チップを被覆する第１透光性樹脂と、該第１透
光性樹脂を被覆する遮光性樹脂とを有してなることを特
徴とする光結合素子。1. An injection three-dimensional wiring molded resin substrate having a recess for accommodating a light emitting and receiving chip and having a plating pattern formed on the surface, and a light emitting chip and a light receiving chip mounted on the plating pattern in the recess of the resin substrate, An optical coupling element comprising: a first light-transmissive resin that covers the light-emitting chip and the light-receiving chip; and a light-shielding resin that covers the first light-transmissive resin.
作確認用発光チップを備え、該動作確認用発光チップを
第２透光性樹脂にて被覆してなることを特徴とする請求
項１記載の光結合素子。2. The operation confirmation light emitting chip is provided on the back surface of the injection three-dimensional wiring molded resin substrate, and the operation confirmation light emitting chip is covered with a second light-transmissive resin. Optical coupling element.
発光チップ収納用凹部を備え表面にめっきパターンが形
成された射出立体配線成形樹脂基板と、該樹脂基板の前
記受発光チップ収納用凹部におけるめっきパターン上に
搭載される発光チップ及び受光チップと、該発光チップ
及び受光チップを被覆する第１透光性樹脂と、該第１透
光性樹脂を被覆する遮光性樹脂と、前記動作確認用発光
チップ収納用凹部におけるめっきパターン上に搭載され
る動作確認用発光チップと、該動作確認用発光チップを
被覆する第２透光性樹脂とを有してなることを特徴とす
る光結合素子。3. An injection three-dimensional wiring molded resin substrate having a recessed portion for receiving and emitting light emitting chips and a recessed portion for receiving operation light emitting chips and having a plating pattern formed on the surface thereof, and the recessed portion for receiving and emitting light receiving chips of the resin substrate. A light-emitting chip and a light-receiving chip mounted on the plating pattern, a first light-transmitting resin that covers the light-emitting chip and the light-receiving chip, a light-shielding resin that covers the first light-transmitting resin, and the operation confirmation An optical coupling element comprising an operation confirmation light emitting chip mounted on a plating pattern in the light emitting chip housing recess and a second translucent resin covering the operation confirmation light emitting chip.
部沿面距離調整手段を有してなることを特徴とする請求
項１又は３記載の光結合素子。4. The optical coupling element according to claim 1 or 3, further comprising an internal creepage distance adjusting means between the light emitting chip and the light receiving chip.
と該第１凹部よりも深さの深い第２凹部とからなり、前
記第１凹部の底面に発光チップが搭載され、前記第２凹
部の底面に受光チップが搭載されるとともに、前記第１
透光性樹脂と遮光性樹脂の境界面を第１凹部側から第２
凹部側に傾斜させてなることを特徴とする請求項１又は
３記載の光結合素子。5. The light receiving and emitting chip accommodating recess comprises a first recess and a second recess having a depth deeper than the first recess, and a light emitting chip is mounted on a bottom surface of the first recess and the second recess is provided. The light receiving chip is mounted on the bottom surface of the recess and the first
The boundary surface between the light-transmitting resin and the light-shielding resin is formed from the first recess side to the second side.
The optical coupling element according to claim 1 or 3, wherein the optical coupling element is inclined toward the recess side.
と該第１凹部よりも深さの深い第２凹部とからなり、前
記第２凹部の底面に発光チップ及び受光チップが搭載さ
れ、前記第２凹部に第１透光性樹脂が充填され、前記第
１凹部に遮光性樹脂が充填されるとともに、前記第１透
光性樹脂と遮光性樹脂の境界面を凸曲面状としてなるこ
とを特徴とする請求項１又は３記載の光結合素子。6. The light receiving and emitting chip housing recess comprises a first recess and a second recess having a depth deeper than the first recess, and a light emitting chip and a light receiving chip are mounted on a bottom surface of the second recess, The second recess is filled with a first light-transmitting resin, the first recess is filled with a light-shielding resin, and the boundary surface between the first light-transmitting resin and the light-shielding resin is formed into a convex curved surface. The optical coupling element according to claim 1 or 3, characterized in that:
検出用発光チップ及び非動作状態検出用発光チップの複
数からなることを特徴とする請求項２又は３記載の光結
合素子。7. The optical coupling element according to claim 2, wherein the operation confirming light emitting chip comprises a plurality of operating state detecting light emitting chips and non-operating state detecting light emitting chips.
きパターンが形成された発光側射出立体配線成形樹脂基
板と、受光チップ収納用凹部を備え表面にめっきパター
ンが形成された受光側射出立体配線成形樹脂基板と、該
両樹脂基板の凹部におけるめっきパターン上にそれぞれ
個別に搭載される発光チップ及び受光チップと、該発光
チップ及び受光チップをそれぞれ被覆する透光性樹脂と
を有し、前記発光側樹脂基板と受光側樹脂基板とを対向
させて前記発光チップと受光チップとが光学的に結合す
るよう一体化してなることを特徴とする光結合素子。8. A light emitting side injection three-dimensional wiring molded resin substrate having a recessed portion for accommodating a light emitting chip and having a plating pattern formed on the surface thereof, and a reception side injection three-dimensional wiring having a recessed portion for accommodating a light receiving chip and having a plating pattern formed on the surface thereof. A light emitting chip and a light receiving chip that are individually mounted on the plating patterns in the recesses of the both resin substrates; and a translucent resin that covers the light emitting chip and the light receiving chip, respectively. An optical coupling element, wherein the side resin substrate and the light receiving side resin substrate are opposed to each other and the light emitting chip and the light receiving chip are integrated so as to be optically coupled.
側面を該凹部の底面から上方にかけて広がる傾斜面とし
てなることを特徴とする請求項８記載の光結合素子。9. The optical coupling element according to claim 8, wherein at least a side surface of the recess for accommodating the light emitting chip is an inclined surface that spreads upward from a bottom surface of the recess.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3501295A JP3179992B2 (en) | 1995-01-27 | 1995-02-23 | Optical coupling device |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1146695 | 1995-01-27 | ||
| JP7-11466 | 1995-01-27 | ||
| JP3501295A JP3179992B2 (en) | 1995-01-27 | 1995-02-23 | Optical coupling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH08264823A true JPH08264823A (en) | 1996-10-11 |
| JP3179992B2 JP3179992B2 (en) | 2001-06-25 |
Family
ID=26346893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3501295A Expired - Fee Related JP3179992B2 (en) | 1995-01-27 | 1995-02-23 | Optical coupling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3179992B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6548880B1 (en) | 1999-08-13 | 2003-04-15 | Nec Compound Semiconductor Devices, Ltd. | Optical semiconductor device and a method of manufacturing the same |
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|---|---|---|---|---|
| JPS6147673A (en) * | 1984-08-13 | 1986-03-08 | Sharp Corp | Photo coupler |
| JPS61114865U (en) * | 1984-12-28 | 1986-07-19 | ||
| JPS63274188A (en) * | 1987-05-06 | 1988-11-11 | Sharp Corp | Optical coupling element |
| JPS6471186A (en) * | 1987-09-10 | 1989-03-16 | Mitsubishi Electric Corp | Optical coupler |
| JPH0415250U (en) * | 1990-05-24 | 1992-02-06 | ||
| JPH0529650A (en) * | 1991-07-19 | 1993-02-05 | Sharp Corp | Optical device |
| JPH0513068U (en) * | 1991-07-30 | 1993-02-19 | サンケン電気株式会社 | The container of a light emitting device and a photo detector |
| JPH05121778A (en) * | 1991-10-24 | 1993-05-18 | Sharp Corp | Photocoupler |
| JPH05251734A (en) * | 1992-03-05 | 1993-09-28 | Sharp Corp | Optically coupled device |
| JPH065906A (en) * | 1992-06-22 | 1994-01-14 | Sharp Corp | Manufacture of monolithic photo-coupler |
| JPH0637352A (en) * | 1992-07-15 | 1994-02-10 | Sharp Corp | Optical coupler and its manufacture |
| JPH06319746A (en) * | 1993-05-11 | 1994-11-22 | Toshiba Corp | Ultrasonic therapeutic apparatus |
-
1995
- 1995-02-23 JP JP3501295A patent/JP3179992B2/en not_active Expired - Fee Related
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6147673A (en) * | 1984-08-13 | 1986-03-08 | Sharp Corp | Photo coupler |
| JPS61114865U (en) * | 1984-12-28 | 1986-07-19 | ||
| JPS63274188A (en) * | 1987-05-06 | 1988-11-11 | Sharp Corp | Optical coupling element |
| JPS6471186A (en) * | 1987-09-10 | 1989-03-16 | Mitsubishi Electric Corp | Optical coupler |
| JPH0415250U (en) * | 1990-05-24 | 1992-02-06 | ||
| JPH0529650A (en) * | 1991-07-19 | 1993-02-05 | Sharp Corp | Optical device |
| JPH0513068U (en) * | 1991-07-30 | 1993-02-19 | サンケン電気株式会社 | The container of a light emitting device and a photo detector |
| JPH05121778A (en) * | 1991-10-24 | 1993-05-18 | Sharp Corp | Photocoupler |
| JPH05251734A (en) * | 1992-03-05 | 1993-09-28 | Sharp Corp | Optically coupled device |
| JPH065906A (en) * | 1992-06-22 | 1994-01-14 | Sharp Corp | Manufacture of monolithic photo-coupler |
| JPH0637352A (en) * | 1992-07-15 | 1994-02-10 | Sharp Corp | Optical coupler and its manufacture |
| JPH06319746A (en) * | 1993-05-11 | 1994-11-22 | Toshiba Corp | Ultrasonic therapeutic apparatus |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6548880B1 (en) | 1999-08-13 | 2003-04-15 | Nec Compound Semiconductor Devices, Ltd. | Optical semiconductor device and a method of manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3179992B2 (en) | 2001-06-25 |
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