JPH05251734A - Optically coupled device - Google Patents

Optically coupled device

Info

Publication number
JPH05251734A
JPH05251734A JP4824492A JP4824492A JPH05251734A JP H05251734 A JPH05251734 A JP H05251734A JP 4824492 A JP4824492 A JP 4824492A JP 4824492 A JP4824492 A JP 4824492A JP H05251734 A JPH05251734 A JP H05251734A
Authority
JP
Japan
Prior art keywords
light
resin
receiving element
emitting element
coupling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4824492A
Other languages
Japanese (ja)
Other versions
JP2787387B2 (en
Inventor
Yasushi Hasegawa
也寸志 長谷川
Soeji Tanabe
添二 田辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP4824492A priority Critical patent/JP2787387B2/en
Publication of JPH05251734A publication Critical patent/JPH05251734A/en
Application granted granted Critical
Publication of JP2787387B2 publication Critical patent/JP2787387B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Abstract

PURPOSE:To improve electric insulation between a light-emitting element and a light-receiving element, and simplify the production process by providing an optically coupled device with two light-shading bodies which are separately formed for the light-emitting element and the light-receiving element. CONSTITUTION:A light-emitting element 13 and a light-receiving element 15 are injection molded separately, and then two shading bodies 18 and 19 are formed. The external area of the two shading bodies are integrally molded by use of coating resin 20 so that these elements 13 and 15 can be optically coupled. As a result, a light path chamber 21 can be formed in the two shading bodies 18 and 19. Therefore, a long light part can be made, and in addition, high insulating resistances of the two shading bodies and coating resin 20 are set, enough insulation between the light-emitting element and the light-receiving element can be ensured. By forming both light-shading substances 18 and 19 and the coating resin 20 of the same resin material, part of the surfaces of these light-shading bodies is molten at the time of injecting the coating resin 20. As a result, resin interface of the primary molded body and the secondary molded body can be eliminated.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、光結合装置(フオトカ
プラ)の構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the structure of an optical coupling device (photocoupler).

【0002】[0002]

【従来の技術】従来における二重トランスフアモールド
タイプの光結合装置(フオトカプラ)の構造を図6に示
す。従来の光結合装置は、発光素子1(LED)と受光
素子2(フオトトランジスタ)を、42アロイまたはC
u等より成るリードフレーム3,4上にAgペースト
(図示しない)等で固着し、金線5等を用いて前記受発
光素子1,2とリードフレーム3,4とを電気的に接続
した後、シリコン等の透光性樹脂6で覆い、さらにエポ
キシ樹脂等を主流とした遮光性樹脂7でモールドしたタ
イプが主流である(従来例1)。なお、図7は図6に示
した光結合装置の製造工程をしめす工程フローチヤート
である。
2. Description of the Related Art FIG. 6 shows the structure of a conventional double transfer mold type optical coupling device (photocoupler). In a conventional optical coupling device, a light emitting element 1 (LED) and a light receiving element 2 (phototransistor) are connected by 42 alloy or C
After being fixed to lead frames 3 and 4 made of u or the like with Ag paste (not shown) or the like, and electrically connecting the light emitting and receiving elements 1 and 2 and the lead frames 3 and 4 using a gold wire 5 or the like The mainstream type is a type that is covered with a transparent resin 6 such as silicon and is further molded with a light-shielding resin 7 mainly made of epoxy resin (conventional example 1). 7 is a process flow chart showing the manufacturing process of the optical coupling device shown in FIG.

【0003】[0003]

【発明が解決しようとする課題】一般に光結合装置は、
電源部等に使用されるリレーのようなものであり、一次
(発光側)と二次(受光側)の間の絶縁耐圧が要求され
る。そのため、発光側と受光側との距離は極力長い方が
好ましい。
Generally, an optical coupling device is
It is like a relay used in a power supply section, etc., and requires a withstand voltage between the primary (light emitting side) and the secondary (light receiving side). Therefore, it is preferable that the distance between the light emitting side and the light receiving side is as long as possible.

【0004】しかしながら、従来例1の場合、両リード
フレーム3,4の位置決め精度に限界があるため、光学
的結合を確保するには、発光素子1と受光素子2の間の
距離をある程度短くする必要があり、故に耐絶縁性に限
界があつた。
However, in the case of the conventional example 1, since the positioning accuracy of the lead frames 3 and 4 is limited, in order to secure the optical coupling, the distance between the light emitting element 1 and the light receiving element 2 is shortened to some extent. Therefore, the insulation resistance is limited.

【0005】このような問題を解決するために、予め成
形されたケースに受発光単体素子を挿入し、密封する光
結合装置があつた。その構造を図8,9に、その工程フ
ローチヤートを図10に示す。すなわち、ポリカーボネ
イト等を用いて成形された外側ケース8内に、発光側の
単体デバイス1aと受光側の単体デバイス2aを受発光
面が対向し略同一光軸となるよう挿入し、同じくポリカ
ーボネイト等で成形された内側ケース9を挿入し、エポ
キシ樹脂等の固定用遮光性樹脂7で固定している(従来
例2)。
In order to solve such a problem, there has been an optical coupling device in which a single element for receiving and emitting light is inserted into a preformed case and hermetically sealed. The structure is shown in FIGS. 8 and 9, and the process flow chart is shown in FIG. That is, the single device 1a on the light emitting side and the single device 2a on the light receiving side are inserted into the outer case 8 molded using polycarbonate or the like so that the light receiving and emitting surfaces face each other and have substantially the same optical axis. The molded inner case 9 is inserted and fixed with a fixing light-shielding resin 7 such as an epoxy resin (conventional example 2).

【0006】この構造の場合、二重トランスフアモール
ドタイプより受発光素子1,2間の距離を長くとれるた
め、高い絶縁性が得られるが、図10の工程フローチヤ
ートに示すように、生産工程が単品処理や手作業となる
工程が多いため、生産工数が増大し、結果として製品一
個当たりの生産コストが高価なものとなつていた。
In this structure, since the distance between the light receiving and emitting elements 1 and 2 can be made longer than that of the double transfer mold type, a high insulating property can be obtained, but as shown in the process flow chart of FIG. However, since there are many processes such as single item processing and manual work, the number of production steps is increased, and as a result, the production cost per product is expensive.

【0007】本発明は、上記課題に鑑み、受発光間の電
気的絶縁性を向上し得、かつ製造工程を簡素化し得る光
結合装置の提供を目的とする。
In view of the above problems, it is an object of the present invention to provide an optical coupling device which can improve the electrical insulation between light receiving and emitting and can simplify the manufacturing process.

【0008】[0008]

【課題を解決するための手段】本発明請求項1による課
題解決手段は、図1,2の如く、発光素子13およびこ
れを搭載する発光側リードフレーム12に一体的に成形
された発光側遮光体18と、受光素子15およびこれを
搭載する受光側リードフレーム14に一体的に成形され
た受光側遮光体19とを備え、該各遮光体18,19
に、発光素子13から受光素子15に至る光路を形成す
る光路室21が設けられ、両遮光体18,19は、前記
両素子13,15が光路室21内の同一光軸上で光学的
に結合するよう配置され、さらに外装樹脂20で一体モ
ールドされたものである。
As shown in FIGS. 1 and 2, the means for solving the problem according to the first aspect of the present invention is to form a light-shielding member on the light-emission side integrally formed with a light-emitting element 13 and a lead-frame 12 on the light-emission side. The light-receiving side light-shielding body 19 is integrally formed with the light-receiving element 15 and the light-receiving side lead frame 14 on which the light-receiving element 15 and the light-receiving element 15 are mounted.
Is provided with an optical path chamber 21 that forms an optical path from the light emitting element 13 to the light receiving element 15, and both the light shields 18 and 19 are such that the elements 13 and 15 are optically arranged on the same optical axis in the optical path chamber 21. It is arranged so as to be coupled, and is integrally molded with the exterior resin 20.

【0009】本発明請求項2による課題解決手段は、請
求項1記載の両遮光体18,19および外装樹脂20
は、同一樹脂材料が用いられたものである。
According to a second aspect of the present invention, the means for solving the problem is to provide both the light shields 18 and 19 and the exterior resin 20 according to the first aspect.
Indicates that the same resin material is used.

【0010】本発明請求項3による課題解決手段は、請
求項2記載の樹脂材料の絶縁抵抗は、+25°C前後の
常温で1012Ω以上で、かつ+100°C前後の高温
で1011Ω以上に設定されたものである。
According to a third aspect of the present invention, the insulation resistance of the resin material according to the second aspect is 10 12 Ω or more at room temperature around + 25 ° C. and 10 11 Ω at high temperature around + 100 ° C. The above is set.

【0011】[0011]

【作用】上記請求項1〜3による課題解決手段におい
て、発光素子13と受光素子15を個別にインジエクシ
ヨンモールドを行ない、二個の遮光体18,19を形成
する。この二個の遮光体18,19の周囲を、両素子1
3,15が光学的に結合するよう、外装樹脂20で一体
モールドする。そうすると、各遮光体18,19に光路
室21を形成できるので、光路長を大とでき、しかも、
両遮光体18,19および外装樹脂20の絶縁抵抗を大
きく設定しているので、受発光間の絶縁性を充分に確保
できる。
In the means for solving the problems according to the first to third aspects, the light emitting element 13 and the light receiving element 15 are individually subjected to the injection molding to form the two light shields 18 and 19. Around both of these two light shields 18 and 19, both elements 1
The exterior resin 20 is integrally molded so that the optical fibers 3 and 15 are optically coupled. Then, since the optical path chamber 21 can be formed in each of the light shields 18 and 19, the optical path length can be increased, and moreover,
Since the insulation resistance of both the light shields 18 and 19 and the exterior resin 20 is set to be large, the insulation between the light receiving and emitting can be sufficiently secured.

【0012】また、請求項2では、両遮光体18,19
および外装樹脂20を同一樹脂材料で形成することによ
り、外装樹脂20の注入時に両遮光体18,19の表面
の一部を溶かして、これら一次モールド体と二次モール
ド体の樹脂界面を無くすことができる。
Further, in claim 2, both light shields 18, 19 are provided.
By forming the exterior resin 20 with the same resin material, a part of the surface of both the light shields 18 and 19 is melted when the exterior resin 20 is injected, and the resin interface between the primary mold body and the secondary mold body is eliminated. You can

【0013】[0013]

【実施例】図1は本発明の一実施例を示す光結合装置の
断面図、図2は光結合装置の製造方法を示す工程フロー
チヤート、図3は各素子を対向配置した状態を示す図、
図4は各遮光体を形成した状態を示す図、図5は両遮光
体を位置決めした状態を示す図である。
1 is a sectional view of an optical coupling device showing an embodiment of the present invention, FIG. 2 is a process flow chart showing a method of manufacturing an optical coupling device, and FIG. 3 is a diagram showing a state in which elements are arranged to face each other. ,
FIG. 4 is a diagram showing a state in which each light shield is formed, and FIG. 5 is a diagram showing a state in which both light shields are positioned.

【0014】図示の如く、本実施例の光結合装置(フオ
トカプラ)は、光結合装置本体11内で、発光側リード
フレーム12に搭載された発光素子13と、受光側リー
ドフレーム14に搭載された受光素子15とが同一光軸
上で光学的に結合するよう対向配置されたものである。
As shown in the figure, the optical coupling device (photocoupler) of this embodiment is mounted on the light emitting element 13 mounted on the light emitting side lead frame 12 and the light receiving side lead frame 14 in the optical coupling device body 11. The light receiving element 15 and the light receiving element 15 are arranged so as to be optically coupled to each other on the same optical axis.

【0015】前記発光素子13および受光素子15の夫
々は、各リードフレーム12,14とともに、透光性樹
脂16にて一体的にモールドされて単体デバイスとされ
ている。
Each of the light emitting element 13 and the light receiving element 15 is integrally molded together with the lead frames 12 and 14 by a translucent resin 16 to form a single device.

【0016】前記光結合装置本体11は、前記発光素子
13および受光素子15の夫々について個別に形成され
た発光側遮光体18および受光側遮光体19と、これら
の周囲に一体モールドされた外装樹脂20とから構成さ
れている。
The optical coupling device main body 11 includes a light-emitting side light-shielding body 18 and a light-receiving side light-shielding body 19 which are individually formed for the light-emitting element 13 and the light-receiving element 15, and an exterior resin integrally molded around them. 20 and 20.

【0017】前記両遮光体18,19は、例えば、ポリ
フエニレンサルフアイド(PPS)、ポリカーボネイト
(PC)、ポリブチレンテレフタレート(PBT)、結
晶性ポリマー、非晶性ポリマー、あるいは液晶ポリマー
等の熱可塑性樹脂のうち一種類またはこれらの混合物を
用いて、インジエクシヨンモールドされて成る。ここで
熱可塑性樹脂を用いるのは、樹脂成形温度が低い特性を
有するため、各素子13,15に与える影響が低いと考
えられるためである。また、熱可塑性樹脂としては、そ
の絶縁抵抗が、+25°C前後の常温で1012Ω以上
で、かつ+100°C前後の高温で1011Ω以上の特
性を有するものが使用され、これにより受発光両リード
フレーム12,14間の電気的絶縁性が確保される。そ
うすると、所定の規格(ドイツ連邦共和国:VDE規格
0884番)に合致し、製品の標準化、大量生産化の要
請に対応できる。
The both light shields 18 and 19 are made of, for example, heat of polyphenylene sulfide (PPS), polycarbonate (PC), polybutylene terephthalate (PBT), crystalline polymer, amorphous polymer or liquid crystal polymer. Injection molding is performed using one kind of a plastic resin or a mixture thereof. The reason why the thermoplastic resin is used here is that the resin molding temperature has a low characteristic, and therefore it is considered that the influence on each of the elements 13 and 15 is low. Further, as the thermoplastic resin, a resin having an insulation resistance of 10 12 Ω or more at room temperature around + 25 ° C. and 10 11 Ω or more at high temperature around + 100 ° C. is used. The electrical insulation between the light emitting lead frames 12 and 14 is secured. By doing so, it meets the predetermined standard (German Federal Republic: VDE standard 0884) and can meet the demand for standardization and mass production of products.

【0018】そして、該各遮光体18,19には、発光
素子13から受光素子15への光路を形成するため、丸
い穴状の光路室21が夫々形成されている。該光路室2
1は、両遮光体18,19を対向配置する際に密閉さ
れ、またその長さは発光素子13および受光素子15が
互いに電気的に絶縁するよう長寸とされている。
A round hole-shaped optical path chamber 21 is formed in each of the light shields 18 and 19 in order to form an optical path from the light emitting element 13 to the light receiving element 15. The optical path room 2
1 is sealed when the two light shields 18 and 19 are arranged opposite to each other, and the length thereof is long so that the light emitting element 13 and the light receiving element 15 are electrically insulated from each other.

【0019】前記外装樹脂20は、前記遮光体18,1
9と同一の遮光性材料を用いて、その全周に渡つてイン
ジエクシヨンモールドされてなる。
The exterior resin 20 is made up of the light shields 18, 1
The same light-shielding material as that of No. 9 is used, and the entire periphery thereof is injection molded.

【0020】なお、図1中、16aは光指向性を高める
ための透光レンズである。
In FIG. 1, reference numeral 16a is a translucent lens for improving the light directivity.

【0021】上記構成の光結合装置は、図2のフローチ
ヤートのように製造される。まず、図3の如く、発光素
子13および受光素子15を透光性樹脂16にてモール
ドし、単体デバイスの状態として対向配置する。
The optical coupling device having the above structure is manufactured as in the flow chart of FIG. First, as shown in FIG. 3, the light emitting element 13 and the light receiving element 15 are molded with the translucent resin 16 and are arranged to face each other as a single device.

【0022】次に、図4の如く、発光素子13および受
光素子15の夫々について、個別に熱可塑性樹脂でイン
ジエクシヨンモールドして各遮光体18,19を形成す
る。この際、光路室21を長寸に形成しておく。
Next, as shown in FIG. 4, each of the light emitting element 13 and the light receiving element 15 is individually subjected to the injection molding with a thermoplastic resin to form the respective light shields 18 and 19. At this time, the optical path chamber 21 is formed long.

【0023】そして、図5の如く、両素子13,15が
光路室21内の同一光軸上で光学的に結合するよう両遮
光体18,19を対向させ、これらを夫々後方より押さ
えながら、図1の如く、この周囲を外装樹脂20で一体
モールドする。
Then, as shown in FIG. 5, both the light shields 18 and 19 are opposed to each other so that the elements 13 and 15 are optically coupled on the same optical axis in the optical path chamber 21. As shown in FIG. 1, the periphery is integrally molded with the exterior resin 20.

【0024】以上の作業を、多連式に連結された複数の
リードフレーム12,14を用いて、複数のデバイスに
ついて併置した状態で同時に行う。その後、リードフレ
ーム12,14を各光結合装置本体11ごとにカツト
し、個別の光結合装置が完成し、テスト工程に供する。
The above work is simultaneously performed using a plurality of lead frames 12 and 14 connected in a multiple manner in a state where they are juxtaposed with respect to a plurality of devices. After that, the lead frames 12 and 14 are cut for each optical coupling device main body 11 to complete an individual optical coupling device, which is then subjected to a test process.

【0025】ここで、光路室21を長寸に形成し、かつ
遮光体18,19および外装樹脂20として絶縁抵抗の
高い樹脂材料を用いているため、発光素子13と受光素
子15との距離が取れ、高い絶縁性が得られる。
Here, since the optical path chamber 21 is formed to be long and a resin material having a high insulation resistance is used as the light shields 18 and 19 and the exterior resin 20, the distance between the light emitting element 13 and the light receiving element 15 is increased. It is possible to obtain high insulation.

【0026】また、例えば、図10に示す従来例2で
は、外側ケースや内側ケース等について単品ごとの処理
になるのに対し、本発明のタイプは、図2の如く、多連
式のフレーム状態のままで成形の段階まで処置できるた
め、金型によつて位置決め等の作業が容易となり、工数
が削減する。したがつて、手作業を廃すことができ、自
動化により安価な製品を提供できる。しかも、外装樹脂
20を金型で成形することにより、従来例2のように嵌
合するタイプに比べてその外寸精度を向上できる。
Further, for example, in the conventional example 2 shown in FIG. 10, the outer case, the inner case, etc. are processed individually, whereas the type of the present invention, as shown in FIG. Since the process can be performed up to the stage of molding as it is, the work such as positioning is facilitated by the mold, and the number of steps is reduced. Therefore, manual work can be eliminated and an inexpensive product can be provided by automation. Moreover, by molding the exterior resin 20 with a mold, the outer dimension accuracy thereof can be improved as compared with the fitting type as in Conventional Example 2.

【0027】また、両遮光体18,19を接触配置させ
たとき、成形誤差によつて僅かに隙間ができることがあ
るが、これらの周囲を外装樹脂20で一体モールドする
ので、光路室21への外乱光の進入を防止できる。した
がつて、信頼性の高い光結合装置を提供できる。
Further, when the two light shields 18 and 19 are arranged in contact with each other, a slight gap may be formed due to a molding error. However, since the periphery of these is integrally molded with the exterior resin 20, the light path chamber 21 is exposed. Ingress of ambient light can be prevented. Therefore, a highly reliable optical coupling device can be provided.

【0028】しかも、両遮光体18,19および外装樹
脂20を、同一樹脂材料で形成しているので、外装樹脂
20の注入時に両遮光体18,19の表面の一部を溶か
して、これら一次モールド体と二次モールド体の樹脂界
面を無くすことができる。したがつて、熱膨張または熱
収縮時等による樹脂破壊等を防止できる。
Moreover, since both the light shields 18 and 19 and the exterior resin 20 are made of the same resin material, when the exterior resin 20 is injected, a part of the surfaces of both the light shields 18 and 19 are melted and the primary resin is removed. The resin interface between the molded body and the secondary molded body can be eliminated. Therefore, it is possible to prevent resin destruction and the like due to thermal expansion or thermal contraction.

【0029】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。
The present invention is not limited to the above embodiment, and it goes without saying that many modifications and changes can be made to the above embodiment within the scope of the present invention.

【0030】例えば、遮光体18,19の片側の開口部
の形状を凸状とし、他側の開口部の形状を凹状とすれ
ば、光学的結合のための位置決めが確実となり、かつ作
業性が向上する。
For example, if the shape of the opening on one side of the light shields 18, 19 is convex and the shape of the opening on the other side is concave, positioning for optical coupling is ensured and workability is improved. improves.

【0031】また、光路室21は円筒形である必要はな
く、矩形等であつてもよい。
The optical path chamber 21 does not have to be cylindrical, but may be rectangular or the like.

【0032】[0032]

【発明の効果】以上の説明から明らかな通り、本発明請
求項1によると、発光素子および受光素子について夫々
別々に形成した二個の遮光体から構成し、これらを外装
樹脂で一体モールドして固定するので、受発光間の光路
を長寸にしても光学的結合が確保でき、この間の電気的
絶縁性が向上する。しかも、外装樹脂にて外乱光の進入
を防止でき、誤動作等を防止できる。
As is apparent from the above description, according to claim 1 of the present invention, the light-emitting element and the light-receiving element are composed of two separately formed light-shielding members, which are integrally molded with the exterior resin. Since they are fixed, optical coupling can be ensured even if the optical path between the light receiving and emitting is made long, and the electrical insulation between them is improved. Moreover, the exterior resin can prevent the entry of ambient light, and can prevent malfunctions and the like.

【0033】また、従来例2のように両素子を外側ケー
スの中に挿入する作業が省略できるため、手作業を廃
し、自動化により製造効率を高めることができる。
Further, since the work of inserting both elements into the outer case as in the conventional example 2 can be omitted, manual work can be eliminated and the manufacturing efficiency can be improved by automation.

【0034】本発明請求項2によると、受発光両遮光体
および外装樹脂を同一樹脂材料で形成しているので、外
装樹脂の注入時に両遮光体の表面の一部を溶かして、こ
れら一次モールド体と二次モールド体の樹脂界面を無く
すことができる。したがつて、熱膨張または熱収縮時等
による樹脂破壊等を防止できる。
According to claim 2 of the present invention, since both the light-receiving and light-shielding body and the exterior resin are made of the same resin material, a part of the surface of both the light-shielding body is melted at the time of injecting the exterior resin so that these primary molds The resin interface between the body and the secondary mold body can be eliminated. Therefore, it is possible to prevent resin destruction and the like due to thermal expansion or thermal contraction.

【0035】本発明請求項3によると、両遮光体および
外装樹脂の絶縁抵抗を大きく設定しているので、受発光
間の絶縁耐圧を高めて所定の規格に対応できるといつた
優れた効果がある。
According to claim 3 of the present invention, since the insulation resistances of both the light shields and the exterior resin are set to be large, an excellent effect can be obtained if the insulation withstand voltage between light reception and emission can be increased to meet a predetermined standard. is there.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例を示す光結合装置の断面図FIG. 1 is a sectional view of an optical coupling device showing an embodiment of the present invention.

【図2】光結合装置の製造方法を示す工程フローチヤー
FIG. 2 is a process flow chart showing a method for manufacturing an optical coupling device.

【図3】各素子を対向配置した状態を示す図FIG. 3 is a diagram showing a state where elements are arranged to face each other.

【図4】各遮光体を形成した状態を示す図FIG. 4 is a diagram showing a state in which each light shield is formed.

【図5】両遮光体を位置決めした状態を示す図FIG. 5 is a view showing a state in which both light shields are positioned.

【図6】従来例1の光結合装置の断面図FIG. 6 is a sectional view of an optical coupling device of Conventional Example 1.

【図7】従来例1の光結合装置の製造方法を示す工程フ
ローチヤート
FIG. 7 is a process flow chart showing a method for manufacturing an optical coupling device of Conventional Example 1.

【図8】従来例2の光結合装置の内側ケース挿入作業時
の断面図
FIG. 8 is a sectional view of an optical coupling device of Conventional Example 2 when an inner case is inserted.

【図9】従来例2の光結合装置の完成後の断面図FIG. 9 is a sectional view of an optical coupling device of Conventional Example 2 after completion.

【図10】従来例2の光結合装置の製造方法を示す工程
フローチヤート
FIG. 10 is a process flow chart showing a method for manufacturing an optical coupling device of Conventional Example 2.

【符号の説明】[Explanation of symbols]

11 光結合装置本体 12 発光側リードフレーム 13 発光素子 14 受光側リードフレーム 15 受光素子 18 発光側遮光体 19 受光側遮光体 20 外装樹脂 21 光路室 11 Optical Coupling Device Main Body 12 Light-Emitting Side Lead Frame 13 Light-Emitting Element 14 Light-Receiving Side Lead Frame 15 Light-Receiving Element 18 Light-Emitting Side Light Shield 19 Light-Receiving Side Light Shield 20 Exterior Resin 21 Optical Path Chamber

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 発光素子およびこれを搭載する発光側リ
ードフレームに一体的に成形された発光側遮光体と、受
光素子およびこれを搭載する受光側リードフレームに一
体的に成形された受光側遮光体とを備え、該各遮光体
に、発光素子から受光素子に至る光路を形成する光路室
が設けられ、両遮光体は、前記両素子が光路室内の同一
光軸上で光学的に結合するよう配置され、さらに外装樹
脂で一体モールドされたことを特徴とする光結合装置。
1. A light emitting side light shield integrally formed with a light emitting element and a light emitting side lead frame mounting the same, and a light receiving side light shield integrally formed with a light receiving element and a light receiving side lead frame mounting the same. An optical path chamber for forming an optical path from the light emitting element to the light receiving element is provided in each of the light shields, and both the light shields are optically coupled to each other on the same optical axis in the optical path chamber. The optical coupling device is characterized in that it is arranged in such a manner that it is integrally molded with an exterior resin.
【請求項2】 請求項1記載の両遮光体および外装樹脂
は、同一樹脂材料が用いられたことを特徴とする光結合
装置。
2. The optical coupling device according to claim 1, wherein the both light shields and the exterior resin are made of the same resin material.
【請求項3】 請求項2記載の樹脂材料の絶縁抵抗は、
+25°C前後の常温で1012Ω以上で、かつ+10
0°C前後の高温で1011Ω以上に設定されたことを
特徴とする光結合装置。
3. The insulation resistance of the resin material according to claim 2,
10 12 Ω or more at room temperature around + 25 ° C, and +10
An optical coupling device, which is set to 10 11 Ω or higher at a high temperature of around 0 ° C.
JP4824492A 1992-03-05 1992-03-05 Optical coupling device Expired - Fee Related JP2787387B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4824492A JP2787387B2 (en) 1992-03-05 1992-03-05 Optical coupling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4824492A JP2787387B2 (en) 1992-03-05 1992-03-05 Optical coupling device

Publications (2)

Publication Number Publication Date
JPH05251734A true JPH05251734A (en) 1993-09-28
JP2787387B2 JP2787387B2 (en) 1998-08-13

Family

ID=12798031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4824492A Expired - Fee Related JP2787387B2 (en) 1992-03-05 1992-03-05 Optical coupling device

Country Status (1)

Country Link
JP (1) JP2787387B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264823A (en) * 1995-01-27 1996-10-11 Sharp Corp Photocoupler

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003282935A (en) 2002-03-26 2003-10-03 Sharp Corp Optically coupled device and method of manufacturing the same, and electronic apparatus

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827952U (en) * 1981-08-18 1983-02-23 株式会社東芝 Optical coupling semiconductor device
JPS62182561U (en) * 1986-05-12 1987-11-19
JP3104766U (en) * 2004-04-21 2004-10-14 株式会社共成レンテム Liquidproof tank

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827952U (en) * 1981-08-18 1983-02-23 株式会社東芝 Optical coupling semiconductor device
JPS62182561U (en) * 1986-05-12 1987-11-19
JP3104766U (en) * 2004-04-21 2004-10-14 株式会社共成レンテム Liquidproof tank

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08264823A (en) * 1995-01-27 1996-10-11 Sharp Corp Photocoupler

Also Published As

Publication number Publication date
JP2787387B2 (en) 1998-08-13

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