JP2787387B2 - Optical coupling device - Google Patents

Optical coupling device

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Publication number
JP2787387B2
JP2787387B2 JP4824492A JP4824492A JP2787387B2 JP 2787387 B2 JP2787387 B2 JP 2787387B2 JP 4824492 A JP4824492 A JP 4824492A JP 4824492 A JP4824492 A JP 4824492A JP 2787387 B2 JP2787387 B2 JP 2787387B2
Authority
JP
Japan
Prior art keywords
light
optical coupling
resin
molded
coupling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP4824492A
Other languages
Japanese (ja)
Other versions
JPH05251734A (en
Inventor
也寸志 長谷川
添二 田辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Consejo Superior de Investigaciones Cientificas CSIC
Original Assignee
Consejo Superior de Investigaciones Cientificas CSIC
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Publication date
Application filed by Consejo Superior de Investigaciones Cientificas CSIC filed Critical Consejo Superior de Investigaciones Cientificas CSIC
Priority to JP4824492A priority Critical patent/JP2787387B2/en
Publication of JPH05251734A publication Critical patent/JPH05251734A/en
Application granted granted Critical
Publication of JP2787387B2 publication Critical patent/JP2787387B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、光結合装置(フオトカ
プラ)の構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical coupling device (photocoupler).

【0002】[0002]

【従来の技術】従来における二重トランスフアモールド
タイプの光結合装置(フオトカプラ)の構造を図6に示
す。従来の光結合装置は、発光素子1(LED)と受光
素子2(フオトトランジスタ)を、42アロイまたはC
u等より成るリードフレーム3,4上にAgペースト
(図示しない)等で固着し、金線5等を用いて前記受発
光素子1,2とリードフレーム3,4とを電気的に接続
した後、シリコン等の透光性樹脂6で覆い、さらにエポ
キシ樹脂等を主流とした遮光性樹脂7でモールドしたタ
イプが主流である(従来例1)。なお、図7は図6に示
した光結合装置の製造工程をしめす工程フローチヤート
である。
2. Description of the Related Art FIG. 6 shows the structure of a conventional double transfer mold type optical coupling device (photocoupler). In a conventional optical coupling device, a light emitting element 1 (LED) and a light receiving element 2 (phototransistor) are connected by a 42 alloy or C
After fixing to the lead frames 3 and 4 made of u or the like with an Ag paste (not shown) or the like, and electrically connecting the light emitting and receiving elements 1 and 2 to the lead frames 3 and 4 using gold wires 5 or the like. The mainstream is a type that is covered with a light-transmitting resin 6 such as silicon and then molded with a light-shielding resin 7 mainly made of an epoxy resin or the like (conventional example 1). FIG. 7 is a process flowchart showing the manufacturing process of the optical coupling device shown in FIG.

【0003】[0003]

【発明が解決しようとする課題】一般に光結合装置は、
電源部等に使用されるリレーのようなものであり、一次
(発光側)と二次(受光側)の間の絶縁耐圧が要求され
る。そのため、発光側と受光側との距離は極力長い方が
好ましい。
Generally, an optical coupling device is
It is like a relay used for a power supply unit and the like, and requires a withstand voltage between a primary (light emitting side) and a secondary (light receiving side). Therefore, it is preferable that the distance between the light emitting side and the light receiving side is as long as possible.

【0004】しかしながら、従来例1の場合、両リード
フレーム3,4の位置決め精度に限界があるため、光学
的結合を確保するには、発光素子1と受光素子2の間の
距離をある程度短くする必要があり、故に耐絶縁性に限
界があつた。
However, in the case of the prior art 1, since the positioning accuracy of the two lead frames 3 and 4 is limited, the distance between the light emitting element 1 and the light receiving element 2 is reduced to some extent to ensure optical coupling. Required, thus limiting the insulation resistance.

【0005】このような問題を解決するために、予め成
形されたケースに受発光単体素子を挿入し、密封する光
結合装置があつた。その構造を図8,9に、その工程フ
ローチヤートを図10に示す。すなわち、ポリカーボネ
イト等を用いて成形された外側ケース8内に、発光側の
単体デバイス1aと受光側の単体デバイス2aを受発光
面が対向し略同一光軸となるよう挿入し、同じくポリカ
ーボネイト等で成形された内側ケース9を挿入し、エポ
キシ樹脂等の固定用遮光性樹脂7で固定している(従来
例2)。
[0005] In order to solve such a problem, there has been an optical coupling device in which a light emitting / receiving single element is inserted into a preformed case and sealed. The structure is shown in FIGS. 8 and 9, and the process flow chart is shown in FIG. That is, the light emitting side single device 1a and the light receiving side single device 2a are inserted into the outer case 8 molded using polycarbonate or the like so that the light receiving and emitting surfaces face each other and have substantially the same optical axis. The molded inner case 9 is inserted and fixed with a fixing light-shielding resin 7 such as an epoxy resin (conventional example 2).

【0006】この構造の場合、二重トランスフアモール
ドタイプより受発光素子1,2間の距離を長くとれるた
め、高い絶縁性が得られるが、図10の工程フローチヤ
ートに示すように、生産工程が単品処理や手作業となる
工程が多いため、生産工数が増大し、結果として製品一
個当たりの生産コストが高価なものとなつていた。
In this structure, since the distance between the light receiving and emitting elements 1 and 2 can be made longer than that of the double transfer mold type, a high insulating property can be obtained. However, as shown in the process flowchart of FIG. However, there are many processes that require single-piece processing and manual work, so that the number of production steps is increased, and as a result, the production cost per product is high.

【0007】本発明は、上記課題に鑑み、受発光間の電
気的絶縁性を向上し得、かつ製造工程を簡素化し得る光
結合装置の提供を目的とする。
In view of the above problems, an object of the present invention is to provide an optical coupling device capable of improving electrical insulation between light receiving and emitting and simplifying a manufacturing process.

【0008】[0008]

【課題を解決するための手段】本発明請求項1による課
題解決手段は、図1,2の如く、透光性樹脂16にてモ
ールドされた発光側単体デバイス13を熱可塑性樹脂に
よつて一体的に成形してなる発光側遮光体18と、透光
性樹脂16にてモールドされた受光側単体デバイス15
を熱可塑性樹脂によつて一体的に成形してなる受光側遮
光体19とを備え、該各遮光体18,19に、前記発光
側単体デバイス13から受光側単体デバイス15に至る
光路を形成する光路室21が設けられ、両遮光体18,
19は、前記両単体デバイス13,15が光路室21内
ほぼ同一光軸上で光学的に結合するよう配置され、さ
らに前記両遮光体18,19と同一の熱可塑性の外装樹
脂20で一体モールドされたものである。
The present invention according to claim 1 according SUMMARY SUMMARY In order to achieve the above, as shown in FIG. 1, the translucent resin 16 Nitemo
The light emitting side single device 13
A light emitting side light shield 18 Yotsute formed by integrally molding, translucent
Light receiving side unit device 15 molded with conductive resin 16
The a light receiving side light-shielding member 19 formed by molding in Yotsute integrally with the thermoplastic resin, the respective light shielding member 18 and 19, the light emitting
There is provided an optical path chamber 21 for forming an optical path from the side single device 13 to the light receiving side single device 15 .
19, the substantially arranged to optically combined on the same optical axis, integrally further by the two light shielding members 18 and 19 and the same thermoplastic exterior resin 20 in both single device 13, 15 the light path chamber 21 It is molded.

【0009】本発明請求項2による課題解決手段は、請
求項1記載の熱可塑性樹脂の材料が、ポリフエニレンサ
ルフアイド(PPS)、ポリカーボネイト(PC)、ポ
リブチレンテレフタレート(PBT)、結晶性ポリマ
ー、非晶性ポリマー、あるいは液晶ポリマー等の熱可塑
性樹脂のうち一種類またはこれらの混合物であることで
ある。
According to a second aspect of the present invention, a thermoplastic resin material according to the first aspect is characterized in that the material of the thermoplastic resin is a polyphenylene
Rufide (PPS), Polycarbonate (PC), PO
Polybutylene terephthalate (PBT), crystalline polymer
-, Amorphous polymers or thermoplastics such as liquid crystal polymers
One or a mixture of these resins
is there.

【0010】本発明請求項3による課題解決手段は、請
求項記載の熱可塑性樹脂の絶縁抵抗、+25°C前
後の常温で1012Ω以上で、かつ+100°C前後の
高温で1011Ω以上に設定されたものである。
[0010] according to item (1) above third aspect, claim 1 Insulation resistance of thermoplastic resins described, + 25 ° C in at ambient temperature of about 10 12 Omega or more and + 100 ° C before and after the high temperature 10 11 It is set to Ω or more.

【0011】[0011]

【作用】上記請求項1〜3による課題解決手段におい
て、発光側単体デバイス13と受光側単体デバイス15
を個別にインジエクシヨンモールドを行ない、二個の遮
光体18,19を形成する。この二個の遮光体18,1
9の周囲を、両単体デバイス13,15が光学的に結合
するよう、外装樹脂20で一体モールドする。そうする
と、各遮光体18,19に光路室21を形成できるの
で、光路長を大とでき、しかも、両遮光体18,19お
よび外装樹脂20の絶縁抵抗を大きく設定しているの
で、受発光間の絶縁性を充分に確保できる。さらに、両
遮光体18,19および外装樹脂20を同一樹脂材料で
形成することにより、外装樹脂20の注入時に両遮光体
18,19の表面の一部を溶かして、一次モールド体と
しての両遮光体18,19と二次モールド体としての外
装樹脂20との樹脂界面を無くすことができる。
The light emitting side single device 13 and the light receiving side single device 15 are provided.
Are individually subjected to an injection molding to form two light shielding members 18 and 19. These two light shields 18, 1
The periphery of 9 is integrally molded with an exterior resin 20 so that the two single devices 13 and 15 are optically coupled. Then, since the light path chamber 21 can be formed in each of the light shielding members 18 and 19, the optical path length can be increased, and the insulation resistance of both the light shielding members 18 and 19 and the exterior resin 20 is set large. Can ensure sufficient insulation. In addition, both
The light shielding bodies 18, 19 and the exterior resin 20 are made of the same resin material.
By forming, when the exterior resin 20 is injected,
A part of the surface of 18, 19 is melted to
The two light shielding members 18 and 19 and the outside as a secondary molded body
The resin interface with the mounting resin 20 can be eliminated.

【0012】また、請求項2では、熱可塑性樹脂の材料
は、ポリフエニレンサルフアイド(PPS)、ポリカー
ボネイト(PC)、ポリブチレンテレフタレート(PB
T)、結晶性ポリマー、非晶性ポリマー、あるいは液晶
ポリマー等の熱可塑性樹脂のうち一種類またはこれらの
混合物とされ、これらは作業性や成形精度が高く、耐候
性に優れているため、能率よく成形が行える。 また、請
求項3では、熱可塑性樹脂の絶縁抵抗を、+25°C前
後の常温で10 12 Ω以上で、かつ+100°C前後の
高温で10 11 Ω以上に設定することにより、受発光間
の絶縁耐圧を高めて所定の規格に対応することができ
る。
According to a second aspect of the present invention, a thermoplastic resin material is used.
Is polyphenylene sulfide (PPS), polycarbonate
Bonate (PC), polybutylene terephthalate (PB
T), crystalline polymer, amorphous polymer, or liquid crystal
One or more of thermoplastic resins such as polymers
These are mixtures, which have high workability and molding accuracy,
Since molding is excellent, molding can be performed efficiently. In addition,
In claim 3, the insulation resistance of the thermoplastic resin is set at + 25 ° C.
At room temperature after 10 12 Ω or more and around + 100 ° C
By setting to 10 11 Ω or more at high temperature,
To meet specified standards by increasing the dielectric strength of
You.

【0013】[0013]

【実施例】図1は本発明の一実施例を示す光結合装置の
断面図、図2は光結合装置の製造方法を示す工程フロー
チヤート、図3は各素子を対向配置した状態を示す図、
図4は各遮光体を形成した状態を示す図、図5は両遮光
体を位置決めした状態を示す図である。
FIG. 1 is a sectional view of an optical coupling device showing an embodiment of the present invention, FIG. 2 is a process flow chart showing a method of manufacturing the optical coupling device, and FIG. ,
FIG. 4 is a view showing a state where each light shield is formed, and FIG. 5 is a view showing a state where both light shields are positioned.

【0014】図示の如く、本実施例の光結合装置(フオ
トカプラ)は、光結合装置本体11内で、発光側リード
フレーム12と共にモールドされた発光側単体デバイス
13と、受光側リードフレーム14と共にモールドされ
た受光側単体デバイス15とがほぼ同一光軸上で光学的
に結合するよう対向配置されたものである。
[0014] As shown, the optical coupling device of the present embodiment (Fuotokapura) is molded with the optical coupling device main assembly 11, the light emitting side alone devices 13 that are molded together with the light emitting side lead frame 12, together with the light receiving side lead frame 14 Is
The light-receiving-side single device 15 is disposed so as to be optically coupled substantially on the same optical axis.

【0015】光素子(図示せず)および受光素子(図
示せず)の夫々は、各リードフレーム12,14に搭載
され、透光性樹脂16にて一体的にモールドされて、そ
れぞれ発光側および受光側単体デバイス13,15とさ
れている。
[0015] - emitting element (not shown) and a light receiving element (Fig.
(Not shown) are mounted on each of the lead frames 12 and 14 .
Are, are integrally molded by translucent resin 16, its
The light emitting side and light receiving side unit devices 13 and 15 are respectively provided.

【0016】前記光結合装置本体11は、前記発光側単
体デバイス13および受光側単体デバイス15の夫々に
ついて個別に形成された発光側遮光体18および受光側
遮光体19と、これらの周囲に一体モールドされた外装
樹脂20とから構成されている。
The optical coupling device main body 11 includes the light emitting side unit.
Each of the body device 13 and the light-receiving-side single device 15 is composed of a light-emitting-side light-shielding member 18 and a light-receiving-side light-shielding member 19 which are individually formed, and an exterior resin 20 integrally molded around these members.

【0017】前記両遮光体18,19は、例えば、ポリ
フエニレンサルフアイド(PPS)、ポリカーボネイト
(PC)、ポリブチレンテレフタレート(PBT)、結
晶性ポリマー、非晶性ポリマー、あるいは液晶ポリマー
等の熱可塑性樹脂のうち一種類またはこれらの混合物を
用いて、インジエクシヨンモールドされて成る。ここで
熱可塑性樹脂を用いるのは、樹脂成形温度が低い特性を
有するため、各単体デバイス13,15に与える影響が
低いと考えられるからである。また、熱可塑性樹脂とし
ては、その絶縁抵抗が、+25°C前後の常温で10
12Ω以上で、かつ+100°C前後の高温で1011
Ω以上の特性を有するものが使用され、これにより受発
光両リードフレーム12,14間の電気的絶縁性が確保
される。そうすると、所定の規格(ドイツ連邦共和国:
VDE規格0884番)に合致し、製品の標準化、大量
生産化の要請に対応できる。
The light shielding members 18 and 19 are made of, for example, heat such as polyphenylene sulfide (PPS), polycarbonate (PC), polybutylene terephthalate (PBT), a crystalline polymer, an amorphous polymer, or a liquid crystal polymer. It is formed by injection molding using one of the plastic resins or a mixture thereof. Here to use a thermoplastic resin, the resin molding temperature has a lower characteristic, because impact on the single device 13, 15 is considered to be low. Further, the insulation resistance of the thermoplastic resin at room temperature around + 25 ° C. is 10%.
10 11 at high temperature above 12 Ω and around + 100 ° C
A material having a characteristic of Ω or more is used, so that electrical insulation between the light receiving and emitting lead frames 12 and 14 is ensured. Then, the specified standard (Federal Republic of Germany:
It conforms to VDE standard No. 0884) and can respond to requests for product standardization and mass production.

【0018】そして、該各遮光体18,19には、発光
側単体デバイス13から受光側単体デバイス15への光
路を形成するため、丸い穴状の光路室21が夫々形成さ
れている。該光路室21は、両遮光体18,19を対向
配置する際に密閉され、またその長さは発光側単体デバ
イス13および受光側単体デバイス15が互いに電気的
に絶縁するよう長寸とされている。
The light shielding members 18 and 19 emit light.
In order to form an optical path from the side unit device 13 to the light receiving side unit device 15, a round hole-shaped optical path chamber 21 is formed. The light path chamber 21 is sealed when the two light shielding members 18 and 19 are arranged to face each other, and has a length equal to the length of the light emitting side device.
The chair 13 and the light-receiving-side single device 15 are long so as to be electrically insulated from each other.

【0019】前記外装樹脂20は、前記遮光体18,1
9と同一の遮光性材料を用いて、その全周に渡つてイン
ジエクシヨンモールドされてなる。
The exterior resin 20 comprises the light shielding members 18 and 1
The same light-shielding material as that of No. 9 is used, and the entire periphery thereof is molded by injection molding.

【0020】なお、図1中、16aは光指向性を高める
ための透光レンズである。
In FIG. 1, reference numeral 16a denotes a light transmitting lens for improving the light directivity.

【0021】上記構成の光結合装置は、図2のフローチ
ヤートのように製造される。まず、図3の如く、発光素
(図示せず)および受光素子(図示せず)を、発光側
および受光側リードフレーム12,14に搭載し、透光
性樹脂16にてモールドし、発光側および受光側単体デ
バイス13,15の状態として対向配置する。
The optical coupling device having the above structure is manufactured as shown in the flowchart of FIG. First, as shown in FIG. 3, a light emitting element (not shown) and a light receiving element (not shown) are connected to a light emitting side.
And mounted on the light-receiving-side lead frames 12 and 14, molded with a translucent resin 16, and arranged to face each other as the light-emitting and light-receiving-side single devices 13 and 15 .

【0022】次に、図4の如く、発光側単体デバイス
3および受光側単体デバイス15の夫々について、個別
に熱可塑性樹脂でインジエクシヨンモールドして各遮光
体18,19を形成する。この際、光路室21を長寸に
形成しておく。
Next, as shown in FIG. 4, the light emitting side alone devices 1
For each of the light-receiving side device 3 and the light-receiving-side single device 15, the light-shielding members 18 and 19 are individually formed by injection molding with a thermoplastic resin. At this time, the optical path chamber 21 is formed long.

【0023】そして、図5の如く、両単体デバイス
3,15が光路室21内のほぼ同一光軸上で光学的に結
合するよう両遮光体18,19を対向させ、これらを夫
々後方より押さえながら、図1の如く、この周囲を外装
樹脂20で一体モールドする。
[0023] Then, as shown in FIG. 5, both stand-alone device 1
The two light shields 18 and 19 are opposed to each other so that the light shields 3 and 15 are optically coupled on substantially the same optical axis in the optical path chamber 21. While pressing these members from behind, as shown in FIG. And mold integrally.

【0024】以上の作業を、多連式に連結された複数の
リードフレーム12,14を用いて、複数のデバイスに
ついて併置した状態で同時に行う。その後、リードフレ
ーム12,14を各光結合装置本体11ごとにカツト
し、個別の光結合装置が完成し、テスト工程に供する。
The above operation is performed simultaneously using a plurality of lead frames 12 and 14 connected in a cascade in a state where a plurality of devices are juxtaposed. Thereafter, the lead frames 12 and 14 are cut for each optical coupling device main body 11, and individual optical coupling devices are completed, and are subjected to a test process.

【0025】ここで、光路室21を長寸に形成し、かつ
遮光体18,19および外装樹脂20として絶縁抵抗の
高い樹脂材料を用いているため、発光側単体デバイス
3と受光側単体デバイス15との距離が取れ、高い絶縁
性が得られる。
Here, since the light path chamber 21 is formed to be long and a resin material having high insulation resistance is used for the light shielding members 18 and 19 and the exterior resin 20, the light emitting side single device 1
3 and the light-receiving-side single device 15 can be separated, and high insulation properties can be obtained.

【0026】また、例えば、図10に示す従来例2で
は、外側ケースや内側ケース等について単品ごとの処理
になるのに対し、本発明のタイプは、図2の如く、多連
式のフレーム状態のままで成形の段階まで処置できるた
め、金型によつて位置決め等の作業が容易となり、工数
が削減する。したがつて、手作業を廃すことができ、自
動化により安価な製品を提供できる。しかも、外装樹脂
20を金型で成形することにより、従来例2のように嵌
合するタイプに比べてその外寸精度を向上できる。
Further, for example, in the conventional example 2 shown in FIG. 10, the processing for each of the outer case and the inner case is performed individually, whereas the type of the present invention, as shown in FIG. Since the treatment can be performed up to the molding stage as it is, the work of positioning and the like can be easily performed by the mold, and the number of steps can be reduced. Therefore, manual work can be eliminated, and inexpensive products can be provided by automation. Moreover, by molding the exterior resin 20 with a mold, the outer dimensional accuracy can be improved as compared with the fitting type as in Conventional Example 2.

【0027】また、両遮光体18,19を接触配置させ
たとき、成形誤差によつて僅かに隙間ができることがあ
るが、これらの周囲を外装樹脂20で一体モールドする
ので、光路室21への外乱光の進入を防止できる。した
がつて、信頼性の高い光結合装置を提供できる。
When the light shielding members 18 and 19 are placed in contact with each other, a slight gap may be formed due to a molding error. Intrusion of disturbance light can be prevented. Therefore, a highly reliable optical coupling device can be provided.

【0028】しかも、両遮光体18,19および外装樹
脂20を、同一樹脂材料で形成しているので、外装樹脂
20の注入時に両遮光体18,19の表面の一部を溶か
して、これら一次モールド体と二次モールド体の樹脂界
面を無くすことができる。したがつて、熱膨張または熱
収縮時等による樹脂破壊等を防止できる。
In addition, since the light shielding members 18 and 19 and the exterior resin 20 are formed of the same resin material, a part of the surface of the light shielding members 18 and 19 is melted when the exterior resin 20 is injected, so that the primary The resin interface between the mold body and the secondary mold body can be eliminated. Therefore, it is possible to prevent resin destruction or the like due to thermal expansion or thermal contraction.

【0029】なお、本発明は、上記実施例に限定される
ものではなく、本発明の範囲内で上記実施例に多くの修
正および変更を加え得ることは勿論である。
It should be noted that the present invention is not limited to the above-described embodiment, and it goes without saying that many modifications and changes can be made to the above-described embodiment within the scope of the present invention.

【0030】例えば、遮光体18,19の片側の開口部
の形状を凸状とし、他側の開口部の形状を凹状とすれ
ば、光学的結合のための位置決めが確実となり、かつ作
業性が向上する。
For example, if the shape of the opening on one side of the light shielding members 18 and 19 is made convex and the shape of the opening on the other side is made concave, positioning for optical coupling is ensured and workability is improved. improves.

【0031】また、光路室21は円筒形である必要はな
く、矩形等であつてもよい。
The optical path chamber 21 does not need to be cylindrical, but may be rectangular or the like.

【0032】[0032]

【発明の効果】以上の説明から明らかな通り、本発明請
求項1によると、発光側単体デバイスおよび受光側単体
デバイスについて夫々別々に形成した二個の遮光体から
構成し、これらを外装樹脂で一体モールドして固定する
ので、受発光間の光路を長寸にしても光学的結合が確保
でき、この間の電気的絶縁性が向上する。しかも、外装
樹脂にて外乱光の進入を防止でき、誤動作等を防止でき
る。また、受発光両遮光体および外装樹脂を同一の熱可
塑性樹脂材料で形成しているので、外装樹脂の注入時に
両遮光体の表面の一部を溶かして、これら一次モールド
体と二次モールド体の樹脂界面を無くすことができる。
したがつて、熱膨張または熱収縮時等による樹脂破壊等
を防止できる。
As is apparent from the above description, according to the first aspect of the present invention, the light emitting side single device and the light receiving side single device
The device is composed of two separately formed light shields, which are integrally molded with an exterior resin and fixed, so that even if the optical path between light receiving and emitting is long, optical coupling can be secured. The electrical insulation is improved. Moreover, the entry of disturbance light can be prevented by the exterior resin, and malfunctions and the like can be prevented. In addition, the light receiving and emitting light shields and the exterior resin are made of the same heat
Since it is made of plastic resin material,
Dissolve a part of the surface of both light shields, these primary mold
The resin interface between the body and the secondary mold body can be eliminated.
Therefore, resin destruction due to thermal expansion or thermal contraction, etc.
Can be prevented.

【0033】また、従来例2のように両素子を外側ケー
スの中に挿入する作業が省略できるため、手作業を廃
し、自動化により製造効率を高めることができる。
Further, since the operation of inserting both elements into the outer case as in the conventional example 2 can be omitted, manual work can be omitted and the production efficiency can be improved by automation.

【0034】本発明請求項2によると、熱可塑性樹脂の
材料は、ポリフエニレンサルフアイド(PPS)、ポリ
カーボネイト(PC)、ポリブチレンテレフタレート
(PBT)、結晶性ポリマー、非晶性ポリマー、あるい
は液晶ポリマー等の熱可塑性樹脂のうち一種類またはこ
れらの混合物であり、これらは作業性が高く成形精度の
高い樹脂材料であり、且つ耐候性に優れた樹脂材料であ
るので、能率よく成形を行うことができる。
According to the second aspect of the present invention, the thermoplastic resin
The material is polyphenylene sulfide (PPS), poly
Carbonate (PC), polybutylene terephthalate
(PBT), crystalline polymer, amorphous polymer, or
Is one or more of thermoplastic resins such as liquid crystal polymers.
These are mixtures that have high workability and high molding accuracy.
It is a high resin material and has excellent weather resistance.
Therefore, molding can be performed efficiently.

【0035】本発明請求項3によると、両遮光体および
外装樹脂の絶縁抵抗を大きく設定しているので、受発光
間の絶縁耐圧を高めて所定の規格に対応できるといつた
優れた効果がある。
According to the third aspect of the present invention, since the insulation resistance of both the light-shielding body and the exterior resin is set to be large, an excellent effect that the insulation withstand voltage between light reception and emission can be increased to meet a predetermined standard can be obtained. is there.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施例を示す光結合装置の断面図FIG. 1 is a sectional view of an optical coupling device showing an embodiment of the present invention.

【図2】光結合装置の製造方法を示す工程フローチヤー
FIG. 2 is a process flow chart showing a method for manufacturing an optical coupling device.

【図3】各単体デバイスを対向配置した状態を示す図FIG. 3 is a diagram showing a state in which each single device is arranged to face each other;

【図4】各遮光体を形成した状態を示す図FIG. 4 is a diagram showing a state in which each light shield is formed.

【図5】両遮光体を位置決めした状態を示す図FIG. 5 is a diagram showing a state in which both light shields are positioned.

【図6】従来例1の光結合装置の断面図FIG. 6 is a cross-sectional view of the optical coupling device of Conventional Example 1.

【図7】従来例1の光結合装置の製造方法を示す工程フ
ローチヤート
FIG. 7 is a process flow chart showing a method for manufacturing the optical coupling device of Conventional Example 1.

【図8】従来例2の光結合装置の内側ケース挿入作業時
の断面図
FIG. 8 is a cross-sectional view of the optical coupling device of Conventional Example 2 when the inner case is inserted.

【図9】従来例2の光結合装置の完成後の断面図FIG. 9 is a cross-sectional view after completion of the optical coupling device of Conventional Example 2.

【図10】従来例2の光結合装置の製造方法を示す工程
フローチヤート
FIG. 10 is a process flow chart showing a method for manufacturing the optical coupling device of Conventional Example 2;

【符号の説明】[Explanation of symbols]

11 光結合装置本体 12 発光側リードフレーム 13 発光側単体デバイス 14 受光側リードフレーム 15 受光側単体デバイス 18 発光側遮光体 19 受光側遮光体 20 外装樹脂 21 光路室REFERENCE SIGNS LIST 11 optical coupling device main body 12 light emitting side lead frame 13 light emitting side single device 14 light receiving side lead frame 15 light receiving side single device 18 light emitting side light shielding body 19 light receiving side light shielding body 20 exterior resin 21 optical path chamber

───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭61−283179(JP,A) 特開 平3−19289(JP,A) 特開 平3−203274(JP,A) 実開 昭58−27952(JP,U) 実開 昭62−182561(JP,U) 実開 平3−104766(JP,U) 実開 平2−8156(JP,U) (58)調査した分野(Int.Cl.6,DB名) H01L 31/12──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-61-283179 (JP, A) JP-A-3-19289 (JP, A) JP-A-3-203274 (JP, A) 27952 (JP, U) Shokai Sho 62-182561 (JP, U) Shokai Hei 3-104766 (JP, U) Shokai Hei 2-8156 (JP, U) (58) Fields surveyed (Int. Cl. 6 , DB name) H01L 31/12

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 透光性樹脂にてモールドされた発光側単
体デバイスを熱可塑性樹脂によつて一体的に成形してな
発光側遮光体と、透光性樹脂にてモールドされた受光
側単体デバイスを熱可塑性樹脂によつて一体的に成形
てなる受光側遮光体とを備え、該各遮光体に、前記発光
側単体デバイスから受光側単体デバイスに至る光路を形
成する光路室が設けられ、両遮光体は、前記両単体デバ
イスが光路室内のほぼ同一光軸上で光学的に結合するよ
う配置され、さらに前記両遮光体と同一の熱可塑性の
装樹脂で一体モールドされたことを特徴とする光結合装
置。
1. A light emitting side unit molded with a translucent resin.
I and the body device molded in Yotsute integrally with the thermoplastic resin
Emitting light-shielding body that, received that is molded by translucent resin
Side single device Yotsute integrally molded thermoplastic resin
And a light-receiving side light-shielding member comprising:
Optical path chamber is provided for forming the optical path to the light receiving side unitary device from the side alone devices, both the light shield, the two unitary Device
An optical coupling characterized in that the chair is disposed so as to be optically coupled on substantially the same optical axis in the optical path chamber, and is integrally molded with the same light-shielding body with the same thermoplastic external resin. apparatus.
【請求項2】 請求項1記載の前記熱可塑性樹脂の材料
は、ポリフエニレンサルフアイド(PPS)、ポリカー
ボネイト(PC)、ポリブチレンテレフタレート(PB
T)、結晶性ポリマー、非晶性ポリマー、あるいは液晶
ポリマー等の熱可塑性樹脂のうち一種類またはこれらの
混合物であることを特徴とする光結合装置。
2. The material of the thermoplastic resin according to claim 1.
Is polyphenylene sulfide (PPS), polycarbonate
Bonate (PC), polybutylene terephthalate (PB
T), crystalline polymer, amorphous polymer, or liquid crystal
One or more of thermoplastic resins such as polymers
An optical coupling device , which is a mixture .
【請求項3】 請求項記載の前記熱可塑性樹脂の絶縁
抵抗は、+25°C前後の常温で1012Ω以上で、か
つ+100°C前後の高温で1011Ω以上に設定され
たことを特徴とする光結合装置。
3. The insulation resistance of the thermoplastic resin according to claim 1 , wherein the insulation resistance is set to 10 12 Ω or more at a normal temperature of about + 25 ° C. and 10 11 Ω or more at a high temperature of about + 100 ° C. Characteristic optical coupling device.
JP4824492A 1992-03-05 1992-03-05 Optical coupling device Expired - Fee Related JP2787387B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4824492A JP2787387B2 (en) 1992-03-05 1992-03-05 Optical coupling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4824492A JP2787387B2 (en) 1992-03-05 1992-03-05 Optical coupling device

Publications (2)

Publication Number Publication Date
JPH05251734A JPH05251734A (en) 1993-09-28
JP2787387B2 true JP2787387B2 (en) 1998-08-13

Family

ID=12798031

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4824492A Expired - Fee Related JP2787387B2 (en) 1992-03-05 1992-03-05 Optical coupling device

Country Status (1)

Country Link
JP (1) JP2787387B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7009166B2 (en) 2002-03-26 2006-03-07 Sharp Kabushiki Kaisha Photocoupler, method for producing the same, and electronic device equipped with the photocoupler

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3179992B2 (en) * 1995-01-27 2001-06-25 シャープ株式会社 Optical coupling device

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5827952U (en) * 1981-08-18 1983-02-23 株式会社東芝 Optical coupling semiconductor device
JPH0526778Y2 (en) * 1986-05-12 1993-07-07
JP3104766U (en) * 2004-04-21 2004-10-14 株式会社共成レンテム Liquidproof tank

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7009166B2 (en) 2002-03-26 2006-03-07 Sharp Kabushiki Kaisha Photocoupler, method for producing the same, and electronic device equipped with the photocoupler

Also Published As

Publication number Publication date
JPH05251734A (en) 1993-09-28

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