JPH08257895A - Lap structure for lapping tool - Google Patents

Lap structure for lapping tool

Info

Publication number
JPH08257895A
JPH08257895A JP8859095A JP8859095A JPH08257895A JP H08257895 A JPH08257895 A JP H08257895A JP 8859095 A JP8859095 A JP 8859095A JP 8859095 A JP8859095 A JP 8859095A JP H08257895 A JPH08257895 A JP H08257895A
Authority
JP
Japan
Prior art keywords
lapping
lap
particle holding
particle
hard particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8859095A
Other languages
Japanese (ja)
Other versions
JP3627824B2 (en
Inventor
Kiyoshi Miura
静止 三浦
Isao Sato
勇夫 佐藤
Osamu Kudo
修 工藤
Masayuki Onimaru
公志 鬼丸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Priority to JP08859095A priority Critical patent/JP3627824B2/en
Priority to DE1996605833 priority patent/DE69605833T2/en
Priority to EP19960104535 priority patent/EP0733436B1/en
Publication of JPH08257895A publication Critical patent/JPH08257895A/en
Application granted granted Critical
Publication of JP3627824B2 publication Critical patent/JP3627824B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00Subject matter not provided for in other groups of this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/08Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
    • B24B19/11Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section for grinding the circumferential surface of rings, e.g. piston rings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B33/00Honing machines or devices; Accessories therefor
    • B24B33/08Honing tools
    • B24B33/081Honing tools for external surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

PURPOSE: To provide a lap structure for a lapping tool excellent in wearing resistance to long maintain a lap shape and to eliminate necessity for correction work. CONSTITUTION: In a wet lapping tool of applying lapping to a surface of a workpiece through an abrasive grain to finish the surface of the workpiece, a particle holding layer 11, in which a particle holding material 12 softer than the abrasive grain 14 holds a hard particle 13 buried in an almost uniform dispersed condition, is formed in a lap surface, to polish a surface of the particle holding layer 11, and a flat surface of the hard particle 13 polished together is exposed, to hold the abrasive grain in a surface of the particle holding material 12 mutually between the exposed hard particles 13.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、工作物表面に砥粒を介
してラッピングを施す湿式のラッピング工具に関し、特
にラップ構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wet lapping tool for lapping a work surface through abrasive grains, and more particularly to a lapping structure.

【0002】[0002]

【従来技術】湿式ラッピング工具は、工作物とラップと
の間に砥粒とラップ液の混合物を介在させて表面加工を
施すもので、従来は鋳鉄のように適度の硬さを保ちなが
ら砥粒を自身の表面に食い込ませて保持するラップ構造
をしていた。
2. Description of the Related Art Wet lapping tools perform surface processing by interposing a mixture of abrasive grains and lapping liquid between a workpiece and a lap. Conventionally, the abrasive grains have a moderate hardness like cast iron. It had a wrap structure that digs into the surface of itself and holds it.

【0003】[0003]

【解決しようとする課題】しかし砥粒を保持する鋳鉄の
如き保持材は、砥粒よりも軟質の材質なので、保持材自
身もラッピングによって磨耗を生じ、所定の形状を維持
することができず、表面精度を要求されるものにあって
は随時工具を修正して加工するところの修正加工を必要
とした。したがって修正加工にコストのかかる特殊な形
のラッピングを行う場合コスト高となっていた。
However, since the holding material such as cast iron that holds the abrasive grains is a softer material than the abrasive grains, the holding material itself wears due to lapping and cannot maintain a predetermined shape. If surface accuracy is required, it is necessary to modify the tool as needed to perform modification. Therefore, the cost is high when performing a special shape of lapping, which requires a high cost for the correction process.

【0004】本発明はかかる点に鑑みなされたもので、
その目的とする処は、耐磨耗性に優れてラップ形状が長
く維持され、修正加工を必要とされないラッピング工具
のラップ構造を供する点にある。
[0004] The present invention has been made in view of such a point,
The purpose thereof is to provide a lap structure of a lapping tool which is excellent in abrasion resistance, has a long lap shape, and does not require correction.

【0005】[0005]

【課題を解決するための手段および作用】上記目的を達
成するために、本発明は、工作物の表面に砥粒を介して
ラッピングを施し工作物表面を仕上げる湿式のラッピン
グ工具において、砥粒よりも軟質の粒子保持材が硬質粒
子を略均一な分散状態で埋設保持した粒子保持層をラッ
プ表面に形成し、前記粒子保持層の表面は研磨されて共
に研磨された硬質粒子の平坦な表面が露出し、前記露出
した硬質粒子相互間で粒子保持材の表面に砥粒が保持さ
れたラッピング工具のラップ構造である。
In order to achieve the above object, the present invention provides a wet lapping tool for lapping a surface of a workpiece through the abrasive grains to finish the surface of the workpiece. A soft particle-holding material also forms a particle-holding layer in which hard particles are embedded and held in a substantially uniform dispersed state on the lap surface, and the surface of the particle-holding layer is polished and the flat surface of the hard particles is ground together. It is a wrap structure of a lapping tool in which abrasive grains are held between the exposed hard particles and on the surface of a particle holding material between the exposed hard particles.

【0006】粒子保持層の表面は分散して埋設された硬
質粒子の平坦な表面が散在露出しているので、砥粒は硬
質粒子以外の粒子保持材を初期段階で磨滅して硬質粒子
間に凹部が形成され、同凹部に砥粒が入り込みかつ粒子
保持材に食い込み保持され、この保持された砥粒によっ
て工作物の表面がラッピングされる。
Since the flat surface of the hard particles embedded in a dispersed manner is scattered and exposed on the surface of the particle holding layer, the abrasive particles wear away the particle holding materials other than the hard particles in the initial stage to form a space between the hard particles. A concave portion is formed, and the abrasive grain enters the concave portion and bites into and is held by the particle holding material. The held abrasive grain laps the surface of the workpiece.

【0007】ラップ表面には硬質粒子が平坦な面を露出
しているので、耐磨耗性に優れラップ形状が長期に亘っ
て維持される。したがって表面精度を要求される加工に
おいても、作業途中で工具の修正を随時行いながら加工
する修正加工を必要とせず、コストの低減を図ることが
できる。
Since the hard particles expose a flat surface on the lap surface, the lap shape is maintained for a long period of time with excellent abrasion resistance. Therefore, even in the processing requiring surface accuracy, it is possible to reduce the cost without the need for the correction processing in which the tool is corrected at any time during the operation.

【0008】前記粒子保持材にニッケルを用い、前記硬
質粒子にダイヤモンドを用いることで、工作物として鉄
製のもの特にSUS材の母材にCrメッキを施したもの
やSUS材に窒化処理をしたもの、その他鋳鉄の工作物
に好適である。
Nickel is used as the particle holding material and diamond is used as the hard particles, so that the workpiece is made of iron, in particular, the base material of the SUS material is Cr-plated or the SUS material is nitrided. Suitable for other cast iron workpieces.

【0009】前記ラッピング工具が非円形の工作物の表
面をラッピングするものである場合に、従来のラップを
逐次回動させながらの往復ラッピングが不可能である
が、本発明は硬質粒子によりラップ形状が常に維持され
るので、回動を伴わない往復動のみによって高い精度の
加工ができ、修正加工も必要としない。
When the lapping tool is for lapping the surface of a non-circular work piece, it is impossible to perform reciprocal lapping while sequentially rotating a conventional lap. Since it is always maintained, high precision machining can be performed only by reciprocating motion without rotation, and correction machining is not required.

【0010】[0010]

【実施例】以下図1ないし図4に図示した本発明の一実
施例について説明する。本実施例は、ピストンリングの
外周面を仕上げるラッピング工具1に適用したものであ
り、図1および図2に図示するように、楕円筒状のラッ
プ盤2の内周面がラップ表面3を形成している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention shown in FIGS. 1 to 4 will be described below. This embodiment is applied to a lapping tool 1 for finishing the outer peripheral surface of a piston ring, and as shown in FIGS. 1 and 2, the inner peripheral surface of an elliptic cylindrical lapping machine 2 forms a lapping surface 3. are doing.

【0011】同ラップ盤2内に上方から挿入される支軸
4の下端に偏平な楕円柱状のホルダー5が固着されてお
り、同ホルダー5の外周面に周方向に亘って形成された
3条の溝状にそれぞれ工作物であるピストンリング6が
嵌合保持されている。ピストンリング6は、楕円形の環
状に形成された耐磨耗性の鋳鉄によりなるもので、この
楕円形の外周面をラッピング加工することになる。その
他SUS材の母材にCrメッキを施したもの、あるいは
SUS材に窒化処理をしたもの等が工作物として適して
いる。
A flat elliptic cylinder-shaped holder 5 is fixed to the lower end of a support shaft 4 which is inserted into the lapping plate 2 from above, and three strips are formed on the outer peripheral surface of the holder 5 in the circumferential direction. Piston rings 6, which are workpieces, are fitted and held in the respective groove shapes. The piston ring 6 is made of wear-resistant cast iron formed in an elliptical annular shape, and the outer peripheral surface of this elliptical shape is lapped. In addition, a SUS base material plated with Cr or a SUS material subjected to a nitriding treatment is suitable as a workpiece.

【0012】ホルダー5の外周面とラップ盤2の内周面
との間には若干の間隙があり、ホルダー5の外周面に嵌
合されたピストンリング6は外側にはみ出しており、所
定のラッピング圧力でラップ盤2の内周面すなわちラッ
プ表面3に圧接されている。ホルダー5はラップ盤2と
中心軸を一致させて上下に昇降することで、ピストンリ
ング6の外周面をラップ表面3に摺接しラッピングす
る。
There is a slight gap between the outer peripheral surface of the holder 5 and the inner peripheral surface of the lapping machine 2, and the piston ring 6 fitted on the outer peripheral surface of the holder 5 is protruded to the outside to provide a predetermined lapping. It is pressed against the inner peripheral surface of the lapping machine 2, that is, the lapping surface 3 by pressure. The holder 5 moves up and down with the central axis aligned with the lapping machine 2 to slide the outer peripheral surface of the piston ring 6 onto the lapping surface 3 for lapping.

【0013】このラップ盤2のラップ表面3を拡大して
図3に示す。ラップ盤2の基材10の表面に粒子保持層11
が形成されており、本実施例では粒子保持層11は砥粒た
るSiC(通称カーボランダム)14より軟質の粒子保持
材であるニッケル12が硬質粒子であるダイヤモンド粒子
13を略均一な分散状態で埋設保持している。
The lapping surface 3 of the lapping machine 2 is enlarged and shown in FIG. Particle holding layer 11 on the surface of base material 10 of lapping machine 2
In this embodiment, the particle holding layer 11 is diamond particles in which nickel 12 which is a particle holding material softer than SiC (commonly known as carborundum) 14 which is an abrasive grain is hard particles.
13 are embedded and held in a substantially uniform dispersed state.

【0014】ダイヤモンド粒子13は表面を平坦な平面に
研磨されて露出し、ダイヤモンド粒子13の露出した表面
は略同一面をなしており、ダイヤモンド粒子13の相互の
間の磨滅した凹部にSiC14が入り込んでニッケル12に
食い込み保持されている。ここにダイヤモンド粒子13の
粒子径は150 〜250 μmで平均約200 μmであり、砥粒
であるSiC14は30μm前後かそれ以下の粒子径を有
し、砥粒の粒子径はラッピング加工の工程段階に応じて
選択する。
The diamond particles 13 are exposed by polishing the surface to a flat plane, the exposed surfaces of the diamond particles 13 are substantially flush with each other, and SiC 14 enters into the worn recesses between the diamond particles 13. It bites into and is held in nickel 12. Here, the diamond particles 13 have a particle size of 150 to 250 μm and an average of about 200 μm, and SiC14 as an abrasive has a particle size of around 30 μm or less, and the particle size of the abrasive is the lapping process step. Select according to.

【0015】このような構造のラップ表面3を形成する
工程を図4に示す。まず図4(1) に図示するように、基
材10の表面にダイヤモンド粒子13を略均一に分散混合し
た軟質のニッケル12を一般的に工業化されている手法に
より電着して粒子保持層11を形成する。
The process of forming the lap surface 3 having such a structure is shown in FIG. First, as shown in FIG. 4 (1), soft nickel 12 in which diamond particles 13 are substantially uniformly dispersed and mixed is electrodeposited on the surface of a substrate 10 by a generally industrialized method, and the particle holding layer 11 is formed. To form.

【0016】次いで図4(2) に図示するように粒子保持
層11の表面を研磨し、約100 μmの厚さの粒子保持層11
とする。この研磨によりダイヤモンド粒子13も研磨され
平坦な面が形成されて表面に露出しており、粒子保持層
11の全体の表面積に対してダイヤモンド粒子13の露出し
た平面の総面積の割合(ダイヤモンド密度)は約60〜80
%を占める。
Next, as shown in FIG. 4 (2), the surface of the particle holding layer 11 is polished to a particle holding layer 11 having a thickness of about 100 μm.
And By this polishing, the diamond particles 13 are also polished to form a flat surface and are exposed on the surface.
The ratio of the total area of the exposed planes of diamond particles 13 to the total surface area of 11 (diamond density) is about 60 to 80.
Account for%.

【0017】このようなラップの表面状態でラッピング
加工を始める。ラップ盤2の円筒内にホルダー5に嵌合
保持されたピストンリング6を嵌入し、ピストンリング
6とラップ表面3との間にSiC14とラップ液の混合物
を介在させてピストンリング6を上下に往復動させラッ
ピング加工を始めると、早い段階で、軟質のニッケル12
がSiC14により磨滅していき、ダイヤモンド粒子13の
相互間の凹部が形成されて、図4(3) に図示するように
同凹部にSiC14が入り込み保持されると同時にSiC
14は凹部の底にあたるニッケル12に食い込んで保持され
る。
The lapping process is started with the surface condition of such a lap. The piston ring 6 fitted and held in the holder 5 is fitted into the cylinder of the lapping machine 2, and the piston ring 6 is reciprocated up and down by interposing a mixture of SiC14 and lapping liquid between the piston ring 6 and the lapping surface 3. When moving and starting the lapping process, soft nickel 12
Are gradually abraded by the SiC14 to form recesses between the diamond particles 13, and as shown in FIG. 4 (3), the SiC14 enter and are held in the recesses, and at the same time the SiC
14 penetrates into and is retained by nickel 12, which is the bottom of the recess.

【0018】以後該ラップ表面3は図4(3) に示す状態
が維持され、ダイヤモンド粒子13の相互間に凹部に入り
込んだSiC14によってピストンリング6の外周面がラ
ッピングされる。
Thereafter, the lap surface 3 is maintained in the state shown in FIG. 4C, and the outer peripheral surface of the piston ring 6 is lapped by the SiC 14 which has entered the recess between the diamond particles 13.

【0019】ラップ表面3はダイヤモンド粒子13の平坦
な面が露出しているので、耐磨耗性に優れラップ形状が
長期間に亘って維持される。したがってピストンリング
6の外周表面を仕上げるのに、後からさらに修正加工を
する必要はなく、生産性の向上を図ることができる。そ
して量産に適しコストを低減することができる。
Since the flat surface of the diamond particles 13 is exposed on the lap surface 3, it is excellent in abrasion resistance and the lap shape is maintained for a long period of time. Therefore, it is not necessary to perform further correction processing after finishing the outer peripheral surface of the piston ring 6, and the productivity can be improved. It is suitable for mass production and can reduce the cost.

【0020】ところで工作物の加工表面が円周面をして
いれば、従来のようにラップを逐次回動させながらの往
復ラッピング加工することで、容易に面圧精度を維持で
きるが、本実施例の如く工作物であるピストンリング6
が楕円形状をしていたりその他特殊な形状をしていたり
すると、ラップの回動を伴う往復ラッピング加工をする
ことができず面圧精度を維持し難い。
By the way, if the machining surface of the workpiece is a circumferential surface, the surface pressure accuracy can be easily maintained by performing the reciprocal lapping while successively rotating the lap as in the conventional case. Piston ring 6 which is a work piece as an example
If it has an elliptical shape or other special shape, it is difficult to perform the reciprocal lapping process involving the rotation of the lap, and it is difficult to maintain the surface pressure accuracy.

【0021】すなわちラップの回動を伴わないラッピン
グ加工を行う場合、局所的にラッピング面圧の高い所が
あると、耐磨耗性の低い工具ではその部分だけ短時間で
磨耗が進行し形状が変化してしまい、しかもオーバーサ
イズに再加工するにも加工コストが高くなる。
That is, when lapping is performed without turning the lap, if there is a locally high lapping surface pressure, a tool with low wear resistance will wear only in that portion in a short time and the shape of the tool will change. It will change, and the processing cost will increase even if it is reprocessed to oversize.

【0022】本実施例のラップ工具1は、ラップ表面3
に露出するダイヤモンド粒子13がラップ形状を維持して
耐磨耗性に優れているので、ラップの往復動のみによっ
て上記のような非円形の工作物の表面加工を精度良く行
うことができる。そして本実施例のピストンリング6の
如く楕円形をしているような場合は、本実施例のラップ
工具1のように楕円形全体を一度にラッピングすること
で、加工時間の短縮を図り生産性を上げることができ
る。
The lapping tool 1 of this embodiment has a lapping surface 3
Since the diamond particles 13 exposed to the inside maintain the lap shape and are excellent in abrasion resistance, the surface processing of the non-circular work piece as described above can be accurately performed only by the reciprocating movement of the lap. When the piston ring 6 of the present embodiment has an elliptical shape, the entire elliptical shape is lapped at once as in the lapping tool 1 of the present embodiment to shorten the processing time and improve productivity. Can be raised.

【0023】[0023]

【発明の効果】本発明は、ラップ表面には硬質粒子が平
坦な面を露出しているので、耐磨耗性に優れラップ形状
が長期に亘って維持されため、表面精度を要求される加
工でも、修正加工を施す必要はなくコストの低減を図る
ことができる。
Industrial Applicability According to the present invention, since hard particles expose a flat surface on the lap surface, abrasion resistance is excellent and the lap shape is maintained for a long period of time. However, it is not necessary to perform the correction process, and the cost can be reduced.

【0024】前記粒子保持材にニッケルを用い、前記硬
質粒子にダイヤモンドを用いることで、工作物として鉄
製のもの特にSUS材の母材にCrメッキを施したもの
やSUS材に窒化処理をしたもの、その他鋳鉄の工作物
に好適である。
By using nickel for the particle holding material and diamond for the hard particles, a workpiece made of iron, in particular, a base material of SUS material plated with Cr or a SUS material subjected to nitriding treatment Suitable for other cast iron workpieces.

【0025】ラッピング工具が非円形の工作物の表面を
ラッピングするものである場合に、硬質粒子によりラッ
プ形状が常に維持されるので、回転以外の摺動によって
高い精度の加工ができ、修正加工も必要としない。
When the lapping tool is for lapping the surface of a non-circular work piece, the lap shape is always maintained by the hard particles, so that high precision machining can be performed by sliding other than rotation, and correction machining is also possible. do not need.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例に係るラッピング工具の上面
図である。
FIG. 1 is a top view of a lapping tool according to an embodiment of the present invention.

【図2】同縦断面図である。FIG. 2 is a longitudinal sectional view of the same.

【図3】同実施例のラップ表面の構造を示す拡大断面図
である。
FIG. 3 is an enlarged cross-sectional view showing the structure of the lap surface of the same example.

【図4】同ラップ表面構造を形成する過程を示すラップ
表面の拡大断面図である。
FIG. 4 is an enlarged cross-sectional view of the lap surface showing a process of forming the same lap surface structure.

【符号の説明】[Explanation of symbols]

1…ラップ工具、2…ラップ盤、3…ラップ表面、4…
支軸、5…ホルダー、6…ピストンリング、10…基材、
11…粒子保持層、12…ニッケル、13…ダイヤモンド粒
子、14…SiC。
1 ... Lapping tool, 2 ... Lapping machine, 3 ... Lapping surface, 4 ...
Support shaft, 5 ... Holder, 6 ... Piston ring, 10 ... Base material,
11 ... Particle holding layer, 12 ... Nickel, 13 ... Diamond particles, 14 ... SiC.

───────────────────────────────────────────────────── フロントページの続き (72)発明者 鬼丸 公志 埼玉県和光市中央1丁目4番1号 株式会 社本田技術研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Koji Onimaru 1-4-1 Chuo, Wako-shi, Saitama Stock Research Institute Honda Technical Research Institute

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 工作物の表面に砥粒を介してラッピング
を施し工作物表面を仕上げる湿式のラッピング工具にお
いて、 砥粒よりも軟質の粒子保持材が硬質粒子を略均一な分散
状態で埋設保持した粒子保持層をラップ表面に形成し、 前記粒子保持層の表面は研磨されて共に研磨された硬質
粒子の平坦な表面が露出し、 前記露出した硬質粒子相互間で粒子保持材の表面に砥粒
が保持されたことを特徴とするラッピング工具のラップ
構造。
1. A wet lapping tool for finishing a workpiece surface by lapping the surface of the workpiece through abrasive grains, wherein a particle holding material softer than the abrasive grains holds hard particles embedded in a substantially uniform dispersed state. Formed a particle holding layer on the lap surface, the surface of the particle holding layer is polished to expose the flat surface of the hard particles polished together, and the surface of the particle holding material is abraded between the exposed hard particles. Lapping structure of lapping tool characterized by holding grains.
【請求項2】 前記粒子保持材にニッケルを用い、前記
硬質粒子にダイヤモンドを用いたことを特徴とする請求
項1記載のラッピング工具のラップ構造。
2. The lapping structure for a lapping tool according to claim 1, wherein nickel is used for the particle holding material and diamond is used for the hard particles.
【請求項3】 前記ラッピング工具が非円形の工作物の
表面をラッピングするものであることを特徴とする請求
項1記載のラッピング工具のラップ構造。
3. The lapping structure for a lapping tool according to claim 1, wherein the lapping tool is for lapping a surface of a non-circular work piece.
JP08859095A 1995-03-23 1995-03-23 Lapping tool lapping structure Expired - Fee Related JP3627824B2 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP08859095A JP3627824B2 (en) 1995-03-23 1995-03-23 Lapping tool lapping structure
DE1996605833 DE69605833T2 (en) 1995-03-23 1996-03-21 Lapping structure of a lapping tool and lapping process
EP19960104535 EP0733436B1 (en) 1995-03-23 1996-03-21 Lap structure of a lapping tool and lapping process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08859095A JP3627824B2 (en) 1995-03-23 1995-03-23 Lapping tool lapping structure

Publications (2)

Publication Number Publication Date
JPH08257895A true JPH08257895A (en) 1996-10-08
JP3627824B2 JP3627824B2 (en) 2005-03-09

Family

ID=13947058

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08859095A Expired - Fee Related JP3627824B2 (en) 1995-03-23 1995-03-23 Lapping tool lapping structure

Country Status (3)

Country Link
EP (1) EP0733436B1 (en)
JP (1) JP3627824B2 (en)
DE (1) DE69605833T2 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4306977B2 (en) * 2001-04-10 2009-08-05 三星モバイルディスプレイ株式會社 Powder holding sheet, method for producing powder holding sheet, and organic EL display device including the powder holding sheet
DE102009052588A1 (en) 2009-11-10 2011-05-19 Federal-Mogul Burscheid Gmbh Method for producing circulating carrying mirror at profiled circumferential surface of piston ring, involves compressing piston ring in circumferential direction, so that piston ring engages round contour
CN102554739B (en) * 2010-12-20 2015-08-19 如皋市江海技工学校 A kind of Quick polishing device
CN108857867B (en) * 2018-06-05 2020-09-25 黄文魁 Diamond grinding pad and preparation process thereof

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251170A (en) * 1987-04-06 1988-10-18 Mikurotetsuku Tsuuwan:Kk Surface to be ground suitable for tool and its forming method
JPH05309557A (en) * 1992-05-11 1993-11-22 Riken Corp Lapping device of piston ring

Also Published As

Publication number Publication date
EP0733436A1 (en) 1996-09-25
JP3627824B2 (en) 2005-03-09
EP0733436B1 (en) 1999-12-29
DE69605833T2 (en) 2000-05-18
DE69605833D1 (en) 2000-02-03

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