EP0733436A1 - Lap structure of a lapping tool - Google Patents

Lap structure of a lapping tool Download PDF

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Publication number
EP0733436A1
EP0733436A1 EP96104535A EP96104535A EP0733436A1 EP 0733436 A1 EP0733436 A1 EP 0733436A1 EP 96104535 A EP96104535 A EP 96104535A EP 96104535 A EP96104535 A EP 96104535A EP 0733436 A1 EP0733436 A1 EP 0733436A1
Authority
EP
European Patent Office
Prior art keywords
lap
lapping
particle holding
hard particles
abrasion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
EP96104535A
Other languages
German (de)
French (fr)
Other versions
EP0733436B1 (en
Inventor
Seishi Miura
Isao Satou
Osamu Kudou
Masayuki Onimaru
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Honda Motor Co Ltd
Original Assignee
Honda Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Honda Motor Co Ltd filed Critical Honda Motor Co Ltd
Publication of EP0733436A1 publication Critical patent/EP0733436A1/en
Application granted granted Critical
Publication of EP0733436B1 publication Critical patent/EP0733436B1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D99/00Subject matter not provided for in other groups of this subclass
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B24B19/08Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section
    • B24B19/11Single-purpose machines or devices for particular grinding operations not covered by any other main group for grinding non-circular cross-sections, e.g. shafts of elliptical or polygonal cross-section for grinding the circumferential surface of rings, e.g. piston rings
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B33/00Honing machines or devices; Accessories therefor
    • B24B33/08Honing tools
    • B24B33/081Honing tools for external surfaces

Definitions

  • This invention relates to a lapping tool of the wet type for performing lapping of a surface of a work using abrasion grain, and more particularly to a lap structure of a lapping tool.
  • a lapping tool of the wet type performs surface treatment with a mixture of abrasion grain and lap liquid interposed between a work and a lap.
  • a lapping tool of the wet type has a lap structure which has a suitable hardness like that of cast ion and has abrasion grain bitten in the surface of the lapping tool itself.
  • the present invention has been made in view of such a situation as described above, and it is an object of the present invention to provide a lap structure of a lapping work which is superior in wear and abrasion resisting property and maintains a lap shape for a long period of time without requiring any correction working.
  • a lap structure of a lapping tool of the wet type wherein lapping is performed for a surface of a work using abrasion grain to finish the surface of the work, constructed such that a particle holding layer wherein a particle holding member softer than the abrasion grain embeds and holds hard particles in a substantially uniformly dispersed condition is formed on a lap surface, that a surface of the particle holding layer is polished so that flat surfaces of the hard particles polished together are exposed to the surface of the particle holding layer, and that the abrasion grain is held on the surface of the particle holding member between the exposed hard particles.
  • the abrasion grain abrades the particle holding member other than the hard particles at an initial stage so that recessed portions are formed between the hard particles, and the abrasion grain is admitted in the recessed portions and bites into and is held by the particle holding member. Consequently, the surface of the work is lapped by the abrasion grain thus held in the particle holding member.
  • the lapping tool Since the hard particles are exposed at the flat faces thereof to the surface of the lap, the lapping tool is superior in wear and abrasion resisting property and the lap shape is maintained for a long period of time.
  • correction working which is working in which correction of the tool is performed as occasion calls midway of working, is not required, and reduction of the cost can be achieved.
  • the lapping tool can be suitably used for works made of iron, particularly works made of a base material of an SUS material to which Cr is plated or works made of an SUS material processed by nitriding or other cast ion works.
  • FIG. 1 is a top plan view of a lapping tool according to an embodiment of the present invention.
  • FIG. 2 is a vertical sectional view of the lapping tool.
  • FIG. 3 is an enlarged sectional view showing a structure of a surface of a lap of the embodiment.
  • FIG. 4 is an enlarged sectional view of the surface of the lap illustrating a process of forming the lap surface structure.
  • FIGS. 1 to 4 an embodiment of the present invention shown in FIGS. 1 to 4 will be described.
  • the present invention is applied to a lapping tool 1 for finishing an outer peripheral face of a piston ring, and as shown in FIGS. 1 and 2, an inner peripheral face of a lapping machine 2 in the form of an elliptic cylinder forms a lap surface 3.
  • a holder 5 in the form of a flattened elliptic column is fixedly mounted at a lower end of a support shaft 4 which is inserted from above in the lapping machine 2, and piston rings 6 each of which is a work are fitted and held in three grooves formed along a circumferential direction on an outer peripheral face of the holder 5.
  • Each of the piston rings 6 is made of wear and abrasion resisting cast iron formed as an elliptic ring, and an elliptic outer peripheral face of it is to be lapped.
  • the holder 5 having a center axis aligned with the lapping machine 2 is moved upwardly and downwardly so that the outer peripheral faces of the piston rings 6 are slidingly contacted with the lap surface 3 to lap the outer peripheral faces.
  • the lap surface 3 of the lapping machine 2 is shown in an enlarged scale in FIG. 3.
  • a particle holding layer 11 is formed on the surface of a base member 10 of the lapping machine 2, and in the present embodiment, the particle holding layer 11 is constructed such that diamond particles 13 which serve as hard particles are embedded and held in a substantially uniformly dispersed condition in nickel 12 which serves as a particle holding member softer than SiC (normally called carborundum) 14 serving as abrasion grain.
  • the diamond particles 13 are polished at surfaces thereof into flat faces and exposed, and the exposed faces of the diamond particles 13 lie substantially in a plane and the SiC 14 is received in abraded recessed portions between the diamond particles 13 and bites in and is held by the nickel 12.
  • the particle size of the diamond particles 13 is 150 to 250 ⁇ m and is approximately 200 ⁇ m in average.
  • the SiC 14 as abrasion grain has a diameter around or less than 30 ⁇ m.
  • the particle size of the abrasion grain is selected in accordance with a step stage of lapping working.
  • FIG. 4 A process of forming the lap surface 3 of such a structure as described above is illustrated in FIG. 4.
  • soft nickel 12 in which diamond particles 13 are dispersed and mixed substantially uniformly is electro-deposited on the surface of a base member 10 using a popularly industrialized technique.
  • the surface of the particle holding layer 11 is polished as seen in (2) of FIG. 4 until it has the thickness of approximately 100 ⁇ m.
  • the diamond particles 13 are polished so that flat faces of them are formed and exposed to the surface.
  • the ratio (diamond density) of the total area of the exposed flat faces of the diamond particles 13 to the overall surface area of the particle holding layer 11 is approximately 60 to 80 percent.
  • Piston rings 6 fitted with and held by the holder 5 are inserted into the cylinder of the lapping machine 2, and the piston rings 6 are moved back and forth in upward and downward directions to start lapping working with a mixture of SiC 14 and lapping liquid interposed between the piston rings 6 and the lap surface 3. Then, at an early stage after the lapping working is started, the nickel 12 is abraded by the SiC 14 so that recessed portions between the diamond particles 13 are formed, and the SiC 14 is admitted into and held in the recessed portions as seen in (3) of FIG. 4 while the SiC 14 simultaneously bites into and is then held by the nickel 12 which forms the bottoms of the recessed portions.
  • the lap surface 3 keeps its condition shown in (3) of FIG. 4, and the outer peripheral faces of the piston rings 6 are lapped by the SiC 14 admitted in the recessed portions between the diamond particles 13.
  • the lap surface 3 Since the flattened faces of the diamond particles 13 are exposed to the lap surface 3, the lap surface 3 is superior in wear and abrasion resisting property, and the lap shape is maintained for a long period of time.
  • the lapping tool is suitable for mass production and can be produced at a reduced cost.
  • the lapping tool 1 of the present embodiment can perform surface working of such a non-circular work as described above with a high degree of accuracy only by reciprocating movements of the lap since the diamond particles 13 exposed to the lap surface 3 maintains the lap shape and is superior in wear and abrasion resisting property.
  • the working time can be reduced and the productivity can be enhanced by lapping the entire elliptic profile at a time as in the case of the lapping tool 1 in the present embodiment.
  • the present invention seeks to provide a lap structure of a lapping tool which is superior in wear and abrasion resisting property and maintains a lap shape for a long period of time without requiring any correction working.
  • the lap structure of a lapping tool of the wet type wherein lapping is performed for a surface of a work using abrasion grain to finish the surface of the work is constructed such that a particle holding layer 11 wherein a particle holding member 12 softer than the abrasion grain 14 embeds and holds hard particles 13 in a substantially uniformly dispersed condition is formed on a lap surface, that a surface of the particle holding layer 11 is polished so that flat surfaces of the hard particles 13 polished together are exposed to the surface of the particle holding layer 11, and that the abrasion grain is held on the surface of the particle holding member 12 between the exposed hard particles 13.

Abstract

To provide a lap structure of a lapping tool which is superior in wear and abrasion resisting property and maintains a lap shape for a long period of time without requiring any correction working.
The lap structure of a lapping tool of the wet type wherein lapping is performed for a surface of a work using abrasion grain to finish the surface of the work is constructed such that a particle holding layer 11 wherein a particle holding member 12 softer than the abrasion grain 14 embeds and holds hard particles 13 in a substantially uniformly dispersed condition is formed on a lap surface, that a surface of the particle holding layer 11 is polished so that flat surfaces of the hard particles 13 polished together are exposed to the surface of the particle holding layer 11, and that the abrasion grain is held on the surface of the particle holding member 12 between the exposed hard particles 13.

Description

  • This invention relates to a lapping tool of the wet type for performing lapping of a surface of a work using abrasion grain, and more particularly to a lap structure of a lapping tool.
  • A lapping tool of the wet type performs surface treatment with a mixture of abrasion grain and lap liquid interposed between a work and a lap. Conventionally, a lapping tool of the wet type has a lap structure which has a suitable hardness like that of cast ion and has abrasion grain bitten in the surface of the lapping tool itself.
  • However, since such a holding member as cast iron for holding abrasion grain is made of a material softer than abrasion grain, also the holding member itself is abraded by lapping and cannot maintain a predetermined shape. Accordingly, where a high surface accuracy is required, correction working to correctly work the tool is necessitated as occasion calls.
  • Accordingly, a high cost is required when lapping for a special shape with which a high cost is required for correction working is performed.
  • The present invention has been made in view of such a situation as described above, and it is an object of the present invention to provide a lap structure of a lapping work which is superior in wear and abrasion resisting property and maintains a lap shape for a long period of time without requiring any correction working.
  • In order to attain the object described above, according to the present invention, there is provided a lap structure of a lapping tool of the wet type wherein lapping is performed for a surface of a work using abrasion grain to finish the surface of the work, constructed such that a particle holding layer wherein a particle holding member softer than the abrasion grain embeds and holds hard particles in a substantially uniformly dispersed condition is formed on a lap surface, that a surface of the particle holding layer is polished so that flat surfaces of the hard particles polished together are exposed to the surface of the particle holding layer, and that the abrasion grain is held on the surface of the particle holding member between the exposed hard particles.
  • Since the flat surfaces of the dispersedly embedded hard particles are exposed discretely to the surface of the particle holding layer, the abrasion grain abrades the particle holding member other than the hard particles at an initial stage so that recessed portions are formed between the hard particles, and the abrasion grain is admitted in the recessed portions and bites into and is held by the particle holding member. Consequently, the surface of the work is lapped by the abrasion grain thus held in the particle holding member.
  • Since the hard particles are exposed at the flat faces thereof to the surface of the lap, the lapping tool is superior in wear and abrasion resisting property and the lap shape is maintained for a long period of time.
  • Accordingly, also in working for which a high surface accuracy is required, correction working, which is working in which correction of the tool is performed as occasion calls midway of working, is not required, and reduction of the cost can be achieved.
  • Where nickel is used for the particle holding member and diamond is used for the hard particles, the lapping tool can be suitably used for works made of iron, particularly works made of a base material of an SUS material to which Cr is plated or works made of an SUS material processed by nitriding or other cast ion works.
  • Where the lapping tool laps a surface of a non-circular work, conventional reciprocating lapping while the lap is turned as occasion calls is impossible, since, according to the present invention, the lap shape is always maintained by the hard particles, working with a high degree of accuracy can be performed only by reciprocating movements of the lapping tool which does not involve any turning motion, and no correction working is required, either.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is a top plan view of a lapping tool according to an embodiment of the present invention.
  • FIG. 2 is a vertical sectional view of the lapping tool.
  • FIG. 3 is an enlarged sectional view showing a structure of a surface of a lap of the embodiment.
  • FIG. 4 is an enlarged sectional view of the surface of the lap illustrating a process of forming the lap surface structure.
  • In the following, an embodiment of the present invention shown in FIGS. 1 to 4 will be described.
  • In the present embodiment, the present invention is applied to a lapping tool 1 for finishing an outer peripheral face of a piston ring, and as shown in FIGS. 1 and 2, an inner peripheral face of a lapping machine 2 in the form of an elliptic cylinder forms a lap surface 3.
  • A holder 5 in the form of a flattened elliptic column is fixedly mounted at a lower end of a support shaft 4 which is inserted from above in the lapping machine 2, and piston rings 6 each of which is a work are fitted and held in three grooves formed along a circumferential direction on an outer peripheral face of the holder 5.
  • Each of the piston rings 6 is made of wear and abrasion resisting cast iron formed as an elliptic ring, and an elliptic outer peripheral face of it is to be lapped.
  • Also other members such as a member formed from a base material of an SUS material and plated with Cr or a member of an SUS material processed by nitriding are suitable as such works.
  • Some gap is left between the outer peripheral face of the holder 5 and the inner peripheral face of the lapping machine 2, and the piston rings 6 fitted on the outer peripheral face of the holder 5 extend outwardly from the outer peripheral face of the holder 5 and are held in pressure contact with the inner peripheral face of the lapping machine 2, that is, the lap surface 3 under a predetermined lapping pressure.
  • The holder 5 having a center axis aligned with the lapping machine 2 is moved upwardly and downwardly so that the outer peripheral faces of the piston rings 6 are slidingly contacted with the lap surface 3 to lap the outer peripheral faces.
  • The lap surface 3 of the lapping machine 2 is shown in an enlarged scale in FIG. 3.
  • A particle holding layer 11 is formed on the surface of a base member 10 of the lapping machine 2, and in the present embodiment, the particle holding layer 11 is constructed such that diamond particles 13 which serve as hard particles are embedded and held in a substantially uniformly dispersed condition in nickel 12 which serves as a particle holding member softer than SiC (normally called carborundum) 14 serving as abrasion grain.
  • The diamond particles 13 are polished at surfaces thereof into flat faces and exposed, and the exposed faces of the diamond particles 13 lie substantially in a plane and the SiC 14 is received in abraded recessed portions between the diamond particles 13 and bites in and is held by the nickel 12.
  • Here, the particle size of the diamond particles 13 is 150 to 250 µm and is approximately 200 µm in average. The SiC 14 as abrasion grain has a diameter around or less than 30 µm. The particle size of the abrasion grain is selected in accordance with a step stage of lapping working.
  • A process of forming the lap surface 3 of such a structure as described above is illustrated in FIG. 4.
  • First, as seen in (1) of FIG. 4, soft nickel 12 in which diamond particles 13 are dispersed and mixed substantially uniformly is electro-deposited on the surface of a base member 10 using a popularly industrialized technique.
  • Then, the surface of the particle holding layer 11 is polished as seen in (2) of FIG. 4 until it has the thickness of approximately 100 µm.
  • By the polishing, also the diamond particles 13 are polished so that flat faces of them are formed and exposed to the surface. The ratio (diamond density) of the total area of the exposed flat faces of the diamond particles 13 to the overall surface area of the particle holding layer 11 is approximately 60 to 80 percent.
  • Lapping working is started with such a surface condition of the lap as described above.
  • Piston rings 6 fitted with and held by the holder 5 are inserted into the cylinder of the lapping machine 2, and the piston rings 6 are moved back and forth in upward and downward directions to start lapping working with a mixture of SiC 14 and lapping liquid interposed between the piston rings 6 and the lap surface 3. Then, at an early stage after the lapping working is started, the nickel 12 is abraded by the SiC 14 so that recessed portions between the diamond particles 13 are formed, and the SiC 14 is admitted into and held in the recessed portions as seen in (3) of FIG. 4 while the SiC 14 simultaneously bites into and is then held by the nickel 12 which forms the bottoms of the recessed portions.
  • Thereafter, the lap surface 3 keeps its condition shown in (3) of FIG. 4, and the outer peripheral faces of the piston rings 6 are lapped by the SiC 14 admitted in the recessed portions between the diamond particles 13.
  • Since the flattened faces of the diamond particles 13 are exposed to the lap surface 3, the lap surface 3 is superior in wear and abrasion resisting property, and the lap shape is maintained for a long period of time.
  • Accordingly, in finishing the outer peripheral surfaces of the piston rings 6, no later correction working need be performed additionally. Consequently, improvement in productivity can be achieved.
  • And, the lapping tool is suitable for mass production and can be produced at a reduced cost.
  • By the way, if a surface of a work to be worked has a circumferential face, then the plane pressure accuracy can be maintained readily by performing reciprocating lapping working while the lap is turned as occasion calls as in the prior art. However, if the piston rings 6 as works have an elliptic shape as in the present embodiment or have some other special shape, then reciprocating lapping working which involves turning motion of the lap cannot be performed, and consequently, it is difficult to maintain the plane pressure accuracy.
  • In particular, when lapping working which does not involve turning motion of the lap is performed, if the lapping plane pressure is locally high, then where the tool is low in wear and abrasion resisting property, abrasion proceeds only at the location of the tool in a short time and the shape of the tool is varied. Besides, even for reworking to an over-size, the working cost is increased.
  • The lapping tool 1 of the present embodiment can perform surface working of such a non-circular work as described above with a high degree of accuracy only by reciprocating movements of the lap since the diamond particles 13 exposed to the lap surface 3 maintains the lap shape and is superior in wear and abrasion resisting property.
  • And, where the work has an elliptic shape like the piston rings 6 in the preset embodiment, the working time can be reduced and the productivity can be enhanced by lapping the entire elliptic profile at a time as in the case of the lapping tool 1 in the present embodiment.
  • Summarized the present invention seeks to provide a lap structure of a lapping tool which is superior in wear and abrasion resisting property and maintains a lap shape for a long period of time without requiring any correction working.
  • The lap structure of a lapping tool of the wet type wherein lapping is performed for a surface of a work using abrasion grain to finish the surface of the work is constructed such that a particle holding layer 11 wherein a particle holding member 12 softer than the abrasion grain 14 embeds and holds hard particles 13 in a substantially uniformly dispersed condition is formed on a lap surface, that a surface of the particle holding layer 11 is polished so that flat surfaces of the hard particles 13 polished together are exposed to the surface of the particle holding layer 11, and that the abrasion grain is held on the surface of the particle holding member 12 between the exposed hard particles 13.

Claims (3)

  1. A lap structure of a lapping tool (1) of the wet type wherein lapping is performed for a surface of a work using abrasion grain to finish the surface of the work, characterized in that
    a particle holding layer (11) wherein a particle holding member (12) softer than the abrasion grain (14) embeds and holds hard particles (13) in a substantially uniformly dispersed condition is formed on a lap surface (3), that
    a surface of said particle holding layer is polished so that flat surfaces of said hard particles (13) polished together are exposed to the surface of said particle holding layer (11), and that
    the abrasion grain (14) is held on the surface of said particle holding member (12) between the exposed hard particles (13).
  2. A lap structure of a lapping tool (1) according to claim 1, characterized in that nickel is used for said particle holding member (12), and diamond is used for said hard particles (13).
  3. A lap structure of a lapping tool (1) according to claim 1, characterized in that said lapping tool (1) laps a surface of a non-circular work.
EP19960104535 1995-03-23 1996-03-21 Lap structure of a lapping tool and lapping process Expired - Lifetime EP0733436B1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8859095 1995-03-23
JP08859095A JP3627824B2 (en) 1995-03-23 1995-03-23 Lapping tool lapping structure
JP88590/95 1995-03-23

Publications (2)

Publication Number Publication Date
EP0733436A1 true EP0733436A1 (en) 1996-09-25
EP0733436B1 EP0733436B1 (en) 1999-12-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
EP19960104535 Expired - Lifetime EP0733436B1 (en) 1995-03-23 1996-03-21 Lap structure of a lapping tool and lapping process

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EP (1) EP0733436B1 (en)
JP (1) JP3627824B2 (en)
DE (1) DE69605833T2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057352B2 (en) * 2001-04-10 2006-06-06 Samsung Sdi Co., Ltd. Particle holding sheet, method of manufacturing particle holding sheet and organic electroluminescent display having particle holding sheet
CN102554739A (en) * 2010-12-20 2012-07-11 如皋市江海技工学校 Quick polishing device
CN108857867A (en) * 2018-06-05 2018-11-23 惠州市科伟特新材料有限公司 Diamond lap pad and its preparation process

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102009052588A1 (en) 2009-11-10 2011-05-19 Federal-Mogul Burscheid Gmbh Method for producing circulating carrying mirror at profiled circumferential surface of piston ring, involves compressing piston ring in circumferential direction, so that piston ring engages round contour

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251170A (en) * 1987-04-06 1988-10-18 Mikurotetsuku Tsuuwan:Kk Surface to be ground suitable for tool and its forming method
JPH05309557A (en) * 1992-05-11 1993-11-22 Riken Corp Lapping device of piston ring

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63251170A (en) * 1987-04-06 1988-10-18 Mikurotetsuku Tsuuwan:Kk Surface to be ground suitable for tool and its forming method
JPH05309557A (en) * 1992-05-11 1993-11-22 Riken Corp Lapping device of piston ring

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 013, no. 041 (M - 791) 30 January 1989 (1989-01-30) *
PATENT ABSTRACTS OF JAPAN vol. 018, no. 115 (M - 1566) 24 February 1994 (1994-02-24) *

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7057352B2 (en) * 2001-04-10 2006-06-06 Samsung Sdi Co., Ltd. Particle holding sheet, method of manufacturing particle holding sheet and organic electroluminescent display having particle holding sheet
CN102554739A (en) * 2010-12-20 2012-07-11 如皋市江海技工学校 Quick polishing device
CN102554739B (en) * 2010-12-20 2015-08-19 如皋市江海技工学校 A kind of Quick polishing device
CN108857867A (en) * 2018-06-05 2018-11-23 惠州市科伟特新材料有限公司 Diamond lap pad and its preparation process
CN108857867B (en) * 2018-06-05 2020-09-25 黄文魁 Diamond grinding pad and preparation process thereof

Also Published As

Publication number Publication date
DE69605833D1 (en) 2000-02-03
JP3627824B2 (en) 2005-03-09
JPH08257895A (en) 1996-10-08
DE69605833T2 (en) 2000-05-18
EP0733436B1 (en) 1999-12-29

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