JPH08250502A - Formation of high viscosity material - Google Patents

Abstract

PURPOSE: To rapidly carry out heating/cooling cycle by supplying a high viscosity material in unmolten state to a recessed part of a molding die consisting of a material of high orientation property graphite and forming a high viscosity material to a desired configuration by heating, dissolving and cooling it from an outside. CONSTITUTION: A molding die 10 is comprised of a lamination body 12 wherein a number of stripe-shaped orientation graphites 12a are laminated in a thickness direction thereof and a number of molding recessed parts 16 are formed by discharge processing along an outer circumference. A screen print device 40 is put above the molding die 10, a molding recessed part 16 is filled with high viscosity material power 50 and powder is heated and dissolved by bringing a heating body 20 consisting of a metal, etc., of a large heat capacity into contact with a bottom of the molding die 10 or performing laser beam emission. For cooling, a cooling body 30 of material/configuration similar to the heating body 20 is used. Thereby, molding of a desired configuration such a bump electrode can be carried out rapidly and accurately.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a method for molding a high-viscosity material.

[0002]

2. Description of the Related Art As a specific example of the technique of molding and using a high viscosity material, there is a technique of forming bump electrodes on a semiconductor IC. A metal material to be bump electrodes is made into a high-viscosity mixed liquid state together with a binder, and this is discharged from a nozzle by a predetermined amount and molded into a predetermined electrode shape on a substrate.
This method has a feature that the work is simple and the number of steps can be reduced as compared with the technique which is generally used in the related art, in which the bump electrode is formed by using the photoengraving technique or the etching technique.

On the other hand, a high-viscosity adhesive is attached in spots on a substrate for the purpose of die bonding or the like. Also in this case, the high-viscosity adhesive is molded into a predetermined spot shape using the same nozzle as above.

[0004]

In working techniques such as the bump electrode as described above, the molded shape of a high-viscosity material is very important. It is required to obtain a molded product having a predetermined shape and size. However, the material liquid having high viscosity has poor fluidity, and it is difficult to precisely control the discharge amount from the nozzle. Therefore, the shape and size of the molded high-viscosity material are likely to vary. Further, in the case of the above bump electrodes, a large number of tens to more than 100 bump electrodes may be provided on one IC substrate. Therefore, the high-viscosity material liquid may be discharged from the nozzle by changing the position of each bump electrode. Discharging and molding is a very troublesome work. In particular, the high-viscosity material liquid with poor fluidity does not start immediately when the gate is opened or pressure is applied to eject it from the nozzle, and conversely, when the ejection from the nozzle is ended, it does not immediately begin. The discharge does not end. Therefore, the molding time for each time is long, and the workability becomes extremely poor when a large number of moldings as described above are repeated. Techniques for improving the shape and structure of the nozzle to solve the above problems have also been proposed, but they have not been sufficiently solved, and the device structure such as the nozzle becomes complicated. The problem remains.

An object of the present invention is to rapidly and accurately supply the above-mentioned high-viscosity material into a predetermined shape in a molding recess so that a molded product having an accurate shape and size can be accurately positioned. It is to provide a molding method that can be formed with good workability. In order to achieve this purpose, if the bump forming apparatus is taken as an example, it is necessary to supply the bump material in a non-molten state that does not have high viscosity. It is necessary to quickly perform a heating / cooling cycle of heating and melting in the molding recess and then cooling.

[0006]

Therefore, according to the present invention, in order to achieve a rapid heating and cooling cycle inside the molding die, the molding die itself has excellent thermal conductivity, and the molding recess is formed from outside the molding die. It was completed by paying attention to the fact that it is necessary to configure so that heating and cooling can be performed via a molding die made of a highly oriented graphite material when molding a highly viscous material that exhibits high viscosity when melted. Is prepared, the high-viscosity material is supplied to the molding recess in the mold in a non-molten state, the high-viscosity material in the molding recess is heated and melted from the outside through the mold, It is a molding method for cooling a molten high-viscosity material and molding it into a desired shape.

In the present invention, in order to carry out the above-mentioned molding method, it is necessary for the molding die to transfer heat to the molding concave portion quickly and accurately from the outside of the mold. It is preferable that the graphite material is a laminated body in which highly oriented graphite sheets are laminated, and the molding recess is formed on one side surface where the end surfaces of the sheets are arranged in parallel, and the graphite crystals are oriented to the opposite side surface. .

Further, in order to uniformly heat and cool the molding recess of the molding die, one end surface of the highly oriented first graphite sheet laminate forming the molding die is arranged in parallel with one side surface. On the opposite side, make a second alignment so that the orientation is orthogonal.
It is preferable to bond the laminated body in which the graphite sheets are laminated and to heat and cool the molding recess formed on the end face of the second laminated body through the first laminated body.

A laminate of the above sheets is disclosed in Japanese Patent Laid-Open No. 4-215.
Manufactured by laminating a specific polymer film using the method described in No. 08, and finally performing heat treatment at a temperature of 2400 ° C or higher while performing heat treatment in a temperature range of 2000 ° C or higher in an inert gas. However, it is preferable that they are bound by a heat resistant band and integrally fixed. The polymer film contains a filler and has a thickness of 200 μm or less. m-phenylene isophthalamide), poly (phenylene benzobisimidazole), polythiazole, polyparaphenylene vinylene, and aromatic polyimide films such as polypyrolimitimide are particularly preferable.

In order to supply the high-viscosity material to the molding recess in the molding die, it is preferable that the molding die is provided with high-viscosity material supply means for supplying the high-viscosity material to the molding recess. In order to heat and melt the high-viscosity material in the molding recess from the outside through the molding die and cool the melted high-viscosity material, the molding die has a molding surface on the outer surface of the molding recess. It is preferable to provide heating / cooling means for selectively heating and cooling the inside of the recess.

In the case of molding using the above-mentioned powder form, it is preferable to prepare a high-viscosity material in the form of paste by kneading with a printing binder. The powder may be a metal powder, depending on the molding application. Various powders such as bump material powder, dielectric material powder, insulating material powder, and optical component material powder are selected.
The printing binder volatilizes and disappears when heated in the molding recess. As a means for supplying the paste-like high-viscosity material, a screen printing plate having a powder passage portion at a position corresponding to the molding concave portion arranged above the surface of the molding die having the molding concave portion, It is preferable that the screen printing apparatus comprises a screen printing apparatus having a squeegee that pushes the powder supplied onto the upper surface of the screen printing plate along the screen printing plate.

When the high viscosity material is a linear body for wire bonding or the like, the high viscosity material supply means is
It is arranged above the surface of the molding die having the molding recess, and is configured as a linear body supply device for feeding the tip of the linear body into the molding recess. On the other hand, it is preferable that the heating / cooling means includes a heating body and a cooling body which can selectively come into contact with the opposite surface of the molding die.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION According to the method of the present invention, since the mold for high viscosity material is made of highly oriented graphite and has excellent thermal conductivity, the high viscosity material is supplied to the molding recess and melted by heating. At this time, the heating of the high-viscosity material through the mold is performed quickly and efficiently. Also when cooling the molded product of the high-viscosity material that has been melted by heating and molded, it is possible to cool quickly and efficiently through the molding die. Therefore, it becomes possible to supply a powder or linear body to the molding recess and mold a predetermined molded body by utilizing a rapid heating / cooling cycle. Since this highly oriented graphite is also excellent in heat resistance, it can be applied to a high viscosity material that must be melted at a high temperature without any problem.

If the highly-oriented graphite is oriented from the surface having the molding recess to the opposite surface, the highly-oriented graphite has a particularly high thermal conductivity in the direction along the orientation. By heating or cooling from the outer surface opposite to the molding recess, the powder or molded product in the molding recess on the surface can be heated and cooled quickly and efficiently.

Highly oriented graphite is generally manufactured in a thin sheet state. By stacking such highly oriented graphite sheets into a laminated body, a thick molding die can be easily constructed. The laminate of highly oriented graphite sheets oriented in the plane direction is in a state of being favorably oriented in the plane direction of the sheet as a whole.
If there is a molding recess on the surface where the end faces of the sheet are arranged side by side, it becomes a mold with a very good orientation in which the highly oriented graphite is aligned from the surface having the molding recess to the opposite surface, The thermal conductivity from the to the opposite side is improved.

A laminate of highly oriented graphite sheets is
If it is bundled with a heat resistant band and fixed integrally,
A molding die can be easily manufactured without adhering the sheets constituting the laminated body one by one. Since the molding die is heated to a high temperature or rapidly heated and cooled repeatedly, the integrity of the sheets will be reduced by means such as adhesion,
By bundling with a heat resistant band, it is possible to sufficiently withstand heating to high temperatures and rapid heating and cooling.

When the above-mentioned molding die is provided with a high-viscosity material supply means and a heating / cooling means, a series of working steps from supply of the high-viscosity material to the molding recess, heating and melting of the high-viscosity material, and cooling Can be done quickly. When the molding material is a powder, if the powder and a printing binder that volatilizes by heating are kneaded to form a high-viscosity material,
Easy to handle and easy to heat and melt and mold. In this case, if the high-viscosity material supplying means is equipped with a screen printing device having a screen printing plate and a squeegee, it is possible to reliably and efficiently supply the required amount of powder to the molding recess of the molding die. Even when the molding die is provided with a large number of molding recesses, it is possible to supply the powder uniformly to a large number of molding recesses at the same time.

If the high-viscosity material is a linear body that can be heated and melted, it is unlikely to scatter like powder, and is easy to store and carry. In this case, if the high-viscosity material supply means feeds the tip of the linear body into the molding recess, only the linear body having a required length can be heated and melted in the molding recess to be molded.
There is no concern that the high-viscosity material will leak out of the molding recess. The structure of the device for supplying the linear body is simplified.

If the heating / cooling means is provided with a heating body and a cooling body which can selectively come into contact with the opposite surface of the molding die, a complicated heating mechanism or cooling mechanism is provided inside the molding die made of highly oriented graphite. Therefore, it is easy to manufacture the molding die. If the heating element is brought into contact with the forming die, heating is started quickly, and if the heating element is separated from the forming die and the cooling element is brought into contact with it, rapid cooling is started. Therefore, work efficiency can be improved.

In the method of molding a high-viscosity material of the present invention, the high-viscosity material is supplied to the molding recess of the molding die in a non-melted state of the powder, the powder kneading paste or the linear body. It is much easier to supply the material to the forming die than supplying the material. Further, the supply amount of the high-viscosity material can be set accurately. If the heating element is brought into contact with the surface of the forming die opposite to the forming recess, the powder supplied to the forming recess on the surface can be quickly transferred through the forming die made of highly oriented graphite with excellent thermal conductivity. It is heated and melted to be molded according to the shape of the molding recess. When the cooling body instead of the heating body is brought into contact with the molding die, the molded product in the molding recess is cooled quickly and can maintain a predetermined molding shape. The cooled molded product can be taken out of the mold and used freely.

If the high-viscosity material is a mixed powder of a metal and a binder, it is possible to easily and efficiently manufacture a molded product for making a metal sintered product or a molded product for a bump electrode. it can. If the high-viscosity material is a bump material, the bump electrode can be easily and efficiently manufactured.
If the high-viscosity material is a dielectric material or an insulating material, the dielectric member and the insulating member used in various electronic devices can be easily and efficiently manufactured. If the high-viscosity material is an optical component material, optical components used in various optical devices can be easily and efficiently manufactured. If the high-viscosity material is a wire-bonding linear body, the wire-bonding structure used in various electronic devices can be easily and efficiently manufactured.

The molding apparatus shown in FIG. 1 is a molding apparatus used for forming bump electrodes on an IC substrate. Mold 1
0, heating body 21, and cooling body 30 are provided. Mold 1
0 is a strip-shaped highly oriented graphite sheet 12a
A rectangular parallelepiped laminated body 12 in which a large number of are laminated in the thickness direction
And a heat resistant band 14 arranged on the outer periphery of the laminated body 12 along the laminating direction of the sheets 12a.

Graphite is a crystal of carbon, and the crystal has a layered structure. The material in which the carbon crystal is arranged with a certain orientation is highly oriented graphite. The highly oriented graphite can be produced, for example, by baking the specific polymer film as described above under the following conditions. If a plurality of polymer films are stacked and baked, a sheet-shaped or block-shaped highly oriented graphite can be obtained. The highly-oriented graphite sheet 12a may be a highly-oriented graphite film itself made of a polymer film as described above, or may be a sheet having a predetermined thickness obtained by baking and hardening a plurality of thin highly-oriented graphite films. You can use the one The thickness of the sheet 12a is 5 to 200 μ
The thing of about m is used.

Production Example 1 200 sheets of 25 μm-thick polypyromellitimide (Kapton H film, manufactured by Dyupon Co., Ltd.) were stacked, set on a graphite jig, and heated to 1400 ° C. at a rate of 10 ° C./min in argon gas. The temperature was raised. During this period, 100g for the sample
The pressure of the jig weight of / cm ² was applied. Then 1
After reaching 400 ℃, 30 while maintaining the same rate of temperature rise
It was heated to 1600 ° C. while applying a pressure of kg / cm ² . After that, the pressure was reduced so that only the pressure of the jig was applied, and heating was performed up to 2700 ° C. Then increase the pressure to 300
The temperature was adjusted to kg / cm ² and the temperature was raised to 3000 ° C., and the heat treatment was completed to obtain a graphite block.

Production Example 2 A 25 μm thick polypyromellitimide (Kapton H film manufactured by Dyupon Co.) containing 5% by weight of calcium hydrogen phosphate was used in an LTF-S type electric furnace manufactured by Sankyo Denki Kogyo Co., Ltd. Then, the temperature was raised to 1000 ° C. in nitrogen gas at a rate of 3 ° C./min, and the temperature was kept at 1000 ° C. for 1 hour for preheat treatment. Next, the obtained carbonized sheet was set inside a graphite cylinder so that it could be freely expanded and contracted, and an ultrahigh temperature furnace type 46-5 manufactured by Shinsei Denki Co., Ltd. was used together with the graphite cylinder at 5 ° C / m.
Heated to 2800 ° C. at a rate of in. The heating was carried out at normal pressure in an argon atmosphere. The obtained sheet was passed through two rollers made of stainless steel (manufactured by Kumagai Riki Kogyo Co., Ltd.) for rolling treatment. A sheet having a tensile strength of 630 Kgf / cm ^{2 and} a thermal conductivity of 860 kcal / m · h · ° C was obtained.

The heat resistant band 14 is made of the same highly oriented graphite sheet as the laminated body 12, and the laminated body 1
The sheet 12 that is wound around the outer periphery of the sheet 2 to form the laminated body 12
The a's are tightly bound, integrated and fixed. The end portions of the heat resistant band 14 are overlapped and bonded or mechanically joined. A large number of molding recesses 16 are provided along the outer periphery of the upper surface of the molding die 10 on which the end faces of the sheet 12a are lined up. Electric discharge machining is applied to form the forming recess 16 on the surface of the forming die 10 made of the highly oriented graphite sheet 12a.

The molding recess 16 has a circular columnar shape in a plan view and has a spherical bottom surface. The shape and arrangement of the molding recess 16 are set in accordance with the shape and arrangement of the bump electrode to be manufactured. The heating body 20 is made of metal or the like having a large heat capacity, has a top surface shape that abuts the bottom surface of the molding die 10, and has a rectangular parallelepiped shape as a whole. The cooling body 30 is also made of the same material as the heating body 20 and has the same shape.

The heating body 20 is provided between a position in contact with the bottom surface of the molding die 10 and a heating device (not shown) such as a heating furnace or a heater for heating the heating body 20 at a position distant from the molding die 10. It is movably installed. The cooling body 30 is movably provided between a position in contact with the bottom surface of the molding die 10 and a position separated from the molding die 10. Even if the cooling body 30 is not provided with a special cooling device, it may be maintained at a low temperature with respect to the heating body 20 by allowing it to cool at room temperature.

In order to facilitate uniform heating or cooling from the heating body 20 and the cooling body 30, the heating body having a high orientation in the plane direction shown in FIG. 8 or 9 on the heating and cooling side of the molding die 10. 200 or heating / cooling body 300 can be used. In the case of FIG. 8, the molding recess 16 is formed.
Which is a highly oriented first graphite sheet laminated body forming a sheet, and a second graphite sheet in which the orientation is orthogonal to the side surface opposite to the one side surface formed by arranging the end surfaces of the mold 100 in parallel. A YAG or CO ₂ laser beam device 202 which is formed by joining the body 200 through a joined graphite sheet 201 having flexibility (it can be manufactured by the method disclosed in Japanese Patent Laid-Open No. 2-103478) and reciprocates in the horizontal direction. A laser beam from the second laminated body 200
And heat received by the second laminated body 200 that spreads in the surface direction of the second laminated body 200 can be received through the first laminated body 100 to heat the molding recess 16 formed on the end face thereof. . Since the second laminated body 200 has a high orientation in the plane direction, the second laminated body 200 has a property of functioning as a soaking and heating source when the laser beam irradiates the center and has a thickness of 1 mm or more. ing.

On the other hand, in FIG. 9, the Peltier element 300 is used as a heating / cooling body instead of the laser beam device used in FIG. 8, and by providing the Peltier element 300 at a part of both ends of the second laminated body 200. Second stacked body 200
It may be used as a uniform heating and cooling source for the first stacked body 100 by utilizing the high orientation in the plane direction. A molding method using the molding apparatus having the above structure will be described.

As shown in FIG. 2, a screen printing device 40 is arranged above the molding die 10. The screen printing device 40 is a device used for so-called silk screen printing. The screen printing device 40 has a screen printing plate 42 whose periphery is supported by a frame. The screen printing plate 42 is made of a metal or synthetic resin plate or mesh, and has holes through which the printing material passes only at the printing points. In this embodiment, at a position above the molding recess 16 of the molding die 10, a circular powder passage hole 46 having substantially the same shape as the plan shape of the molding recess 16 is formed in the screen printing plate 42.
It is provided in.

A powder paste 50 of a high-viscosity material is supplied to the upper surface of the screen printing plate 42, and a knife-shaped squeegee 44 having a sharp lower end moves along the upper surface of the screen printing plate 42. The powder paste 50 is a powder in which a metal powder to be a bump electrode is mixed with a binder made of a synthetic resin that exerts an action of bringing the metal powders together during molding.

With the movement of the squeegee 44, the powder passage hole 4
The powder paste 50 dropped from 6 is filled with the molding recesses 16
Accumulates inside. The powder paste 50 is formed in the molding recess 16
Can be supplied near or slightly beyond the top of the. Powder paste 5 in the molding recess 16
After 0 is supplied, as shown in FIG. 1, the heating body 20 heated to a high temperature of about 300 ° C. is brought into contact with the bottom surface of the molding die 10. Then, heat is transferred from the heating body 20 to the powder paste 50 in the molding recess 16 through the molding die 10. The heated powder paste 50 is melted and molded according to the shape of the molding recess 16. When a printing binder is used as the above-mentioned binder, it can be volatilized and eliminated during heating.

As shown in FIG. 3A, the heat-melted powder 50 is formed into a spherical shape along the shape of the bottom of the forming concave portion 16 by the action of its own surface tension or the like to form a formed product 52. . When the powder 50 is heated and melted to form the molded product 52, the heating body 20 is removed from the bottom surface of the molding die 10, and the cooling body 30 maintained at a temperature of about 20 ° C. is brought into contact with the bottom surface of the molding die 10. . The molded product 52 is cooled via the molding die 10. If the molded product 52 is cooled to such an extent that it can be handled,
Cooling may be completed by separating the cooling body 30 from the mold 10. The molded product 52 can be taken out from the molding recess 16.

In this embodiment, as shown in FIG. 3 (b), the molding 52 is transferred directly from the molding die 10 to the substrate 60 on which bump electrodes are to be manufactured. That is, the projections 62 for supporting electrodes are provided on the lower surface of the substrate 60. The protrusion 62 may be a terminal of the IC substrate or a part of the wiring member. The projection 62 is pierced into the molded product 52 by bringing the substrate 60 close to the mold 10. At this time, the molded product 52 is in a state of being easily deformed before being completely cooled and solidified. Molded product 5
When the projection 62 stuck in 2 is lifted together with the substrate 60, the molded product 52 is picked up from the molding recess 16 and transferred to the substrate 60 in a state where the molded product 52 is stuck at the tip of the projection 62. When the molded product 52 transferred to the substrate 60 is further cooled and solidified, the molded product 52 becomes a protrusion 62.
It is fixed in the state of being stuck in.

In this way, the molding 52 is molded into the molding die 10.
By directly transferring the molded product 52 from the substrate 60 to the substrate 60, it is not necessary to separately perform the work of taking out the molded product 52 from the molding die 10 and the work of mounting the taken-out molded product 52 at each predetermined position of the substrate 60, and the production of bump electrodes. Work can be done very efficiently. In addition, since the molded article 52 does not come into contact with other instruments or members, the shape of the bump electrode to be manufactured is the same as that of the molded article 52 at the time of molding. It is also possible to prevent foreign matter from entering the molded product 52.

The shape of the molding recess 16 provided in the molding die 10 may be a hemispherical shape as shown in FIG. In the case of the hemispherical molding recess 16, as shown in FIG. 4B, the powder 50 is supplied so as to rise above the upper end of the molding recess 16 and rise to the surface of the molding die 10. The powder 50 has the molding die 10 around the molding recess 16
It may be protruding on the surface.

As shown in FIG. 4 (c), when the powder 50 is heated and melted, a spherical molded article 52 is obtained as in the above embodiment.
Is formed. As the powder 50 is heated and melted, it is gathered into a spherical shape due to the action of surface tension and the like.
And the powder 50 is also integrated with the molded product 52. In this embodiment, the molded product 52 is the molding recess 16
Since it protrudes to the upper part of the above, the above-mentioned transfer operation to the substrate 60 is easy to perform. Even if the substrate 60 does not have the protrusion 62, the flat surface of the substrate 60 is brought into contact with the upper end of the spherical molded article 52 protruding from the surface of the molding die 10 to attach the molded article 52 to the substrate 60 to perform molding. The object 52 can be transferred to the substrate 60.

Next, as shown in FIGS. 5A to 5C, a conical recess 16 for molding can be used. Also in this case,
The spherical molded article 5 that is inscribed in the conical molding recess 16 is formed into a spherical shape by the surface tension when the powder 50 that is supplied to the outside of the molding recess 16 is melted by heating.
2 is obtained. In this embodiment, the molded product 5 formed by the amount of the powder 50 supplied to the molding recess 16 is formed.
The ball diameter of 2 changes. It is possible to easily mold various spherical molded products 52 with one type of conical recess 16 for molding.

As shown in FIG. 6, a linear body 54 formed by molding a wire bonding material, which is a high-viscosity material, into a thin wire can be used. As shown in FIG. 6A, the linear body 54 is disposed above the molding recess 16 of the molding die 10. The linear body 54 is handled using a linear object handling device similar to a normal wire bonding device or the like.

As shown in FIG. 6 (b), the tip of the linear body 54 is pressed into the molding recess 16 of the heated mold 10. The linear body 54 gradually heats and melts from the tip. If the linear body 54 is continuously pressed against the molding concave portion 16, the linear body 5
4 is heated and melted one after another, and the high-viscosity material is accumulated in the molding concave portion 16 in a heated and melted state. As shown in FIG. 6C, when the required amount of the high-viscosity material for the linear body 16 is supplied into the molding recess 16, the linear body 54 is moved away from the molding recess 16.
The high-viscosity material in the heat-melted state accumulated in the molding recess 16 is naturally molded into a spherical shape in the same manner as in the above-mentioned embodiment to obtain a spherical molded product 56. The subsequent cooling process is performed in the same manner as in the above embodiment.

[Embodiment for Vacuum Suction] As shown in FIG. 7, the basic steps are the same as those of the embodiment shown in FIG. 4, but in this embodiment, FIG. As shown in FIG. 7, after the powder 50 of the high-viscosity material is supplied to the molding recess 16 of the molding die 10, as shown in FIG.
Is sent to the vacuum suction device 80. In the vacuum suction device 80, the mold 10 is heated to release the volatile components such as the binder component contained in the powder 50, and the gas in the vacuum suction device 80 is vacuum sucked and released from the powder 50. Volatile components are removed to the outside.

As shown in FIG. 7 (c), the powder 50 from which the volatile components have been removed is melted by heating and molded according to the shape of the molding recess 16 to obtain a molded product 52 having a substantially lens shape. In this embodiment, the volatile components contained in the high-viscosity material can be quickly and efficiently removed by vacuum suction, the workability of the molding process can be improved, and the obtained molded product 52 has volatile components. High quality with less residue.

[Other Embodiments] (1) The molding die 10 may be composed of a laminated body 12 in which the above-mentioned highly oriented graphite sheets 12a are laminated, or a block-shaped highly oriented graphite is used. It can also be configured. (2) In addition to the above-described electric discharge machining, machining techniques such as etching and laser machining can be applied to the machining of the molding recess 16.

(3) The heat resistant band 14 is made of materials other than highly oriented graphite as long as it has heat resistance to withstand heating in the molding process and mechanical strength capable of binding the highly oriented graphite sheet 12a. Materials can also be used. If the heating temperature during molding exceeds 1200 ° C,
Ceramic insulation cloth or highly oriented graphite sheet is preferred. When the heating temperature at the time of molding is low, a metal band can be used.

(4) As the high-viscosity material, any material can be used as long as it is a material containing various metals, synthetic resins, ceramics and other organic substances and inorganic substances such as the above-mentioned materials for bump electrodes. It is preferably applied to a material that has been conventionally formed into a liquid state having a high viscosity. Specifically, electrode materials, dielectric materials, insulating materials, adhesives and the like used in various electronic parts are used. Further, a sintered material for sintering and manufacturing various mechanical parts can also be used. Optical component materials such as glass are also used. In order to use the high-viscosity material in the form of powder or linear material, materials that can be processed into respective forms may be used.

(5) In order to heat and melt the high-viscosity material, the material is heated to a heating temperature corresponding to the high-viscosity material. When the heating temperature is relatively low, the molding can be performed in the atmosphere, but when the heating temperature is as high as 800 ° C. or higher, the molding is preferably performed in an inert gas. (6) In order to mold the molded product 52 from the powder 50 of the high-viscosity material or the linear body 54, a means for heating the molding die 10 is indispensable, but in the case of cooling only by cooling, special cooling is required. Means may not be necessary. However, the cooling means such as the above-described cooling body 30 is effective for quick cooling to improve workability.

(7) The present invention can be applied not only to the formation of the bump electrodes and the spot-shaped adhesive described above, but also to the molding of a sintered material for sintering and manufacturing various mechanical parts. It can also be applied to melt molding of optical parts such as glass. FIG. 10 shows a comparison between the conventional method and the method of the present invention in circuit mounting. That is, conventionally, a bonding component is formed and bonded to a conveyed IC by a bonding wire and a gold ball. If the number of joining points is N, the joining is repeated N times. Next, solder / silver paste is printed, and the IC component is surface-mounted on a circuit board that is separately transported. Next, after performing reflow / laser reflow on the circuit board on which the IC components are mounted, a final inspection of circuit mounting is performed.

According to the present invention, the printing paste formed by kneading the powder of the high-viscosity material for the joined parts and the printing binder is supplied to the concave portion of the molding die of the present invention by screen printing, and heated and melted. After cooling, it is molded. A three-dimensional joined part is aligned and manufactured in a forming die by one molding. Therefore, it is possible to transfer a predetermined IC to the molding die provided with the aligned joint parts, to collectively transfer the joint parts, and to join them. The surface mounting on the circuit board is the same as the conventional one.

FIG. 11 shows a comparison between the conventional method and the method of the present invention applied to the molding of optical parts. That is, conventionally, a ball lens is cut out from a lens rod as a lens material, cut out, ground into a predetermined shape and formed into a predetermined shape by a heating and pressing press, and this is ground and sent to a final inspection. On the other hand, when the present invention is applied, the glass frit of the lens material is crushed into an ultrafine powder, which is kneaded with an acrylic low-molecular composition (for example, a binder for a ceramic green sheet) which is a binder for printing to form a paste. Eggplant This paste is poured into the molding recess of the mold by the printing method of the present invention. Therefore, press molding is performed by heating to a high temperature of about 1600 ° C. to melt and volatilize the binder component while precisely controlling the heat cycle with a laser beam. According to the method of the present invention, the steps of cutting and polishing the lens balls are not required, and the molding process becomes extremely easy.

[Brief description of drawings]

FIG. 1 is a perspective view of a molding apparatus showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a high-viscosity material supply process.

FIG. 3 is a cross-sectional view showing a step of transferring a molded high-viscosity material in stages.

4A to 4C are cross-sectional views showing stepwise a molding process using another embodiment of a molding recess.

FIG. 5 is a cross-sectional view showing a molding process stepwise using another embodiment of a molding recess.

FIG. 6 is a cross-sectional view showing stepwise a molding process of an embodiment of the present invention using a linear body.

FIG. 7 is a cross-sectional view showing stepwise a molding process of an embodiment of the present invention using a vacuum suction device.

FIG. 8 is a side view showing an outline of a molding die when a laser beam is used as a heating source.

FIG. 9 is a side view showing an outline of a molding die when a Peltier element is used as a heating / cooling source.

FIG. 10 is a process diagram comparing a conventional circuit mounting process and a circuit mounting process when the method of the present invention is applied.

FIG. 11 is a process diagram comparing a conventional optical component molding process with a molding method when the method of the present invention is applied.

[Explanation of symbols]

 10 Mold 12 Laminated body 12a Highly oriented graphite sheet 14 Heat resistant band 16 Molding recess 20 Heated body 30 Cooled body 40 Screen printing device 42 Screen printing plate 50 High viscosity material powder 52 High viscosity material molding 54 High Linear body of viscous material

Claims (10)

[Claims] 1. When molding a high-viscosity material exhibiting high viscosity when melted, a molding die made of a highly oriented graphite material is prepared, and the high-viscosity material in a non-melted state is formed in a molding recess in the die. A method for molding a high-viscosity material in which the high-viscosity material in the molding recess is supplied from the outside by heating and melting, and the high-viscosity material melted through the mold is cooled and molded into a desired shape. . 2. A highly oriented graphite material constituting the shaping die is a laminate in which highly oriented graphite sheets are laminated so that the shaping die transfers heat to the shaping recess from the outside. 2. The method for molding a high-viscosity material according to claim 1, wherein the molding recess is formed on one side surface where the end surfaces of the sheet are arranged in parallel, and the graphite crystals are oriented to the opposite side surface. 3. A second orientation in which the orientation is orthogonal to the side surface opposite to the one side surface where the end surfaces of the highly oriented first graphite sheet laminate forming the molding recess are juxtaposed. 3. A high-strength structure according to claim 2, wherein a stack of graphite sheets is joined together, and the molding recess formed on the end face of the second stack through the first stack is heated and cooled. Method of molding viscous material. 4. The method for molding a high-viscosity material according to claim 3, wherein the laminated body of the sheets is bound by a heat resistant band and integrally fixed. 5. The mold has a high-viscosity material supply means for supplying the high-viscosity material to the molding recess for supplying the high-viscosity material to the molding recess in the molding die. In order to heat and melt the high-viscosity material in the molding recess from the outside through and to cool the molten high-viscosity material,
The method for molding a high-viscosity material according to claim 1, further comprising heating and cooling means for selectively heating and cooling the inside of the molding recess on the outer surface of the molding recess of the molding die. 6. When the high-viscosity material is a powder, the high-viscosity material supply means forms a paste as it is or by kneading with a printing binder, and the high-viscosity material supply means has a surface having the molding recess of the molding die. A screen printing plate having a powder passage portion at a position corresponding to the molding recess disposed above, and a squeegee that pushes the powder supplied on the upper surface of the screen printing plate along the screen printing plate. The method for molding a high-viscosity material according to claim 5, further comprising a screen printing device having: 7. The high-viscosity material is one powder selected from the group consisting of metal powder, bump material powder, dielectric material powder, insulating material powder, and optical component material powder. 7. The method for molding a high-viscosity material according to item 6. 8. When the high-viscosity material is a linear body,
The high-viscosity material supplying means is arranged above the surface of the mold having the molding recess, and the linear material supply device is provided for feeding the tip of the linear body into the molding recess. Molding method for high viscosity materials. 9. The method for molding a high-viscosity material according to claim 8, wherein the high-viscosity material is a wire-bonding linear body. 10. The method for molding a high-viscosity material according to claim 5, wherein the heating / cooling means includes a heating body and a cooling body which can selectively come into contact with the opposite surface of the molding die.