JPH1015691A - Joining material of electronic parts, its production and supplying method therefor as well as method for packaging electronic parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To substantially prevent the deterioration in the adhesive performance of an adhesive included in a joining material with time and the curing of the adhesive and to assure a good joining state by coating a mixture composed of conductive particles and the adhesive with a coating film and forming the mixture as capsule-like particulates. SOLUTION: The joining material A is formed as the capsule-like particulates by coating the mixture (c) composed of the conductive particles (a) and the joining material (b) with the coating film (d). Electronic parts are mounted at a printed circuit board and are heated by a heater, by which the coating film (d) of the joining material A is melted with an org. solvent and the mixture (c) composed of the conductive particles (a) and the joining material (b) is eluted to join the materials to be joined to conductor patterns. In addition, the adhesive (b) is cured by heating to fix the electronic parts to the printed circuit board. The electrical conductivity between the parts to be joined of the electronic parts and the conductor patterns is assured by the conductive particles (a) incorporated into the adhesive (b).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for mounting electronic components such as a microcomputer and a capacitor.

[0002]

2. Description of the Related Art FIG. 8 is a sectional view showing an example of a conventional electronic component mounting structure. In the figure, F is an electronic component,
The electronic component F is composed of, for example, a capacitor having a pair of electrodes 20.
No. 0a is provided on the component body 19 so as to be exposed, and a brazing material 21 is attached to the conductor pattern 14 of the printed wiring board K in which a predetermined conductor pattern 14 is adhered to the electrically insulating substrate 15.
Then, they are mounted on the printed wiring board K.

[0003] That is, the printed wiring board K is shown in FIG.
As shown in FIG. 1A, a predetermined conductor pattern 14 is formed on an electrically insulating substrate 15 and a creamy solder 22 as a bonding material for electronic components is formed on the upper surface thereof by a screen printing technique using a mask (not shown). After being supplied, the electronic component K is mounted on the conductor pattern 14 via the creamy solder 22 as shown in FIG. 4B, and is exposed to a high temperature atmosphere by hot air or infrared rays h as shown in FIG. Exposed. The creamy solder 22 is formed by mixing a powdery solder made of, for example, a Sn-Pb eutectic alloy and an adhesive mainly composed of a synthetic resin, and is exposed to a high-temperature atmosphere to form the soldered portion. 20a can be mounted on the printed wiring board K with the brazing material 21 on the conductor pattern 14 of the printed wiring board K. By using the mask, the cream-like solder 22 is transferred to the printed wiring board K.
When the cream solder 22 is supplied to the mask by the screen printing technique, the amount of the cream solder 22 passing through the opening of the mask is controlled by the mask printing technique itself even if the supply quantity of the cream solder 22 to the mask fluctuates. Therefore, it is easy to control the supply amount of the creamy solder 22 to the printed wiring board K, and the creamy solder 22 can be supplied in a relatively wide range and quickly.

[0004]

However, in the creamy solder 22, the adhesive performance of the adhesive contained therein deteriorates with the passage of time due to the opening of the package, and the solder is easily cured. Therefore, there is a problem that it is difficult to transmit through the opening of the mask, and it is difficult to supply the printed wiring board K with the screen printing technique. On the other hand, when the creamy solder 22 is injected from a supply nozzle (not shown) into the printed wiring board K and supplied instead of the screen printing technique using the mask, the injection is performed directly. Although the supply to the printed wiring board K is relatively easy even when the curing of the adhesive proceeds, on the other hand, the supply of the creamy solder 22 is local and inefficient, and the supply amount Is difficult to control.

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and one object of the present invention is to provide a bonding material for an electronic component in which the adhesive performance of an adhesive contained in the bonding material is hardly deteriorated or hardened over time. Is to do. Another object of the present invention is to provide a method of manufacturing a bonding material for an electronic component, which can easily mass-produce a bonding material in which the adhesive performance of the contained adhesive is hardly deteriorated or hardened over time. Another object of the present invention is to join electronic components that can easily control the amount of joining material supplied to a printed wiring board by screen printing technology and can supply the joining material relatively widely and quickly. An object of the present invention is to provide a method of supplying a material. It is still another object of the present invention to provide a method of mounting an electronic component, which facilitates supply of a bonding material to a printed wiring board and mounting of the electronic component by a screen printing technique.

[0006]

According to a first aspect of the present invention, there is provided a bonding material for an electronic component, wherein a portion to be bonded of the electronic component is bonded to a conductor pattern of an electrically insulating substrate. A bonding material, wherein a mixture of conductive particles and an adhesive is coated with a coating film to form capsule-shaped fine particles. According to a second aspect of the present invention, there is provided a method of manufacturing a bonding material for an electronic component, the method comprising bonding a portion to be bonded of the electronic component to a conductive pattern of an electrically insulating substrate, wherein the bonding material is bonded to the conductive particles. Comprising a step of dispersing and suspending the mixture with the agent in the form of fine particles, and a step of directing the jet fluid containing the coating liquid to the fine particle mixture, and comprising the capsule-like fine particles in which the mixture is coated with a coating film. It is characterized by producing a joining material.

According to a third aspect of the present invention, there is provided a method of supplying a bonding material for an electronic component, comprising the steps of: disposing a mask having an opening corresponding to a portion to be bonded of the electronic component on the electrically insulating substrate; Supplying a kneaded material of a bonding material and a solvent comprising a mixture of conductive particles and an adhesive with a coating film of a capsule-shaped fine particle coated with a coating film to the mask and printing the kneaded material on the electrically insulating substrate, A bonding material for bonding a portion to be bonded of the electronic component to a conductive pattern is supplied to the electrically insulating substrate. According to a fourth aspect of the present invention, there is provided a method for supplying a bonding material for an electronic component, comprising the steps of: disposing a mask having an opening corresponding to a portion to be bonded of the electronic component opposite to the electrically insulating substrate; A step of supplying a mask and printing the above-mentioned electrically insulating substrate on the electrically insulating substrate, and a step of applying a bonding material composed of capsule-like fine particles coated with a coating film of a mixture of conductive particles and an adhesive to the solvent. The bonding material for bonding the bonded part of the electronic component to the conductor pattern is supplied to the electrically insulating substrate.

According to a fifth aspect of the present invention, there is provided a method of mounting an electronic component, comprising the steps of: disposing a mask having an opening corresponding to a portion to be joined of the electronic component on an electrically insulating substrate;
A step of supplying a kneaded material of a bonding material composed of capsule-shaped fine particles coated with a coating film of a mixture of conductive particles and an adhesive and a solvent to the mask and printing the kneaded material on the electrically insulating substrate; Mounting the joined part of the kneaded material to the kneaded material, melting the coating film of the bonding material with a solvent to flow out a mixture of the conductive particles and the adhesive, and using the flowed-out mixture to form the electronic component. Joining the joined portion to the conductor pattern of the electrically insulating substrate. Claim 6 of the present invention
The method for mounting an electronic component according to the above includes a step of arranging a mask having an opening corresponding to a part to be bonded of the electronic component on the electrically insulating substrate, and coating the mixture of the conductive particles and the adhesive with a coating film. Applying a bonding material made of capsule-shaped fine particles coated with the above to the electrically insulating substrate; mounting a bonded portion of the electronic component to the bonding material; pressing the bonding material to form the conductive material; A step of causing a mixture of the conductive particles and the adhesive to flow out, and a step of bonding the joined part of the electronic component to the conductor pattern of the electrically insulating substrate with the flowed-out mixture.

[0009]

According to the first aspect of the present invention, the bonding material of the electronic component is formed into capsule-shaped fine particles by coating the mixture of the conductive particles and the adhesive with the coating film. However, it is hard to deteriorate or harden over time due to the opening of the package, and it is possible to eliminate a defective bonding of the electronic component and to secure a good bonding state. According to the second aspect of the present invention, the mixture of the conductive particles and the adhesive is dispersed and suspended in a fine particle state, and the jet fluid containing the coating liquid is directed to the fine particle mixture. A relatively large amount of a bonding material composed of capsule-shaped fine particles coated with the resin can be produced.

According to the third aspect of the present invention, a mask having an opening corresponding to a part to be joined of an electronic component is disposed to face the electrically insulating substrate, and a mixture of conductive particles and an adhesive is coated with a coating film. A kneaded material of a bonding material consisting of capsule-shaped fine particles coated with a solvent and a solvent is supplied to the mask and printed on the electric insulating substrate, and the bonding material for bonding the bonded portion of the electronic component to the conductive pattern is formed on the mask. Supply to an electrically insulating substrate, and supply to a printed wiring board by screen printing technology is easily achieved. In addition, when the bonding material is supplied to the printed wiring board by screen printing technology by using the mask, even if the supply amount of the bonding material to the mask fluctuates, the bonding material transmitted through the opening of the mask is changed. Since the transmission amount can be controlled by the printing technique itself using the mask, it is easy to control the supply amount of the bonding material to the printed wiring board, and the bonding material can be supplied in a relatively wide range and quickly. .

According to the fourth aspect of the present invention, a mask having an opening corresponding to a part to be joined of an electronic component is disposed to face the electrically insulating substrate, and a solvent is supplied to the mask to provide the electrically insulating material. A bonding material consisting of capsule-shaped fine particles printed on a substrate and coated with a mixture of conductive particles and an adhesive with a coating film is applied to the solvent, and a bonding part of the electronic component is bonded to a conductive pattern. Since the material is supplied to the electrically insulating substrate and the bonding material does not need to pass through the opening of the mask, the bonding material can be easily supplied to the printed wiring board.

According to the fifth aspect of the present invention, a mask having an opening corresponding to a part to be joined of an electronic component is disposed to face the electrically insulating substrate, and a mixture of conductive particles and an adhesive is coated with a coating film. The kneaded material of the bonding material comprising the capsule-shaped fine particles coated with the solvent and the solvent is supplied to the mask and printed on the electrically insulating substrate, and the part to be bonded of the electronic component is mounted on the kneaded material, and the bonding is performed. The coating film of the material is melted with a solvent to flow out the mixture of the conductive particles and the adhesive, and the flowed-out mixture is used to join the bonded part of the electronic component to the conductor pattern of the electrically insulating substrate. In addition, it is easy to supply a bonding material to a printed wiring board and mount electronic components by a screen printing technique.

According to the sixth aspect of the present invention, a mask having an opening corresponding to a part to be joined of an electronic component is disposed opposite to the electrically insulating substrate, and a mixture of conductive particles and an adhesive is coated with a coating film. A bonding material composed of capsule-shaped fine particles coated with the above is adhered to the electrically insulating substrate, a portion to be bonded of the electronic component is mounted on the bonding material, and the bonding material is pressed to adhere to the conductive particles. The mixture with the agent is caused to flow out, and the to-be-joined portion of the electronic component is joined to the conductor pattern of the electrically insulating substrate with the flowed-out mixture, so that the mixture is easily flowed out and mounting of the electronic component is easy. .

[0014]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an example of a bonding material for an electronic component according to the first aspect of the present invention. In the figure, a bonding material A is formed into capsule-shaped fine particles by coating a mixture c of conductive particles a and an adhesive b with a coating film d. Examples of the conductive particles a include simple metals such as Pb, Au, Ag, and Cu having a particle size of 5 to 5 μm, Sn—Au based materials containing no Pb component, and Sn—Sb.
One or plural kinds of various alloy materials of the Sn-based and Sn-Bi-based alloys are employed. In this case, the conductive particles a may be formed by coating a conductive material such as Au on electrically insulating particles such as an acrylic resin. Further, as the adhesive b, for example, one or more kinds of thermosetting resins such as epoxy resin and ultraviolet curable resin such as epoxy resin having a particle diameter substantially equal to the conductive particles a are employed, and further, as the coating film d, For example, acrylic resin, PMMA resin,
One or a plurality of thermosetting resins such as an epoxy resin and a silicone resin and an ultraviolet curing resin are employed. When the mixture with the solvent is supplied to the printed wiring board by the screen printing technique, it is recommended that the bonding material A has a particle diameter of, for example, 0.1 mm or less from the viewpoint of easy transmission through the opening of the mask.

FIG. 2 is a schematic view showing an example of an apparatus for producing a bonding material according to the method of the present invention. As shown in the figure, a coating chamber 1 contains conductive particles a and an adhesive b.
Are connected via valves 4 and 5, and a rectifying plate 7 having a large number of small holes 6 is arranged at the bottom of the coating chamber 1, and the coating liquid d1 is compressed from below. The inlet pipes 8 and 9 for the fluid e are valves 10 and 11
The coating chamber 1 is further connected to a discharge pipe 12 of the manufactured bonding material A via a valve 13. As the compressed fluid e, compressed air or an inert gas such as argon (Ar) is used.

In the above configuration, the conductive particles a and the adhesive b are supplied to the coating chamber 1 through the carrying-in pipes 2 and 3 by adjusting the valves 4 and 5, and from the straightening plate 7 at the bottom through the carrying-in pipes 8 and 9. Coating liquid d1 and compressed fluid e
Is supplied by adjusting the valves 10 and 11. At this time, it is recommended that warm air f be supplied from below the current plate 7 to make the internal space of the coating chamber 1 a heated atmosphere. When the compressed fluid e is supplied together with the warm air f from below the current plate 7 while supplying the conductive particles a and the adhesive b to the coating chamber 1, the mixture c of the conductive particles a and the adhesive b is finely divided. When the jetting fluid g composed of a mixed gas of the coating liquid d1 and the compressed fluid e is pointed at the particulate mixture c, the mixture c is coated on the outer surface as a core material. A fine droplet of the liquid d1 is adhered, and the coating liquid d1 is dried with the hot air f to cover the mixture c of the conductive particles a and the adhesive b with the coating film d as shown in FIG. The bonding material A made of the encapsulated fine particles is manufactured and carried out of the carrying-out tube 12.

According to the structure of the bonding material A, the mixture c of the conductive particles a and the adhesive b is coated with the coating film d to form the capsule-shaped fine particles. However, it is hard to deteriorate or harden over time due to the opening of the package, and it is possible to eliminate a defective bonding of the electronic component and to secure a good bonding state. Further, the bonding material A
According to the production method, the mixture c of the conductive particles a and the adhesive b is dispersed and suspended in a fine particle state, and the coating liquid d1
Is directed to the fine particle mixture c, the bonding material A composed of capsule-like fine particles in which the mixture c is coated with the coating film d can be produced relatively easily and in large quantities.

FIG. 3 is a schematic view showing an example of a method for supplying a bonding material for an electronic component and a method for mounting an electronic component according to the third and fifth aspects. As shown in FIG. 1A, a mask B having an opening 16 corresponding to the conductor pattern 14 is mounted on a printed wiring board K composed of an electrically insulating substrate 15 having a predetermined conductor pattern 14. The paste-like kneaded material E of the bonding material A and the organic solvent D passes through the stitch material 17 provided in the opening 16 of the mask B, and the paste-like kneaded material E of the bonding material A and the organic solvent D Be deposited. The kneaded material E adhered to the conductor pattern 14 is separated into a bonding material A and an organic solvent D as shown in FIG. It is arranged free on the surface of the.

Thereafter, as shown in FIG. 1C, an electronic component F composed of, for example, a capacitor having a pair of electrodes 20 exposed on the component body 19 is mounted on the printed wiring board K, and as shown in FIG. When the coating film d of the bonding material A is, for example, an acrylic resin, it is heated and melted at 130 ° C. or more in cooperation with the organic solvent D by heating with the heating device H in the heating furnace G shown by The mixture c of the conductive particles a and the adhesive b is eluted, and the joined portion 20a of the electronic component F is joined to the conductor pattern 14, whereby the wiring board I on which the electronic component A is mounted can be configured. . At this time, when the adhesive b is a thermosetting resin such as an epoxy resin, the adhesive b is heated and cured by the heating device H to fix the electronic component F to the printed wiring board K and to contain the adhesive b in the adhesive b. With the conductive particles a thus obtained, the conductivity between the joined portion 20a of the electronic component F and the conductive pattern 14 can be ensured.

According to the above-described method, the mask B having the opening 16 corresponding to the part 20a to be joined of the electronic component F is disposed to face the electrically insulating substrate 15 so that the conductive particles a and the adhesive b A kneaded material E of a bonding material A composed of capsule-like fine particles coated with the mixture c with a coating film d and an organic solvent D is supplied to the mask B and printed on the electrically insulating substrate 15 to form the electronic component F. The part to be joined 20a is connected to the conductor pattern 1
Since the bonding material A to be bonded to the substrate 4 is supplied to the electrically insulating substrate 15, it is easy to supply the bonding material A to the printed wiring board K by a screen printing technique. When the bonding material A is supplied to the printed wiring board K by the screen printing technique by using the mask B, even if the supply amount of the bonding material A to the mask B varies, the opening of the mask B is changed. 16 can be controlled by the printing technique itself using the mask B,
The supply amount of the bonding material A to the printed wiring board B can be easily controlled, and the bonding material A can be supplied in a relatively wide range and quickly.

The electronic component F is mounted on a printed wiring board K and heated by a heating device H so that the coating film d of the bonding material A is melted with an organic solvent D to form conductive particles a therein. The mixture c with the adhesive b elutes out,
The joined part 20a is joined to the conductor pattern 14, and the adhesive b is cured by heating, so that the electronic component F
Can be fixed to the printed wiring board A, and the conductive particles a contained in the adhesive b can secure the conductivity between the joined portion 20a of the electronic component F and the conductor pattern 14. It can be easily and efficiently mounted on the printed wiring board K and adapted to mass production.
That is, the adhesive b shrinks after being cured by heating, and the conductive particles a contained in the adhesive b come into contact with each other and become electrically conductive, so that the joined portion 20a of the electronic component F and the conductive pattern 14 And the conductivity of the film can be ensured.

In the above embodiment, the heating furnace G
May be a heating element or a laser beam irradiating body. In the case of a laser beam irradiating body, the laser beam is applied to the bonding material A to heat it, and the coating film d is heated with an organic solvent. D to melt the mixture c of the conductive particles a and the adhesive b therein, and to heat and cure the adhesive b to fix the electronic component F to the printed wiring board K and to bond the electronic component F to the printed wiring board K. Conductivity between the joined part 20a of the electronic component F and the conductor pattern 14 is secured by the conductive particles a contained in the agent b, and the joined part 20a of the electronic component F is
To form a wiring board I on which the electronic component A is mounted.

In the above embodiment, the adhesive b may be an ultraviolet curable resin instead of the thermosetting resin. In this case, after the coating film d is melted with the organic solvent D by the heating device H, , Eluted internal conductive particles a
The adhesive b in the mixture c of the adhesive c and the adhesive b may be configured to be cured by ultraviolet rays. In that case, it is recommended to set an ultraviolet irradiation device (not shown) that irradiates the adhesive b with ultraviolet light from both sides of the electronic component F inside or outside the heating furnace G. Alternatively, the adhesive b may be a mixture of a thermosetting resin and an ultraviolet curable resin. In this case, the adhesive b can be quickly cured by the heating device H and the ultraviolet irradiation device to improve work efficiency.

FIG. 4 is a schematic view showing an example of a method for supplying a bonding material for an electronic component according to a fourth aspect. As shown in FIG. 1A, a mask B having an opening 16 corresponding to the conductor pattern 14 is mounted on a printed wiring board K composed of an electrically insulating substrate 15 having a predetermined conductor pattern 14. The organic solvent D is applied to the conductive pattern 14 through the opening 16 of the mask B while the thickness of the organic solvent D is adjusted by a squeegee 18. The bonding material A is sprayed from the nozzle J on the printed wiring board K as shown in FIG. 3B, and unnecessary bonding material A is dropped by gravity as shown in FIG. A desired bonding material A is applied to the surface of the conductor pattern 14 by removing by means such as vibration drop as shown in FIG.

According to the above method, the mask B having the opening 16 corresponding to the part 20a to be joined of the electronic component F is disposed to face the electrically insulating substrate 15, and the organic solvent D is applied to the mask B
And printing on the electrically insulating substrate 15, applying the bonding material A to the solvent D, and bonding the bonding material A for bonding the bonded portion 20a of the electronic component F to the conductor pattern 14 with the electric material. The supply of the organic solvent D and the bonding material A to the printed wiring board K is easy because the supply is performed to the insulating substrate 15. In particular, since the bonding material A does not need to be transmitted through the opening 16 of the mask B and does not adhere to unnecessary portions of the printed wiring board K after the application of the solvent D, for example, the particle diameter is 0.1 mm. It is recommended that this be done, and its manufacture is relatively easy.

Thereafter, as shown in FIG. 3E, for example, an electronic component F composed of a capacitor having a pair of electrodes 20 exposed on the component body 19 is mounted on the printed wiring board K, and FIG. In the method described above, the mixture c of the conductive particles a and the adhesive b inside was eluted by the method described above, and the joined part 20a of the electronic component F was joined to the conductor pattern 14 to mount the electronic component A. The wiring board I can be manufactured.

In the above embodiment, the case where the organic solvent D is supplied to the printed wiring board K by the screen printing technique using the mask B has been described.
Alternatively, the solvent D stored in the container M may be applied to the tip of the transfer pin L as shown in FIG.

FIG. 6 is a schematic view showing an example of a method of mounting an electronic component according to the present invention, which is shown in FIGS. 3 (A) to 3 (C) or 4 (A) to 4 (E). After the electronic component F is mounted on the printed wiring board B by the above method, the electronic component F may be broken by applying a pressure N to the electronic component F, thereby facilitating the mounting of the electronic component. In this embodiment, the processing after the destruction of the coating film d is substantially the same as that in the above-mentioned case, so that the detailed description thereof will be omitted.

FIG. 7 is a schematic view showing a modification of the method of mounting an electronic component according to the present invention. As shown in FIG. 7A, a printed wiring board comprising an electrically insulating substrate 15 having a predetermined conductor pattern 14 is shown. K has a recess 15a formed therein, and the opening 16 of the mask B mounted on the electrically insulating substrate 15 is formed.
After the organic solvent D is applied to the surface of the organic solvent D, the desired bonding material A as shown in FIG. Thereafter, as shown in FIG. 3C, for example, an electronic component F composed of a capacitor in which a pair of electrodes 20 are exposed on the component body 19 is mounted on the printed wiring board K, as described above with reference to FIG. The mixture c of the internal conductive particles a and the adhesive b is eluted by such a method, the joined part 20a of the electronic component F is joined to the conductor pattern 14, and the wiring board I on which the electronic component A is mounted is mounted. Can be manufactured. According to the electronic component mounting method, the electronic component A can be housed in the recess 15a of the printed wiring board K, and the small and compact wiring board I can be manufactured.

Although a capacitor has been described as the electronic component A in the above embodiment, the present invention can be applied to a case where the electronic component A including, for example, a resistor, a coil device, a capacitor, or a microcomputer is mounted on the electrically insulating substrate 15. Needless to say.

[0031]

As described above in detail, according to the first aspect of the present invention, it is possible to provide a bonding material for an electronic component in which the adhesive performance of the adhesive contained in the bonding material is hardly deteriorated or hardened over time. According to the second aspect of the present invention, it is possible to provide a method of manufacturing a bonding material for an electronic component, which can easily mass-produce a bonding material in which the adhesive performance of the contained adhesive is hardly deteriorated or hardened over time. According to the third aspect of the present invention, it is easy to control the supply amount of the bonding material to the printed wiring board by the screen printing technique, and it is possible to supply the bonding material relatively widely and quickly. A method for supplying the material can be provided.

According to the fourth aspect of the present invention, since the bonding material does not need to be transmitted through the opening of the mask by the screen printing technique, the bonding material for the electronic component can be easily supplied to the printed wiring board. Can be provided. According to the fifth aspect of the present invention, it is possible to provide a method for mounting an electronic component, which can easily supply a bonding material to a printed wiring board and mount the electronic component by a screen printing technique. According to the sixth aspect of the present invention, it is possible to provide a method of mounting an electronic component in which the bonding material is pressurized to easily flow out the mixture, and the electronic component is easily mounted.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of a bonding material for an electronic component according to the first aspect of the present invention.

FIG. 2 is a schematic view showing an example of an apparatus for producing a bonding material according to the method of the present invention.

FIG. 3 is a schematic view showing an example of a method for supplying a bonding material for an electronic component and a method for mounting an electronic component according to claims 3 and 5;

FIG. 4 is a schematic view showing an example of a method for supplying a bonding material for an electronic component according to a fourth embodiment.

FIG. 5 is a schematic view showing another example of a method for supplying a bonding material for an electronic component.

FIG. 6 is a schematic view showing one example of a method for mounting an electronic component according to claim 6;

FIG. 7 is a schematic view showing a modification of the electronic component mounting method according to the present invention.

FIG. 8 is a sectional view showing an example of a conventional electronic component mounting structure.

FIG. 9 is a cross-sectional view illustrating an example of a conventional electronic component mounting method.

[Explanation of Symbols] A bonding material B mask C wiring board D solvent E kneaded material F electronic component K printed wiring board 14 conductive pattern 15 electrically insulating substrate 16 opening 20a bonded part a conductive particles b adhesive c mixture d Coating film d1 Coating liquid g Jet fluid

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[Procedure amendment]

[Submission date] September 19, 1996

[Procedure amendment 1]

[Document name to be amended] Statement

[Correction target item name] Brief description of drawings

[Correction method] Change

[Correction contents]

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an example of a bonding material for an electronic component according to the first aspect of the present invention.

FIG. 2 is a schematic view showing an example of an apparatus for producing a bonding material according to the method of the present invention.

FIG. 3 is a schematic view showing an example of a method for supplying a bonding material for an electronic component and a method for mounting an electronic component according to claims 3 and 5;

FIG. 4 is a schematic view showing an example of a method for supplying a bonding material for an electronic component according to a fourth embodiment.

FIG. 5 is a schematic view showing another example of a method for supplying a bonding material for an electronic component.

FIG. 6 is a schematic view showing one example of a method for mounting an electronic component according to claim 6;

FIG. 7 is a schematic view showing a modification of the electronic component mounting method according to the present invention.

FIG. 8 is a sectional view showing an example of a conventional electronic component mounting structure.

FIG. 9 is a cross-sectional view illustrating an example of a conventional electronic component mounting method.

[Explanation of Symbols] A bonding material B mask C wiring board D solvent E kneaded material F electronic component K printed wiring board 14 conductive pattern 15 electrically insulating substrate 16 opening 20a bonded part a conductive particles b adhesive c mixture d Coating film d1 Coating liquid g Jet fluid

[Procedure amendment 2]

[Document name to be amended] Drawing

[Correction target item name] All figures

[Correction method] Change

[Correction contents]

FIG.

FIG. 2

FIG. 4

FIG. 5

FIG. 6

FIG. 8

FIG. 3

FIG. 7

FIG. 9

Claims (6)

[Claims] 1. A joining material for joining a joined portion of an electronic component to a conductor pattern of an electrically insulating substrate, wherein the mixture is made of a mixture of conductive particles and an adhesive with a coating film to form capsule-shaped fine particles. A bonding material for electronic parts, characterized by being made. 2. A method of manufacturing a bonding material for bonding a bonded portion of an electronic component to a conductor pattern of an electrically insulating substrate, the method comprising: dispersing and suspending a mixture of conductive particles and an adhesive in a fine particle state; Directing a jet fluid containing a coating liquid to the fine particle mixture to produce a bonding material comprising capsule-shaped fine particles coated with the mixture with a coating film. The method of manufacturing the material. 3. A step of disposing a mask having an opening corresponding to a portion to be joined of an electronic component to an electrically insulating substrate,
Supplying a kneaded material of a bonding material and a solvent comprising a mixture of conductive particles and an adhesive with a coating film of a capsule-shaped fine particle coated with a coating film to the mask and printing the kneaded material on the electrically insulating substrate, A method for supplying a bonding material for an electronic component, comprising: supplying a bonding material for bonding a portion to be bonded of the electronic component to a conductive pattern to the electrically insulating substrate. 4. A step of arranging a mask having an opening corresponding to a part to be joined of an electronic component on an electrically insulating substrate,
Supplying a solvent to the mask and printing on the electrically insulating substrate, and applying a bonding material composed of capsule-like fine particles coated with a coating film of a mixture of conductive particles and an adhesive to the solvent; And supplying a bonding material for bonding a portion to be bonded of the electronic component to a conductor pattern to the electrically insulating substrate. 5. A step of arranging a mask having an opening corresponding to a part to be joined of an electronic component on an electrically insulating substrate,
A step of supplying a kneaded material of a bonding material composed of capsule-shaped fine particles coated with a coating film of a mixture of conductive particles and an adhesive and a solvent to the mask and printing the kneaded material on the electrically insulating substrate; Mounting the joined part of the kneaded material to the kneaded material, melting the coating film of the bonding material with a solvent to flow out a mixture of the conductive particles and the adhesive, and using the flowed-out mixture to form the electronic component. Joining the joined portion to the conductor pattern of the electrically insulating substrate. 6. A step of arranging a mask having an opening corresponding to a portion to be joined of an electronic component on an electrically insulating substrate,
A step of applying a bonding material made of capsule-shaped fine particles coated with a mixture of a conductive particle and an adhesive with a coating film to the electrical insulating substrate; and mounting a bonded portion of the electronic component to the bonding material. Step, and a step of flowing the mixture of the conductive particles and the adhesive by pressing the bonding material,
Joining the joined part of the electronic component to the conductor pattern of the electrically insulating substrate with the mixture that has flowed out.