JPH08249064A - Method and device for positioning object to be positioned - Google Patents

Abstract

PURPOSE: To simplify the structure and to improve the general usefulness. CONSTITUTION: First and second positioning plates 21 and 22 put one over the other and a cam 27 are provided. When the cam 27 is moved in the direction of an arrow X1 , first and second positioning plates 21 and 22 are turned in opening directions, and first positioning pins 23-1 and 23-2 and second positioning pins 24-l and 24-2 are moved in opposite directions. Pins 23-1 and 24-2 catch one corner part 40 of two diagonal corner parts of a substrate 40 between themselves, and pins 23-21 and 24-2 catch the another corner part 40-6 between themselves.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a positioning device for an object to be positioned, and more particularly to mounting a solder ball on a PCB (plastic circuit ball).
l) A device for positioning a semiconductor package.

This positioning device is based on a BGA (ball).
It is used in one process of manufacturing a grid array type semiconductor device.

[0003]

2. Description of the Related Art Conventionally, in mounting a solder ball, a sensor or an image recognition device is used to find the position of a PCB package substrate on a stage, and the stage is moved appropriately so that the PCB package substrate can fix the solder ball. It was positioned just below the heads that were held side by side.

[0004]

The above-mentioned conventional equipment has the following problems. The cost of developing a hardware such as a camera and the cost of developing a soft wafer for recognition increases, and the amount of equipment becomes expensive.

Since a camera or the like is installed, the equipment becomes large. When the mark or the slit is provided on the package substrate, the number of manufacturing steps of the package substrate is increased by one, and the cost of the package substrate increases accordingly. There is also the problem of positional deviation of the marks or slits.

Therefore, an object of the present invention is to provide an apparatus and method for positioning an object to be positioned, which solves the above problems.

[0007]

According to the first aspect of the present invention,
A first positioning plate rotatably provided on the fixed shaft; and a second positioning plate rotatably provided on the fixed shaft in a state of being overlapped with the first positioning plate; The first positioning pin that is implanted in the positioning plate of No. 2, the second positioning pin that is implanted in the second positioning plate, and moves forward to enter between the first and second positioning plates. And cam means for rotating the first and second positioning plates in opposite directions, and the first and second positioning plates are rotated in opposite directions by the cam means.
The positioning pins move in opposite directions along a circle centered on the fixed shaft to sandwich the object to be positioned.

According to a second aspect of the present invention, the first and second positioning plates and the cam means include the first and second positioning plates and the cam means when the cam means is retracted. Is configured to be non-contact. According to a third aspect of the present invention, each of the first positioning pin and the second positioning pin is two, and the cam means is the first and second positioning pins.
The positioning plate is rotated such that the first and second positioning pins sandwich two corners of the rectangular object to be positioned, which are diagonal to each other.

According to a fourth aspect of the present invention, each of the first positioning pin and the second positioning pin has four pins, and the cam means includes the first and second positioning plates and the first and second positioning plates. The second positioning pin is configured to rotate so as to simultaneously sandwich the four corner portions of the rectangular object to be positioned.

According to a fifth aspect of the present invention, each of the first positioning pin and the second positioning pin is four in number, and the cam means first includes the first and second positioning plates, and the first positioning pin described above. Two of the four first positioning pins and two of the four second positioning pins sandwich two corners of the rectangular object to be positioned, which are diagonal to each other,
Then, the sandwiching is released, and the remaining two first and first
The second positioning pin is configured so as to sandwich the two corner portions having different diagonal angles and rotate so as to maintain the state.

According to a sixth aspect of the invention, in the first positioning pin and the second positioning pin, the diameter of the shorter pin is set to be slightly smaller than the diameter of the longer pin. . According to a seventh aspect of the present invention, the first positioning plate having the first positioning pin implanted therein and the second positioning plate having the second positioning pin implanted therein are rotated in opposite directions to each other. According to the first positioning pin and the second
The positioning pin moves along a circle to sandwich the object to be positioned.

[0012]

In the invention of the object-to-be-positioned object positioning device according to claim 1, the positioning pins pinch the object to be positioned by rotating the first and second positioning plates in opposite directions by the cam means. The above-described structure acts so as to make the movement simple and to easily replace the first and second positioning plates.

According to a second aspect of the present invention, the cam means is retracted when the cam means is retracted so that the first and second positioning plates and the cam means are not in contact with each other. This serves to facilitate the replacement work of the first and second positioning plates in the state. In the invention of claim 3,
The configuration in which the first and second positioning pins sandwich two diagonal corners of the rectangular object to be positioned is
This serves to position the object to be positioned stably and accurately.

In the fourth aspect of the invention, the structure in which the first and second positioning pins simultaneously sandwich the four corner portions of the object to be positioned having a quadrangular shape compared to the case where the two corner portions are sandwiched. This serves to position the positioning object more stably and more accurately.

In the invention of claim 5, the first and second positioning pins first sandwich a corner portion forming one diagonal, and then, instead of the corner portion, another diagonal is formed. The configuration that sandwiches the eggplant corner part and keeps that state,
Special means, such as a vacuum suction means, which acts to position the object to be positioned more stably and more accurately than the structure in which only two corner portions forming one diagonal are sandwiched, and which maintains the positioning state Acts to eliminate the need for.

According to the sixth aspect of the present invention, in the structure in which the diameters of the first and second positioning pins are slightly different according to their lengths, the first and second positioning pins sandwich the object to be positioned. At this time, the bending of the first positioning pin and the bending of the second positioning pin act so as to be equal to each other.

According to the seventh aspect of the invention, the configuration in which the positioning pins that have moved along the circle sandwich the object to be positioned serves to center and position the object to be positioned.

[0018]

【Example】

[First Embodiment] (Embodiments of the Invention of Claims 1, 2, 3, 6, 7) FIG. 1 shows a positioning device 10 for a PCB package substrate according to a first embodiment of the present invention.

This substrate positioning device 10 is shown in FIG.
It is used in the positioning step 12 in the step of forming the solder bumps of the BCA (ball grid array) type semiconductor device shown in FIG. The solder bump is shown in FIG. 8 (A).
As shown in, the substrate is placed on the stage (step 1
1) and then position the substrate on the stage (step 1
2) In this state, solder balls are collectively mounted on each pad of the board (step 13), and finally, the board on which the solder balls are mounted is passed through a reflow oven (step 14) to form the solder balls. .

The substrate positioning device 10 includes a stage 20 and a first positioning plate 2 as shown in FIGS.
1, the second positioning plate 22, the two first positioning pins 23 _-1 , 23 _-2, and the two second positioning pins 24
_-1 , 24 _-2 , cam followers 25, 26, and cam 27
It has a return spring 28, a cam drive mechanism 28, a vacuum suction mechanism 30, a fixed shaft 31, and the like.

Next, the structure of each part of the substrate positioning device 10 will be described. [Stage 20 and Related Parts] Stage 20
Has a square shape with a side length of a a, it has a convex portion 20 _-1 along the circumference, and the center O ₁ to have a suction hole 20 _-2 and sides around 20 _- Having ₃ .

The stage 20 has a notch 20 _{-4 at} each corner.
Have. The notch 20 _-4 is provided so that the robot hand can easily grasp the PCB package substrate 32 when the PCB package substrate is transported. The stage 20 has substantially the same size as the PCB package substrate 40.

The stage 20 is detachably fixed to a predetermined position on the stage mounting base 32. The predetermined position is a position where the center O _{1 of the} stage 20 coincides with the center O _{2 of the} fixed shaft 32 on the plan view.

The stage 20 is oriented such that the side surface 20 _-3 is orthogonal to the X axis and the Y axis. In addition, the vacuum suction mechanism 3
0 is provided in connection with the suction hole 20 _-2 . As the stage 20, a plurality of types having different sizes according to the type of the PCB package substrate are prepared in advance.

[First and Second Positioning Plates 21, 22 and Portions Associated Therewith] The fixed shaft 31 is fixed to the main body 33 of the substrate positioning apparatus 10 and is located directly below the stage 20. A state in which the first positioning plate 21 fits the center hole 21 _-1 of the fixed shaft 31 and the second positioning plate 22 fits the center hole 22 _-1 of the fixed shaft 31 in a vertically overlapped state. It is attached so that it can rotate.

The first positioning plate 21 generally has a semicircular portion 2
1 _-2, having become more shape as the arm portion 21 _-3 extending from the semicircular portion 21 _-2. The first positioning plate 21 has a first
Positioning pins 23 _-1 and 23 _-2 are implanted and long holes 21 _-4 and 21 _-5 are formed.

Reference numeral 50 is a circle having a radius R ₁ centered on the center O ₃ of the center hole 21 _-1 . The first positioning pin 23 _-1 ,
23 _-2 is planted at the intersection of the diameter 51 and the circle 50. The long holes 21 _-4 and 24 _-5 are formed at an intersection of another diameter 52 orthogonal to the diameter 51 and the circle 50 and in the vicinity thereof.

As also shown in FIG. 3, a shaft 34 is planted downward at the tip of the arm portion 21 _-3 . This axis 34
Further, a cam follower 25 composed of a roller is rotatably provided. The second positioning plate 22 is the first positioning plate 2
It has a shape in which 1 is turned upside down, and has a semicircular portion 22 _-2 and an arm portion 22.
_-3 and.

Second positioning pins 24 _-1 , 24 _-2 are implanted in the second positioning plate 22. 53 is the center 2
The radius R of the circle 53 is centered on the center O _{4 of} 2 _-1.
1 and a circle is equal radius R _1.

The second positioning pins 24 _-1 , 24 _-2 are planted at the intersections of the diameter 54 and the circle 53. FIG.
As also shown, a shaft 35 is planted at the tip of the arm portion 22 _-3 , and a cam follower 26 composed of a roller is rotatably provided on the shaft 35.

A return spring 28, which is a tension coil spring, is laid between the shaft 34 and the shaft 35, and the cam follower 2 is provided.
5, 26 are in contact with each other. 36 is a cam follower 2
This is the point where 5, 26 are in contact with each other. When the cam followers 25, 26 are in contact with each other, the return spring 2
8 is the natural length.

The positioning pins 24 _-1 , 24 _-2 penetrate through the long holes 21 _-4 , 21 _-5 , respectively. The first and second positioning plates 21 and 22 are in a state in which their rotations are regulated while the cam followers 25 and 26 are in contact with each other. Also, as shown in FIG. 5, the radius R ₁ of the circles 50 and 53 is
Is longer than half the length a of one side of the stage 20 (PCB package substrate 40), that is, a / 2.
Half of the diagonal length b of the CB package substrate 40), b
The size is specified to be shorter than / 2.

As a result, the circles 50 and 53 are
At each corner of 0, it is drawn inside the stage 20,
Other parts are drawn outside the stage 20. These circles 50 and 53 are used for positioning pins 23 _-1 , 23 _-2 , 24 _-1 , 2 when the board positioning device 10 operates.
_4-2 coincides with the locus of movement.

As shown in FIG. 6, the first positioning pin 2
Three_-1(23_-2) Is the length l₁, Diameter d ₁Having. Second
Positioning pin 24_-1(24_-2) Is the length l₂, Diameter d₂To
Have. Positioning pin 23_-1(23_-2), 24_-1(24
_-2), The top part protrudes above the stage 20 by the dimension c.
Same height H₁It is said that.

The portions 23 _-1a and 24 _{-1a of the} dimension c are PC
This is a portion for clamping the side surface of the B package substrate 40, and is slightly longer than the thickness t ₁ (see FIG. 1) of the package substrate 40. Since the first and second positioning plates 21 and 22 are overlapped with each other, l ₂ is slightly longer than l ₁ .

Since l ₂ > l ₁ , d ₁ <d ₂ . d ₁ <extent of d _2, when clamping the substrate 40 (positioning pins 23 _-1, 24 the same force acts on the top of _-1) deflection e ₁ and the positioning pin of the top of the positioning pins 23 _-1 The flexure e _{2 at} the top of 24 ₋₁ is set to be equal. The flexures e ₁ and e ₂ are exaggerated for convenience of illustration.

Here, if d ₁ = d ₂ , then e ₂
> E ₁ As a result, the PCB package substrate 40 is moved from the predetermined position to the second positioning pin 24 _-1.
A little closer to the side. Since e ₁ = e ₂ ,
The PCB package substrate 40 is positioned more accurately than when e ₂ > e ₁ .

Also, the first and second positioning plates 21, 22
Are prepared in advance according to the type of PCB package substrate. [Cam 27 and Related Parts] As shown in FIGS. 1, 2, and 4, the cam 27 has a wedge-shaped cam portion 27 a.
And has a thickness t ₂ .

The cam 27 is provided on the main body 33 of the apparatus so as to be slidable in the X ₁ and X ₂ directions by a slide unit (not shown). The cam 27 is reciprocated between the positions Q ₁ and Q ₂ by a cam drive mechanism 29 that uses a motor or compressed air as a drive source.

The speed of movement of the cam 27 depends on the cam drive mechanism 2
9 is adjusted so that the impact applied to the package substrate during positioning is sufficiently small. Cam 2
7 and the cam drive mechanism 29 constitute a cam means. next,
PCB package substrate positioning device 10 having the above configuration
The operation will be described with reference to FIG.

First, the PCB package substrate 40 to be positioned will be described. As shown in FIG. 1, the PCB package substrate 40 has a square shape and four side surfaces 40 _-1.
.About.40 _-4 and four corner portions 40 _-5 to 40 _-9 . A semiconductor chip is not mounted on the PCB package substrate 40, and a large number of pads 41 to which the solder paste is transferred are aligned on the upper surface (which becomes the back surface when the PBGA semiconductor package is formed).

The apparatus 10 operates in the state of FIG. 1 → the state of FIG. 4 → the state of FIG. 1 → the state of FIG. 4 ... [Initial State] (See FIGS. 2 and 7A) The cam followers 25 and 26 are in contact with each other.

The cam 27 is located at the retracted position Q ₁ . The tip portion 27b of the cam portion 27a of the cam 27 is inserted into the concave portion 37 formed by the cam followers 25 and 26 in contact with each other. However, the cam portion 27a
Is not pressed against the cam followers 25 and 26, and the cam followers 25 and 26 and the cam 27 are substantially in non-contact with each other.

The first and second positioning plates 21 and 22 are oriented so that the straight line 38 connecting the center O ₃ and the point 36 is in the X-axis direction. In this direction, in relation to the stage 20, the diameters 51, 52 and 54 in FIG.
The direction is parallel or orthogonal to the side surface 20 _{-3 of} 0.

Therefore, as shown in FIG. 2 and FIG.
Positioning pin 23_-1, 23_-2, 24 _-1, 24_-2Respectively
Side 20 of stage 20_-3Away from the dimension f by the side
Face 20_-3Is facing. That is, the positioning pin 23_-1,
23_-2, 24_-1, 24_-2Is the stage 20 in plan view
It is located outside.

In this state, the robot mounts the package substrate 40 on the stage 20 as shown in FIG. 7 (A). Here, the position of the package substrate 40 is
As shown in FIG. 7A, it is assumed that the center of the stage 20 is deviated to the upper right. O ₅ is the center of the package substrate 40.

[State in the middle of positioning] (see FIGS. 7B and 8B) The cam 27 is moved in the X ₁ direction by the cam drive mechanism 29.
It is moved as shown in FIG. The cam portion 27a enters between the cam followers 25 and 26, the first positioning plate 21 moves in the direction of arrow A ₁ and the second positioning plate 22 moves in the direction of arrow A _1.
The return spring 28 is rotated in _two directions while extending it.

By rotating the first and second positioning plates 21 and 22, the first positioning pin 2 in FIG.
3 _-1 , 23 _-2 move in the A ₁ direction along the circle 50, and positioning pins 24 _-1 , 24 _-2 move in the A ₂ direction and approach the side surface 20 _-3 of the stage 20. .

Positioning pins 23 _-1 , 23 _-2 , 24 _-1 , 2
4 out _-2, the first positioning pin 23 _-2 contact with the side surface 40 _-3, the second positioning pin 24 _-2 in contact with the side surface 40 _-2 press package substrate 40, the stage 20 Move to the center, and centering starts.

[State at the time of completion of positioning] (FIGS. 4 and 7)
(C), see FIG. 8 (C)) The cam 27 is moved to the advanced position Q ₂ . As a result, the cam portion 27a completely enters between the cam followers 25 and 26, and the first and second positioning plates 21 and 22 are rotated to the final positions.

As a result, the first positioning pins 23 _-1 ,
23 _-2 moves in the A ₁ direction, reaches the final position shown in FIG. 7C, and stops at that position. The second positioning pins 24 _-1 , 24 _-2 are moving in the A ₂ direction, as shown in FIG.
The final position shown in (C) is reached and the vehicle stops at that position.

Each positioning pin 23_-1, 23_-2, 24_-1,
24_-2Is the side surface 40 of the package substrate 40._-1Etc.
Barrel As a result, the package substrate 40 is diagonally formed.
Two corners 40_-6, 40 _-8Of the four corners
0_-8Of the positioning pin 23_-1, 24_-1Sandwiched by
Another corner 40 embedded_-6Positioning pin 2 near
Three_-2And 24_-2Sandwiched between and, center O_FiveStay
The center O of the 20₁Centered to match
Be positioned.

Positioning pins 23 _-1 , 24 _-1 , 23 _-2 , 2
4 _-2, all are presses against the side surface 40 ₁ and the like of the package substrate 40 are deflected slightly. Here, the positioning pins 23 _{-1 to} 24 _-2 have slightly different diameters as shown in FIG. 6, and the deflections e ₁ and e ₂ are equal. For this reason, the package substrate 40 has the positioning pins 23 _{-1 to} 24 _-2.
The positioning is performed more accurately than when the diameters are set to be equal.

As shown in FIG. 8B, X _{1 of} the cam 27
Directional movement, especially the latter half of the movement, is done at low speed. As a result, the positioning pins 23 _{-1 to} 24 _-2 are attached to the package substrate
The impact applied to the side surfaces 40 _-1 to 40 _-4 of the package substrate 40 when hitting the side surfaces 40 _-1 to 40 _-4 of 0 is sufficiently softened, and the package substrate 40 is not damaged.

It should be noted that making the materials of the positioning pins 23 _{-1 to} 24 _-2 relatively soft is also effective in alleviating the impact. As shown in FIG. 8C, the cam 27
Is reached to the position Q ₂ and the package substrate 40 is positioned, the vacuum suction mechanism 30 operates and the package substrate 40 is adsorbed onto the stage 20.

[Condition when the pinch is released] (FIGS. 2 and 7)
(See (D)) After the vacuum suction mechanism 30 operates, the cam drive mechanism 29 moves.
Made, cam 27 is X ₂Moved to the original position Q
₁Returned to. As a result, the first and second positioning plates 2
Due to the spring force of the return spring 28,
The state is rotated from the state shown in FIG. 2 to the state shown in FIG. 7 (D).
Positioning pin 23_-1~ 24_-2Is the package substrate 40
Side 40_-1~ 40_-FourGet away from. Package board 40
Positioning pin 23 to prevent damage_-1~ 24_-2by
This is to release it from the pinching force.

In this state, the solder ball mounting operation of FIG. 8A is performed. The head holding the solder balls in an array comes down, and the solder balls are mounted on each pad 41 of the package substrate 40 attracted onto the stage 20. Here, since the package substrate 40 is accurately centered and positioned, the solder ball mounting operation is performed with high reliability.

Next, the features of the package substrate positioning device 10 having the above-mentioned structure, which have not been described above, will be described. It is possible to support various types of package substrates 40.
By matching the first and second positioning plates 21 and 22 and the stage 20 with the type of the package substrate 40 and exchanging them, it is possible to handle different types of package substrates.

It is easy to replace the first and second positioning plates 21 and 22. First and second positioning plates 21, 22
2, the cam 27 is not substantially in contact with the cam followers 25 and 26. Therefore, the replacement of the first and second positioning plates 21 and 22 is performed as compared with the case where the cam follower is pressed against the cam.
It's easy.

The structure is simple and the durability is excellent. Since the cam 27 is directly moved and the first and second positioning plates 21 and 22 are simply rotated thereby, the structure is simple, the durability is excellent, and the control is easy. High reliability and low manufacturing cost.

It is small. The rotation center O ₂ of the first and second positioning plates 21 and 22 is the stage 20 in plan view.
Coincides with the center O ₁ . Therefore, the space of the device 10 is reduced.

In the state of FIG. 4, it is possible to displace the first and second positioning plates 21 and 22 in the direction perpendicular to the paper surface. The cam 27 has a thickness t ₂ . Therefore, even if the first and second positioning plates 21 and 22 are slightly displaced in the direction perpendicular to the plane of the drawing, the cam followers 25 and 26 will not move.
The cam 27 is kept in contact with the cam 27 without coming off.

Therefore, in the apparatus 10, for example, with the positioning pins 23 _{-1 to} 24 _-2 sandwiching the package substrate 40, the first and second positioning plates 21 and 22 are slightly moved up and down in the Z ₁ and Z ₂ directions. It can be configured to. Next, a modified example of the cam 27 will be described.

Instead of the cam 27 in FIG. 1, a cam 27A shown in FIG. 9A or a cam 27B shown in FIG. 9B may be used. The cam 27A has a cam portion 27Aa.
The cam portion 27Aa has a shape in which a portion corresponding to the slope of the wedge-shaped cam portion 27Aa in FIG. 1 is a concave curved surface.

The cam 27B has a cam portion 27Ba.
The cam portion 27Ba has a convex curved surface, contrary to the cam portion 27Aa. Using the above cams 27A and 27B,
When the cams 27A and 27B are moved at a constant speed in the X ₁ direction, the speed of movement of the cam followers 25 and 26 changes.

When the cam 27B is used, the cam follower 2
The movement speed of 5, 26 becomes slower in the final stage, and the impact when the positioning pin hits the substrate is relieved. Cam 2
When 7A is used, contrary to the case of the above-mentioned cam 27B,
The speed of movement of the cam followers 26, 27 is increased at the final stage, and the positioning pins slam against the board.

[Second Embodiment] (Embodiment of the Invention of Claims 4 and 7) FIG. 10 shows a PCB package substrate positioning apparatus 10A according to a second embodiment of the present invention. This device 10A is roughly the same as the positioning device 10 of FIG.
This is a configuration in which 3 _-3 , 23 _-4 , 24 _-3 , and 24 _-4 are added.

The first positioning pins 23 _-3 and 23 _-4 are planted on the first positioning plate 21 at positions on the diameter orthogonal to the diameter 51 in FIG. The second positioning pins 24 _-3 and 24 _-4 are planted on the second positioning plate 22 at positions on the diameter orthogonal to the diameter 54 in FIG.

In FIG. 10, parts corresponding to the parts shown in FIG. 1 are designated by the same reference numerals, and the description thereof will be omitted. In the initial state, as shown in FIG. 11A, the two positioning pins 23 _{-1 to} 24 _-4 are provided on the side surface of each side of the stage 20.
But facing away.

When the cam 27 moves in the X ₁ direction after the package substrate 40 is placed on the stage 20, the first positioning plate 21 moves in the A ₁ direction and the second positioning plate 22 moves in the A ₂ direction.
Rotate in the direction. This causes the first positioning pins 23 _{-1 to} 24 _-4 to move in the A ₁ direction in FIG.
Positioning pins 24 _{-1 to} 24 _-4 move in the A ₂ direction.

The positioning pins 23 _{-1 to} 24 _-4 are shown in FIG.
Move to the final position shown in (B). Package board 4
0 is centered, and in that state, all four corner portions 40 _-5 to 40 _-8 are respectively sandwiched by a pair of positioning pins for positioning.

The package substrate 40 is positioned more accurately than the positioning by the device 40 of FIG. [Third Embodiment] (Embodiments of the Invention of Claims 5 and 7) FIG. 12 shows a PCB package substrate positioning apparatus 10B according to a third embodiment of the present invention.

This device 10B corresponds to the positioning device 1 of FIG.
0, four positioning pins 23 _-3X, 23 _-4X, 24
_-3X, a 24 _-4X added, and instead of the cam 27, the cam 2
It is a structure having 7C. First positioning pin 2
3 _-3X, 23 _-4X is a both the first positioning plate 21, respectively the first positioning pins 23 _-1, are planted in a position adjacent to the 23 _-2.

Second positioning pins 23 _-3X , 24
_-4X are both planted on the second positioning plate 22 at positions adjacent to the second positioning pins 24 _-1 , 24 _-2 , respectively. The cam 27C has a cam portion 27c in addition to the cam portion 27a. In the cam portion 27c, as shown in FIG. 13D, the rotation positions of the first and second positioning plates 21 and 22 are set such that all the positioning pins 23 _{-1 to} 24 _-4X are located on the side surface of the stage 20. It is formed so as to be in a position to be separated from each other.

The cam portion 27a indicates the rotational positions of the first and second positioning plates 21 and 22 as shown in FIG. 13 (F).
The positioning pins 23 _-1 , 23 _-2 , 24 _-1 , 24 _-2 are formed so as to come into contact with the side surface of the stage 20. Also, the return spring 28 is used for the cam follower 2
In the state where 5 and 26 are in contact with each other, it becomes a substantially natural length,
It will be in a slightly stretched state. Also, at this time, FIG.
As shown in (H), the positioning pins 23 _-3X , 2
3 _-4X, 24 _-3X, 24 _-4X abuts against the side surface of the respective stage 20.

The substrate positioning device 10B operates as described below. [Stop (when power is off)] (See FIGS. 13A and 13B) The cam 27C is stopped at the position Q ₁ . When the power is turned on, the cam 27C moves to the position Q ₂ and stands by,
After that, it moves from Q _{1a to} Q ₁ and in this state, the solder balls are mounted, the cam 27C reaches Q ₂ via Q _1a, and stands by at this position.

[Non-clamped state (when power is on)] (FIG. 1
3 (C), the (D) refer) power is turned on, the cam 27C is led to the position Q _2, the cam portion 27c guides the cam follower 25 and 26. As a result, the first and second positioning plates 21 and 22 rotate slightly in the opening direction, and the pins 23 _{-1 to} 24 at the front portion are rotated.
_-4X is separated from the side surface of the stage 20.

In this state, the package substrate 40 is placed on the stage 20. [During Positioning] (See FIGS. 13E to 13H) Positioning is performed in two steps, and final positioning is performed by clamping with a positioning pin.

The cam 27C is at the position Q.₂Than X₂In the direction
Moved, position Q_1aVia position Q ₁Reach to. Cam 27
C is position Q_1aHas not reached the first stage of positioning.
Be done. That is, as shown in FIG. 13 (E), the cam portion 27a
Guides the cam followers 25, 26, and the first and second positions
The positioning plates 21 and 22 rotate in the opening direction to move the first positioning plate.
Female pin, 23_-1, 23_-3X, 23_-2, 23_-4XIs A₁One
The second positioning pin 24_-1, 24_-3X, 2
4_-2, 24_-4XIs A₂Move in the direction.

As a result, the substrate 40 is formed as shown in FIG.
Corners 40 _-6 , 40 on the diagonal line 60 in the upper right corner
_-8 to the positioning pins 23 _-2 , 24 _-2 , and 23 _-1 , respectively.
It is sandwiched by 24 _-1 and positioned in the first stage. With the cam 27C reaching the position Q ₁ , the second stage positioning is performed.

That is, as shown in FIG. 13G, the cam portion
27a comes out from between the cam followers 25 and 26,
1, the cam plate in the direction in which the second positioning plates 21 and 22 are closed.
Rotate until the followers 25 and 26 come into contact, and position
Pin 23_-1, 23_-3X, 23 _-2, 23_-4XIs A₂In the direction
Move and position pin 24_-1, 24_-3X, 24_-2, 24
_-4XIs A₁Move in the direction.

As a result, this time, the substrate 40 is moved to the position shown in FIG.
In (B), the corners 40 _-5 , 4 on the diagonal line 61 to the right descending
0 _-7, respectively positioning pin 23 _-3X, 24 _-4X and 23
_-4X, sandwiched by 24 _-3X, the second stage positioning is performed. In addition, the substrate 40 has the positioning pins 23.
_-3X, 24 _-4X, 23 _-4X, kept in a state of being weakly clamped by 24 _-3X.

In this state, the mounting operation of the solder balls on the substrate 40 is performed. [Clamp Release] (See FIGS. 13C and 13D) The cam 27C moves to Q _{2 in the} X ₁ direction. As a result, the clamp on the board 40 on which the solder balls are mounted is released.

In this state, the substrate 40 on which the solder balls are mounted is unloaded from the stage 20, and another substrate is placed on the stage 20. Then, the above-mentioned positioning operation is performed. The substrate positioning device 40 has the following features.

The positioning accuracy of the substrate 40 is high. The positioning of the substrate 40 is performed twice. For this reason, the substrate 40 is positioned with higher accuracy as compared with the case where positioning is performed once.

No vacuum adsorption is required. The substrate 40 is
As shown in FIG. 13 (H), positioning 23_-3X, 24
_-4X, 23 _-4X, 24_-3XSandwiched between
Are positioned). Therefore, vacuum adsorption
Not necessary.

According to the present invention, not only the PCB package substrate but also other components can be positioned.

[0088]

As described above, according to the first aspect of the present invention, the structure is simplified because the first and second positioning plates are simply rotated in the opposite directions by the cam means. As a result, excellent durability, controllability, and reliability can be realized. Further, by exchanging the first and second positioning plates, it is possible to deal with different types of objects to be positioned, and it is possible to improve versatility.

According to the second aspect of the present invention, it is possible to remove the first and second positioning plates and attach the other first and second positioning plates with good workability. According to the invention of claim 3, the rectangular object to be positioned is
Positioning can be performed stably and accurately.

According to the invention of claim 4, as compared with the invention of claim 3, a square object to be positioned can be positioned more stably and more accurately. Claim 5
According to the invention of (1), compared to the invention of (3), it is possible to position the rectangular object to be positioned more stably and more accurately. Moreover, it is possible to eliminate the need for special means for maintaining the positioning state, and the structure can be simplified accordingly.

According to the sixth aspect of the invention, the first and second positioning pins have different lengths despite the difference in length.
The first and second positioning pins can be made to have the same flexure in the state where the positioning pin sandwiches the object to be positioned. Therefore, compared with the case where the diameters of the first and second positioning pins are the same, The positioning object can be positioned with high accuracy.

According to the invention of claim 7, the object to be positioned can be positioned while attacking from the surroundings, and the positioning can be performed smoothly and accurately.

[Brief description of drawings]

FIG. 1 is an exploded perspective view of a positioning device for a PCB package board according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a state before the operation of the substrate positioning apparatus of FIG.

3 is a diagram showing a cam follower portion of the substrate positioning device of FIG. 1. FIG.

4 is a diagram showing a state after the operation of the substrate positioning apparatus of FIG.

5 is a diagram for explaining the size of circles 50 and 53 in FIG. 1 with respect to the stage 20. FIG.

FIG. 6 is a diagram illustrating a positioning pin.

FIG. 7 is a diagram illustrating a positioning operation by the positioning device in FIG.

8 is a diagram illustrating a solder bump forming step to which the positioning device for the PCB package substrate of FIG. 1 is applied.

FIG. 9 is a diagram showing a modified example of the cam.

FIG. 10 is an exploded perspective view of a PCB package board positioning device according to a second embodiment of the present invention.

FIG. 11 is a diagram illustrating a positioning operation by the positioning device in FIG.

FIG. 12 is an exploded perspective view of a positioning device for a PCB package board according to a third embodiment of the present invention.

13 is a diagram for explaining the operation of the apparatus of FIG.

[Explanation of symbols]

10 PCB Package Substrate Positioning Device 12 PCB Package Substrate Positioning Process 20 Stage 20 _-1 Convex Strip 20 _-2 Suction Hole 20 _-3 Side 20 _-4 Notch 21 First Positioning Plate 22 Second Positioning Plate 23 _{-1 , 23 -2, 23 -3, 23} -4, 23 -3X, 23 -4X
The first positioning pins _{24 -1, 24 -2, 24 -3} , 24 -4, 24 -3X, 24 -4X
Second positioning pin 25, 26 Cam follower 27, 27A, 27B, 27C Cam 27a, 27Aa, 27Ba, 27c Cam part 27b Tip part 28 Return spring 29 Cam drive mechanism 30 Vacuum suction mechanism 31 Fixed shaft 32 Stage mounting base part 33 Substrate Positioning device main body 34,35 Shaft 36 Points in contact with each other 37 Recessed portion 38 Straight line 40 PCB package substrate 40 _-1 to 40 _-4 Side surface 40 _-5 to 40 _-8 Corner portion 41 Pad 50,53 Yen 51,52,54 Diameter 60,62 diagonal

Claims (7)

[Claims] 1. A first positioning plate rotatably provided on a fixed shaft, and a second positioning plate rotatably provided on the fixed shaft in a state of overlapping with the first positioning plate. A first positioning pin embedded in the first positioning plate, a second positioning pin embedded in the second positioning plate, and a forward space between the first and second positioning plates Cam means for entering and rotating the first and second positioning plates in mutually opposite directions, the cam means rotating the first and second positioning plates in mutually opposite directions, 1. A positioning target object positioning device, wherein the first and second positioning pins move in opposite directions along a circle centered on the fixed axis to sandwich the positioning target object. 2. The first and second positioning plates and the cam means are provided with the first and second positioning plates when the cam means is retracted.
The object positioning device according to claim 1, wherein the second positioning plate and the cam means are not in contact with each other. 3. The first positioning pin and the second positioning pin are each two in number, and the cam means includes the first and second positioning plates and the first and second positioning pins. The positioning target object positioning device according to claim 1, wherein the positioning target object positioning device is configured to rotate so as to sandwich two corner portions of the rectangular positioning target object that are diagonal to each other. 4. The first positioning pin and the second positioning pin are each four, and the cam means includes the first and second positioning plates and the first and second positioning pins. The positioning target object positioning device according to claim 1, wherein the positioning target object positioning device is configured to rotate so that four corners of the rectangular positioning target object are sandwiched at the same time. 5. The first locating pin and the second locating pin are four in number, respectively, and the cam means includes the first and second locating plates first in two of the four locating pins. First locating pin of the book and two second locating pins of the above four pinch two diagonal corners of a square object to be positioned, and then release the pinch. The remaining two first and second positioning pins sandwich the two diagonally opposite corner portions and rotate so as to maintain the state. The object to be positioned positioning device described. 6. The first positioning pin and the second positioning pin are configured such that the diameter of the shorter pin is set to be slightly smaller than the diameter of the longer pin. Item 5. The positioning device for a positioning object according to any one of items 5 to 5. 7. A first locating pin is implanted in the first
Second positioning plate and second positioning pin are installed
By rotating the positioning plate and the positioning plate in opposite directions, the first positioning pin and the second positioning pin move along a circle to sandwich the object to be positioned. A method for positioning an object to be positioned.