JPH08222675A - Lead forming machine - Google Patents

Abstract

PURPOSE: To obtain a lead forming-machine in which the labor can be saved by measuring the electric performance of electronic devices simultaneously upon finishing lead forming and discriminating between acceptable and rejective products. CONSTITUTION: The lead forming machine comprises a parts feeder section for feeding electronic devices 10 sequentially, a section 13 for forming the lead of an electronic device, a measuring section 20 for determining pass/tail of the electric performance of the electronic device after lead forming, and means 14 for transferring the electronic device to each section.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead forming apparatus for electronic parts such as diodes, transistors, resistors, capacitors and sensors. More specifically, the present invention relates to a lead forming apparatus that can immediately check electrical characteristics with the same apparatus after molding leads of electronic components.

[0002]

2. Description of the Related Art Conventionally, in electronic parts such as transistors, capacitors, diodes, and ICs, a chip is bonded to a lead frame, molded with resin, and then separated from the lead frame to form each lead into a constant shape. Are formed. An apparatus for performing lead forming processing has a structure as shown in FIG. 3, for example.

The apparatus shown in FIG. 3 is an example of an apparatus that performs a lead forming process for a transistor as the electronic component 10, and includes a parts feeder unit 11 and an electronic component orientation adjusting unit 1.
2, a lead forming part 13 and a carrying means 14 for carrying the electronic component 10 between these parts,
As shown in FIG. 5, the leads of the transistors are formed.

The parts feeder 11 is of a normal vibration type, for example, and sequentially oscillates the electronic parts 10 such as transistors inserted therein and supplies them one by one. Due to the vibration, the lead portion of the transistor enters the groove and is guided by the groove to proceed.

The electronic component orientation adjusting section 12 determines whether or not the leads are aligned in a fixed direction, and corrects the orientation if they are not correct. That is, for example, in the case of a transistor, the lead side is aligned downward by the part feeder section 11 in the vertical direction, but the mold section has a square shape, so the front and back sides are not aligned. In the case of a transistor, the leads have an emitter (E), a base (B), and a collector (C) arranged in a fixed order, and since the forming process of the leads is performed in a fixed direction under the arrangement, the front and back are reversed. If so, the emitter and collector are reversed. Therefore, the order of leads is determined, and in the opposite case, the holder 12a is rotated by 180 ° to align the directions.

As shown in the partially enlarged side view of FIG. 4, the lead forming section 13 is composed of an upper die section 13a and a lower die section 13b provided with a holding metal fitting 13c, and is used to form the transistor 10 It is held by the upper mold part 13a, and the lead of the transistor is pushed and bent by the lower mold part 13b.

In this embodiment, the carrier means 14 is provided with three air chucks 16 on the arm 15 at regular intervals, and each of the air chucks 16 is composed of a component supply part of the part feeder part 11 and an orientation adjusting part 12 of the electronic part. It is provided so as to be positioned between the holder 12a portion and the component holding portion of the lead forming portion 13, and moves up and down by the cam drive portion 17, and
The electronic component 10 has a structure in which it can be moved laterally after being gripped by the air chuck 16 and lifted, and the electronic component 10 of the parts feeder unit 11 is an electronic component orientation adjusting unit 12 and an electronic component orientation adjusting unit 12 is provided. The electronic component 10 of FIG.
The electronic components 10 are simultaneously transported onto the product storage box 31. That is, the transporting means 14 lowers the air chuck 16 by the cam driving portion 17 to grip the electronic component 10 by the air chuck 16, raises the arm 15 and horizontally moves one span, and lowers the arm 15 again. The electronic component 10 is released from the air chuck 16. By repeating this movement, the electronic component 10 is conveyed so that the orientation of the electronic component 10, the forming process, and the storage of the electronic component can be performed automatically.

[0008]

When the leads of the electronic component are automatically subjected to the forming process as described above, a defective product may occur due to the influence of the external force during the forming process. In such a case, it is necessary to align the orientations of the electronic components housed in the housing box again and judge the quality by a measuring device (tester), which causes a problem of increasing man-hours and increasing cost.

The present invention has been made to solve such a problem, and after conducting the lead forming process, the electrical performances of the electronic components are simultaneously measured to determine whether they are good or bad, thereby saving labor. It is an object of the present invention to provide a lead forming device that can be manufactured.

[0010]

SUMMARY OF THE INVENTION A lead forming apparatus according to the present invention comprises a parts feeder for sequentially supplying electronic parts, a lead forming part for forming leads of the electronic parts, and an electrical part of the lead-formed electronic parts. The measuring unit includes a measuring unit that determines whether the performance is good or bad, and a conveying unit that sequentially conveys the electronic component to each unit.

The electronic component orientation adjusting unit for inspecting the arrangement direction of the leads of the electronic component supplied by the parts feeder unit and aligning the arrangement direction of the leads of the electronic component in a constant direction is further provided. However, it is preferable when the lead forming process is performed on an electronic component in which the lead arrangement is not symmetrical.

The measuring section includes a holding section for holding the electronic component by a lead section of the electronic component, and a probe base for bringing the measuring probe into contact with the lead of the electronic component held by the holding section. And a measuring instrument of electric performance electrically connected to the measuring probe.

It is preferable that the holding portion is a rotary chuck driven by a rotary actuator, because the electronic components can be gripped one after another and sent to the next step with a simple structure.

[0014]

According to the present invention, since the measuring portion for checking the electrical performance is provided in the part of the storage box for storing the electronic parts after the forming process of the conventional lead forming apparatus, the forming process is performed. By simply pressing the measuring probe against the lead of the electronic component in the state of being kept, it is possible to check the electrical performance and determine the quality. Therefore, it is not necessary to set the electronic parts one by one to check the electrical performance, and while the forming process is performed by the conventional lead forming device, the electronic parts of which the forming process is finished immediately before are formed. The electrical performance check can be completed and defective electrical performance can be removed.

The measuring unit is composed of a holding unit for the electronic component, a probe base for pressing the measuring probe against the lead of the electronic component so as to make contact with the lead, and a measuring instrument for electrical performance electrically connected to the probe. By pushing out the probe base with an air cylinder etc., the measuring probe can be pressed against each lead of the electronic component, and the electrical performance can be easily checked, so it can be performed at the same time as the forming process of other components. .

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The lead forming apparatus of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is an explanatory view mainly showing a measuring section 20 of an embodiment of the lead forming apparatus of the present invention, and a parts feeder section, an electronic component orientation adjusting section, a lead forming section and the like are omitted. The structure of these is the same as that of FIG. FIG. 2 is an enlarged explanatory view of the rotary chuck unit of FIG.

1 and 2, reference numeral 21 is a rotary chuck 2.
Rotary actuator for rotating 3 (22 (22
a, 22b) is an interlocking gear for interlocking the rotary chucks 23a, 23b, and 23 (23a, 23b) is a holding portion for holding the electronic component 10, which is, for example, a rotary chuck. Reference numeral 24 is a measurement probe, which usually has the same number as the number of leads of the electronic component, is fixed to a probe base 25, and the probe base 25 is provided so as to be pushed forward by an air cylinder 26. Measuring probe 24
Each probe is connected to a measuring device 28 by a cord 27.

The operation of this device will be described. From the parts feeder section (not shown in FIG. 1) to the electronic parts 10
Are supplied to the electronic component 10 in the lead forming unit 13.
The operation until the lead is subjected to forming processing is performed in the same manner as described above with reference to FIGS. 3 and 4. The electronic component 10 that has undergone the forming process is transported by the transporting unit 14 onto the rotary chucks 23 a and 23 b of the measuring unit 20. In the conventional lead forming apparatus, the electronic component 10 that has undergone the forming process has the lead forming section 13
From the above, the measuring means 20 is provided at the position of this storage box, and is conveyed from the lead forming section 13 by the conveying means 14 in the present invention. The lead portion of the electronic component 10 thus formed is sandwiched by the rotary chucks 13a and 13b, and the electrical performance is checked.

That is, the electronic component 10 that has undergone the forming process is gripped by the mold portion of the electronic component 10 by the air chuck 16, and the arm 15 is lifted and moved to the measuring unit 20 side by one span. Then, the arm 15 descends by a predetermined height. After that, the rotary actuator 21 rotates the rotary chucks 23a and 23b via the interlocking gears 22a and 22b, whereby the bent portion of the lead of the electronic component 10 is sandwiched and the electronic component 10 is held. By releasing the gripping by the air chuck 16 before the complete gripping by the rotary chucks 23a, 23b, even if the grip by the air chuck 16 is slightly inclined, the lead chucking by the rotary chucks 23a, 23b is performed. With this, the position of the electronic component is held at an accurate position, and the electronic component 10 is correctly set in the measuring unit 20.

After that, by pushing the probe base 25 forward by the air cylinder 26, the measuring probe 2
4 contacts the lead of the electronic component 10. Since the electronic component 10 is held by the rotary chucks 23a and 23b at its lead portion, it is electrically connected without being deformed even when the measurement probe 24 is pressed. As a result, an electric signal is applied from the measuring device 28 to the lead of the electronic component via the cord 27 and the measuring probe 24, and the result is fed back to the measuring device to immediately judge the quality. The position of the lead of the electronic component 10 and the position of the measuring probe 24 are adjusted in advance so that they coincide with each other.

By rotating the rotary actuator 21 in the direction in which the rotation of the rotary actuator 21 is returned, the electronic component 10 having a good determination result widens the distance between the rotary chucks 23a and 23b, and the electronic component 10 is released from the clamp and drops. Then, it is collected in the storage box 31 through the chute 32. If the result of the determination is bad, an alarm may be issued to remove it artificially, or the rotation of the rotary actuator 21 may be controlled by the electronic component 1.
The electronic component 10 is dropped in front of the chute 32 by rotating so that 0 moves toward the measurement probe 24 side, and then the rotary actuator 21 is reversely rotated and held so that the rotary chuck 23 returns to the original state. The unit (rotary chuck) 23 returns to the initial standby state.

While the electrical performance of the electronic component 10 is being measured, the next electronic component is subjected to forming processing in the lead forming section 13, and the electrical performance of the electronic component 10 subjected to the forming processing is performed without requiring special man-hours. The checks are sequentially performed, and the quality is discriminated.

[0024]

According to the lead forming apparatus of the present invention, the forming of the leads of the electronic component is performed, and at the same time, the quality of the electric performance is judged and classified, so that no special performance check process is required, Improves reliability.
Further, since it can be performed at the same time as the lead forming process, the number of work steps does not increase, and the work can be saved.

[Brief description of drawings]

FIG. 1 is a perspective explanatory view showing an embodiment of a lead forming apparatus of the present invention.

FIG. 2 is an enlarged explanatory view of an air chuck portion of FIG.

FIG. 3 is a perspective explanatory view showing an example of a conventional lead forming apparatus.

FIG. 4 is a partially enlarged side view of a lead forming unit of the lead forming apparatus.

FIG. 5 is a diagram showing an example of a lead forming process for a transistor.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Electronic parts 11 Parts feeder part 12 Direction adjustment part of electronic parts 13 Lead forming part 14 Conveying means 20 Measuring part 21 Rotary actuator 23 Holding part (rotating chuck) 24 Measuring probe 25 Probe stand

Claims (4)

[Claims] 1. A parts feeder section for sequentially supplying electronic parts, a lead forming section for molding leads of the electronic parts, a measuring section for judging quality of electric performance of the lead-molded electronic parts, and the electronic part. A lead forming apparatus for electronic components, comprising: a transporting unit that sequentially transports components to the respective units. 2. The electronic component orientation adjusting unit for inspecting the alignment direction of the leads of the electronic component supplied by the parts feeder unit and aligning the alignment direction of the leads of the electronic component in a constant direction is further provided. The lead forming apparatus according to claim 1, wherein 3. The measuring unit includes a holding unit that holds the electronic component by a lead unit of the electronic component, and a probe base that brings the measuring probe into contact with the lead of the electronic component held by the holding unit by pressing. The lead forming apparatus according to claim 1 or 2, further comprising: an electric performance measuring instrument electrically connected to the measuring probe. 4. The lead forming apparatus according to claim 3, wherein the holding portion is a rotary chuck driven by a rotary actuator.