JPH08204479A - Manufacture of vibrator - Google Patents

Manufacture of vibrator

Info

Publication number
JPH08204479A
JPH08204479A JP844195A JP844195A JPH08204479A JP H08204479 A JPH08204479 A JP H08204479A JP 844195 A JP844195 A JP 844195A JP 844195 A JP844195 A JP 844195A JP H08204479 A JPH08204479 A JP H08204479A
Authority
JP
Japan
Prior art keywords
vibrating
diaphragm
covers
plate
outer periphery
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP844195A
Other languages
Japanese (ja)
Inventor
Zenichi Tsuru
善一 鶴
Atsushi Kakimoto
厚 柿本
Tetsuo Shimamura
徹郎 島村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP844195A priority Critical patent/JPH08204479A/en
Publication of JPH08204479A publication Critical patent/JPH08204479A/en
Pending legal-status Critical Current

Links

Landscapes

  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)

Abstract

PURPOSE: To improve working efficiency by performing mirror grinding after the etching removal of a working alteration layer. CONSTITUTION: A diaphragm 1 and first and second covers 2 and 3 for covering the front and back of the diaphragm 1 and holding the outer periphery part of a vibration part 7 there between in the outer periphery part are provided. Also, the vibration part 7 is provided with the vibration part 7 of a tongue piece shape on the inner part of a crimping part by the first and second covers 2 and 3 and a cut groove 6 is formed on the outer periphery of the vibration part 7 so as to form the vibration part 7 of the tongue piece shape. Then, the diaphragm 1 provided with the vibration part 7 is etched, thereafter the front and back surfaces of the diaphragm 1 are mirror ground and then, the first and second covers 2 and 3 are abutted respectively to the front and back surfaces of the diaphragm 1 and directly joined.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は振動子の製造方法に関す
るものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibrator manufacturing method.

【0002】[0002]

【従来の技術】振動板と、この振動板の表裏を覆うとと
もに、その外周部で、前記振動部の外周部を挟持した第
1,第2のカバーとを備え、前記振動部は第1,第2の
カバーによる挟持部内方に舌片状の振動部を有し、振動
板の表裏面にそれぞれ前記第1,第2のカバーを当接さ
せて直接接合させた振動子の従来の製造方法は次の様に
なっていた。
2. Description of the Related Art A vibrating plate is provided with first and second covers for covering the front and back of the vibrating plate and sandwiching the outer peripheral part of the vibrating part with the outer peripheral part thereof. A conventional method of manufacturing a vibrator having a tongue-shaped vibrating portion inside the holding portion by the second cover, and directly contacting the first and second covers to the front and back surfaces of the vibrating plate, respectively. Was as follows.

【0003】すなわち振動板の表裏面には第1,第2の
振動板を直接接合させるので、振動板の振動部外周は鏡
面を保たねばならず、よって振動板は図9のごとく製造
されていた。
That is, since the first and second vibrating plates are directly joined to the front and back surfaces of the vibrating plate, the outer periphery of the vibrating portion of the vibrating plate must maintain a mirror surface, and thus the vibrating plate is manufactured as shown in FIG. Was there.

【0004】先ず振動板を精密研磨(A)し、次にその
表裏面を鏡面研磨(B)し、その後サンドブラスト
(C)によりU字状の切溝を形成して舌片状の振動部を
設ける。
First, the vibrating plate is precision-polished (A), then the front and back surfaces thereof are mirror-polished (B), and then a U-shaped groove is formed by sandblasting (C) to form a tongue-shaped vibrating portion. Set up.

【0005】次に第1,第2の振動板の接合面となる振
動部外周の振動板表裏面にマスクを形成(D)し、その
後この振動板をエッチング(E)し、これにより切溝に
臨む振動部外周にエッチング加工により形成された加工
変質層を除去する。
Next, a mask is formed (D) on the front and back surfaces of the vibrating plate on the outer periphery of the vibrating portion, which is a joint surface of the first and second vibrating plates, and then the vibrating plate is etched (E), whereby kerf The work-affected layer formed by etching on the outer periphery of the vibrating portion facing to is removed.

【0006】そしてその後、マスクを除去(F)し、こ
のマスクにより鏡面を保たれた振動板の振動部外周の表
裏面に第1,第2のカバーを当接し、それぞれ直接接合
していた。
After that, the mask was removed (F), and the first and second covers were brought into contact with the front and back surfaces of the outer periphery of the vibrating portion of the vibrating plate whose mirror surface was kept by the mask, and were directly joined to each other.

【0007】[0007]

【発明が解決しようとする課題】しかしながら直接接合
用の鏡面を保つべく、マスクを形成(D)したり、後で
除去(F)したりするのは作業性の悪いものであった。
However, in order to keep the mirror surface for direct bonding, forming a mask (D) and removing it (F) later is not easy to work with.

【0008】そこで本発明は作業性を良好にすることを
目的とするものである。
Therefore, the present invention aims to improve workability.

【0009】[0009]

【課題を解決するための手段】そしてこの目的を達成す
るために本発明は、前記舌片状の振動部を形成すべくこ
の振動部の外周に切溝を形成し、次にこの振動部を有す
る振動板をエッチングし、その後この振動板の表裏面を
鏡面研磨し、次にこの振動板の表裏面にそれぞれ前記第
1,第2のカバーを当接させて直接接合させるものであ
る。
In order to achieve this object, the present invention forms a kerf on the outer periphery of the vibrating portion to form the tongue-shaped vibrating portion, and then forms the vibrating portion. The vibrating plate included therein is etched, and then the front and back surfaces of this vibrating plate are mirror-polished, and then the first and second covers are respectively brought into contact with the front and back surfaces of this vibrating plate to directly bond them.

【0010】[0010]

【作用】以上の製造方法によると、振動板の振動部外周
と第1,第2のカバーとの直接接合を行うための、この
振動部外周の鏡面化は、振動板の切溝に臨む振動部の外
周部に形成された切溝加工による加工変質層のエッチン
グ除去後に鏡面研磨により行うので、従来のごとくこの
振動板の振動部外周へのマスク形成、およびエッチング
後のマスク除去が不要となり、作業性がきわめて良いも
のとなる。
According to the above manufacturing method, the outer periphery of the vibrating portion of the vibrating plate is mirror-finished so that the outer periphery of the vibrating portion is directly joined to the first and second covers. Since it is performed by mirror polishing after etching removal of the work-affected layer by kerf processing formed on the outer peripheral portion of the portion, it is not necessary to form a mask on the outer periphery of the vibrating portion of this diaphragm and remove the mask after etching as in the conventional case. Workability is extremely good.

【0011】また振動板の鏡面研磨により、振動部の外
周の板厚が薄くなり、これにより不要振動の発生が抑制
されることにもなる。
Further, by mirror-polishing the vibrating plate, the plate thickness on the outer periphery of the vibrating portion is thinned, thereby suppressing the generation of unnecessary vibration.

【0012】[0012]

【実施例】図1においては1は振動板で、板厚100μ
mの水晶板で構成されている。振動板1の表、裏面に
は、板厚400μmの水晶板よりなるカバー2,3がそ
れぞれ水晶同士により直接接合されている。尚、この図
1における4,5は外部電極で、カバー3の裏面の両側
部分に配置されている。前記振動板1は、図2及び図3
に示すように、その内方にU字状の切溝6が形成され、
これにより舌片状の振動部7が形成されている。この振
動部7の表、裏面には、励振用電極8,9が形成され各
々振動部7の根元部10分を介してそのリード電極1
1,12が引き出されている。この内リード電極11の
端部は、図2から図5に示すごとく、振動板1をスルー
ホール13により貫通し、その後図3に示すごとく振動
部7の側方を通って根元部10の反対側に延長されて接
続部14を形成している。またリード電極12は、根元
部10側において接続部15を形成している。そしてこ
れらの接続部14,15に対応するカバー3に形成され
た貫通孔16,17内の導電体18を介して各々外部電
極4,5に接続されている。尚カバー2,3は、その外
周部で振動板1の表、裏面の外周部を挟持し、また水晶
同士で直接接合されているものであるが、それは振動板
1の切溝6の外周部において、接合されているのであっ
てリード電極11が振動部7の側方を通過している部分
については、その外方においてカバー3と接合されてい
る。そして、このように振動板1の裏面側において、振
動部7の側方に、リード電極11を形成するために、図
5,図6から明らかなように、振動板1は、カバー2,
3との挟持部分だけを板厚を厚くし、振動部7及びリー
ド電極11,12を形成する部分などは、エッチングに
よりその板厚を薄くしている。図4は、このエッチング
工程後の振動板1を明確に表しており、枠線19に対応
する裏面部分がエッチングによりその板厚が薄くなって
いるのである。また、この枠線19の外周部分がカバー
2,3によって挟持接合される部分であり、この図4か
らも明らかなように、振動板1の長手方向側の挟持幅2
0は、短方向の挟持幅21よりも広くしている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In FIG. 1, reference numeral 1 is a vibrating plate having a plate thickness of 100 μm.
It is composed of m crystal plates. On the front and back surfaces of the diaphragm 1, covers 2 and 3 made of a crystal plate having a plate thickness of 400 μm are directly bonded by the crystals. Note that external electrodes 4 and 5 in FIG. 1 are arranged on both sides of the back surface of the cover 3. The diaphragm 1 is shown in FIGS.
As shown in, a U-shaped kerf 6 is formed inside thereof,
As a result, the tongue-shaped vibrating portion 7 is formed. Excitation electrodes 8 and 9 are formed on the front and back surfaces of the vibrating portion 7, and the lead electrode 1 is provided via the root portion 10 of the vibrating portion 7, respectively.
1, 12 are pulled out. As shown in FIGS. 2 to 5, the end of the inner lead electrode 11 penetrates the diaphragm 1 by the through hole 13, and then passes through the side of the vibrating section 7 as shown in FIG. The connection portion 14 is formed by extending to the side. Further, the lead electrode 12 forms a connecting portion 15 on the side of the root portion 10. Then, they are connected to the external electrodes 4 and 5, respectively, via the conductors 18 in the through holes 16 and 17 formed in the cover 3 corresponding to these connecting portions 14 and 15, respectively. The outer peripheral portions of the covers 2 and 3 sandwich the outer peripheral portions of the front and back surfaces of the diaphragm 1 and are directly bonded to each other by the crystals, which is the outer peripheral portion of the kerf 6 of the diaphragm 1. In the above, the portion where the lead electrode 11 passes through the side of the vibrating portion 7 and is joined is joined to the cover 3 at the outside thereof. Then, in order to form the lead electrode 11 on the side of the vibrating portion 7 on the rear surface side of the diaphragm 1 as described above, as is apparent from FIGS.
The plate thickness is made thick only at the sandwiching part with 3, and the plate thickness is made thin by etching the parts forming the vibrating part 7 and the lead electrodes 11, 12. FIG. 4 clearly shows the diaphragm 1 after this etching step, in which the back surface portion corresponding to the frame line 19 is thinned by etching. Further, the outer peripheral portion of the frame line 19 is a portion which is sandwiched and joined by the covers 2 and 3. As is apparent from FIG. 4, the sandwiching width 2 on the longitudinal side of the diaphragm 1 is also increased.
0 is wider than the sandwiching width 21 in the short direction.

【0013】また図3のごとくリード電極11を振動部
7の側方に設けたので、当然のこととして、振動部7
は、振動板1の中心部より一方側へずれている。
Since the lead electrode 11 is provided on the side of the vibrating portion 7 as shown in FIG.
Are displaced from the center of the diaphragm 1 to one side.

【0014】尚、根元部10分における切溝6の切込み
は図4のごとく、半円形状となっており、これにより過
大な衝撃が加わった際にも、クラックが生じにくくなる
のである。
The cut groove 6 at the root 10 minutes has a semi-circular shape as shown in FIG. 4, so that cracks are less likely to occur even when an excessive impact is applied.

【0015】次に、振動板1の製造方法について説明す
る。前記振動板1は、平板状態において先ず2000番
のSiC砥粒で粗研磨され、さらに4000番のSiC
砥粒で精密研磨される(図8のG)。この後、電極8,
9、リード電極11,12が設けられ、次にフィルムレ
ジストを前記振動板1の上に重ねて貼り合わせ、その
後、露光、現像工程を経て、切溝6に対応する部分のみ
レジストがない状態にパターンニングを行う。次に25
00番のSiC砥粒を高圧空気と共に高速で前記振動板
1に垂直方向から吹きつけるサンドブラスト加工(図8
のH)が実施され、前記振動板1の切溝6が加工され
る。切溝6加工の終了した前記振動板1は、フッ化アン
モニウム液により化学的エッチング処理(図8のI)さ
れ、サンドブラスト加工による切溝6両側の加工変質層
が取り除かれる。この時、化学的エッチングを多く実施
すると、水晶AT板特有の異方性が生じ、前記振動板1
の根元部10の切溝6部にエッジ状の部分が生じ、落下
衝撃時に破壊することがある。このため、エッチングは
砥粒噴射加工用による平均粒径の3分の1以下となるま
でだけ実施したが、これでも加工変質層は完全に削除さ
れている。次に酸化セリウムにより鏡面研磨を行い(図
8のJ)、サンドブラストによるマスクの除去も行う。
なお上記電極8,9、リード電極11,12等の形成は
この鏡面研磨後に行っても良い。鏡面研磨を長い時間実
施すると、切溝6部が液だまりとなり、特に振動部7の
先端を図7のごとく板厚を薄くすることができる。そし
てこの様に振動部7の先端の板厚を薄くすると不要振動
の発生を抑制することができる。なお振動部7の先端側
を水晶の結晶のプラスX方向側とするとともに、この先
端部に対応する切溝6の幅を広くしておけば、この幅広
部にエッチング液が多くたまるとともにマイナスX方向
へのエッチングが行いやすいことに起因して板厚の薄形
化処理は行いやすくなる。また上記サンドブラスト加工
(H)時あまり砥粒を小さくすると、加工能率が低下す
るため、砥粒は大きくしているが、その小さい砥粒で前
記振動板1の切溝6にサンドブラスト加工を実施するこ
とにより、加工変質層を減少させ、その分化学エッチン
グ(I)の時間が短縮できる。
Next, a method of manufacturing the diaphragm 1 will be described. In the flat plate state, the vibrating plate 1 is first roughly ground with No. 2000 SiC abrasive grains, and further No. 4000 SiC.
It is precisely polished with abrasive grains (G in FIG. 8). After this, the electrodes 8,
9, lead electrodes 11 and 12 are provided, and then a film resist is laminated on the vibrating plate 1 and bonded, and then, through the exposure and development steps, only the portion corresponding to the kerf 6 has no resist. Perform patterning. Then 25
Sand blasting in which No. 00 SiC abrasive grains are blown onto the vibration plate 1 at high speed with high pressure air from a vertical direction (see FIG. 8).
H) is performed and the cut groove 6 of the diaphragm 1 is processed. The vibrating plate 1 on which the kerfs 6 have been processed is chemically etched with ammonium fluoride solution (I in FIG. 8) to remove the work-affected layers on both sides of the kerfs 6 by sandblasting. At this time, if a large amount of chemical etching is performed, anisotropy peculiar to the quartz crystal AT plate occurs, and the diaphragm 1
An edge-like portion may be formed in the cut groove 6 of the root portion 10 of the and may be broken at the time of a drop impact. For this reason, the etching was carried out only until it became one-third or less of the average grain size by the abrasive grain jetting process, but the process-altered layer was completely deleted even with this. Next, mirror polishing is performed with cerium oxide (J in FIG. 8), and the mask is removed by sandblasting.
The electrodes 8 and 9 and the lead electrodes 11 and 12 may be formed after the mirror polishing. When mirror polishing is carried out for a long time, the cut groove 6 part becomes a liquid pool, and especially the tip of the vibrating part 7 can be thinned as shown in FIG. By thus reducing the plate thickness at the tip of the vibrating portion 7, it is possible to suppress the generation of unnecessary vibration. If the tip side of the vibrating portion 7 is set to the plus X direction side of the crystal of quartz and the width of the kerf 6 corresponding to the tip portion is widened, a large amount of etching liquid accumulates in the wide portion and the minus X Due to the fact that the etching in the direction is easy, the thinning process of the plate thickness is easy. Further, if the abrasive grains are made too small during the sandblasting (H), the machining efficiency is lowered, so the abrasive grains are made large, but the sandblasting is performed on the kerf 6 of the diaphragm 1 with the small abrasive grains. As a result, the work-affected layer can be reduced, and the time for chemical etching (I) can be shortened accordingly.

【0016】なお上記実施例において前記カバー2、カ
バー3をガラスに代えても同じ構造、加工が実施でき
た。前記カバー2、カバー3をガラスにすることによ
り、直接接合の温度を300℃に低下させることができ
た。
In the above embodiment, the same structure and processing could be carried out even if the covers 2 and 3 were replaced with glass. By using glass for the covers 2 and 3, the temperature of direct bonding could be lowered to 300 ° C.

【0017】[0017]

【発明の効果】以上のように本発明は、振動板と、この
振動板の表裏を覆うとともに、その外周部で、前記振動
部の外周部を挟持した第1,第2のカバーとを備え、前
記振動部は第1,第2のカバーによる挟持部内方に舌片
状の振動部を有し、前記舌片状の振動部を形成すべくこ
の振動部の外周に切溝を形成し、次にこの振動部を有す
る振動板をエッチングし、その後この振動板の表裏面を
鏡面研磨し、次にこの振動板の表裏面にそれぞれ前記第
1,第2のカバーを当接させて直接接合させるものであ
る。
As described above, the present invention includes the diaphragm, and the first and second covers that cover the front and back of the diaphragm and sandwich the outer peripheral portion of the vibrating portion with the outer peripheral portion. , The vibrating portion has a tongue-shaped vibrating portion inside the holding portion by the first and second covers, and a cut groove is formed on the outer periphery of the vibrating portion to form the tongue-shaped vibrating portion, Next, the diaphragm having this vibrating portion is etched, then the front and back surfaces of this diaphragm are mirror-polished, and then the first and second covers are respectively brought into contact with the front and back surfaces of this diaphragm to directly bond them. It is what makes me.

【0018】そして以上の製造方法によると、振動板の
振動部外周と第1,第2のカバーとの直接接合を行うた
めの、この振動部外周の鏡面化は、振動板の切溝に臨む
振動部の外周部に形成された切溝加工による加工変質層
のエッチング除去後に鏡面研磨により行うので、従来の
ごとくこの振動板の振動部外周へのマスク形成、および
エッチング後のマスク除去が不要となり、作業性がきわ
めて良いものとなる。
According to the above-described manufacturing method, the mirror surface of the outer periphery of the vibrating portion is directly mirror-finished to directly join the outer periphery of the vibrating portion of the diaphragm to the first and second covers. Since the mirror-polishing is performed after etching removal of the work-affected layer by the kerf processing formed on the outer periphery of the vibrating portion, it is not necessary to form a mask on the outer periphery of the vibrating portion of this diaphragm and remove the mask after etching as in the conventional case. , The workability is extremely good.

【0019】また振動板の鏡面研磨により、振動部の外
周の板厚が薄くなり、これにより不要振動の発生が抑制
されることにもなる。
Further, by mirror-polishing the vibrating plate, the plate thickness on the outer periphery of the vibrating portion is thinned, thereby suppressing generation of unnecessary vibration.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例の斜視図FIG. 1 is a perspective view of one embodiment of the present invention.

【図2】図1の分解斜視図FIG. 2 is an exploded perspective view of FIG.

【図3】図1の分解斜視図FIG. 3 is an exploded perspective view of FIG.

【図4】振動板の上面図FIG. 4 is a top view of the diaphragm.

【図5】図4の振動板にカバー2,3を接合した振動子
のA−A断面図
5 is a cross-sectional view taken along the line AA of the vibrator in which the covers 2 and 3 are joined to the diaphragm of FIG.

【図6】図4の振動板にカバー2,3を接合した振動子
のB−B断面図
6 is a cross-sectional view taken along the line BB of the vibrator in which the covers 2 and 3 are joined to the diaphragm of FIG.

【図7】本発明一実施例の製造方法を示す斜視図FIG. 7 is a perspective view showing a manufacturing method according to an embodiment of the present invention.

【図8】本発明一実施例の製造工程を示す図FIG. 8 is a diagram showing a manufacturing process according to an embodiment of the present invention.

【図9】従来例の製造工程を示す図FIG. 9 is a diagram showing a manufacturing process of a conventional example.

【符号の説明】[Explanation of symbols]

1 振動板 2 カバー 3 カバー 6 切溝 7 振動部 9 励振用電極 10 根元部 11 リード電極 12 リード電極 1 Vibration Plate 2 Cover 3 Cover 6 Groove 7 Vibrating Part 9 Excitation Electrode 10 Root 11 Lead Electrode 12 Lead Electrode

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 振動板と、この振動板の表裏を覆うとと
もに、その外周部で、前記振動部の外周部を挟持した第
1,第2のカバーとを備え、前記振動部は第1,第2の
カバーによる挟持部内方に舌片状の振動部を有し、前記
舌片状の振動部を形成すべくこの振動部の外周に切溝を
形成し、次にこの振動部を有する振動板をエッチング
し、その後この振動板の表裏面を鏡面研磨し、次にこの
振動板の表裏面にそれぞれ前記第1,第2のカバーを当
接させて直接接合させる振動子の製造方法。
1. A vibrating plate comprising: a vibrating plate; first and second covers that cover the front and back of the vibrating plate and sandwich the outer peripheral part of the vibrating part at the outer peripheral part thereof. The second cover has a tongue-shaped vibrating portion inside the holding portion, and a cut groove is formed on the outer periphery of the vibrating portion to form the tongue-shaped vibrating portion, and then the vibration having the vibrating portion is formed. A method of manufacturing a vibrator, wherein a plate is etched, and then the front and back surfaces of this diaphragm are mirror-polished, and then the first and second covers are brought into contact with the front and back surfaces of this diaphragm to directly bond them.
【請求項2】 振動板と第1,第2のカバーは水晶板で
構成され、それぞれ水晶同士の直接接合を行った請求項
1に記載の振動子の製造方法。
2. The method of manufacturing a vibrator according to claim 1, wherein the vibrating plate and the first and second covers are made of crystal plates, and the crystals are directly bonded to each other.
【請求項3】 振動板を水晶板で構成し、第1,第2の
カバーをガラス板で構成した請求項1に記載の振動子の
製造方法。
3. The method according to claim 1, wherein the vibrating plate is made of a quartz plate, and the first and second covers are made of glass plates.
【請求項4】 振動板を水晶板で構成するとともに、そ
の振動部の先端側を結晶のプラスX軸方向とした請求項
1〜3のいずれか一つに記載の振動子の製造方法。
4. The method for manufacturing a vibrator according to claim 1, wherein the vibrating plate is made of a quartz plate, and the tip side of the vibrating portion is in the plus X-axis direction of the crystal.
【請求項5】 振動板の先端側の切溝の幅を側方の切溝
の幅よりも広くした請求項1〜3のいずれか一つに記載
の振動子の製造方法。
5. The method of manufacturing a vibrator according to claim 1, wherein the width of the kerf on the tip side of the diaphragm is wider than the width of the kerf on the side.
JP844195A 1995-01-23 1995-01-23 Manufacture of vibrator Pending JPH08204479A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP844195A JPH08204479A (en) 1995-01-23 1995-01-23 Manufacture of vibrator

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP844195A JPH08204479A (en) 1995-01-23 1995-01-23 Manufacture of vibrator

Publications (1)

Publication Number Publication Date
JPH08204479A true JPH08204479A (en) 1996-08-09

Family

ID=11693223

Family Applications (1)

Application Number Title Priority Date Filing Date
JP844195A Pending JPH08204479A (en) 1995-01-23 1995-01-23 Manufacture of vibrator

Country Status (1)

Country Link
JP (1) JPH08204479A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7564177B2 (en) 2006-12-26 2009-07-21 Nihon Dempa Kogyo Co., Ltd. Crystal unit having stacked structure

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7564177B2 (en) 2006-12-26 2009-07-21 Nihon Dempa Kogyo Co., Ltd. Crystal unit having stacked structure

Similar Documents

Publication Publication Date Title
US6996882B2 (en) Method for producing a surface acoustic wave element
US8581476B2 (en) Quartz-crystal devices and methods for manufacturing same
JP5296113B2 (en) Method for manufacturing piezoelectric vibrating piece, piezoelectric vibrating piece and piezoelectric device
JP3888107B2 (en) Etching method of piezoelectric diaphragm for piezoelectric vibrating device
US20130063001A1 (en) Piezoelectric device and method of manufacturing piezoelectric device
JP5363092B2 (en) Method of manufacturing composite substrate for surface acoustic wave filter and composite substrate for surface acoustic wave filter
JP2008205888A (en) Manufacturing method of piezoelectric vibation chip and piezoelectric vibration element
JP4211886B2 (en) Crystal oscillator
JPH08204479A (en) Manufacture of vibrator
JP2000228547A (en) Manufacture of piezoelectric board
JP3814458B2 (en) Quartz crystal bevel processing method
JP2000357931A (en) Manufacture of composite piezoelectric oscillator
JP4963229B2 (en) Piezoelectric thin film device
JP3361608B2 (en) Vibrator for piezoelectric actuator
JP2008244725A (en) Piezoelectric thin film device
JP2008147833A (en) Piezoelectric thin film device
JPH07111435A (en) Production of crystal piezoelectric device
JP2002217666A (en) Surface acoustic wave element and its manufacturing method
JPH098581A (en) Manufacture of vibrator
JP4064420B2 (en) Manufacturing method of crystal unit
JP2005094670A (en) Manufacturing method of tuning fork type crystal oscillator
JP2007306210A (en) Piezoelectric thin film device
JP2001036160A (en) Manufacture of electronic device
JPH08228122A (en) Frame-shaped crystal oscillator and manufacture thereof
JP2002299977A (en) Method for manufacturing piezoelectric vibrator