JP2002299977A - Method for manufacturing piezoelectric vibrator - Google Patents

Method for manufacturing piezoelectric vibrator

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Publication number
JP2002299977A
JP2002299977A JP2001101734A JP2001101734A JP2002299977A JP 2002299977 A JP2002299977 A JP 2002299977A JP 2001101734 A JP2001101734 A JP 2001101734A JP 2001101734 A JP2001101734 A JP 2001101734A JP 2002299977 A JP2002299977 A JP 2002299977A
Authority
JP
Japan
Prior art keywords
piezoelectric
substrate
thin plate
thin
piezoelectric substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001101734A
Other languages
Japanese (ja)
Inventor
Arata Doi
Manabu Ishikawa
新 土井
学 石川
Original Assignee
Kinseki Ltd
キンセキ株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kinseki Ltd, キンセキ株式会社 filed Critical Kinseki Ltd
Priority to JP2001101734A priority Critical patent/JP2002299977A/en
Publication of JP2002299977A publication Critical patent/JP2002299977A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a method for manufacturing a piezoelectric device by which a piezoelectric body is made to a thin plate with high accuracy and a piezoelectric vibrator is easily made to high frequency. SOLUTION: This method for manufacturing a piezoelectric vibrator is provided with a process for joining a second thin plate-shaped piezoelectric substrate to a first thin plate-shaped piezoelectric substrate where through holes are formed by making a plurality of holes, a process for holding a pressing tool that is inserted from the through hole of the first thin plate-shaped piezoelectric substrate into the through hole of the first thin plate-shaped piezoelectric substrate, a process for making the second thin plate-shaped piezoelectric substrate to be a thin plate while united with the jig into one, a process for removing the tool when the thickness of the second thin plate-shaped piezoelectric substrate becomes desired thickness and etching the second thin plate-shaped piezoelectric substrate, a process for forming electrode parts on the front and rear faces of the part located at the through hole of the second thin plate-shaped piezoelectric substrate, and a process for cutting out the surrounding part of the through-hole into piezoelectric vibrating units.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION
【0001】[0001]
【発明の属する技術分野】本発明は圧電体を用い高周波
の発振周波数を得るための極めて薄い振動子(薄板)の
製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an extremely thin vibrator (thin plate) for obtaining a high-frequency oscillation frequency using a piezoelectric material.
【0002】[0002]
【従来の技術】昨今の移動体・情報通信機器等に用いら
れる振動子やフィルターなどの圧電デバイスは機器の小
型化、デジタル化への展開とあいまって、高周波数、広
帯域化という基本仕様のハイスペック化の傾向にある。
2. Description of the Related Art Piezoelectric devices such as vibrators and filters used in mobile and information communication devices in recent years have been developed to meet the basic requirements of high frequency and wide band in combination with the miniaturization and digitalization of devices. It tends to be a specification.
【0003】特に、移動体通信分野では通信網が高密度
化するなど、多重通信時代が到来することに対し、これ
ら高密度の通信網では従来より効率の良いフィルタリン
グとフィルタ特性の広帯域化の要求とが望まれている。
In particular, in the field of mobile communications, the era of multiplex communication has arrived, for example, the density of communication networks has increased. On the other hand, in these high-density communication networks, there has been a demand for more efficient filtering and broadening of filter characteristics than before. Is desired.
【0004】上記のような高周波を発振させるために
は、圧電振動子の板厚を薄く加工することは必須な条件
であり、従来の圧電振動子の加工方法の代表例では、研
磨技術やエッチング技術などの薄板化技術を向上させる
ことで、高周波化と広帯域化に対応するのが現状にあ
る。
In order to oscillate the high frequency as described above, it is indispensable to process the piezoelectric vibrator so as to have a small thickness, and a typical example of the conventional piezoelectric vibrator processing method is a polishing technique or an etching. At present, it is possible to cope with higher frequency and wider band by improving thinning technology such as technology.
【0005】[0005]
【発明が解決しようとする課題】しかしながら、圧電振
動子(例えばATカット板の水晶振動子)を両面研磨機
(俗に言うラッピングマシン)を用いて厚み研磨加工を
行う方法では、被加工物が研磨加工中および被加工物の
取り扱い(研磨作業中の被加工物を取り出すとき)に被
加工物に割れ、欠けが生じる。高周波の振動子を得るた
めに板厚自体も極薄く、更には、被加工物の外形寸法も
2ミリ角と非常に小さいことから、組立工程時において
も取り扱いが非常に難しい。
However, in a method in which a piezoelectric vibrator (for example, a crystal vibrator of an AT-cut plate) is subjected to thickness polishing using a double-side polishing machine (commonly called a lapping machine), the work to be processed is difficult. During the polishing process and during handling of the workpiece (when removing the workpiece during the polishing operation), the workpiece is cracked or chipped. In order to obtain a high-frequency vibrator, the thickness of the plate itself is extremely thin, and the external dimensions of the workpiece are very small, such as 2 mm square. Therefore, it is very difficult to handle even during the assembly process.
【0006】一般的にな両面研磨機での量産加工におけ
る厚み加工の限界としては100μm程度と考えられて
いる。この限界値は、高周波化を狙った水晶振動子など
の厚み加工をするには、厚み数値で比較しても非常に厚
く加工そのものが非常に不安定である。
It is considered that the limit of the thickness processing in mass production processing using a general double-side polishing machine is about 100 μm. This limit value is extremely thick for processing a thickness of a quartz oscillator or the like aiming at a higher frequency, and the processing itself is very unstable even when compared with a numerical value of the thickness.
【0007】一方、高周波化を狙い化学エッチング(例
えばフッ酸溶液を用いた)工法で圧電板の一部をエッチ
ングしようとしても、水晶振動子の持つ結晶構造により
材料内の欠陥が選択的に除去されるなどの問題が生じ一
様な厚み制御が難しいひとや、エッチング溶液の状態管
理(エッチング時の液温や濃度など)などが起因とな
り、エッチングにより水晶振動子の一部分を選択的に薄
く加工し厚み制御することも、その製造工程並びに品質
維持については非常に不安定となっているのが現状であ
る。
On the other hand, even if a part of the piezoelectric plate is to be etched by a chemical etching method (for example, using a hydrofluoric acid solution) to increase the frequency, defects in the material are selectively removed due to the crystal structure of the quartz oscillator. Due to the difficulty of uniform thickness control and the condition of the etching solution (such as the temperature and concentration of the solution during etching), etc., the etching process partially thins the crystal unit. At present, the thickness control is very unstable in the production process and quality maintenance.
【0008】本発明は、このような従来の圧電デバイス
の製造方法の課題を考慮し、圧電体を高精度に薄板化し
圧電振動子の高周波化を容易にする圧電デバイスの製造
方法を提供することを目的とするものである。
The present invention has been made in view of the above-mentioned problems of the conventional method for manufacturing a piezoelectric device, and provides a method for manufacturing a piezoelectric device which makes it possible to make a piezoelectric body thinner with high precision and to easily increase the frequency of a piezoelectric vibrator. It is intended for.
【0009】[0009]
【課題を解決するための手段】前記の目的を解決するた
めに、本発明は、複数の孔加工を施し貫通孔を形成した
第1の薄板状圧電基板に、第2の薄板状圧電基板を接合
する工程と、前記第1の薄板状圧電基板の該貫通孔か
ら、該第1の薄板状圧電基板の貫通孔に挿入する押さえ
ジグを保持する工程と、前記該ジグと一体となった状態
で該第2の薄板状圧電基板を薄板化する工程と、該第2
の薄板状圧電基板の板厚が所望の厚みになったところで
該ジグをはずし該第2の薄板状圧電基板をエッチングす
る工程と、該第2の薄板状圧電基板の該貫通孔に位置す
る部位の表裏に電極部分を形成する工程と、該第1の薄
板状圧電基板と該第2の薄板状圧電基板が一体となって
いる形態で、該貫通孔単位での該貫通孔周囲を切断する
工程と、を備えたことを特徴とする圧電振動子の製造方
法である。
In order to solve the above-mentioned object, the present invention relates to a first thin-plate piezoelectric substrate formed with a plurality of holes and formed with through holes, and a second thin-plate piezoelectric substrate. Bonding, holding a holding jig from the through hole of the first thin piezoelectric substrate into the through hole of the first thin piezoelectric substrate, and a state integrated with the jig. Thinning the second thin piezoelectric substrate with
Removing the jig when the thickness of the thin plate-shaped piezoelectric substrate reaches a desired thickness, etching the second thin plate-shaped piezoelectric substrate, and a portion located in the through hole of the second thin plate-shaped piezoelectric substrate Forming an electrode portion on the front and back surfaces of the substrate, and cutting the periphery of the through hole in the unit of the through hole in a form in which the first thin plate piezoelectric substrate and the second thin plate piezoelectric substrate are integrated. And a method for producing a piezoelectric vibrator.
【0010】要するに本発明は、比較的厚い基板状態の
圧電基板同士を接合し、一方の基板に貫通孔を設け、他
方が圧電振動子として振動板を構成することで、強度的
にも薄板状の加工工程のし易さにおいても改善するもの
である。
[0010] In short, the present invention provides a thin plate-like structure by joining piezoelectric substrates in a relatively thick substrate state, forming a through-hole in one substrate, and forming a vibrating plate as a piezoelectric vibrator. This also improves the ease of the processing step.
【0011】従って本発明では、圧電(水晶材料)基板
と異なる材料の基板を接合することによっても圧電振動
子を実現するものであり、基板を接合するために本発明
では、接合面を鏡面状態にし、両者の接合面の摩擦力で
接合したり、有機系接着剤を用いるもので、水晶材料と
異なる基板の材料については高分子材料またはセラミッ
クなどを用いるものてある。
Therefore, according to the present invention, a piezoelectric vibrator is realized by bonding a substrate made of a material different from that of a piezoelectric (quartz material) substrate. In this case, the two members are joined by a frictional force between the joining surfaces, or an organic adhesive is used. As a material of the substrate different from the quartz material, a polymer material or ceramic is used.
【0012】本発明の製造方法により、高周波の振動子
の製造方法を比較的に簡易化するこができ、圧電振動子
の薄板化に伴う割れ、カケの発生も減少することから、
製造工程の各工程における作業性と品質維持、歩留まり
の改善と向上を実現するものである。
According to the manufacturing method of the present invention, the method of manufacturing a high-frequency vibrator can be relatively simplified, and the generation of cracks and chips due to the thinning of the piezoelectric vibrator is reduced.
It is intended to achieve workability and quality maintenance in each step of the manufacturing process, and to improve and improve the yield.
【0013】[0013]
【発明の実施の形態】以下、添付図面に従ってこの発明
の実施例を説明する。なお、各図において同一の符号は
同様の対象を示すものとする。図1は本発明の圧電振動
子の製造方法の概要を説明する斜視図である。
Embodiments of the present invention will be described below with reference to the accompanying drawings. In each drawing, the same reference numeral indicates the same object. FIG. 1 is a perspective view illustrating an outline of a method of manufacturing a piezoelectric vibrator according to the present invention.
【0014】図1において、1は第1の薄板状圧電基
板、2は第2の薄板状圧電基板、4は貫通孔、5はジ
グ、6は電極部分で、第1の薄板状圧電基板1に代えて
薄板状基板3を用いても同様の効果を奏することで説明
する。第1の薄板状圧電基板1には複数の孔を機械的な
加工あるいは化学エッチング加工などにより貫通孔4を
形成し、第2の薄板状圧電基板2を有機系接着剤で接合
し一体化する。本実施の形態では、接合時では第2の薄
板状圧電基板2の厚みは80μmで、第1の薄板状圧電
基板1(または、薄板状基板3)の厚みは70μmを例
とし、加工後の発振周波数は150MHzを想定する。
In FIG. 1, reference numeral 1 denotes a first thin piezoelectric substrate, 2 denotes a second thin piezoelectric substrate, 4 denotes a through hole, 5 denotes a jig, and 6 denotes an electrode portion. The same effect can be obtained by using the thin plate substrate 3 instead of the above. A plurality of holes are formed in the first thin piezoelectric substrate 1 by mechanical processing or chemical etching to form through holes 4, and the second thin piezoelectric substrate 2 is joined and integrated with an organic adhesive. . In the present embodiment, at the time of bonding, the thickness of the second thin piezoelectric substrate 2 is 80 μm, and the thickness of the first thin piezoelectric substrate 1 (or the thin substrate 3) is 70 μm. The oscillation frequency is assumed to be 150 MHz.
【0015】加工時は、第1の薄板状圧電基板1の貫通
孔4からジグ5を挿入しその先端(長さLは第1の薄板
状圧電基板1(または、薄板状基板3)の板厚み)は第
2の薄板状圧電基板2に達する格好となる。この状態で
第2の薄板状圧電基板2の接合部の裏面を研磨加工など
により第2の薄板状圧電基板2自体の板厚みを所望の厚
さまで薄く加工する。
At the time of processing, a jig 5 is inserted from the through hole 4 of the first thin plate-shaped piezoelectric substrate 1 and its tip (the length L is the plate of the first thin plate-shaped piezoelectric substrate 1 (or the thin plate-shaped substrate 3)). Thickness) will reach the second thin piezoelectric substrate 2. In this state, the thickness of the second thin piezoelectric substrate 2 itself is reduced to a desired thickness by polishing the back surface of the joint portion of the second thin piezoelectric substrate 2.
【0016】第1の薄板状圧電基板1と第2の薄板状圧
電基板2は接合することで一体化の形態を成しており、
第2の薄板状圧電基板2のみの厚みを薄く加工すること
により、圧電振動子の振動部(第2の薄板状圧電基板
2)は薄く、圧電振動子の他の部分(第1の薄板状圧電
基板1)は振動部に比べて充分な厚みを持つことから、
強度を持ち高い高周波を振動させることのできる圧電振
動子を得ることができる。
The first thin plate-shaped piezoelectric substrate 1 and the second thin plate-shaped piezoelectric substrate 2 are joined to form an integrated form.
By processing the thickness of only the second thin-plate piezoelectric substrate 2 to be thin, the vibrating portion (the second thin-plate piezoelectric substrate 2) of the piezoelectric vibrator is thin, and the other portion of the piezoelectric vibrator (the first thin-plate piezoelectric substrate 2) is formed. Since the piezoelectric substrate 1) has a sufficient thickness compared to the vibrating part,
A piezoelectric vibrator having strength and capable of vibrating a high frequency can be obtained.
【0017】図1からも分かるように、第1の薄板状圧
電基板1に形成する貫通孔4を一つの圧電振動子の単位
と考えると、貫通孔4の周囲で切り離し分離することに
より、複数もの高い周波数を持った圧電振動子を容易に
得ることとなる。なお、図3には本発明の製造フローを
斜視図により説明する。
As can be seen from FIG. 1, when the through hole 4 formed in the first thin plate-like piezoelectric substrate 1 is considered as a unit of one piezoelectric vibrator, a plurality of parts can be separated and separated around the through hole 4. A piezoelectric vibrator having a very high frequency can be easily obtained. FIG. 3 is a perspective view illustrating the manufacturing flow of the present invention.
【0018】本発明は前述の圧電振動子を得るために、
次の製造方法を特徴とする。図3(a)は第1の薄板状
圧電基板1に複数の孔加工を施し貫通孔4を形成する工
程で、図3(b)は該第1の薄板状圧電基板1に第2の
薄板状圧電基板2を接合する工程で、図3(c)は前記
第1の薄板状圧電基板1の該貫通孔4から、該第1の薄
板状圧電基板1の貫通孔4に挿入する押さえジグ5を保
持する工程で、図3(d)は前記該ジグ5と一体となっ
た状態で該第2の薄板状圧電基板2を、例えば表面研磨
機(ラッピングマシン)などで厚み研磨加工により薄板
化する工程で、図3(e)は該第2の薄板状圧電基板2
の板厚が所望の厚みになったところで該ジグ5をはずし
第2の薄板状圧電基板2をエッチングする工程で、図3
(f)は該第2の薄板状圧電基板2の該貫通孔4に位置
する部位の表裏に電極部分6を形成する工程で、図3
(g)は該第1の薄板状圧電基板1と該第2の薄板状圧
電基板2が一体となっている形態で、該貫通孔4単位で
の該貫通孔4周囲を切断する工程を備えた製造方法によ
り、図3(h)に示す圧電振動子を実現するものであ
る。なお、貫通孔4周辺部を切断することで圧電振動子
を形成するものであるが、一つの圧電振動子に貫通孔4
が複数存在する場合もある。
According to the present invention, in order to obtain the above-described piezoelectric vibrator,
The following manufacturing method is characterized. FIG. 3A shows a process in which a plurality of holes are formed in the first thin plate-shaped piezoelectric substrate 1 to form through holes 4, and FIG. 3B shows a process in which a second thin plate is formed in the first thin plate-shaped piezoelectric substrate 1. FIG. 3 (c) shows a holding jig inserted from the through hole 4 of the first thin plate-shaped piezoelectric substrate 1 into the through hole 4 of the first thin plate-shaped piezoelectric substrate 1 in the step of joining the two piezoelectric plates 2. 3D, the second thin piezoelectric substrate 2 is integrated with the jig 5 and the second thin piezoelectric substrate 2 is thinned by, for example, a thickness polishing machine (lapping machine). FIG. 3E shows the second thin piezoelectric substrate 2.
In the step of removing the jig 5 and etching the second thin piezoelectric substrate 2 when the thickness of the substrate has reached a desired thickness, FIG.
FIG. 3F shows a step of forming electrode portions 6 on the front and back of a portion of the second thin piezoelectric substrate 2 located at the through hole 4.
(G) is a mode in which the first thin plate-shaped piezoelectric substrate 1 and the second thin plate-shaped piezoelectric substrate 2 are integrated, and includes a step of cutting the periphery of the through hole 4 in units of the through hole 4. By the manufacturing method described above, the piezoelectric vibrator shown in FIG. The piezoelectric vibrator is formed by cutting the peripheral portion of the through hole 4.
There may be more than one.
【0019】図3の製造フロー図では、第1と第2共に
薄板状圧電基板を用いているが、第1の基板は圧電振動
子の枠体を構成することから、第1の薄板状圧電基板1
に代えて薄板状基板3(高分子材料またはセラミック材
質)を用いても構わない。また、薄板状圧電基板同士の
接合あるいは、薄板状圧電基板と薄板状基板との接合
に、本発明では、接合面を鏡面状態にし、両者の接合面
の摩擦力で接合したり、有機系接着剤を用いており、第
1の薄板状圧電基板1あるいは、薄板状基板3に形成す
る貫通孔4については、機械的工法や、エッチング工法
(ドライ、ウェット)を用いて行われるものであり、第
2の薄板状圧電基板2や薄板状基板3をエッチングする
エッチング工法についても、ドライエッチングやウェッ
トエッチングが用いられる。なお、第2の薄板状圧電基
板2や薄板状基板3をエッチングすることにより、研磨
加工後の歪み除去効果を得ることができる。
In the manufacturing flow chart of FIG. 3, a thin plate-like piezoelectric substrate is used for both the first and second substrates. However, since the first substrate constitutes a frame of the piezoelectric vibrator, the first thin plate-like piezoelectric substrate is used. Substrate 1
Instead, a thin plate-like substrate 3 (polymer material or ceramic material) may be used. In addition, in the present invention, when joining the thin plate-like piezoelectric substrates or joining the thin plate-like piezoelectric substrate and the thin plate-like substrate, the joining surface is mirror-finished, and the two joining surfaces are joined by a frictional force, or an organic adhesive is used. The through hole 4 formed in the first thin plate-shaped piezoelectric substrate 1 or the thin plate-shaped substrate 3 is formed by using a mechanical method or an etching method (dry or wet). Dry etching or wet etching is also used as an etching method for etching the second thin piezoelectric substrate 2 or the thin substrate 3. In addition, by etching the second thin plate-shaped piezoelectric substrate 2 or the thin plate-shaped substrate 3, it is possible to obtain an effect of removing distortion after polishing.
【0020】[0020]
【発明の効果】以上のように、本発明の製造方法によっ
て、高周波化、広帯域化に対応できる薄板の圧電振動子
を安定して製造することができることから、製造歩留ま
りの改善と品質の向上を実現することができる。
As described above, according to the manufacturing method of the present invention, it is possible to stably manufacture a thin-plate piezoelectric vibrator capable of coping with a higher frequency and a wider band, so that the manufacturing yield and the quality can be improved. Can be realized.
【図面の簡単な説明】[Brief description of the drawings]
【図1】本発明の圧電振動子の概念を説明する斜視図で
ある。
FIG. 1 is a perspective view illustrating the concept of a piezoelectric vibrator according to the present invention.
【図2】本発明の製造方法を説明するフロー図である。FIG. 2 is a flowchart illustrating a manufacturing method of the present invention.
【図3】本発明の製造フローを説明する斜視図である。FIG. 3 is a perspective view illustrating a manufacturing flow of the present invention.
【符号の説明】[Explanation of symbols]
1 第1の薄板状圧電基板 2 第2の薄板状圧電基板 3 薄板状基板 4 貫通孔 5 ジグ 6 電極部分 DESCRIPTION OF SYMBOLS 1 1st thin plate-shaped piezoelectric substrate 2 2nd thin plate-shaped piezoelectric substrate 3 thin plate-shaped substrate 4 through hole 5 jig 6 electrode part

Claims (8)

    【特許請求の範囲】[Claims]
  1. 【請求項1】 複数の孔加工を施し貫通孔を形成した薄
    板状基板に、薄板状圧電基板を接合する工程と、前記薄
    板状基板の該貫通孔から、該薄板状基板の貫通孔に挿入
    する押さえジグを保持する工程と、前記該ジグと一体と
    なった状態で該薄板状圧電基板を薄板化する工程と、該
    薄板状圧電基板の板厚が所望の厚みになったところで該
    ジグをはずし該薄板状圧電基板をエッチングする工程
    と、該薄板状圧電基板の該貫通孔に位置する部位の表裏
    に電極部分を形成する工程と、圧電振動子単位に切断す
    る工程と、を備えたことを特徴とする圧電振動子の製造
    方法。
    1. A step of bonding a thin-plate piezoelectric substrate to a thin-plate substrate formed with a plurality of holes and having a through-hole formed therein, and inserting the thin-plate substrate into the through-hole of the thin-plate substrate from the through-hole. Holding the holding jig, reducing the thickness of the thin piezoelectric substrate in a state where the jig is integrated with the jig, and removing the jig when the thickness of the thin piezoelectric substrate becomes a desired thickness. Removing, etching the thin-plate piezoelectric substrate, forming electrode portions on the front and back of a portion of the thin-plate piezoelectric substrate located at the through hole, and cutting the piezoelectric vibrator unit. A method for manufacturing a piezoelectric vibrator, comprising:
  2. 【請求項2】 複数の孔加工を施し貫通孔を形成した第
    1の薄板状圧電基板に、第2の薄板状圧電基板を接合す
    る工程と、前記第1の薄板状圧電基板の該貫通孔から、
    該第1の薄板状圧電基板の貫通孔に挿入する押さえジグ
    を保持する工程と、前記該ジグと一体となった状態で該
    第2の薄板状圧電基板を薄板化する工程と、該第2の薄
    板状圧電基板の板厚が所望の厚みになったところで該ジ
    グをはずし該第2の薄板状圧電基板をエッチングする工
    程と、該第2の薄板状圧電基板の該貫通孔に位置する部
    位の表裏に電極部分を形成する工程と、圧電振動子単位
    に切断する工程と、を備えたことを特徴とする圧電振動
    子の製造方法。
    2. A step of joining a second thin plate-shaped piezoelectric substrate to a first thin plate-shaped piezoelectric substrate on which a plurality of holes have been formed to form through holes, and the through-holes of the first thin plate-shaped piezoelectric substrate. From
    Holding a holding jig inserted into the through-hole of the first thin plate-shaped piezoelectric substrate, thinning the second thin plate-shaped piezoelectric substrate in a state integrated with the jig; Removing the jig when the thickness of the thin plate-shaped piezoelectric substrate reaches a desired thickness, etching the second thin plate-shaped piezoelectric substrate, and a portion located in the through hole of the second thin plate-shaped piezoelectric substrate A method for manufacturing a piezoelectric vibrator, comprising the steps of: forming an electrode portion on the front and back of the device; and cutting the piezoelectric vibrator into units.
  3. 【請求項3】 前記貫通孔を形成する工程は、前記圧電
    基板の接合工程の前に実施されることを特徴とする請求
    項1と請求項2に記載の圧電振動子の製造方法圧電振動
    子。
    3. The method according to claim 1, wherein the step of forming the through-hole is performed before the step of bonding the piezoelectric substrate. .
  4. 【請求項4】 前記薄板状圧電基板の材質が水晶の圧電
    材料基板であることを特徴とする請求項1ないし請求項
    2記載の圧電振動子の製造方法。
    4. The method for manufacturing a piezoelectric vibrator according to claim 1, wherein the material of said thin plate-shaped piezoelectric substrate is a quartz piezoelectric material substrate.
  5. 【請求項5】 前記薄板状基板の材質が高分子材料また
    はセラミックであることを特徴とする請求項2記載の圧
    電振動子の製造方法。
    5. The method according to claim 2, wherein the material of the thin plate-shaped substrate is a polymer material or ceramic.
  6. 【請求項6】 前記薄板状圧電基板同士の接合あるい
    は、薄板状圧電基板と薄板状基板との接合は摩擦力であ
    ることを特徴とする請求項1と請求項2に記載の圧電振
    動子の製造方法圧電振動子。
    6. The piezoelectric vibrator according to claim 1, wherein the bonding between the thin plate-shaped piezoelectric substrates or the bonding between the thin plate-shaped piezoelectric substrates and the thin plate-shaped substrate is a frictional force. Manufacturing method Piezoelectric vibrator.
  7. 【請求項7】 前記薄板状圧電基板同士の接合あるい
    は、薄板状圧電基板と薄板状基板との接合に有機系接着
    剤を用いることを特徴とする請求項1と請求項2に記載
    の圧電振動子の製造方法圧電振動子。
    7. The piezoelectric vibration according to claim 1, wherein an organic adhesive is used for joining the thin plate-shaped piezoelectric substrates or for joining the thin plate-shaped piezoelectric substrates to each other. Element manufacturing method Piezoelectric vibrator.
  8. 【請求項8】 前記貫通孔は、機械的あるいはエッチン
    グ工法で形成されることを特徴とする請求項1〜7のい
    ずれかに記載の圧電振動子の製造方法。
    8. The method according to claim 1, wherein the through-hole is formed by a mechanical or etching method.
JP2001101734A 2001-03-30 2001-03-30 Method for manufacturing piezoelectric vibrator Pending JP2002299977A (en)

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Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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Publications (1)

Publication Number Publication Date
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Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007274348A (en) * 2006-03-31 2007-10-18 Kyocera Kinseki Corp Manufacturing method of lame mode crystal vibrator

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007274348A (en) * 2006-03-31 2007-10-18 Kyocera Kinseki Corp Manufacturing method of lame mode crystal vibrator

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