JPH08181450A - Electronic circuit board and manufacture thereof - Google Patents

Abstract

PURPOSE: To realize an electronic circuit board adapted for high density mounting and a method for manufacturing the same by superposing many wiring sheets having stable sizes and effectively adhering the electric connections of vias to the sheets. CONSTITUTION: Wiring sheets 200A, 200B are formed by processing wiring patterns (211 for a power source and 212 for signal) made of a material adhered with copper foils 202, 203 to both surfaces of a thermosetting polyimide resin sheet 201. An adhesive sheet 100 provided with metal vias 104 at predetermined positions of a thermoset polyimide resin sheet 101 in parallel therewith, the vias 104 of the sheet and the connecting pads 214 of the signal wiring side of the wiring sheet are aligned, laminated, the laminate is connected at the electric connector under pressure, then heated by a temperature profile of two stages for connecting between the resin sheets, press-bonded to obtain the circuit board of the multilayer.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board obtained by forming a conductor wiring pattern on an organic resin sheet, laminating them in multiple layers with an adhesive sheet, press-bonding and heating, and a method for producing the same. In particular, the present invention relates to an electronic circuit board suitable as a high-density mounting board and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally used printed wiring boards have used glass cloth fixed with a thermosetting resin such as an epoxy resin in order to keep the coefficient of thermal expansion of an insulating layer at a level of copper wiring. However, when the glass cloth is used, the thickness of the insulating layer needs to be 0.1 mm or more.

On the other hand, recently, the need for a high-density wiring board is increasing, and thin film wiring having a wiring width of 0.1 mm or less has been put into practical use. As the wiring width becomes narrower, it is necessary to reduce the thickness of the insulating layer in order to keep the impedance of the wiring constant, and the conventional printed circuit board has a limit in increasing the density.

Therefore, thin film wiring suitable for high density is beginning to be used. However, the thin film wiring has a problem that the manufacturing period becomes long and the yield is poor because the wiring layers are sequentially laminated one by one. there were. One way to solve this is
A manufacturing method has been proposed in which a wiring pattern is formed on an organic resin sheet such as a glass cloth, which does not include a core material, for example, a sheet made of polyimide, and a large number of the wiring patterns are stacked and integrated under pressure and heating.

This example will be described in detail with reference to FIGS. 9 to 12. FIG. 9 shows a power source in which a wiring pattern 902, vias 903 for connecting upper and lower layers, and connection pads 904 are provided on a polyimide sheet 901. Layer 900, X wiring layer 9
10 shows a four-layer sheet including a Y wiring layer 920, a Y wiring layer 920, and a ground (G) layer 930 as viewed obliquely.

A power supply layer 90 is formed on the surface of each of these sheets.
Although not shown in FIG. 9, thin uncured polyimide 901a (see FIG. 10) is applied except for 0, and is used as an adhesive for bonding upper and lower layers. Figure 10
9 is a cross-sectional view of each sheet of FIG.
02 and the via portion 903 are made of a gold conductor material.
When the via portion 903 and the connection pad portion 904 are aligned so as to overlap with each other in the state shown in FIG. 10, and pressure bonding and heating are performed, the via portion 903 is metal-bonded by heat diffusion of gold and gold, and electrical conduction is obtained. . At the same time, the uncured polyimide 901a is solidified in the other portions, and the upper and lower layers are bonded. In this way, a multilayer wiring board can be formed.

On the other hand, in the example showing the sectional structure of the sheet in FIG. 11, the wiring pattern 902 is formed on the front and back surfaces of the polyimide sheet 901, and the via portion 90 of one wiring sheet 960 is formed.
3 is provided with a conductive metal protrusion 903a. And
For bonding the upper and lower layers, wiring sheets 940 and 960 are formed by using an uncured polyimide sheet provided with a hole 905 so that the protruding metal 903a of the via portion can be inserted as an adhesive layer 950.
It is sandwiched in between and laminated, and heating and pressure bonding are performed. As a result, the multilayer wiring board shown in FIG. 12 can be formed.

According to the two examples described above, the manufacturing period is shorter than that of the build-up method in which the polyimide layer and the wiring layer are formed one by one for each wiring to form a multilayer thin film wiring board. There is an advantage that the previously formed wiring layer is not damaged many times. Note that, as a technique related to this type of technique, for example, Japanese Patent Laid-Open No. 4-162589 can be cited.

[0009]

However, in the conventional example shown in FIG. 9, it is difficult to completely remove the uncured polyimide 901a from the joint portion of the via 903 when thermocompression bonding is performed, and the conduction failure of the via 903 is poor. Occurs. For example, the polyamic acid that is a polyimide precursor is 100 to 2
Imidization progresses at a temperature of 00 ° C and the viscosity increases sharply.
Before the polyimide 901a is completely removed from the joint portion of No. 3, it is solidified.

In the conventional example shown in FIG. 11, the projection 903a of the via conductor is inserted into the hole 905 formed in the uncured polyimide sheet 950, but the wiring pattern 902 is used.
When the density is increased and the scale is increased, the via protrusion 903a and the hole 90 are formed.
5 Both become finer and difficult to insert. For example, if the via diameter is 30 μm, the via pitch is 300 μm, and the sheet size is 200 mm square, approximately 400,000 via protrusions 903a must be inserted into the holes 905 of the adhesive sheet and stacked. The clearance of the hole that can be inserted is determined by the stability of the sheet, but considering the difference in the coefficient of thermal expansion between the wiring sheets 940 and 960 and the adhesive sheet 950 and the difference in the moisture absorption characteristics, the dimensional stability is about ± 0.2%. I have to anticipate. From this value, it is necessary to estimate the clearance for inserting all the projections of vias into the holes of the adhesive sheet on the entire surface of the sheet of 200 mm square, and it is necessary to be ± 200 μm or more. This requires making holes of 430 μm in the adhesive sheet, which makes it impossible to provide vias at a pitch of 300 μm.

If an un-cured polyimide sheet is used as the adhesive sheet 950, water molecules generated by the dehydration reaction during curing may gather at the adhesive interface to generate bubbles. In particular, this tendency is remarkable when there is a metal layer with a large adhesion area and bubbles that are difficult to escape in the middle,
This has been an obstacle for surely adhering the sheet-like circuit as in the present invention.

On the other hand, in the conventional method, since the wiring pattern formed on the polyimide sheet is not restricted in any way, the pattern can be freely designed. However, depending on the pattern design, the ratio of the conductor area occupied on the sheet to each layer is different. It changes every time. For this reason, the dimension of the polyimide sheet may change for each layer due to temperature change or moisture absorption, and the upper and lower layers may not be aligned with each other. For example, in a copper-clad polyimide sheet, the dimensional change before and after the etching of the copper foil varies depending on the extending direction, but about ± 0.2% occurs. This is 20
Calculating the dimensional variation from the center of the 0 mm square sheet corresponds to ± 200 μm, which is a major obstacle to realizing a laminated sheet by accurately stacking high-density wiring patterns.

Therefore, an object of the present invention is to solve the above-mentioned problems of the prior art. More specifically, a large number of wiring sheets having stable dimensions are piled up to ensure electrical connection of via portions and sheets. It is to realize the electronic circuit board suitable for high-density mounting and the manufacturing method thereof.

[0014]

In order to achieve the above object, through holes are provided in an adhesive sheet for connecting upper and lower layers of a wiring sheet, and a via metal is previously embedded by embedding a conductive metal in the hole. Using an adhesive sheet,
Also, for the adhesive sheet, a thermoplastic material in which the resin flows at a temperature higher than the connection temperature of the joining metal is used. That is, as the adhesive sheet, a sheet such as a thermoplastic resin having a glass transition point Tg above the joining temperature of the joining metal, for example, a thermoplastic polyimide resin is used.

The wiring sheet is made of a heat-resistant thermosetting resin as a base material. Then, as a method for maintaining the dimensional accuracy of the wiring sheet, a conductive metal is laminated on both sides of an organic resin film as a raw material of the wiring sheet, and at least one surface of the front and back layers, preferably the surface forming the power supply layer. A wiring sheet patterned by leaving 70% or more of the conductor metal therein is used.

[0016]

In the adhesive sheet in which the via metal is embedded in the thermoplastic resin sheet, the ratio of the conductive metal is small (for example, 3
(The metal occupancy is about 0.8% when the vias with a diameter of 30 μm are embedded at a pitch of 00 μm.) It can be considered that it is almost the physical property of resin, and the vias can be arranged at regular intervals, so that they are equal to the surface It is easy to obtain the dimensional accuracy.

Further, since an adhesive sheet is used in which the via metal has its head protruded from the adhesive surface in advance, the adhesive material is not caught in the adhesive surface, and a defective connection is unlikely to occur. There is no need to insert many holes in the sheet.

Further, as an adhesive, an adhesive sheet of a thermoplastic resin having a glass transition point Tg higher than the joining temperature of the joining metal is used, and an adhesive step of superposing the wiring sheet and thermocompression bonding with a two-step temperature profile is used. . As a result, the via metal is first joined at the temperature of the first step, but at this time the adhesive resin is below Tg and maintains high viscosity, so that it does not flow to the joint interface and good via joining is achieved. it can. Next, at the temperature of the second stage, the adhesive begins to flow over Tg and starts to flow, so that the adhesion between the wiring sheets can be surely performed, and at the same time, the heat which can solve the problem of the thermosetting resin as the adhesive. Since the plastic resin is used, the bonding is performed without a chemical reaction such as a dehydration reaction, and the cause of bubble generation can be eliminated.

A double-sided wiring sheet is formed by etching an organic resin sheet having metal foils on both sides, and at least 70% or more of the metal foil is left on one side of the sheet. As a result, the dimensional change caused by moisture absorption or temperature change of the organic resin can be accurately maintained by the rigidity of the metal foil. Therefore, the positioning accuracy of the upper and lower layers in the case where a plurality of wiring sheets and adhesive sheets are stacked for electrical connection is improved, and a manufacturing method suitable for a sheet batch laminated circuit board having a high-density wiring pattern can be provided.

[0020]

An embodiment of the present invention will be described below with reference to the drawings. <Example 1> This example illustrates the basic principle of the present invention in which an adhesive sheet 100 is sandwiched between two wiring sheets 200 and the laminated body is heated and pressure-bonded to form a wiring module 300.

(1) Method for Manufacturing Adhesive Sheet FIG. 1 shows a sectional process drawing for manufacturing the adhesive sheet 100, which will be sequentially described below with reference to this process drawing. As shown in FIG. 1A, first, a thermoplastic polyimide 101 was applied on a copper plate 102 to a thickness of 25 μm and dried.
As shown in FIG. 1B, a resist film pattern (not shown) is formed on the polyimide film 101, and 300 μm is formed by dry etching or laser ablation.
Via holes 103 having a diameter of 30 μm were provided at m intervals.

As shown in FIG. 1 (c), this was immersed in a copper etching solution to etch the bottom of the via hole 103 into a hemispherical shape.

As shown in FIG. 1D, gold was embedded in the via hole 103 by electroplating using the copper plate 102 as one electrode to form a via metal 104. By performing electroplating thicker than the polyimide film, the polyimide film 1
It is possible to obtain a gold via 104 having a shape protruding from the surface of 01. As shown in FIG. 1 (e), the adhesive sheet 100 was formed by immersing the copper plate 102 again in the copper etching solution and completely removing the copper plate 102 from the polyimide film 101. The numerical values sandwiched by arrows in the drawing represent the thickness of the polyimide film 101, the protruding height and diameter of the via metal 104 from the surface of the polyimide film, and the distance between adjacent vias in μm units.

The via hole 10 is formed by the steps described above.
It is possible to form the adhesive sheet 100 in which the metal conductor 104 is embedded in the sheet 3, and since the head of the via metal protrudes from the surface of the sheet 101, the connection reliability of the via is improved in the sheet adhering step described later. effective.

(2) Method for Manufacturing Wiring Sheet FIGS. 2 and 3 show sectional process drawings for manufacturing the wiring sheet 200, which will be sequentially described below with reference to these process drawings. As shown in FIG. 2A, a copper-clad sheet in which copper foils 202 and 203 are preliminarily laminated on both surfaces of a thermosetting polyimide sheet 201 is prepared. In this example, a polyimide sheet 201 having a thickness of 25 μm and a copper foil having a thickness of 2 μm on both the front surface (wiring) side and the back surface (power supply) side was used. Figure 2
As shown in (b), after a protective tape 205 against a copper etching solution was adhered to the back surface, a photoresist 204 for forming via holes was applied to the front surface side by curtain coating and dried. As shown in FIG. 2C, the resist 204 is exposed through a first mask (not shown) for forming a predetermined via hole, and developed to remove the resist 204 only in the via hole forming region 206a, and then copper. The copper foil 202 is partially removed by immersing it in the etching solution described above, a mask for forming a via hole is transferred, and a two-layer resist mask including a resist 204 and the copper foil 202 for use in the next via hole forming step is formed. did.

As shown in FIG. 2D, the sheet surface on which the two-layer resist mask is formed is entirely scanned by an excimer laser having a wavelength of 248 nm, and the resist 204 is removed by laser ablation and the opening of the copper foil 202 is exposed. The via hole 206 is opened in the polyimide sheet 201 in the corresponding via hole forming region 206a. Since the etching rate of the copper 202 and the polyimide 201 can be increased by 10 times or more by adjusting the laser irradiation intensity, the copper foil 203 is not significantly damaged even if overetching is performed.

As shown in FIG. 2E, a film resist 207 is attached to the entire surface of the sheet from which the resist 204 has been removed in the step (d). As shown in FIG. 2 (f), (c)
Second step for forming a via hole (not shown) similar to the step
The film resist 207 is exposed through the mask of No. 2 and developed to form a plating mask 207a for the front surface copper foil 202, electrolytic copper plating is performed using the back surface copper foil 203 as a plating electrode, and the via hole 206 is filled with copper plating. A 25 μm via stud 208 having substantially the same thickness as the polyimide sheet 201 was formed. As shown in the figure, the plating mask 207a is formed so as to expose from the center of the via hole 206 to a part of the surface copper foil 202 on the periphery of the opening.

As shown in FIG. 3G, after the film resist 207a used in the step of FIG. 2F is once peeled off,
A resist 209 is newly applied and dried, and a connection pad formation region 214a and a groove-shaped wiring pattern are formed by a so-called photolithography formation process of exposure and development through a wiring pattern formation mask including connection pads (not shown). A region 212a is formed. Using this as a plating mask, copper electroplating was again performed to a thickness of 10 μm in the same manner as in the step of FIG.

As shown in FIG. 3H, after the resist 209 on the front surface and the protective film 205 on the back surface are peeled off, a resist 210 is applied to the back surface and dried to form a wiring pattern including connection pads (not shown). A wiring pattern including a connection pad was formed in a positive shape by exposing and developing through a formation mask.

As shown in FIG. 3I, the backside resist 2
Copper was etched using 10 and the wiring plating on the surface as an etching mask to separate the wiring film, and the back surface resist 210 was peeled off. As a result, the wiring pattern 212 and the connection pad 214 are formed on the front surface, and the wiring pattern 211 and the connection pad 21 serving as a power supply pattern are formed on the back surface.
4 and 4 were formed.

As shown in FIG. 3J, a resist 213 was applied to the back surface and the connection pad portion 214 was exposed by a photoetching process. As shown in FIG. 3 (k),
Electroless tin plating 215 was performed using the resist pattern 213 formed in step (j) as a plating mask.

As shown in FIG. 3 (I), the resist 213 on the back surface used in the step (k) was finally peeled off, and a series of manufacturing steps were completed. As a result, the wiring pattern 212 and the connection pad 214 are provided on the front surface, and the wiring pattern 211 and the connection pad 214 which are the power supply pattern are provided on the back surface, and the metallization by tin plating 215 is performed on the connection pad 214 and the wiring pattern 212 on the front surface. A wiring sheet 200 subjected to the above was created.

(3) Method of Creating Wiring Module FIG. 4 shows the adhesive sheet 100 with a via made in the manufacturing process of FIG. 1 and the two wiring sheets 200 made in the manufacturing process of FIGS. 2 and 3. It is a perspective view showing a state before stacking. In the wiring layer of the wiring sheet 200, the wiring sheet 200A running in the X direction and the wiring sheet 200B running in the Y direction are opposed to each other, and the connection pads 214 are provided on the respective sheets.
The adhesive sheet 100 is positioned such that the via metal portion 104 provided on the adhesive sheet 100 and the via metal portion 104 are overlapped with each other, and pressure-bonded and heated.

The pressure at the time of pressure bonding is 2 MPa (20 kg / cm
² ) When heated at 240 ° C. for 10 minutes, the tin 215 (not shown) which is the surface metal of the connection pad 214 provided on the wiring sheet 200 is first melted and the adhesive sheet 1
Gold, which is the via metal 104 of 00, is melted. As the concentration of gold in tin increases, the η phase of the intermetallic compound grows, the melting point of the metal increases, and the joint is solidified to complete the joint.

Next, when the temperature is raised to 300 ° C. and heated for 10 minutes, the glass transition point (Tg) of the thermoplastic polyimide, which is the material of the adhesive sheet 100, exceeds 250 ° C., so the resin flows and the adhesion between the wiring sheets 200 is made. Is completed. At this time, an ε phase is also generated in the alloy phase of the joint portion, the melting point further rises, and a strong connection is established. Thus, the intended wiring module 300 was obtained.

FIG. 5 (a) is a partially transparent plan view of the wiring module 300 thus obtained, and FIG. 5 (b) is a sectional view taken along line AA 'in FIG. 5 (a). Accordingly, the structure of the wiring module 300 will be described in more detail. The uppermost layer and the lowermost layer of the wiring module 300 are formed on the peripheral portion of the circular connection pad 214 by the polyimide sheet 201.
Except for the wiring isolation region where the surface of the power source is exposed, almost the entire surface is covered with a copper conductor layer having a thickness of 2 μm and the power supply pattern 211 is formed.
And three insulating layers each having a thickness of 25 μm (thermosetting polyimide 201 / thermoplastic polyimide 101 / thermosetting polyimide 201) as an inner layer, and a width of 30 μ between them.
m and 10 μm thick X and Y wirings 212a and 212b are arranged orthogonally. A so-called stripline structure is realized, and a structure suitable for impedance matching can be realized.

Each wiring layer has a via metal 20 of 30 μm in diameter via a connection pad 214 of 150 μm in diameter.
8 are connected. Therefore, the dimensional margin required for connecting the upper and lower layers can be ± 60 μm.

<Embodiment 2> FIG. 6 is a cross-sectional process diagram for manufacturing a multilayer wiring module by further increasing the number of wiring layers. As shown in FIG. 3A, one wiring module 300 for one pair of signals shown in FIG. 5 is laminated on the upper and lower sides of the adhesive sheet 100 shown in FIG.
Next, as shown in FIG. 7B, the connection pad 214 and the via metal 104 are aligned, and then pressure-bonded and heated. As a result, the wiring module 40 in which the two sets of wiring modules 300 are joined and fixed with the single adhesive sheet 100 is provided.
0 was produced.

In principle, this manufacturing method can be used to stack the wiring modules 300 in any number of layers. Moreover, since each wiring module 300 can be inspected at the stage of formation and defective products can be selected, a wiring board having a multilayer structure can be used. It is a method suitable for manufacturing a multi-layer substrate capable of preventing a decrease in yield.

In order to make the wiring layers multi-layered, in this example, the wiring module 300 was prepared in advance, and these were laminated via the adhesive sheet 100. It goes without saying that the wiring sheets 200 and the adhesive sheets 100 may be alternately laminated and laminated in a required number, and may be collectively pressure-bonded and heated.

<Embodiment 3> FIG. 7 shows a substrate structure for obtaining a practical wiring board. To explain from the upper layer, the uppermost layer is a connection pad for mounting components such as an LSI chip. A surface layer 500 having a metallization layer 515 (such as a Ni alloy) formed on the surface of the surface layer 500;
The third layer is the third wiring module layer 300 and the surface layer 500.
It is the adhesive sheet 100 for connecting with. The fourth layer is an adhesive sheet 100 for connecting the lower matching layer 600 and the upper layer, and the matching layer 600 is a layer for achieving a dimensional matching of the wiring density with the printed circuit board 700 of the lowermost layer.

The lowermost printed circuit board 700 is used to attach rigidity to the wiring board and at the same time to attach a connection terminal to an external circuit. The thermal expansion coefficient of the printed circuit board 700, which is mainly composed of glass cloth and epoxy resin, is about 25p.
pm, and the difference in expansion coefficient from the thermal expansion coefficient of 20 ppm of polyimide is small. Therefore, the wiring module 300
The thermal stress generated after bonding is small and the warp of the substrate is small. This has an advantage that the thermal stress generated when the wiring module 300 is bonded to a ceramic substrate having a thermal expansion coefficient of about 4 ppm can be reduced to about 1/3.

<Embodiment 4> FIG. 8 shows a multi-layer wiring board assembled by the procedure shown in FIG.
9 is a perspective view showing the structure of a multi-chip module in which 0 is mounted by flip chip bonding and an input / output pin 701 is attached to the back surface of the printed board 700. FIG.

[0044]

As described above in detail, according to the present invention, the intended purpose can be achieved. That is, an adhesive sheet in which a via metal is embedded in a thermoplastic resin sheet in advance is used, and a plurality of wiring sheets with wiring patterns are thermocompression-bonded to produce a multilayer wiring board, so that the electrical conductivity between wiring sheets is increased. Since reliable connection is achieved and no reaction gas is generated from the adhesive material, bubbles are not generated at the adhesive interface.

At this time, a material whose bonding temperature of the metal used for electrical connection between the upper and lower layers is lower than the glass transition point of the thermoplastic resin used as the adhesive is used, and the bonding temperature of the metal and the glass of the thermoplastic resin are used. Each sheet is thermocompression bonded by two-stage heating at a temperature above the transition point. This can prevent the adhesive resin from flowing into the interface of the metal joint,
The electrical connection of the via can be ensured.

On the other hand, as a wiring sheet, processing is started from a sheet in which metal foils are preliminarily adhered to both sides of a resin sheet, and a wiring pattern in which at least 70% or more of the metal conductor on at least one side is left is formed, and the dimension due to moisture absorption and temperature change of the resin. Change 0.
It can be reduced from 2% to 0.02% or less. This is 200m
Calculating the dimensional change from the center of the m-square wiring sheet, 2
00 μm corresponds to the effect of being able to reduce it to 20 μm, and the dimensional margin provided to the bonding pad could be reduced by this amount. As a result, the diameter of the wiring pad required to reliably connect the wiring layers can be reduced by about one digit, and a sheet wiring board suitable for high-density wiring can be obtained.

Further, by using this method, it becomes easy to modularize each element of the wiring board, and the impedance matching is performed by sandwiching the signal wirings in the XY directions orthogonal to each other in the power supply layer, which is a so-called stripline structure. It is possible to give flexibility to the design and manufacturing of the wiring board, for example, by forming the wiring layer into a module, or combining wiring patterns having different functions as needed to form a circuit board.

[Brief description of drawings]

FIG. 1 is a process diagram showing a cross-sectional view of a manufacturing process of an adhesive sheet used in the present invention for each process.

FIG. 2 is a process drawing showing a manufacturing process of a wiring sheet used in the present invention as a change in a sectional structure of the sheet for each manufacturing process.

FIG. 3 is a process drawing that similarly shows the manufacturing process of the wiring sheet as a change in the sectional structure of the sheet for each manufacturing process.

FIG. 4 is a partial perspective view showing a state of a wiring board according to the present invention before being laminated.

5A and 5B are a partially transparent plan view and a sectional view showing a state after a wiring board according to the present invention is laminated.

FIG. 6 is a partial cross-sectional view showing an example in which the wiring board according to the present invention is further multilayered.

FIG. 7 is a partial cross-sectional view of a board structure showing an application example of the wiring board according to the present invention.

FIG. 8 is an external view of a module showing an example in which a wiring board according to the present invention is applied to a multichip module.

FIG. 9 is a partial perspective view of sheets before lamination showing a method for laminating wiring sheets according to a conventional technique.

FIG. 10 is a partial cross-sectional view of a wiring sheet according to a conventional technique before being laminated.

FIG. 11 is a partial cross-sectional view of a wiring sheet according to a second example of the prior art before being laminated.

FIG. 12 is a partial cross-sectional view of a wiring sheet according to a second example of the prior art after being laminated.

[Explanation of symbols]

 100 ... Adhesive sheet, 101 ... Thermoplastic polyimide, 102 ... Copper plate, 103 ... Via hole, 104 ... Via metal, 200 ... Wiring sheet, 200A ... X wiring sheet, 200B ... Y wiring sheet, 201 ... Polyimide sheet, 202, 203 ... Copper foil, 204, 209, 210, 213 ... Resist, 205 ... Protective tape, 206 ... Via hole, 206a ... Via hole forming region, 207 ... Film resist, 207a ... Film resist mask, 208 ... Via stud, 211 ... Power supply pattern, 212 ... Wiring pattern, 212a ... X wiring pattern, 212b ... Y wiring pattern, 214 ... Connection pad, 214a ... Connection pad forming area, 215 ... Tin plating, 300, 400 ... Wiring module, 500 ... Surface layer, 514 ... LSI connection pad , 15 ... Ni alloy metallization, 600 ... Matching layer, 700 ... Printed circuit board, 701 ... Input / output pin, 800 ... LSI, 900 ... Power supply layer, 901 ... Polyimide sheet, 901a ... Adhesive layer (uncured polyimide), 902 ... Wiring pattern , 903 ... Via part, 904 ... Connection pad, 905 ... Via hole, 910 ... X wiring layer, 920 ... Y wiring layer, 930 ... Ground layer, 940, 960 ... Wiring sheet, 950 ... Adhesive layer.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masayuki Kyoi 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa, Ltd.

Claims (13)

[Claims] 1. A laminate of a plurality of sheet-shaped wiring circuit boards each having a wiring layer disposed on both sides of a thermosetting resin layer and conductor vias penetrating the resin layer. An electronic circuit board in which each wiring layer is alternately insulated by an insulating layer of a heat-resistant thermoplastic resin layer and a thermosetting resin layer to form a laminated structure. 2. A laminated body in which a plurality of wiring sheets having wiring layers provided on both surfaces of a thermosetting resin layer and via studs penetrating the resin layer are laminated. In the electronic circuit board, the connection between the wiring sheet resin layers constituting the laminate is adhered and connected via an adhesive sheet made of a thermoplastic resin layer having heat resistance, and the electrical connection between the wiring sheets is made. , Which are connected via a conductive via metal disposed on the adhesive sheet. 3. A conductor comprising a wiring layer disposed on one surface of the wiring sheet as a power source layer and a wiring layer disposed on the back surface serving as a signal wiring layer, the signal wiring layer sides facing each other, and the conductors. The electronic circuit board according to claim 1 or 2, further comprising a wiring module that is laminated with an adhesive sheet on which a via metal is arranged. 4. The multi-layer wiring module, wherein the wiring module is used as a unit wiring module, and a plurality of the unit wiring modules are laminated by interposing an adhesive sheet on which conductive via metal is arranged. Or 2
Electronic circuit board as described. 5. The wiring layer disposed on the wiring sheet, wherein the conductor layer on the power source layer side that constitutes the outer surface of the wiring module occupies at least 70% of the entire surface area. Electronic circuit board. 6. The signal wirings formed inside the two wiring sheets constituting the unit wiring module are XY
6. The electronic circuit board according to claim 3, wherein the electronic circuit board is orthogonal to the direction and has a structure in which these intersecting signal wirings are sandwiched by power supply layers on both back surfaces to perform impedance matching. 7. The conductive via metal formed on the adhesive sheet comprises at least a joint portion made of gold, and the joint portion of a connection pad formed on a wiring sheet connected to the conductor via joint portion is made of tin. 7. The electronic circuit board according to claim 3, wherein the electrical connection between the two is formed by a gold-tin diffusion layer. 8. The electronic circuit according to claim 3, wherein when the wiring module is connected to a rigid base substrate, a difference in thermal expansion coefficient between the wiring sheet and the base substrate is 10 ppm or less. substrate. 9. A step of forming a wiring sheet having wiring layers on both surfaces of a thermosetting resin layer and connection pads connected to via studs penetrating the resin layer, and a conductive via metal. The step of forming an adhesive sheet composed of a thermoplastic resin layer having a pattern, and the via connection portion on the adhesive sheet and the connection pad formed on the wiring sheet are aligned, and the adhesive sheet is provided on both sides thereof. A method of manufacturing an electronic circuit board, comprising: a step of laminating wiring sheets; and a step of heating the laminated body under pressure to make electrical connection in the laminated body and connection between resin sheets. 10. The thermoplastic resin layer forming the adhesive sheet is formed of a thermoplastic resin sheet having a glass transition temperature Tg higher than a bonding temperature of a bonding metal for electrically connecting in the laminate. 9. The method for manufacturing an electronic circuit board according to item 9. 11. The step of heating the laminate under pressure to make the electrical connection in the laminate and the connection between the resin sheets is performed at a joining temperature of a joining metal forming the electrical connection and at a temperature higher than the joining temperature. 11. The method for manufacturing an electronic circuit board according to claim 9 or 10, which comprises a step of providing a temperature profile in which the bonding temperature of the adhesive resin is two-step heating. 12. The thermosetting resin layer forming the wiring sheet is made of thermosetting polyimide, and the thermoplastic resin layer forming the adhesive sheet is made of thermoplastic polyimide. The method for manufacturing an electronic circuit board as described in 1. 13. The method of manufacturing an electronic circuit board according to claim 9, wherein the step of forming the adhesive sheet is a step of forming the tip of the via by projecting a predetermined height from the surface of the sheet.