JPH0817219B2 - Forming device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a forming device for bending an external lead of a semiconductor device into a predetermined shape.

[0002]

2. Description of the Related Art Conventionally, in order to mold an external lead extending outward from each resin-sealed portion of a lead frame in which a semiconductor chip is resin-sealed into a predetermined shape by a press machine, after the resin-sealing, the frame portion is formed. The semiconductor device was separated from the above, and the external lead was bent in a separate process. Alternatively, in a processing device that feeds a semiconductor chip-sealed lead frame in a predetermined direction and performs predetermined processing such as cutting and bending on this feed path in multiple stages, one die can perform multiple stages of processing. I was going to do it.

[0003]

However, when the semiconductor device is separated from the frame portion of the lead frame after the semiconductor chip is sealed with resin and the bending process for bending the external lead is performed, the semiconductor device is separated from the frame portion. It is necessary to transfer the semiconductor device to the forming device, or once stored in a box etc. and then bent.
There are problems that the man-hours increase and the device becomes complicated. Further, in the processing device that performs multi-step processing with one mold described above, when a partial defect such as severe wear of a process part with a mold occurs, the entire mold is removed and inspected,
Repair is required. Therefore, an object of the present invention is to provide a forming device capable of efficiently forming an external lead of a semiconductor device into a predetermined shape and easily inspecting and repairing a die used for forming the external lead. .

[0004]

The present invention eliminates the above-mentioned problems and has the following configuration. That is, in the present invention, a plurality of unit lead frames are connected,
Gold the semiconductor chip mounted on the lead frame units subjected to required processing a strip of lead frames sealed with a resin
In a forming apparatus that conveys between molds and molds the external leads extending outward from each resin sealing part into a predetermined shape with a mold, a supply mechanism that supplies the lead frame, and a lead frame is carried in by the supply mechanism. The loading section,
A first transport mechanism for supplying the lead frame carried into the carry-in section to the die, and a first cutting die for separating the external lead from the frame section, except for the hanging pins of the resin sealing section of the lead frame. And at least a molding die for bending the base portion and a molding die for shaping the tip portion of the outer lead of the lead frame fed from the first cutting die,
A plurality of molding dies for bending the external leads into a predetermined shape in multiple stages, and the hanging pins of the lead frame fed from the plurality of dies are cut to separate the semiconductor device and the frame part. A second cutting die, a plurality of the first cutting die, the plurality of molding dies, and the second cutting die.
It is divided into a mold group, comprising: a plurality of press mounted to each other in the plurality of tool groups, a semiconductor device, separated by the second cutting die, and a discharge mechanism for discharging the adsorbed Then, the carry-in section, the first cutting die, the plurality of molding dies, and the second cutting die are linearly positioned and disposed, and the first cutting die and the is disposed on each of a plurality of molding die, the holding frame portion of the lead frame supplied by the first conveying mechanism has a feed arm provided to be conveyed lead frame,
A second transfer mechanism having a drive unit of the feed arm for carrying the lead frame into the die of the next stage by reciprocally driving the feed arm in synchronism with the operation of the press machine is provided. And

[0005]

According to the forming apparatus of the present invention, the first
The external leads are separated from the frame portion by the cutting die of (1) and the semiconductor device is supported by the hanging pins. Then, with the plurality of semiconductor devices supported by the frame portion, the external leads can be molded into a predetermined shape such as a J shape by a plurality of molding dies. The plurality of semiconductor devices connected to the frame portion with the hanging pins hold the frame portion by the first and second transfer mechanisms until the external leads are formed into a predetermined shape and finally separated. It can be transported. Therefore, the frame portion also functions as a guide portion for positioning the semiconductor device, and a large number of semiconductor devices can be efficiently and accurately sequentially supplied to a plurality of linearly arranged molds.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT A preferred embodiment of the present invention will be described below in detail with reference to the accompanying drawings. FIG. 1 is a front view of a forming device 10 for forming and processing external leads of a semiconductor device, and FIG. 2 is a plan view thereof. This forming device 10
Are five presses 10A, 10B, 10 on the base 8.
C, 10D, and 10E are linearly arranged. A supply mechanism 14 for supplying the lead frame 12 cut to a predetermined length is provided near the first press machine 10A, and a semiconductor device discharge mechanism 16 is provided to the fifth press machine 10E.
Are juxtaposed. The lead frame 12 supplied to the first press machine 10A is obtained by sealing a semiconductor chip with resin, connecting a plurality of unit lead frames, and cutting the unit lead frame to a predetermined length. The lead frame 12 is housed in the magazine 14a in a stacked state.

Reference numeral 14A is a magazine supply device, which houses a plurality of magazines 14a. In the magazine supply device 14A, the magazines 14a are stored in parallel on the supply line M with respect to the feed position L of the lead frame 12, and are pushed in the supply direction by the supply means (not shown). When the magazine 14a is sent to the supply position m, the lift device 14 located below the magazine 14a.
The lead frame 12 is pushed upward by c, and the uppermost lead frame 12 is sent by the chuck device 18 to the feed position L, which is the lead frame carry-in portion. Then, when the uppermost lead frame 12 is fed, the lead frame 12 is pushed up by one lift by the lift device 14c. Then, when the lead frame 12 in the magazine 14a disappears, the magazine 14a is sent to the right in FIG. 2 by the discharging means (not shown), and the empty magazine 14a is counter-supplied by the sending means (not shown). Sent in the direction.

The lead frame 12 at the feed position L is
It is sent in the longitudinal direction of the lead frame 12 (arrangement direction of each press machine) by the cylinder 20 which constitutes the first transport mechanism, and is supplied to the first press machine 10A.

Each of the first press machine 10A to the fourth press machine 10D is provided with a second transfer mechanism for supplying the lead frame 12 to each press machine. The second transport mechanism is provided with the feed arms 22 on the die supply side and the die discharge side of each press machine (note that the fourth press machine 10D is provided only on the supply side). The feed arms 22 are linked to the cylinders 24, respectively, and can reciprocate simultaneously. The feed arms 22 hold the cradle portion of the frame portion 12 a of the lead frame 12 in synchronization with the operation of the press machine. Are provided so that they can be transported. Also, the fourth press 10D
The fifth pressing machine 10E is provided with a plurality of feed rollers 26 arranged in pairs on both sides of the die.
6 holds the cradle portion which is a part of the frame portion 12a of the lead frame 12 and conveys it by rotating.

Next, a bending process and a cutting process by each of the press machines 10A to 10E will be described. An example is shown in which the external lead 30a of the semiconductor device is J-bent. Further, FIGS. 3A to 3D are cross-sectional explanatory views of a plurality of molding dies showing a bending state in each step. First
With the press 10A, the resin burr is removed and the dam bar 12 is used.
The cutting and removal of b are performed (see FIG. 4).

In the second press machine 10B, a cutting step of cutting the external lead 30a into a predetermined length by the first cutting die, and a two-step bending step (first bending step, first bending step by the two forming dies). 2 bending step). The first bending step is the third
External lead 30 extending horizontally as shown in FIG.
With the tip of a left (in a free state), the intermediate portion (which may include the base portion) is clamped by the die 32B and the knockout 34B. The tip of the external lead 30a is attached to the die 3
The punch 36B is bent at a substantially right angle so as to follow the curved surface of 2B. In the second bending step, as shown in FIG. 3B, the base of the external lead 30a is attached to the die 33B and the knockout 35.
It is clamped by B, and the bending surface 33b of the punch 37B and the die 33B.
The outer lead 30a is bent at 45 degrees.

In the third press machine 10C, the third bending step is performed by one molding die. In the third bending step, as shown in FIG. 3C, the semiconductor device 30 is supported by the die 32C and the external lead 30 is mounted by the knockout 34C.
By pressing the base portion of a, the bending punch 36C is brought into contact with the surface of the outer lead 30a without slipping in the bending direction of the outer lead 30a by a cam mechanism (not shown) or the like, and is lowered in an arc shape to move the outer lead 30a. Fold it almost vertically.

In the fourth pressing machine 10D, two molding dies perform preliminary curling for bending the tips of the outer leads 30a in an arc shape and molding curling (fourth bending step). Put block 3 for both pre-curling and molding curling
The upper surface of the semiconductor device 30 and the base of the external lead are pressed by 4D, and the external lead 30a is pressed by the bent portion 32d of the die 32D.
Bend the tip in an arc. The curvature of the bent portion 32d of the die 32D is different between the preliminary curling and the molding curling. Reference numeral 38 is an eject pin that projects the semiconductor device 30 after curling.

In the fifth press machine 10E, the second cutting die separates the bent semiconductor device 30 from the lead frame 12. In the above steps,
As shown in the drawing, in a state where the frame portion 12a including the cradle portion of the lead frame 12 and the corner portion of the semiconductor device 30 are connected by the hanging pins 12c, each cutting is performed by the first to fourth press machines 10A to 10D. And each bending process. In the fifth press machine 10E described above, the semiconductor device 30 separated by the second cutting die is conveyed onto the tray 42 by the robot hand 40 having the suction cup 40a.
On the other hand, the cradle portion of the frame portion 12a is discharged by the feed roller 26 in front of the fifth pressing machine 10E.

Next, the discharge mechanism will be described. The robot hand 40 sucks the semiconductor device 30 with the suction cup 40a, moves up (shown by arrow a in FIG. 1), and then moves horizontally to a predetermined position (shown by arrow b in FIG. 2) at this predetermined position. The semiconductor device 30 is placed on the tray 42 by descending (indicated by arrow c in FIG. 1) to release the suction by the suction cup 40a. The trays 42 are stacked on a lift device (not shown) in the lower space 46 of the fifth press machine 10E, and the uppermost tray 42 is supported by the pushing means 48 to support the storage frame 50 by one row.
2 is configured to be extruded in order. Therefore, the tray 42 is pushed out by the robot hand 40.
This is performed while the semiconductor device 30 is placed on the tray 42 and the next semiconductor device 30 is sent in synchronism with the movement of the. Therefore, the robot hand 40 repeats the same movement, so that the semiconductor devices 30 are sequentially transferred to the tray 42.
Can be stored. Then, when the tray 42 becomes full, the supporting device 52 supporting the tray 42 descends by one stage of the tray 42, the next tray 42 is fed onto the previous tray 42, and operates in the same manner as above. Two trays 42 can be arranged side by side in the storage frame 50, and when stored in one row, the storage frame 50 slides along the rail 54 and can be stored in the other side. Then, the frame portion 12a is discharged by the roller 26.

In the above forming device, each group of molds divided into five groups as described above corresponds to five groups.
It is installed in two press machines and a series of steps
Although the knitting process is performed by one press machine, the bending process and the cutting process can be appropriately performed in order to simplify the structure of the mold. Also, in the case of Z-bending of the external leads of the semiconductor device, the bending step and the cutting step may be performed by each press machine as described above.
Although the present invention has been variously described with reference to the preferred embodiments, the present invention is not limited to these embodiments, and it goes without saying that many modifications can be made without departing from the spirit of the invention. Is.

[0017]

As described above, according to the forming apparatus of the present invention, the external leads are separated from the frame portion and are supported by the hanging pins, so that a plurality of semiconductor devices are supported by the frame portion. The external leads can be molded into a predetermined shape such as J-shape. Then, the plurality of semiconductor devices connected to the frame portion with the hanging pins can be carried by holding the frame portion until the external leads are formed into a predetermined shape and finally cut off individually. Therefore, the frame portion also functions as a guide portion for positioning the semiconductor device, and a large number of semiconductor devices can be efficiently and accurately sequentially supplied to a plurality of dies arranged linearly. It has a remarkable effect that the productivity of the device can be improved. Further, since the dam bar cutting process, the external lead bending process, etc. are carried out by a plurality of mold groups which are mounted corresponding to a plurality of press machines, respectively, even if a defect occurs in the mold for each process group. However, it is sufficient to repair only the mold that has a problem, the repair is easy, and the apparatus can be stopped for a short time. Further, although the bending process of the external leads is quite complicated like J-bending, since this bending process can be divided and performed by a plurality of mold groups, the structure of the mold is simple and the processing is easy. Yes, the processing time of the mold can be shortened.

[Brief description of drawings]

FIG. 1 is a front view showing an embodiment of a forming device for bending an external lead according to the present invention.

FIG. 2 is an explanatory plan view of the embodiment shown in FIG.

FIG. 3 is a process diagram illustrating a process of an example according to the present invention.

FIG. 4 is a schematic explanatory diagram of a lead frame.

[Explanation of symbols]

 10A-10E Press machine 12 Lead frame 12a Frame part 12c Hanging pin 14 Supply mechanism 16 Discharging mechanism 18 Chuck device 22 Feed arm 24 Cylinder 26 Feed roller 30 Semiconductor device 30a External lead 32B, 32D die 40 Robot hand 42 Tray L Feed position

Claims (1)

[Claims] 1. A plurality of unit lead frames are connected,
Gold the semiconductor chip mounted on the lead frame units subjected to required processing a strip of lead frames sealed with a resin
In a forming device that conveys between molds and molds external leads extending outward from each resin sealing part into a predetermined shape with a mold, a supply mechanism that supplies the lead frame and a lead frame that is carried in by the supply mechanism. And a first transfer mechanism for supplying the lead frame carried into the carry-in section to the mold, and the hanging pin of the resin sealing section of the lead frame,
A first cutting die that separates the external lead from the frame portion, and a molding die that bends at least the base portion and a molding die that forms the tip portion of at least the outer lead of the lead frame fed from the first cutting die. A plurality of molding dies including a mold and bending the external leads into a predetermined shape in multiple stages, and the hanging pins of the lead frame fed from the plurality of molding dies to cut the semiconductor device and the frame portion. a second cutting die for separating the bets, the first cutting die, said plurality of molding die, said second cutting die is divided into a plurality of tool groups, the plurality of tool groups To
A plurality of press machine is mounted on each other, a semiconductor device, separated by the second cutting die, comprising a discharge mechanism for discharging adsorbed, the loading unit, the first cutting die, The plurality of molding dies and the second cutting dies are arranged linearly, and the first cutting dies and the plurality of molding dies are arranged.
Is disposed on each of said first holding frame portion of the lead frame supplied by the transport mechanism comprises a feed arm provided to be conveyed to the lead frame, the operation of the press the said transmission Ri arm A forming apparatus provided with a second transfer mechanism having a drive unit of a feed arm for loading and unloading a lead frame into a die of the next stage by reciprocally driving all at once in synchronism with the above.