JPS60130849A - Press die for processing lead for semiconductor device - Google Patents

Abstract

PURPOSE:To process a lead efficiently with high accuracy, and to improve safety and workability by carrying a lead frame to a tray slidably mounted to a guide plate fitted on the bottom force side and regulating the position of the tray by a center pin and a pilot pin. CONSTITUTION:A lead frame 17 to which a plurality of IC chips 15 are disposed at regular intervals is received in a recessed section 13a in a tray 13, and positioning pins 21 fitted to the base of the recessed section in the tray 13 are fitted into positioning holes 18 formed to the lead frame 17. Consequently, the lead frame 17 is carried in the recessed section 13a in the tray 13 without positional displacement. The tray 13 is inserted into a recessed section 14a in a guide plate 14 mounted to the bottom force side, and the tips of center pins 22 are brought into contact with V grooves 13b formed to the side surface of the tray 13. The tray 13 is transferred at every one pitch by pushing the tray in the direction of the arrow A as shown in the figure, and each lead 16 for the IC chips 15 is processed simultaneously at a time.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a press mold for processing leads of semiconductor devices for cutting and bending leads of semiconductor integrated circuits (hereinafter simply referred to as IC) into a predetermined shape. It is related to.

Conventional configuration and its problems Traditionally, IC lead processing has been done for small quantity production.

Press processing was performed on a single IC cut out from a lead frame. Pressing a single IC requires the use of fingertips or a tool such as a bottle set to put it in and out of the mold due to its small shape, resulting in poor workability and poor I/O in each process.
This tends to cause deformation of the C leads, resulting in the production of defective products.

OBJECTS OF THE INVENTION The present invention overcomes the above-mentioned drawbacks of the prior art, and
It is an object of the present invention to provide a press mold for processing leads of a semiconductor device with little lead deformation and high productivity.

Structure of the Invention In order to achieve the above-mentioned object, the present invention provides a tray for carrying and transferring a lead frame in which a plurality of IC chips are arranged at predetermined intervals on a guide plate provided on a lower mold, The moving distance of this tray is determined by the center pin provided on the lower mold side to correspond to the multiple IC chips provided in the above room 7L/-, and the die of each process constituting the lower mold. The lead frame is configured to be regulated by a pilot pin that fits into a pilot hole corresponding to the IC chip on the lead frame, so that lead processing in each process can be performed simultaneously by one stroke of the upper die. It is characterized by the following.

DESCRIPTION OF EMBODIMENTS The present invention will be described below based on embodiments shown in the drawings. 1 to 3 show a press mold structure according to an embodiment of the present invention, and FIG. 4 shows an IC lead frame structure. Figures 1 to 4
In the figure, the upper mold boulder 11/rC includes a punch 3 for each process and four guide bins 9 arranged to surround it.
A stripper plate 8 is provided which is fixed through the punch tip 1<-)4' (5 bucking play) 10'ii and guided by the guide bin 9. A knockout pin 5 is provided inside the punch 3 for each of the above steps, and the knockout pin 6 is urged downward by a spring 6. The spring 6-screw plug 7 is installed in the upper mold holder 1. On the other hand, the lower mold boulder 2 has a die plate 1 that holds the dies 11 for each process so as to correspond to the punch 3.
2 is fixed, and a guide plate 14 is provided on this guide plate 12 so that it can move slightly up and down.

The tray 13 is configured to slide within a recess 14a provided on the upper surface of the guide plate 14. The guide plate 14 has center pins 22 at the beginning and end, respectively, so that the eight center pins 22 continue to press the side surface of the tray 13 by the pressing force of a spring 23. The spring 23 is held inside the guide plate 14 by a screw plug 24, and the suppressing force of the spring 23 can be adjusted by the screw plug 24.

On the side of the tray 13, there is an I of the IC lead frame 17.
V grooves 13b corresponding to the number of C chips 16 are provided,
The tip of the center pin 22 comes into contact with this V-groove tab.

Furthermore, an IC lead frame 1 is mounted on the upper surface of the tray 13.
It has a recess 13a for placing 7, and this recess 13a
A positioning pin 21 for positioning the IC lead frame 17 is installed on the bottom surface of the IC lead frame 17. The positioning pin 21 is fitted into the positioning hole 18 of the IC lead frame 17.

The tray 13 is fed by hand from the outside of the mold and is fed one pitch at a time using the squirrel feeling created by the center pin 22 and the V-groove 13b, so safety is high. The punch 3 and die 11 used in each of the above steps have standardized shapes and mounting dimensions other than the press-processed surfaces to facilitate parts replacement. The first step is a cutting die, and the second to fourth steps are a bending die.

Since the punch 3 and the die 11 are respectively fixed on the same haunch plate 4 or the same die plate 12, dimensional variations between the respective processes are reduced, and dimensional accuracy is further improved.

In order to improve the vertical precision of the mold, the guide bin 9 slides in the guide hole 26 in addition to being guided by the guide post 2a+guide bush 1a.

To position the IC chip 16 during processing, a pilot bin 19 is protruded from the stripper plate 8 that constitutes the upper mold, and the pilot bin 19 is placed between the IC lead frame 17 and the pilot bin 19.
It is designed to be held by fitting into the pilot hole 20 of.

Further, a long hole 130 is provided in the bottom surface of the tray 13, and when the upper die is lowered during processing, the stripper plate 8 presses the tray 13 and the tie 11 enters therein.

In such a configuration, as shown in FIG. 4, a plurality of IC chips 16 are arranged at predetermined intervals, and pilot holes 2° corresponding to the intervals are provided at the start and end ends of the lead frame 17. A positioning hole 18 is provided in each of the lead frames 17, and the lead frame 17 is inserted into the recess of the tray 13.
a, and the positioning pin 21 provided at the bottom of the recess of the tray 13 is fitted into the positioning hole 18 provided in the lead frame 17. As a result, the lead frame 1
7 is held in the recess 13 & of the tray 13 without any displacement.

Next, the guide plate 1 with the tray 13 provided on the lower mold side
A plurality of IC chips 16 are inserted into the recesses 142L of No. 4 and provided on the lead frame 17 on the side surface of the tray 13.
The V-groove 13bVc provided to correspond to the spacing is brought into contact with the tip of the center pin 22, which is springed by the spring 23'. and.

By pushing the tray 13 in the direction of the arrow shown in the figure, the tray 13 is moved between the V groove 13b and the center bin 22.
It is transferred one pitch at a time by using the quick feeling.

When the tray 13 is transferred one pitch at a time, the upper and lower molds move up and down relative to the IC chip 16. At this time, the upper and lower molds include a cutting mold for cutting the leads 16 of the IC chip 16, a bending mold for the leads 16, and a molding mold, which are arranged in this order.

Therefore, when one stroke of the upper and lower molds is performed, each lead 16 of the IC chip 16 provided on the lead frame 17 is
As shown in Figures a to e, they are processed simultaneously at one time.

Effects of the Invention As described above, the present invention includes a lead frame in which a plurality of semiconductor chips are arranged side by side on a tray that is slidably provided on a guide plate provided on the lower mold side, and a center corresponding to the tray. Since the position of the tray is controlled by a pin and a pilot bottle that fits into the pilot hole of the lead frame, the position of the semiconductor chips supported by the plurality of molds and the tray and transferred at a constant pitch σ is as follows. Lead processing can be performed with high precision and efficiency. Moreover, semiconductor chips are processed into leads while supported by a lead frame, and are not pressed into individual ICs. Therefore, individual ICs must be moved in and out of molds, and independent molds must be connected in each process. There is no hassle of moving frames,
It has great effects in terms of safety and workability, and therefore leads to less deformation of the leads, and has a great effect in terms of quality.

[Brief explanation of the drawing]

Fig. 1 is a side view showing a fourth embodiment of a press die according to the present invention, Fig. 2 is a plan view of the lower mold of the press die, Fig. 3 is a side view thereof, and Fig. 4 is a side view of the press die. I processed in mold
FIG. 3 is a plan view of the CIJ-de frame. FIG. 6 is an explanatory diagram of the ICIJ-de process. 1... - Ri type holder % 1a... Guide bush. 2°...°...Lower die holder, 2°...Guide post %3...Punch, 4...Punch plate, 6...Knockout bin, 6... ...Spring% 7...Screw plug, 8...
... Stripper plate, 9 ... Guide bin, IQ ... Backing plate, 11 ...
...Gui, 12...Die plate, 13.
・Song/tray, i3a Yu...concavity, 13b...
・V groove, 13c...long hole, 14...guide plate, 14mm old...recess, 16...IC chip, 16...lead , 17° old, +, +- frame, 18... positioning hole, 19... pilot hinge, 20... pilot hole, 2.
1... Positioning pin, 22... Spring for center pin %23... 24... Screw plug, 26... Guide hole. Name of agent: Patent attorney Toshio Nakao and one other person
to 5 e introduction υ

Claims (1)

[Claims] a guide plate that holds a tray on which a plurality of semiconductor chips are mounted on which a plurality of semiconductor chips are arranged at predetermined intervals; and a guide plate that holds a tray on which a plurality of semiconductor chips are placed on the lead frame; a lower mold having a guide plate for positioning the tray; an upper mold having a pilot bin fitted into a pilot hole corresponding to a semiconductor chip on the lead frame that is associated with a plurality of dies constituting the lower mold; The semiconductor chip on the lead frame held on the tray is positioned by the seven turbine turbines provided on the upper mold and the pilot bin, and the leads of the semiconductor chip are simultaneously moved into a predetermined position by a plurality of molds. A press mold for processing leads of semiconductor devices, characterized by being configured to be processed into a shape.