JPH081456B2 - Electronic component inspection device - Google Patents

Description

TECHNICAL FIELD The present invention relates to an inspection device for electronic parts in which conductive parts are formed at regular intervals on a tape-shaped body.

(Prior Art) In recent years, TAB (Tape Autemated Bo) shown in FIGS.
Electronic parts called tape are used.
The TAB tape 1 is handled while being wound on the reel 15. The TAB tape 1 has a conductive portion 3 formed of a conductive pattern or the like on a frame-by-frame basis. A semiconductor integrated circuit or the like is bonded to the conductive portion 3 and cut along the alternate long and short dash line shown in FIG.
Equipped in electronic devices such as watches. Further, perforations 4 are formed on the upper and lower ends of the TAB tape 1.

For the TAB tape 1, it is necessary to inspect whether or not the conductive portion 3 is defective in conductivity. This inspection is performed by a TAB tape inspection device. The TAB tape inspection device is an application filed by the applicant of the present application in Japanese Patent Application No. 1-291731
No. 152480).

 In FIG. 14, reference numeral 10 indicates a TAB tape inspection device.

In the figure, reference numeral 11 indicates the apparatus main body,
The reel 11 is provided with a pair of reel stands 12 and 13. A supply reel 15 is attached to the reel stand 12. This supply reel 15 has TAB tape 1 and space film 1
4 is rolled up. This space film 14 is reel 1
This is to prevent the TAB tape 1 from being damaged when the TAB tape 1 is wound around the 5 and transported.
It is wound so as to intervene between them. An accommodation reel 16 is attached to the reel stand 13. Further, the apparatus body 11 is provided with seven rollers 17 for guiding the space film.

A supply side idle reel 18 and a supply side sprocket 20, and a storage side idle reel 19 and a storage side sprocket 21 are arranged in the apparatus main body 11. Sprocket 20, 21
Is driven by a motor.

Reference numerals 27 and 28 denote tape clamps, and the TAB tape 1 is clamped by the tape clamps 27 and 28.
A sensor 29 for inspecting the feed amount of the TAB tape 1 when inspecting the conductive state of the TAB tape 1 is arranged on the left side of the tape clamp 27.

Reference numeral 23 indicates a conductive state inspecting device, and the conductive state inspecting device 23 is in the vertical direction, and in the direction in which the TAB tape 1 is stretched (hereinafter referred to as XX 'direction) and in the direction orthogonal to the tape 1 (hereinafter referred to as Y). -Y 'direction).

As shown in FIGS. 16 and 17, an inspection jig 50 made of a conductive rubber sheet is provided on the upper surface of the conductive state inspection device 23.
Is provided. The conductive rubber sheet that constitutes the inspection jig 50 has a plurality of conductive path forming portions that form conductive paths in the thickness direction in a pressurized state or in a non-pressurized state, and between the conductive path forming portions. It is composed of an insulating portion that insulates. Specific examples of the structure of this conductive rubber sheet include (1) a structure in which conductive fibers such as metal fibers and carbon fibers are embedded in parallel in the thickness direction in an elastic sheet,
(2) A structure in which conductive rubber containing conductive carbon is alternately laminated, and (3) conductive magnetic particles having a particle size of about 1 to 100 μm are arranged in a thickness direction in an elastic sheet. Examples thereof include the composition contained. Under the conductive rubber sheet, measuring electrodes corresponding to the measured conductive portion 3 of the TAB tape 1 are formed in the form of a printed circuit board or the like. A tester is connected to the inspection jig 50, and the conductive state of the conductive portion 3 of the TAB tape 1 shown in FIG. 13 can be inspected by bringing the TAB tape 1 into contact with the inspection jig 50.

A pressure device 25 is provided on the upper side of the conductive state inspection device 23. The pressurizing device 25 is provided with a pressurizing portion composed of a pressurizing plate and a pressurizing spring, and the pressurizing portion faces the inspection jig 50 of the conductive state inspecting device 23. The pressurizing device 25 can be operated in the vertical direction (hereinafter referred to as ZZ 'direction).

Reference numeral 30 indicates a device for detecting the positions of the TAB tape 1 and the inspection jig 50. The detailed configuration of this device 30
Shown in the figure.

In the figure, reference numeral 31 indicates a position detecting device, which has an L-shape and is fixed to the Y table 32. The Y table 32 is attached to the X table 33 so as to be movable in the Y-Y 'direction, and this Y table 32 is driven by a motor 35. X table 33 is XX '
It is attached to a base 34 so as to be movable in a direction, and the X table 33 is driven by a motor 36.

19 and 20 show the internal structure of the position detection device 31.
As shown in the figure, openings 40 and 41 are formed in the top and bottom surfaces of the tip portion of the head portion 38 of the position detecting device 31. Head
A right-angle prism 42 is provided inside the 38 by being bonded to a support base 43. The right-angle prism 42 reflects light incident from the openings 40 and 41 in the right-angle direction. An objective lens 44 is held and arranged by a lens holder 45 in the reflection direction of the rectangular prism 42. Further, a reflecting prism 46 is arranged at the base end of the head portion 38. A camera and an image processing device 60 are provided in the reflection direction of the reflection prism 46, and the image of the objective lens 44 is picked up by the camera, and this image is processed by the image processing device 60 to perform TAB.
The positions of the tape 1 and the inspection jig 50 are compared.

Reference numerals 48 and 49 denote lighting lamps, and these lighting lamps 48 and 49
Are supported on the top and bottom ends of the head portion 38 by a mechanism (not shown).

 Next, the operation of the TAB tape inspection device 10 will be described.

At the start of the operation of the TAB tape inspection device 10, the pressure device 25 is in a state of moving upward.
The pressurizing unit 25 is separated from the inspection jig 50 provided on the upper surface of the conductive state inspection device 23. Further, the tape clamps 27 and 28 are not in a state of holding the TAB tape 1, but the TAB tape 1 is in a runnable state.

Supply reel by rotating the sprockets 20 and 21
The TAB tape 1 is drawn out from the unit 15, is sent at a predetermined pitch, that is, in units of one frame (inspection unit) according to the route indicated by the alternate long and short dash line, and is wound on the accommodation reel 16. At this time, the space film 14 is guided by the space film guiding roller 17 and wound on the storage reel 16.

The positioning operation of the TAB tape 1 with respect to the inspection jig 50 provided in the electroconductive state inspection device 23 and the operation for inspecting the electroconductive state of the TAB tape 1 will be described with reference to the flowchart of FIG.

When the TAB tape 1 is fed by a predetermined pitch, the TAB tape 1 is stopped (step S ₁ ), the TAB tape 1 is held by the tape clamps 27 and 28, and the portion to be inspected of the TAB tape 1 is fixed, and at the same time, The flatness is maintained (step S ₂ ). At this time, the conductive state inspection device 23 is in a standby position facing the tape 1 away from the tape 1.

Then, together with the Y table 32, the position detection device 31
The head unit 38 of the position detecting device 31 moves to the 16th direction.
As shown in FIG. 17, FIG. 17 and FIG. 18, it is advanced between the TAB tape 1 and the conductive state inspection device 23 (step S ₃ ).

As shown in FIG. 20, the illumination lamp 49 illuminates the periphery of the edge portion of the inspection jig 50 provided on the upper surface of the conductive state inspection device 23. The reflected light from the conductive state inspection device 23 side is
The light enters the head portion 38 through the opening portion 41 and is reflected by the rectangular prism 42 toward the objective lens 44. Further, the light that has passed through the objective lens 44 is reflected by the reflecting prism 46 and guided to the camera, and an image of the edge of the inspection jig 50 is picked up by the camera as an image of the objective lens 44. Then, the position of the edge portion of the inspection jig 50 is stored in the image processing device 60 by image processing (step S ₄ ).

Next, the tape 1 is illuminated by the illumination lamp 48. The reflected light from the tape 1 side enters the head portion 38 through the opening 40 and is reflected by the reflecting prism 42 toward the objective lens 44. Further, the light that has passed through the objective lens 44 is reflected by the reflecting prism 46 and guided to the camera, and the portion of the TAB tape 1 to be inspected is imaged by the camera as an image of the objective lens 44, and the image is processed to be inspected. position detecting (step S _5).

Then, the position of the TAB tape 1 detected by the image processing device 60 is compared with the position of the edge portion of the inspection jig 50 that is already stored, and the portion of the TAB tape 1 to be inspected and the inspection jig 50 are compared. Deviation is determined and the movement of the conductive state inspection device 23 is instructed (step S ₆ ). Of course, if there is no deviation, no instructions will be given.

Then, based on the result of this image processing, the operation of the motor is controlled by the computer, and the conductive state inspection device 23
The move in the X direction and the Y direction to perform positioning with respect to the inspection jig 50 of the TAB tape 1 (step S _7).

Then, the position detecting device 31 is moved to Y ′ together with the Y table 32.
The head portion 38 of the position detecting device 31 is moved backward between the TAB tape 1 and the conductive state inspection device 23 (step S ₈ ).

Next, the conductive state inspection device 23 is raised and then the pressure device 25 is lowered, and the conductive portion 3 of the TAB tape 1 is pressed against the inspection jig 50 by the pressure portion to inspect the conductive state of the conductive portion 3 ( step S _9).

Further, the inspection apparatus 10 to return to the state before the test started (step S _10), the travel of the TAB tape, stop, clamp TAB tape 1 according to a tape clamp 27, pressure device 25
And the conductive state inspecting device 23 is raised to repeat the process of inspecting the conductive state of the conductive portion 3 of the TAB tape 1.

The position detecting device 31 picks up an image of the edge portion of the inspection jig 50 of the conductive state inspection device 23, stores the position of the edge portion, picks up the image of the TAB tape 1, and further the conductive portion 3 of the TAB tape 1.
Normally, the inspection operation of the TAB tape 1 wound on one supply reel 15 is completed, and the TAB tape 1 to be newly inspected is moved to the position of the inspection jig 50.
This is performed when the TAB tape inspection device 10 is restarted after being attached to the tape inspection device 10.

(Problems to be Solved by the Invention) However, since the TAB tape 1 has a manufacturing error and expands and contracts due to temperature change, the conductive portion 3
The dimension between them is not always constant. Therefore TA
Even if the B tape 1 and the inspection jig 50 are positioned before the start of the inspection operation, a dimensional error between the conductive parts 3 of the TAB tape 1 accumulates during the inspection operation, and the inspection jig 50 and the TAB tape 1 become electrically conductive. The deviation from the part 3 is gradually increased. Inspection jig 50 and conductive part 3
If the deviation from the value exceeds a certain value, the inspection cannot be performed. Therefore, the inspection must be interrupted and the TAB tape 1 and the inspection jig 50 must be repositioned.

The inspection can be performed while the deviation between the inspection jig 50 and the conductive portion 3 of the TAB tape 1 is within the allowable range. However, if the deviation of the conductive portion 3 with respect to the inspection jig 50 causes a high inspection. It may not be possible to perform with precision.

The present invention has been made in view of the above conventional problems, and it is not necessary to interrupt the inspection and re-align the TAB tape and the inspection jig, and the electronic component can always maintain the inspection with high accuracy. An object is to provide an inspection device.

(Means for Solving the Problem) An electronic component inspection apparatus of the present invention is a tape running stopping means for running and stopping a tape having conductive parts formed on a surface thereof at regular intervals, and the conductive part. In an electronic component inspecting apparatus, which is arranged so as to oppose to the inspection device and has an inspection jig that comes into contact with the conductive portion and a conductive state inspection means that is connected to the inspection jig and inspects the conductive state of the conductive portion. When the inspection operation is stopped when the jig is separated from the conductive portion, the inspection jig has a first function of comparing the positions of both the conductive portion and the inspection jig, and A second function of comparing the position of the conductive portion on the upstream side in the tape running direction with respect to the conductive portion which is being inspected by the conductive state inspecting means to a previously stored reference position during the inspection operation in the contact state. Position comparison with Means and the tape is moved based on the comparison result by the first function, the conductive portion is aligned with the inspection jig, and the tape is moved based on the comparison result by the second function, Before the conductive portion on the upstream side in the tape running direction is inspected, a moving means for aligning the conductive portion with the inspection jig is provided.

(Operation) According to the electronic component inspection device of the present invention, the second function of the position comparison means allows the conductive portion of the tape to be inspected after the conductive portion to be inspected during the inspection operation of the conductive portion of the tape. The position is compared with a prestored reference position, and based on the comparison result, the moving means moves the tape to inspect the conductive portion before the conductive portion to be inspected is inspected. Positioning with respect to the jig is performed. Therefore, the deviation between the conductive part and the inspection jig due to the dimensional error between the conductive parts is corrected during the inspection operation.
The dimensional error does not accumulate.

(Embodiment) An embodiment of the present invention will be described below with reference to the drawings of FIGS. 1 to 11.

1 and 2, reference numeral 100 indicates a TAB tape inspection device as an electronic component inspection device. This TAB tape inspection device 100 has devices and members having the same functions as the TAB tape inspection device 10 in the conventional example. Therefore, devices and members having the same functions are denoted by the same reference numerals as those in the conventional example. , The description is omitted.

In the figure, reference numeral 111 indicates an apparatus main body, and the apparatus main body 111 is provided with a pair of reel stands 12 and 13.
A supply reel 15 is attached to the reel stand 12.
The TAB tape 1 is wound around the supply reel 15. An accommodation reel 16 is attached to the reel stand 13. Further, the apparatus main body 111 is equipped with a television receiver 151.

Further, the apparatus main body 111 is provided with a pair of guide rollers 118 and 119. Further, the apparatus main body 111 is provided with tape guide units 130a and 130b. Each of the tape guide units 130a and 130b is composed of a pair of rollers, which are opposed to each other with the TAB tape 1 sandwiched therebetween, and two sets of which are provided in one unit. Tape guide unit 130a,
130b can be swung in the direction indicated by the arrow by a mechanism (not shown).

Reference numeral 132 indicates a moving block as a moving means, and the moving block 132 includes a pair of tape clamps 27, 2
8, a pair of sprockets 20, 21 and a pressure device 25 are provided. The moving block 132 is X as shown in FIG.
It can operate in the -X 'direction, the YY' direction, and the ZZ 'direction.

The inspection jig 50 is installed on the printed circuit board 133,
The inspection jig 50 is fixed on a support base (not shown). On the printed circuit board 133, measuring electrodes corresponding to the conductive parts 3 of the TAB tape 1 are formed. The printed circuit board 133 is connected to the analyzer 141, and the conductive state of the conductive portion 3 of the TAB tape 1 can be inspected by bringing the TAB tape 1 into contact with the inspection jig 50. The printed circuit board 133 and the analyzer 141 constitute a conductive state inspection means.

Reference numeral 131 indicates a position detection device, and this position detection device 131
Is attached to the Y table 142 so as to be movable in the YY 'direction, as shown in FIG. Position detection device 131 is Y
Y by a feed screw mechanism 181 operated by a motor 180
Move in the -Y 'direction. Y table 142 is Z table 143
Is mounted movably in the ZZ 'direction, and is moved in the ZZ' direction by the Z motor 144. The Z table 143 is attached to the X table 145 so as to be movable in the XX 'direction, and is moved in the XX' direction by the X motor 146.

FIG. 5 shows the internal structure of the position detecting device 131. In the figure, reference numeral 160 indicates an image processing device, and this image processing device 160 processes an image captured by the camera Ca.
The image processing device 160 has the same function as the image processing device 60 provided in the TAB tape inspection device 10 of the conventional example, and will be described later.
It has a second function of detecting the position of the conductive portion 3 by comparing a predetermined perforation 4 of the TAB tape 1 with a previously stored reference perforation image 4a.

The position detecting device 131 and the image processing device 160 constitute a position comparing means.

Next, according to the flow charts shown in FIGS. 6 and 7, the positioning operation of the TAB tape 1 with respect to the inspection jig 50, the TAB
Operation for inspecting the conductive state of the conductive portion 3 of the tape 1,
The operation of correcting the accumulation of dimensional error and the like between the conductive portions 3 during the inspection operation will be described.

TAB tape 1 by rotating the sprockets 20 and 21
Is sent at a predetermined pitch, that is, in a predetermined frame unit (inspection unit), the TAB tape 1 stops (step
S ₁ ), the tape guide units 130a and 130b swing, and TAB
The tape 1 is adjusted so as to be parallel to the line connecting the centers of the sprockets 20 and 21, and the frame A to be inspected of the TAB tape 1 shown in FIG. 8 is clamped by the tape clamps 27 and 28 ( step S _2).

Next, the moving block 132 moves in the Z direction (step S
₃ ), the head portion 38 of the position detecting device 131 moves in the Y direction,
In the same way as the conventional example shown in FIGS. 16 to 18, the tape is advanced between the TAB tape 1 and the inspection jig 50 (step S ₄ ). Then, the position detection device 131, the camera Ca, and the image processing device 160 image the frame A of the TAB tape 1 and the inspection jig 50 in the same manner as in the conventional example, and detect the deviation between the frame A and the inspection jig 50. (step S _5), (step S _6), (step
S ₇ ). If there is a deviation, move block 132 to XX ′.
Direction, Y-Y 'direction, the TAB tape 1 held by the tape clamps 27 and 28 is moved to align the frame A to be inspected with the TAB tape 1 and the inspection jig 50 ( step S _8). Next, the head portion 38 becomes Y '
And moves backward in the direction between the TAB tape 1 and the inspection jig 50 (step S ₉ ).

Next, the moving block 132 moves in the Z'direction (step S
_10), the conductive portion 3 of the frame A by the pressing device 25 is pressed against the inspection jig 50, the conductive state of the conductive portion 3 of the frame A is examined (step S _11). And moving block 1
The pressurizing device 25 mounted on the 32 moves in the Z direction, and the pressurization of the frame A by the pressurizing device 25 is released (step
S ₁₂ ). Then the clamp according to the tape clamp 27 is released (step S _13).

The operations of steps S ₁₄ and S ₁₆ described below are performed in parallel with the operations of steps S ₁₀ to S ₁₃ described above.

Position detector 131 Figure 8, is moved to a position facing the frame B to be inspected in the next frame A as shown in FIG. 9 (Step S _14). Then, the position detection device 131,
A predetermined perforation 4 of the frame B is captured by the camera Ca as shown in FIGS. 10 and 11, and the captured perforation 4 and the reference perforation stored in the image processing device 160. images 4a and the superposition compared, a primary direction of an image 4a of the perforations are perforations 4 are shifted, for detecting the distance (step S _15).

The positional relationship between the predetermined perforation 4 and the conductive portion 3 is set to be constant. Therefore, by detecting the direction and distance in which the perforation 4 deviates from the perforation image 4a, it is determined whether or not the conductive portion 3 of the frame B deviates from its original position, and the direction and distance in which it deviates further. Can be detected.

Shift amount of the conductive portion 3 of the detected frame B exceeds the allowable range in step S _15, is determined to be uncorrectable (step S _16), moreover the tape clamp Step S ₁₃
When 27 and 28 are released, the TAB tape 1 is fed by one frame, that is, the frame B is moved to the position facing the inspection jig 50.
Moving the TAB tape 1 (step S _17), the flow returns to step S _1. This is to reposition the TAB tape 1 and the inspection jig 50. Step one conductive portion 3 of the frame B in S ₁₆ is not shifted from one to the position originally also amount deviation disconnected is determined to be correctable range,
Moreover the tape clamp 27 in step S ₁₃ is released, the process proceeds to step S ₁₈ shown in Figure 7.

In step S ₁₈ , TAB tape 1 is sent (step
S ₁₈ ), the conductive portion 3 of the frame B is stopped at a position facing the inspection jig 50 (step S ₁₉ ), and the tape clamps 27, 28
It is clamped by the (step S _20). Then, based on the determination of whether the conductive portion 3 of the frame B is shifted from one to the position originally in step S _15, whether it is necessary to adjust the position of the TAB tape 1 it is determined (step S ₂₁₎ . When it is determined that the position adjustment is necessary, the moving block 132 moves in the XX 'direction and the YY' direction, and T
Move the AB tape 1 moves the conductive portion 3 of the frame B to a to a position originally (step S _22). The position adjustment if it is determined that it is not necessary to shift to step S ₂₃ and step S ₂₆ (step S _25).

Frame B by pressing device 25 in step S ₂₃
Is pressed and pressed against the inspection jig 50, and the frame B
Conductive state of the conductive portion 3 is examined (step S _23), then pressurizing the frame B is released (step S _24).
And if the test result of the conductive portion 3 is judged that there is abnormality proceeds to step S _3.

The operations of steps S ₂₆ and S ₂₇ described below are performed in parallel with the operations of steps S ₂₃ to S ₂₅ .

Position predetermined perforations 4 of the frame C is the detector 131 is compared with the image 4a of perforations as a reference in the same manner as in step S _15, positional deviation of the conductive portion 3 of the frame C is detected (step S ₂₆ ). Then, the displacement amount of the conductive portion 3 of the frame C exceeds the allowable range,
If it is determined that the correction is impossible (step S ₂₇ ), and if it is determined that the conductive state of the conductive portion 3 is normal in step S ₂₅ , the process proceeds to step S ₂₈ , and the TAB by the tape clamps 27 and 28 is performed. The clamp of the tape 1 is released (step S ₂₈ ), and the process proceeds to step S ₁₇ in FIG.

In step S ₂₇ , it is determined that the conductive portion 3 of the frame C is not displaced from the position where it should be, or if the displacement is within the correctable range, the conductive state of the conductive portion 3 is determined in step S _25. Is judged to be normal, TA
It is determined whether or not the B tape 1 is at the end (end) (step S ₂₉ ), and if not, the TAB tape 1 is unclamped (step S ₃₀ ), and the process proceeds to step S ₁₈ .

The above operation is repeated until it is determined that the TAB tape 1 is the end, the inspection operation is completed, and the TAB tape inspection device 100 is stopped (step S ₃₁ ).

In the above embodiment, the displacement of the conductive portion of the frame to be inspected, which is one before the frame of the TAB tape 1 currently inspected, that is, the frame to be inspected next to the frame currently inspected, is detected. The invention is not limited to this, and the shift of the frame to be inspected may be detected after a plurality of frames.

As described above, according to the present invention, the position comparing means has the first function and the second function, and the moving means moves the tape based on the respective comparison results. It is possible to prevent the occurrence of deviation between the inspection part and the inspection jig, and to prevent the accumulation of the inspection error by correcting the deviation between the inspection part and the inspection part due to the dimensional error between the inspection parts. The inspection can be always maintained with high accuracy without interrupting the inspection and re-aligning the conductive portion and the inspection jig.

Since the inspection jig 50 and the analyzer 141 are directly connected to each other as shown in the embodiment, it is possible to suppress the generation of nozzles for the inspection signal to a minimum.

Since the pressurizing device 25 and the like are mounted on the moving block 132 and only the predetermined members and devices that need to be moved are moved, the power required to move the members and devices can be minimized.

[Brief description of drawings]

FIG. 1 is a front view of a TAB tape inspection apparatus according to an embodiment of the present invention, FIG. 2 is a side view of the same, and FIG. 3 is equipped with the TAB tape inspection apparatus shown in FIGS. 1 and 2. FIG. 4 is a perspective view of the moving block, FIG. 4 is a perspective view of the position detecting device and a drive mechanism of the position detecting device, and FIG. 5 is shown in FIG. 1 and FIG.
Figures 6 and 7 show the internal structure of the position detector installed in the TAB tape inspection device.
A flow chart showing the operation of the tape inspecting apparatus, FIGS. 8 and 9 are views for explaining the position detecting operation of the conductive portion of the TAB tape inspecting apparatus according to the present invention, and FIGS. 10 and 11 show the operation of the conductive portion. FIG. 12, FIG. 12 and FIG. 12 for explaining the comparison operation of the perforation of the TAB tape and the image of the perforation stored in the image forming apparatus for performing the position detection operation.
Figure 13 shows the TAB tape, and Figure 14 shows the TAB according to the conventional example.
FIG. 15 is a plan view of the tape inspection device, FIG. 15 is a perspective view of a position detection device and a drive mechanism of the position detection device equipped in the TAB tape inspection device of FIG. 14, and FIGS. 16 to 18 are conventional examples. FIG. 19 and FIG. 20 showing the operation of the position detection device equipped in the TAB tape inspection device are related to the conventional example.
FIG. 21 is a diagram showing the internal structure of the position detection device mounted in the TAB tape inspection device, and FIG. 21 is a flowchart showing the operation of the TAB tape inspection device according to the conventional example. 1 ... TAB tape 3 ... Conductive part 50 ... Inspection jig 100 ... TAB tape inspection device 131 ... Position detection device 132 ... Moving block 141 ... Analyzer 160 ... Image processing device

Claims (1)

[Claims] 1. A tape running stopping means for running and stopping a tape in which conductive parts are formed at regular intervals on a surface of the tape, and a tape running stop means arranged so as to face the conductive part and contact the conductive part. In an electronic component inspection device having an inspection jig and a conductive state inspection means that is connected to the inspection jig and inspects the conductive state of the conductive portion, the inspection jig is in a state of being separated from the conductive portion. When the operation is stopped, it has a first function of comparing the positions of both the conductive portion and the inspection jig, and at the time of the inspection operation in which the inspection jig is in contact with the conductive portion, the conductive state inspection is performed. Position comparison means having a second function of comparing the position of the conductive portion on the upstream side in the tape running direction with respect to the conductive portion being inspected by the means, with the first function, and comparison by the first function. Based on the result The tape is moved to align the conductive portion with the inspection jig, and the tape is moved based on the comparison result by the second function to inspect the conductive portion on the upstream side in the tape running direction. An electronic component inspection apparatus, characterized by further comprising a moving means for aligning the conductive part with the inspection jig.