JPH08139431A - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPH08139431A JPH08139431A JP6272658A JP27265894A JPH08139431A JP H08139431 A JPH08139431 A JP H08139431A JP 6272658 A JP6272658 A JP 6272658A JP 27265894 A JP27265894 A JP 27265894A JP H08139431 A JPH08139431 A JP H08139431A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- integrated circuit
- circuit device
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
Landscapes
- Combinations Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、自動実装及びリフロー
半田付けが可能な構造を有する混成集積回路装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit device having a structure capable of automatic mounting and reflow soldering.
【０００２】[0002]
【従来の技術】図２に従来の面実装型の混成集積回路装
置の一般的な構造を示す。図２において、配線基板１の
表面にチップ部品２を、裏面に部品１１を実装し、面実
装型に加工された外部接続用リード３が半田付けされて
いる。2. Description of the Related Art FIG. 2 shows a general structure of a conventional surface mount type hybrid integrated circuit device. In FIG. 2, the chip component 2 is mounted on the front surface of the wiring board 1 and the component 11 is mounted on the rear surface thereof, and the external connection leads 3 processed into the surface mounting type are soldered.
【０００３】[0003]
【発明が解決しようとする課題】上述のような混成集積
回路装置では、配線基板１にチップ部品２を実装するた
め、配線基板１の表面が平坦にならず凹凸が出来てしま
う。このため、この混成集積回路装置を自動搭載する場
合、搭載機の吸着ノズルで混成集積回路装置を確実に吸
着保持することが出来ない。In the hybrid integrated circuit device as described above, since the chip component 2 is mounted on the wiring board 1, the surface of the wiring board 1 is not flat and uneven. Therefore, when the hybrid integrated circuit device is automatically mounted, the suction nozzle of the mounting machine cannot reliably suck and hold the hybrid integrated circuit device.
【０００４】また、吸着用の板部材を配線基板１に搭載
されたチップ部品２の上に直接貼り付ける場合がある
が、搭載されたチップ部品２の厚みが異なると、吸着用
の板部材４と配線基板１が平行にならない。There is a case where the suction plate member is directly attached onto the chip component 2 mounted on the wiring board 1. However, when the mounted chip components 2 have different thicknesses, the suction plate member 4 is attached. And the wiring board 1 are not parallel.
【０００５】[0005]
【課題を解決するための手段】本発明は上述の課題を解
決するために、混成集積回路装置の上面に製品吸着用の
板部材としても使用されるプリント配線板４が外部接続
用リード３に固定されたものである。すなわち、配線基
板１と該配線基板１の表面上に搭載された部品２と該配
線基板１に備えた外部接続用リード３とを有する面実装
型混成集積回路装置において、該面実装型混成集積回路
装置の上にプリント配線板４が配線基板１に対して一定
間隔を保ち、かつ平行に外部接続リード３に接続され、
かつ上記プリント配線板４の表面には部品が搭載され
ず、下方の配線基板１と対向するプリント配線板４の裏
面に部品が搭載されていることを特徴とする混成集積回
路装置である。According to the present invention, in order to solve the above-mentioned problems, a printed wiring board 4 which is also used as a board member for adsorbing a product on the upper surface of a hybrid integrated circuit device is used as an external connection lead 3. It is fixed. That is, in a surface-mounted hybrid integrated circuit device having a wiring board 1, a component 2 mounted on the surface of the wiring board 1, and external connection leads 3 provided on the wiring board 1, the surface-mounted hybrid integrated circuit device is provided. On the circuit device, a printed wiring board 4 is connected to the external connection lead 3 in parallel with the wiring board 1 at a constant distance.
Further, the hybrid integrated circuit device is characterized in that no component is mounted on the front surface of the printed wiring board 4 and the component is mounted on the back surface of the printed wiring board 4 facing the lower wiring board 1.
【０００６】[0006]
【作用】本発明によると、混成集積回路装置の配線基板
１表面にチップ部品を実装することによって配線基板１
表面に凹凸ができても、混成集積回路装置の配線基板１
に対して一定間隔を保ち、且つ平行に設けられたプリン
ト配線板４により、自動搭載機で確実に吸着保持するこ
とができる。また、混成集積回路装置の上に回路構成さ
れたプリント配線板を重ねることにより、混成集積回路
装置の回路規模が大きくなる。According to the present invention, by mounting a chip component on the surface of the wiring board 1 of the hybrid integrated circuit device, the wiring board 1
Wiring board 1 for hybrid integrated circuit device, even if the surface has irregularities
With respect to the printed wiring board 4 which is provided in parallel with and at a constant interval, it is possible to securely suck and hold the printed wiring board 4 by the automatic mounting machine. Further, by stacking a printed wiring board having a circuit configuration on the hybrid integrated circuit device, the circuit scale of the hybrid integrated circuit device is increased.
【０００７】[0007]
【実施例】図１は本発明に係る面実装型混成集積回路装
置の要部の断面図である。図１において、配線基板１の
表面に、チップ部品２が搭載してあり、外部接続用リー
ド３が面実装用に加工して高温半田５で半田付されてい
る。外部接続用リード３には、プリント配線板４を配線
基板１に対して一定間隔を保ち、かつ平行に固定するた
めに図３のようにリード幅方向にストッパー部１０を有
する段差の付いた支持部６が設けられており、外部接続
リードをプリント配線板４に設けられた挿入穴７に挿入
し、高温半田５で接続固定されている。８はリード端
部、９はクリップ部である。このプリント配線板４の表
面には部品を搭載せず、下方の配線基板１と対向するプ
リント配線板４の裏面に部品１２が搭載されている。図
４は他の実施例で、上述の挿入穴７の代わりにプリント
配線板に半田付電極が設けてあり、外部接続用リード３
の支持部６の先端で折り曲げてプリント配線板４の半田
付電極と面接続させてもよい。1 is a cross-sectional view of the essential parts of a surface-mounted hybrid integrated circuit device according to the present invention. In FIG. 1, a chip component 2 is mounted on the surface of a wiring board 1, and external connection leads 3 are processed for surface mounting and soldered with high temperature solder 5. The external connection lead 3 has a stepped support having a stopper portion 10 in the lead width direction as shown in FIG. 3 in order to fix the printed wiring board 4 to the wiring board 1 at a constant distance and in parallel. The portion 6 is provided, and the external connection lead is inserted into the insertion hole 7 provided in the printed wiring board 4 and is fixedly connected with the high temperature solder 5. Reference numeral 8 is a lead end portion, and 9 is a clip portion. No component is mounted on the front surface of the printed wiring board 4, and the component 12 is mounted on the back surface of the printed wiring board 4 facing the wiring board 1 below. FIG. 4 shows another embodiment in which a soldering electrode is provided on the printed wiring board instead of the insertion hole 7 and the external connection lead 3 is provided.
It may be bent at the tip of the supporting portion 6 to be surface-connected to the soldering electrode of the printed wiring board 4.
【０００８】[0008]
【発明の効果】本発明によれば、次のような効果が得ら
れる。 （１）面実装型混成集積回路装置の上面に、部品を搭載
しないプリント配線板４が取付けられているので、自動
搭載機の吸着ノズルで該面実装型混成集積回路装置を吸
着する際、プリント配線板４のチップ部品未実装面に直
接に吸着ノズルを当接できるため確実に保持吸着できる
ようになる。 （２）外部接続用リード３に設けられた支持部６にプリ
ント配線板４を固定するので、配線基板１上に厚みの異
なる部品が搭載された場合でも、配線基板１にプリント
配線板４を平行に固定できる。 （３）プリント配線板４に組み込まれた回路分だけ、混
成集積回路装置としての回路規模が大きくなる。According to the present invention, the following effects can be obtained. (1) Since the printed wiring board 4 on which no component is mounted is attached to the upper surface of the surface-mount type hybrid integrated circuit device, when the surface-mount type hybrid integrated circuit device is sucked by the suction nozzle of the automatic mounting machine, the print is performed. Since the suction nozzle can directly come into contact with the surface of the wiring board 4 on which the chip components are not mounted, it is possible to surely hold and suction. (2) Since the printed wiring board 4 is fixed to the supporting portion 6 provided on the lead 3 for external connection, the printed wiring board 4 is mounted on the wiring board 1 even when components having different thicknesses are mounted on the wiring board 1. Can be fixed in parallel. (3) The circuit scale of the hybrid integrated circuit device is increased by the amount of the circuit incorporated in the printed wiring board 4.
【図１】本発明の面実装型混成集積回路装置の一実施例
の要部の断面図である。FIG. 1 is a sectional view of an essential part of an embodiment of a surface-mounted hybrid integrated circuit device of the present invention.
【図２】従来の面実装型混成集積回路装置の断面図であ
る。FIG. 2 is a cross-sectional view of a conventional surface mount hybrid integrated circuit device.
【図３】本発明のリードフレームの一実施例で（イ）は
斜視図、（ロ）は正面図、（ハ）は側面図である。3A is a perspective view, FIG. 3B is a front view, and FIG. 3C is a side view.
【図４】本発明の面実装型混成集積回路装置の他の実施
例の要部の断面図である。FIG. 4 is a cross-sectional view of the essential parts of another embodiment of the surface-mounted hybrid integrated circuit device of the present invention.
１ 配線基板 ２ チップ部品 ３ 外部接続用リード ４ プリント配線板 ５ 高温半田 ６ 支持部 ７ 挿入穴 ８ リード端部 ９ クリップ部 １０ ストッパー部 １１ 部品 １２ 部品 1 Wiring Board 2 Chip Component 3 External Connection Lead 4 Printed Wiring Board 5 High Temperature Solder 6 Support 7 Insertion Hole 8 Lead End 9 Clip 10 Stopper 11 Component 12 Component
Claims (1)
面上に搭載された部品（２）と該配線基板（１）に備え
た外部接続用リード（３）とを有する面実装型混成集積
回路装置において、該面実装型混成集積回路装置の上に
プリント配線板（４）が配線基板（１）に対して一定間
隔を保ち、かつ平行に外部接続リード（３）に接続さ
れ、かつ上記プリント配線板（４）の表面には部品が搭
載されず、下方の配線基板（１）と対向するプリント配
線板（４）の裏面に部品が搭載されていることを特徴と
する混成集積回路装置。1. Surface mounting having a wiring board (1), a component (2) mounted on the surface of the wiring board (1), and an external connection lead (3) provided on the wiring board (1). In the hybrid type integrated circuit device of the type, a printed wiring board (4) is connected to the external connection lead (3) in parallel with the printed circuit board (4) on the surface of the surface mount type hybrid integrated circuit device. Moreover, the component is not mounted on the surface of the printed wiring board (4), and the component is mounted on the back surface of the printed wiring board (4) facing the lower wiring board (1). Integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6272658A JPH08139431A (en) | 1994-11-07 | 1994-11-07 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6272658A JPH08139431A (en) | 1994-11-07 | 1994-11-07 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08139431A true JPH08139431A (en) | 1996-05-31 |
Family
ID=17516994
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6272658A Pending JPH08139431A (en) | 1994-11-07 | 1994-11-07 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08139431A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10062962A1 (en) * | 2000-12-16 | 2002-07-25 | Bosch Gmbh Robert | Holding device for fastening an electrical component like a capacitor on a supporting substrate has a holder for the component and wiring for making a connection between the component's connectors and contacts on the substrate. |
-
1994
- 1994-11-07 JP JP6272658A patent/JPH08139431A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10062962A1 (en) * | 2000-12-16 | 2002-07-25 | Bosch Gmbh Robert | Holding device for fastening an electrical component like a capacitor on a supporting substrate has a holder for the component and wiring for making a connection between the component's connectors and contacts on the substrate. |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040225 |
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| A131 | Notification of reasons for refusal |
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