JPH08124813A - Terminal electrode conductive paste coating method - Google Patents

Terminal electrode conductive paste coating method

Info

Publication number
JPH08124813A
JPH08124813A JP6262877A JP26287794A JPH08124813A JP H08124813 A JPH08124813 A JP H08124813A JP 6262877 A JP6262877 A JP 6262877A JP 26287794 A JP26287794 A JP 26287794A JP H08124813 A JPH08124813 A JP H08124813A
Authority
JP
Japan
Prior art keywords
conductive paste
terminal electrode
electronic component
groove
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP6262877A
Other languages
Japanese (ja)
Inventor
Masahiro Tanaka
巨浩 田中
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP6262877A priority Critical patent/JPH08124813A/en
Publication of JPH08124813A publication Critical patent/JPH08124813A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE: To provide a terminal electrode conductive paste coating method with which a continuous spreading to the adjacent surface can be formed on the corner part. CONSTITUTION: A part base material 1A is inserted into the through hole of the elastic mask member 13 where a groove 13b is formed along the terminal electrode forming position of the part base material 1A, a screen 12, where an opening 12a is formed on the terminal electrode forming position and a part of the upper surface of the part base material 1A, is brought into contact with the upper surface of the part base material 1A, conductive paste 15 is fed to the screen 12, the conductive paste 15 is introduced into the groove 13b from the aperture 12a while the conductive paste 15 is being sucked from the lower part, and the conductive paste 15 is continuously spread from the side face of the part base material 1A to a part of the upper surface of the part base material 1A. Accordingly, as the conductive paste 9 can be continuously spread on the part base material ranging to a part of the upper surface adjacent to the terminal electrode forming objective surface, the surface layer electrode and the terminal electrode can be connected with sufficient superposition even when the surface layer electrode is formed on the adjacent surface.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、平行して並ぶ複数の端
子電極を有する積層複合部品等の電子部品の端子電極用
導電性ペーストの塗布方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for applying a conductive paste for terminal electrodes of electronic parts such as laminated composite parts having a plurality of terminal electrodes arranged in parallel.

【0002】[0002]

【従来の技術】従来、図2に示すような電子部品、例え
ば積層複合部品1には、内部電極2と表層電極3を接続
するため、及び積層複合部品1をマザーボード(部品実
装基板)に半田付けするために、平行して並ぶ複数の帯
状の端子電極4が形成されている。
2. Description of the Related Art Conventionally, in an electronic component as shown in FIG. 2, for example, a laminated composite component 1, in order to connect an internal electrode 2 and a surface layer electrode 3, and the laminated composite component 1 is soldered to a mother board (component mounting board). For attachment, a plurality of strip-shaped terminal electrodes 4 arranged in parallel are formed.

【0003】この端子電極4は、スクリーン印刷等によ
って焼成後の素体の端面に導電性ペーストを塗布して形
成されている。さらに、端子電極4が形成された後、続
いてスクリーン印刷によって表層電極3が形成される。
また、製品によっては、その後、積層複合部品1の表面
に表層電極3に導電接続された厚膜抵抗を形成したり、
表層電極3に半導体等の電子部品を半田付けすることも
ある。
The terminal electrode 4 is formed by applying a conductive paste to the end surface of the element body after firing by screen printing or the like. Further, after the terminal electrode 4 is formed, the surface layer electrode 3 is subsequently formed by screen printing.
Further, depending on the product, thereafter, a thick film resistor conductively connected to the surface layer electrode 3 is formed on the surface of the laminated composite component 1,
An electronic component such as a semiconductor may be soldered to the surface layer electrode 3.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、前述し
た従来の端子電極用導電性ペーストの塗布方法において
は、スクリーン印刷によって端子電極4と表層電極3と
を形成しているので、コーナー部におけるこれら端子電
極4と表層電極3との重なりが少なくなるため、これら
が接続されなかったり、また端子電極4と表層電極3と
の重なり部分が薄いため、半田付け時にオープン不良が
発生することがあり、高い信頼性が得られないという問
題点があった。
However, in the above-mentioned conventional method of applying the conductive paste for terminal electrodes, since the terminal electrodes 4 and the surface layer electrodes 3 are formed by screen printing, these terminals at the corners are formed. Since the overlap between the electrode 4 and the surface layer electrode 3 is small, they are not connected to each other, and the overlapping part between the terminal electrode 4 and the surface layer electrode 3 is thin, which may cause an open defect during soldering, which is high. There was a problem that reliability was not obtained.

【0005】本発明の目的は上記の問題点に鑑み、コー
ナー部において隣接面へ連続した回り込みが形成できる
端子電極用導電ペーストの塗布方法を提供することにあ
る。
In view of the above problems, an object of the present invention is to provide a method for applying a conductive paste for a terminal electrode, which can form a continuous wraparound to an adjacent surface at a corner portion.

【0006】[0006]

【課題を解決するための手段】本発明は上記の目的を達
成するために請求項1では、側面に上面から下面に延び
る端子電極を有する電子部品の端子電極用導電性ペース
トの塗布方法であって、前記端子電極形成位置に沿って
所定深さの溝が形成されたマスク部材を、前記電子部品
の端子電極形成面に押し当て、前記電子部品の端子電極
形成位置に対応して、端子電極形成位置及び前記電子部
品の上面の一部にかかる開口が形成されたスクリーンを
前記電子部品の上面に当て、前記スクリーン上に導電性
ペーストを供給して、該導電性ペーストを前記開口から
前記溝内に導入し、前記電子部品の側面から上面の一部
にかけ連続して導電性ペーストを塗布する端子電極用導
電性ペーストの塗布方法を提案する。
In order to achieve the above object, the present invention provides, in claim 1, a method for applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode extending from an upper surface to a lower surface on a side surface. Then, the mask member in which a groove having a predetermined depth is formed along the terminal electrode formation position is pressed against the terminal electrode formation surface of the electronic component, and the terminal electrode is formed in correspondence with the terminal electrode formation position of the electronic component. A screen in which an opening is formed in the formation position and a part of the upper surface of the electronic component is applied to the upper surface of the electronic component, a conductive paste is supplied onto the screen, and the conductive paste is applied through the opening to the groove. A method of applying a conductive paste for a terminal electrode, which is introduced into the inside of the electronic component and continuously applied from the side surface to a part of the upper surface of the electronic component, is proposed.

【0007】また、請求項2では、側面に上面から下面
に延びる端子電極を有する電子部品の端子電極用導電性
ペーストの塗布方法であって、前記端子電極形成位置に
沿って所定深さの溝が形成されたマスク部材を、前記電
子部品の端子電極形成面に押し当て、前記電子部品の端
子電極形成位置上に描画ノズルによって導電性ペースト
を射出し、該導電性ペーストを前記溝内に導入し、前記
電子部品の側面から上面の一部にかけ連続して導電性ペ
ーストを塗布する端子電極用導電性ペーストの塗布方法
を提案する。
According to a second aspect of the present invention, there is provided a method of applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode extending from an upper surface to a lower surface on a side surface, the groove having a predetermined depth along the terminal electrode forming position. The mask member on which is formed is pressed against the terminal electrode formation surface of the electronic component, a conductive paste is injected by a drawing nozzle onto the terminal electrode formation position of the electronic component, and the conductive paste is introduced into the groove. Then, a method of applying the conductive paste for the terminal electrode is proposed, in which the conductive paste is continuously applied from the side surface to a part of the upper surface of the electronic component.

【0008】また、請求項3では、請求項1又は2記載
の端子電極用導電性ペーストの塗布方法において、前記
マスク部材は弾性体からなる端子電極用導電性ペースト
の塗布方法を提案する。
A third aspect of the present invention proposes a method for applying the conductive paste for a terminal electrode according to the first or second aspect, wherein the mask member is made of an elastic material and is used for the conductive paste for a terminal electrode.

【0009】また、請求項4では、請求項1又は2記載
の端子電極用導電性ペーストの塗布方法において、前記
電子部品の下方から吸引することにより前記開口から前
記溝内へ導電性ペーストを導入する端子電極用導電性ペ
ーストの塗布方法を提案する。
According to a fourth aspect of the present invention, in the method of applying the conductive paste for a terminal electrode according to the first or second aspect, the conductive paste is introduced into the groove from the opening by sucking from below the electronic component. We propose a method for applying a conductive paste for terminal electrodes.

【0010】また、請求項5では、請求項1又は2記載
の端子電極用導電性ペーストの塗布方法において、少な
くとも前記溝を中心とする所定範囲内を覆う通気性シー
トを前記電子部品の下面に押し当てた状態で前記溝内に
前記導電性ペーストを導入する端子電極用導電性ペース
トの塗布方法を提案する。
According to a fifth aspect of the present invention, in the method for applying the conductive paste for a terminal electrode according to the first or second aspect, a breathable sheet covering at least a predetermined area centered on the groove is provided on the lower surface of the electronic component. A method for applying a conductive paste for a terminal electrode, which introduces the conductive paste into the groove in a pressed state, is proposed.

【0011】[0011]

【作用】本発明の請求項1によれば、電子部品の端子電
極形成位置に沿って所定深さの溝が形成されたマスク部
材が前記電子部品の端子電極形成面に押し当てられると
共に、前記電子部品の端子電極形成位置に対応して、端
子電極形成位置及び前記電子部品の上面の一部にかかる
開口が形成されたスクリーンが前記電子部品の上面に当
てられ、この状態で前記スクリーン上に導電性ペースト
が供給され、該導電性ペーストが前記開口から前記溝内
に導入される。これにより、前記端子電極形成位置以外
の部分は、前記マスク部材とスクリーンによってマスク
され、前記電子部品の側面から上面の一部にかけ連続し
て、所定形状に導電性ペーストが塗布される。
According to the first aspect of the present invention, the mask member in which the groove having the predetermined depth is formed along the terminal electrode forming position of the electronic component is pressed against the terminal electrode forming surface of the electronic component, and Corresponding to the terminal electrode formation position of the electronic component, a screen having an opening formed in the terminal electrode formation position and a part of the upper surface of the electronic component is applied to the upper surface of the electronic component, and in this state, on the screen. A conductive paste is supplied, and the conductive paste is introduced into the groove through the opening. As a result, the portions other than the terminal electrode forming positions are masked by the mask member and the screen, and the conductive paste is applied in a predetermined shape continuously from the side surface to a part of the upper surface of the electronic component.

【0012】また、請求項2によれば、電子部品の端子
電極形成位置に沿って所定深さの溝が形成されたマスク
部材が前記電子部品の端子電極形成面に押し当てられ、
この状態で前記電子部品の端子電極形成位置上に描画ノ
ズルによって導電性ペーストが射出され、該導電性ペー
ストが前記溝内に導入される。これにより、前記端子電
極形成位置以外の部分は、前記マスク部材によってマス
クされ、前記電子部品の側面から上面の一部にかけ連続
して所定形状に導電性ペーストが塗布される。
According to a second aspect of the present invention, a mask member having a groove having a predetermined depth formed along the terminal electrode forming position of the electronic component is pressed against the terminal electrode forming surface of the electronic component,
In this state, the conductive paste is injected onto the terminal electrode formation position of the electronic component by the drawing nozzle, and the conductive paste is introduced into the groove. As a result, the portions other than the terminal electrode formation positions are masked by the mask member, and the conductive paste is continuously applied in a predetermined shape from the side surface to a part of the upper surface of the electronic component.

【0013】また、請求項3によれば、前記マスク部材
は弾性体からなるため、マスク部材と電子部品とを密着
させることができる。
According to the third aspect, since the mask member is made of an elastic body, the mask member and the electronic component can be brought into close contact with each other.

【0014】また、請求項4によれば、前記電子部品の
下方から吸引することにより前記開口から前記溝内へ導
電性ペーストが導入される。
According to the fourth aspect, the conductive paste is introduced into the groove from the opening by sucking from below the electronic component.

【0015】また、請求項5によれば、通気性シートを
前記電子部品の下面に押し当てた状態で、前記溝内に前
記導電性ペーストが導入される。これにより、前記溝の
下端からの導電性ペーストの射出が抑制されると共に、
前記通気性シートへの導電性ペーストの付着により、前
記溝下端に隣接する電子部品下面の一部にも導電性ペー
ストが塗布される。
According to a fifth aspect of the present invention, the conductive paste is introduced into the groove with the breathable sheet pressed against the lower surface of the electronic component. This suppresses injection of the conductive paste from the lower end of the groove,
By attaching the conductive paste to the breathable sheet, the conductive paste is also applied to a part of the lower surface of the electronic component adjacent to the lower end of the groove.

【0016】[0016]

【実施例】以下、図面に基づいて本発明の一実施例を説
明する。図1は本実施例において端子電極を形成した積
層複合部品を示す側面断面図である。図において、前述
した従来例と同一構成部分は同一符号をもって表す。即
ち、1は積層複合部品(以下、部品と称する)で、内部
電極2と表層電極3を接続するため、及び部品1をマザ
ーボード(部品実装基板)に半田付けするために、平行
して並ぶ複数の帯状の端子電極5が形成されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view showing a laminated composite component in which a terminal electrode is formed in this embodiment. In the figure, the same components as those of the above-described conventional example are denoted by the same reference numerals. That is, reference numeral 1 denotes a laminated composite component (hereinafter referred to as component), which is arranged in parallel for connecting the internal electrode 2 and the surface electrode 3 and for soldering the component 1 to a motherboard (component mounting board). The strip-shaped terminal electrode 5 is formed.

【0017】この端子電極5は、部品1の側面から上面
及び下面にかけて断面略コ字形状に形成され、上面にお
いては表層電極3と十分な重なりをもって導電接続され
ている。
The terminal electrode 5 is formed in a substantially U-shaped cross section from the side surface of the component 1 to the upper surface and the lower surface thereof, and is electrically connected to the surface electrode 3 with sufficient overlap on the upper surface.

【0018】従って、コーナー部におけるこれら端子電
極5と表層電極3との重なりが十分であるため、これら
が接続されないことが無く、また従来のように端子電極
5と表層電極3との重なり部分が薄いため、半田付け時
にオープン不良が発生することが無く、高い信頼性が得
られる。
Therefore, since the terminal electrodes 5 and the surface layer electrodes 3 are sufficiently overlapped at the corners, they are not connected to each other, and the overlapping portion between the terminal electrodes 5 and the surface layer electrodes 3 is different from the conventional case. Since it is thin, open defects do not occur during soldering, and high reliability is obtained.

【0019】前述した部品1の端子電極5の形成方法
は、次に述べる方法により端子電極用導電性ペーストを
塗布した後、この導電性ペーストを硬化させることによ
り形成される。
The method of forming the terminal electrode 5 of the component 1 described above is performed by applying a conductive paste for a terminal electrode by the method described below and then curing the conductive paste.

【0020】即ち、第1の実施例における端子電極用導
電性ペーストの塗布方法は、図3及び図4に示すよう
に、端子電極5及び表層電極3を形成していない部品素
体1Aを部品保持具11によって保持すると共に、この
上面にスクリーン12を当てる。このとき、部品素体1
Aの上面は部品保持具11の上面と一致するように保持
される。
That is, as shown in FIGS. 3 and 4, the method of applying the conductive paste for the terminal electrode in the first embodiment is a method of forming a component element body 1A in which the terminal electrode 5 and the surface layer electrode 3 are not formed. The screen is held by the holder 11 and the screen 12 is applied to the upper surface. At this time, the component body 1
The upper surface of A is held so as to match the upper surface of the component holder 11.

【0021】部品保持具11は、図3乃至図5に示すよ
うに、シリコン樹脂等の弾性体からなる弾性マスク部材
13とこれを囲む剛体14とからなり、弾性マスク部材
13の中央部には部品素体1Aが嵌合する貫通孔13a
が形成されると共に、この貫通孔13aの側面には、部
品素体1Aの側面の端子電極形成位置に沿った所定深さ
の溝13bが形成されている。さらに、弾性マスク部材
13と剛体14には凹凸部が形成されこれらが嵌合し
て、弾性マスク部材13が剛体14から外れないように
なっている。また、スクリーン12には、端子電極形成
位置及び部品素体1Aの上面の一部にかかる開口12a
が形成されている。
As shown in FIGS. 3 to 5, the component holder 11 comprises an elastic mask member 13 made of an elastic material such as silicon resin and a rigid body 14 surrounding the elastic mask member 13. Through hole 13a into which the component body 1A is fitted
And a groove 13b having a predetermined depth is formed on the side surface of the through hole 13a along the terminal electrode formation position on the side surface of the component body 1A. Further, the elastic mask member 13 and the rigid body 14 are formed with uneven portions so that they are fitted to each other so that the elastic mask member 13 does not come off from the rigid body 14. In addition, the screen 12 has an opening 12a that is formed at the terminal electrode formation position and a part of the upper surface of the component body 1A.
Are formed.

【0022】前述したように部品保持具11に部品素体
1Aを保持した状態で、その上面にスクリーン12を当
て、図6に示す工程で端子電極用の導電性ペーストを塗
布する。即ち、部品素体1Aを弾性マスク部材13の貫
通孔13aに嵌合させると、弾性マスク部材13の弾性
により弾性マスク部材13が部品素体1Aの側面に密着
し、溝13bの部分のみに隙間ができる。この状態で、
これらの上面に開口12aが端子電極形成位置及び部品
素体1Aの上面の一部にかかるようにスクリーン12を
配置する(図6の(a))。
As described above, with the component body 1A held by the component holder 11, the screen 12 is applied to the upper surface thereof, and the conductive paste for the terminal electrode is applied in the step shown in FIG. That is, when the component element body 1A is fitted into the through hole 13a of the elastic mask member 13, the elasticity of the elastic mask member 13 causes the elastic mask member 13 to adhere to the side surface of the component element body 1A, leaving a gap only in the groove 13b. You can In this state,
The screen 12 is arranged so that the openings 12a are formed on the upper surfaces of the terminal electrode formation positions and a part of the upper surface of the component body 1A ((a) of FIG. 6).

【0023】次に、スクリーン12上に導電性ペースト
15を供給し、部品保持具11の下方からバキュームポ
ンプ等によって吸引しながら、スキージ16によって開
口12aの部分に導電性ペースト15を供給する(図6
の(b))。
Next, the conductive paste 15 is supplied onto the screen 12, and the conductive paste 15 is supplied to the portion of the opening 12a by the squeegee 16 while sucking from below the component holder 11 with a vacuum pump or the like (FIG. 6
(B)).

【0024】これにより、開口12aから溝13b内に
導電性ペースト15が導入され(図6の(c))、部品
素体1Aの側面(端子電極形成面)から上面(表層電極
形成面)の一部にかけて導電性ペースト15が連続して
塗布され、部品素体1Aにはコーナー部において側面か
ら上面へ連続した回り込みが形成できる(図6の
(d))。
As a result, the conductive paste 15 is introduced from the opening 12a into the groove 13b ((c) of FIG. 6), and the side surface (terminal electrode forming surface) to the upper surface (surface layer electrode forming surface) of the component body 1A. The conductive paste 15 is continuously applied to a part thereof, and a continuous wraparound can be formed from the side surface to the upper surface in the corner of the component body 1A ((d) of FIG. 6).

【0025】この後、部品素体1A裏返して前述と同様
の塗布工程を実行することにより、部品素体1Aの下面
にも側面から連続して導電性ペーストが塗布される。次
いで、スクリーン印刷等によって部品素体1Aの上面或
いは下面に表層電極3を形成することにより図1に示す
部品1が完成する。
Thereafter, the component body 1A is turned over and the same coating process as described above is performed, so that the conductive paste is continuously applied to the lower surface of the component body 1A from the side. Next, the surface layer electrode 3 is formed on the upper surface or the lower surface of the component body 1A by screen printing or the like to complete the component 1 shown in FIG.

【0026】従って、上面或いは下面に表層電極3を形
成したときにも、表層電極3と端子電極5とを十分な重
なりをもって接続することができる。これにより、半田
付け時における端子電極5と表層電極3との間のオープ
ン不良の発生を防止することができ、高い信頼性を得る
ことができる。
Therefore, even when the surface layer electrode 3 is formed on the upper surface or the lower surface, the surface layer electrode 3 and the terminal electrode 5 can be connected with a sufficient overlap. As a result, it is possible to prevent the occurrence of an open defect between the terminal electrode 5 and the surface layer electrode 3 during soldering, and it is possible to obtain high reliability.

【0027】尚、弾性マスク部材13は、導電性ペース
ト15が付着し難い材質を選ぶことが好ましい。例え
ば、導電性ペースト15が油性の場合には親水性樹脂か
らなる弾性マスク部材13を用いることにより導電性ペ
ースト15が弾性マスク部材13に付着せず塗布作業を
良好に行うことができる。
For the elastic mask member 13, it is preferable to select a material to which the conductive paste 15 is unlikely to adhere. For example, when the conductive paste 15 is oily, by using the elastic mask member 13 made of a hydrophilic resin, the conductive paste 15 does not adhere to the elastic mask member 13 and the application work can be performed well.

【0028】また、前述した塗布工程終了後に部品素体
1Aを裏返して、同様の塗布工程を実施することにより
部品素体1Aの裏面にも回り込んだ端子電極を形成する
ことができる。
Also, after the above-mentioned coating process is completed, the component body 1A is turned over and the same coating process is carried out to form a terminal electrode that also wraps around the back surface of the component body 1A.

【0029】次に、本発明の第2の実施例における端子
電極用導電性ペーストの塗布方法を説明する。第2の実
施例においては、前述した第1の実施例の構成に加え
て、図7に示すように部品保持具11の下部に通気性の
良いメッシュスクリーン17を配置した。
Next, a method of applying the conductive paste for terminal electrodes in the second embodiment of the present invention will be described. In the second embodiment, in addition to the configuration of the first embodiment described above, a mesh screen 17 with good air permeability is arranged below the component holder 11 as shown in FIG.

【0030】前述したように部品保持具11の下部にメ
ッシュスクリーン17を配置した状態で、図8に示す工
程で端子電極用の導電性ペーストを塗布する。即ち、部
品素体1Aを弾性マスク部材13の貫通孔13aに嵌合
させて、弾性マスク部材13を部品素体1Aの側面に密
着させ、溝13bの部分のみに隙間が生じるようにす
る。この状態で、これらの上面に開口12aが端子電極
形成位置及び部品素体1Aの上面の一部にかかるように
スクリーン12を配置する(図8の(a))。
As described above, the conductive paste for the terminal electrodes is applied in the step shown in FIG. 8 with the mesh screen 17 arranged under the component holder 11. That is, the component element body 1A is fitted into the through hole 13a of the elastic mask member 13, the elastic mask member 13 is brought into close contact with the side surface of the component element body 1A, and a gap is formed only in the groove 13b. In this state, the screen 12 is arranged so that the openings 12a are formed on the upper surfaces of the terminal electrode formation positions and a part of the upper surface of the component body 1A ((a) of FIG. 8).

【0031】次に、スクリーン12上に導電性ペースト
15を供給し、部品保持具11の下方からバキュームポ
ンプ等によって吸引しながら、スキージ16によって開
口12aの部分に導電性ペースト15を供給する(図8
の(b))。
Next, the conductive paste 15 is supplied onto the screen 12, and is sucked from below the component holder 11 by a vacuum pump or the like, while the squeegee 16 supplies the conductive paste 15 to the opening 12a (FIG. 8
(B)).

【0032】これにより、開口12aから溝13b内に
導電性ペースト15が導入され(図8の(c))、溝1
3bの下端から射出した導電性ペースト15はメッシュ
スクリーン17によって飛散が阻止され、部品素体1A
及び弾性マスク部材13とメッシュスクリーン17との
間に導電性ペースト15が流入するため、部品素体1A
の側面(端子電極形成面)から上面及び下面(表層電極
形成面)の一部にかけて導電性ペースト15が連続して
塗布され、部品素体1Aにはコーナー部において側面か
ら上面及び下面へ連続した回り込みが形成できる(図8
の(d))。
As a result, the conductive paste 15 is introduced into the groove 13b from the opening 12a ((c) of FIG. 8), and the groove 1
The conductive paste 15 injected from the lower end of 3b is prevented from scattering by the mesh screen 17, and the component body 1A
Since the conductive paste 15 flows between the elastic mask member 13 and the mesh screen 17, the component body 1A
From the side surface (terminal electrode forming surface) to a part of the upper surface and the lower surface (surface layer electrode forming surface), the conductive paste 15 is continuously applied, and the component body 1A is continuously applied from the side surface to the upper surface and the lower surface at the corner portion. A wraparound can be formed (Fig. 8
(D)).

【0033】この後、スクリーン印刷等によって部品素
体1Aの上面或いは下面に表層電極を形成することによ
り図1に示す部品1が完成する。
After that, a surface layer electrode is formed on the upper surface or the lower surface of the component body 1A by screen printing or the like to complete the component 1 shown in FIG.

【0034】次に、本発明の第3の実施例における端子
電極用導電性ペーストの塗布方法を説明する。第3の実
施例では、第2の実施例のスキージ16に代えて、図9
に示すように描画ノズル18を用いて導電性ペースト1
5の供給を行うようにした。
Next, a method of applying the conductive paste for terminal electrodes in the third embodiment of the present invention will be described. In the third embodiment, instead of the squeegee 16 of the second embodiment, FIG.
Conductive paste 1 using the drawing nozzle 18 as shown in FIG.
5 was supplied.

【0035】前述したように描画ノズル18を用いて導
電性ペーストの供給を行い端子電極用の導電性ペースト
15を塗布する際には、まず、部品素体1Aを弾性マス
ク部材13の貫通孔13aに嵌合させて、弾性マスク部
材13を部品素体1Aの側面に密着させ、溝13bの部
分のみに隙間が生じるようにする。この状態で、これら
の上面に開口12aが端子電極形成位置及び部品素体1
Aの上面の一部にかかるようにスクリーン12を配置す
る(図9の(a))。
As described above, when the conductive paste is supplied by using the drawing nozzle 18 and the conductive paste 15 for the terminal electrode is applied, first, the component element body 1A is inserted into the through hole 13a of the elastic mask member 13. The elastic mask member 13 is brought into close contact with the side surface of the component body 1A so that a gap is formed only in the groove 13b. In this state, the openings 12a are formed on the upper surfaces of the terminal electrode forming positions and the component body 1.
The screen 12 is arranged so as to cover a part of the upper surface of A ((a) of FIG. 9).

【0036】次に、部品保持具11の下方からバキュー
ムポンプ等によって吸引しながら、スクリーン12の開
口12a上に描画ノズル18から導電性ペースト15を
供給する(図9の(b))。
Next, the conductive paste 15 is supplied from the drawing nozzle 18 onto the opening 12a of the screen 12 while sucking from below the component holder 11 with a vacuum pump or the like ((b) of FIG. 9).

【0037】これにより、開口12aから溝13b内に
導電性ペースト15が導入され(図9の(c))、溝1
3bの下端から射出した導電性ペースト15はメッシュ
スクリーン17によって飛散が阻止され、部品素体1A
及び弾性マスク部材13とメッシュスクリーン17との
間に導電性ペースト15が流入するため、部品素体1A
の側面(端子電極形成面)から上面及び下面(表層電極
形成面)の一部にかけて導電性ペースト15が連続して
塗布され、部品素体1Aにはコーナー部において側面か
ら上面及び下面へ連続した回り込みが形成できる(図9
の(d))。
As a result, the conductive paste 15 is introduced from the opening 12a into the groove 13b (FIG. 9 (c)), and the groove 1
The conductive paste 15 injected from the lower end of 3b is prevented from scattering by the mesh screen 17, and the component body 1A
Since the conductive paste 15 flows between the elastic mask member 13 and the mesh screen 17, the component body 1A
From the side surface (terminal electrode forming surface) to a part of the upper surface and the lower surface (surface layer electrode forming surface), the conductive paste 15 is continuously applied, and the component body 1A is continuously applied from the side surface to the upper surface and the lower surface at the corner portion. A wraparound can be formed (Fig. 9
(D)).

【0038】この後、スクリーン印刷等によって部品素
体1Aの上面或いは下面に表層電極を形成することによ
り図1に示す部品1が完成する。
After that, the surface layer electrodes are formed on the upper surface or the lower surface of the component body 1A by screen printing or the like to complete the component 1 shown in FIG.

【0039】尚、前述した第1乃至第3の実施例では部
品素体1Aを1個のみ保持する部品保持具11を用いて
端子用導電性ペーストの塗布を行ったが、図10に示す
ように複数の部品素体1Aをマトリックス状に保持でき
る部品保持具19を用いることにより、作業効率の向上
を図ることができることは言うまでもないことである。
In the first to third embodiments described above, the conductive paste for terminals is applied by using the component holder 11 which holds only one component element body 1A. As shown in FIG. It goes without saying that the work efficiency can be improved by using the component holder 19 capable of holding the plurality of component bodies 1A in a matrix.

【0040】[0040]

【発明の効果】以上説明したように本発明の請求項1に
よれば、端子電極形成対象面に隣接する面の一部にも導
電性ペーストが連続して塗布され、電子部品にはコーナ
ー部において前記隣接面へ連続した回り込みが形成で
き、前記隣接面に表層電極を形成したときにも、該表層
電極と前記端子電極とを十分な重なりをもって接続する
ことができる。これにより、半田付け時における前記端
子電極と表層電極との間のオープン不良の発生を防止す
ることができ、高い信頼性を得ることができる。
As described above, according to the first aspect of the present invention, the conductive paste is continuously applied to a part of the surface adjacent to the surface on which the terminal electrode is formed, and the electronic component has a corner portion. In, the continuous wraparound can be formed to the adjacent surface, and even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode can be connected with sufficient overlap. As a result, it is possible to prevent the occurrence of an open defect between the terminal electrode and the surface electrode during soldering, and it is possible to obtain high reliability.

【0041】また、請求項2によれば、端子電極形成対
象面に隣接する面の一部にも導電性ペーストが連続して
塗布され、電子部品にはコーナー部において前記隣接面
へ連続した回り込みが形成でき、前記隣接面に表層電極
を形成したときにも、該表層電極と前記端子電極とを十
分な重なりをもって接続することができる。これによ
り、半田付け時における前記端子電極と表層電極との間
のオープン不良の発生を防止することができ、高い信頼
性を得ることができる。
According to the second aspect, the conductive paste is continuously applied to a part of the surface adjacent to the surface where the terminal electrode is formed, and the electronic component is continuously wrapped around the adjacent surface at the corner portion. Can be formed, and even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode can be connected with a sufficient overlap. As a result, it is possible to prevent the occurrence of an open defect between the terminal electrode and the surface electrode during soldering, and it is possible to obtain high reliability.

【0042】また、請求項3によれば、上記の効果に加
えて、前記マスク部材は弾性体からなり、前記マスク部
材と電子部品とを密着させることができるので、溝以外
のマスク部材と電子部品との間に導電性ペーストが入り
込むことがなく、所望の端子電極形状に導電性ペースト
を塗布することができる。
According to the third aspect, in addition to the above effect, the mask member is made of an elastic body, and the mask member and the electronic component can be brought into close contact with each other. The conductive paste can be applied to a desired terminal electrode shape without the conductive paste entering into the parts.

【0043】また、請求項4によれば、上記の効果に加
えて、前記電子部品の下方から吸引することによりスク
リーンの開口から前記溝内へ導電性ペーストが導入され
るので、前記溝内へ導電性ペーストを容易に導入するこ
とができる。
Further, according to claim 4, in addition to the above effect, since the conductive paste is introduced into the groove from the opening of the screen by sucking from below the electronic component, the conductive paste is introduced into the groove. The conductive paste can be easily introduced.

【0044】また、請求項5によれば、上記の効果に加
えて、前記溝の下端からの導電性ペーストの射出が抑制
されると共に、前記通気性シートへの導電性ペーストの
付着により、前記溝下端に隣接する電子部品下面の一部
にも導電性ペーストが塗布されるので、前記電子部品の
下面へも同時に端子電極用の導電性ペーストを塗布で
き、作業工程の簡略化を図ることができる。
According to the fifth aspect, in addition to the above effects, the ejection of the conductive paste from the lower end of the groove is suppressed, and the conductive paste is attached to the breathable sheet, whereby Since the conductive paste is also applied to a part of the lower surface of the electronic component adjacent to the lower end of the groove, the conductive paste for the terminal electrode can be simultaneously applied to the lower surface of the electronic component, which simplifies the working process. it can.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例において端子電極を形成した積
層複合部品を示す側面断面図
FIG. 1 is a side sectional view showing a laminated composite component in which a terminal electrode is formed in an embodiment of the present invention.

【図2】従来例の積層複合部品を示す構成図FIG. 2 is a configuration diagram showing a laminated composite component of a conventional example.

【図3】本発明の第1の実施例における端子電極用導電
性ペーストの塗布方法を説明する図
FIG. 3 is a diagram illustrating a method for applying a conductive paste for terminal electrodes according to the first embodiment of the present invention.

【図4】本発明の第1の実施例における端子電極用導電
性ペーストの塗布方法を説明する図
FIG. 4 is a diagram illustrating a method for applying a conductive paste for terminal electrodes according to the first embodiment of the present invention.

【図5】本発明の第1の実施例における部品保持具を示
す側面断面図
FIG. 5 is a side sectional view showing a component holder according to the first embodiment of the present invention.

【図6】本発明の第1の実施例における端子電極用導電
性ペーストの塗布工程を説明する図
FIG. 6 is a diagram illustrating a step of applying a conductive paste for terminal electrodes in the first embodiment of the present invention.

【図7】本発明の第2の実施例における端子電極用導電
性ペーストの塗布方法を説明する図
FIG. 7 is a diagram illustrating a method for applying a conductive paste for terminal electrodes according to a second embodiment of the present invention.

【図8】本発明の第2の実施例における端子電極用導電
性ペーストの塗布工程を説明する図
FIG. 8 is a diagram illustrating a step of applying a conductive paste for terminal electrodes in the second embodiment of the present invention.

【図9】本発明の第3の実施例における端子電極用導電
性ペーストの塗布工程を説明する図
FIG. 9 is a diagram illustrating a step of applying a conductive paste for a terminal electrode according to a third embodiment of the present invention.

【図10】本発明の一実施例における部品保持具の他の
例を示す構成図
FIG. 10 is a configuration diagram showing another example of the component holder in one embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1…積層複合部品、1A…部品素体、2…内部電極、3
…表層電極、4,5…端子電極、11…部品保持具、1
2…スクリーン、12a…開口、13…弾性マスク部
材、13a…貫通孔、13b…溝、14…剛体、15…
導電性ペースト、16…スキージ、17…メッシュスク
リーン、18…描画ノズル、19…部品保持具。
DESCRIPTION OF SYMBOLS 1 ... Laminated composite component, 1A ... Component element body, 2 ... Internal electrode, 3
... Surface layer electrodes, 4, 5 ... Terminal electrodes, 11 ... Component holder, 1
2 ... Screen, 12a ... Opening, 13 ... Elastic mask member, 13a ... Through hole, 13b ... Groove, 14 ... Rigid body, 15 ...
Conductive paste, 16 ... Squeegee, 17 ... Mesh screen, 18 ... Drawing nozzle, 19 ... Component holder.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 側面に上面から下面に延びる端子電極を
有する電子部品の端子電極用導電性ペーストの塗布方法
であって、 前記端子電極形成位置に沿って所定深さの溝が形成され
たマスク部材を、前記電子部品の端子電極形成面に押し
当て、 前記電子部品の端子電極形成位置に対応して、端子電極
形成位置及び前記電子部品の上面の一部にかかる開口が
形成されたスクリーンを前記電子部品の上面に当て、 前記スクリーン上に導電性ペーストを供給して、該導電
性ペーストを前記開口から前記溝内に導入し、前記電子
部品の側面から上面の一部にかけ連続して導電性ペース
トを塗布することを特徴とする端子電極用導電性ペース
トの塗布方法。
1. A method of applying a conductive paste for a terminal electrode of an electronic component, which has a terminal electrode extending from an upper surface to a lower surface on a side surface, wherein a mask having a groove of a predetermined depth is formed along the terminal electrode forming position. The member is pressed against the terminal electrode forming surface of the electronic component, and a screen in which an opening is formed corresponding to the terminal electrode forming position of the electronic component and the terminal electrode forming position and a part of the upper surface of the electronic component is formed. The conductive paste is applied to the upper surface of the electronic component, the conductive paste is supplied onto the screen, the conductive paste is introduced into the groove through the opening, and conductive is continuously applied from the side surface of the electronic component to a part of the upper surface. A method for applying a conductive paste for terminal electrodes, which comprises applying a conductive paste.
【請求項2】 側面に上面から下面に延びる端子電極を
有する電子部品の端子電極用導電性ペーストの塗布方法
であって、 前記端子電極形成位置に沿って所定深さの溝が形成され
たマスク部材を、前記電子部品の端子電極形成面に押し
当て、 前記電子部品の端子電極形成位置上に描画ノズルによっ
て導電性ペーストを射出し、該導電性ペーストを前記溝
内に導入し、前記電子部品の側面から上面の一部にかけ
連続して導電性ペーストを塗布することを特徴とする端
子電極用導電性ペーストの塗布方法。
2. A method of applying a conductive paste for a terminal electrode of an electronic component, which has a terminal electrode extending from an upper surface to a lower surface on a side surface, wherein a mask having a groove of a predetermined depth is formed along the terminal electrode forming position. The member is pressed against the terminal electrode formation surface of the electronic component, a conductive paste is injected by a drawing nozzle onto the terminal electrode formation position of the electronic component, and the conductive paste is introduced into the groove, the electronic component A method for applying a conductive paste for terminal electrodes, characterized in that the conductive paste is applied continuously from the side surface to a part of the upper surface.
【請求項3】 前記マスク部材は弾性体からなることを
特徴とする請求項1又は2記載の端子電極用導電性ペー
ストの塗布方法。
3. The method for applying a conductive paste for a terminal electrode according to claim 1, wherein the mask member is made of an elastic material.
【請求項4】 前記電子部品の下方から吸引することに
より前記開口から前記溝内へ導電性ペーストを導入する
ことを特徴とする請求項1又は2記載の端子電極用導電
性ペーストの塗布方法。
4. The method for applying a conductive paste for a terminal electrode according to claim 1, wherein the conductive paste is introduced into the groove from the opening by sucking from below the electronic component.
【請求項5】 少なくとも前記溝を中心とする所定範囲
内を覆う通気性シートを前記電子部品の下面に押し当て
た状態で前記溝内に前記導電性ペーストを導入すること
を特徴とする請求項1又は2記載の端子電極用導電性ペ
ーストの塗布方法。
5. The conductive paste is introduced into the groove while a breathable sheet covering at least a predetermined area centering on the groove is pressed against the lower surface of the electronic component. 1. A method for applying the conductive paste for a terminal electrode according to 1 or 2.
JP6262877A 1994-10-26 1994-10-26 Terminal electrode conductive paste coating method Withdrawn JPH08124813A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6262877A JPH08124813A (en) 1994-10-26 1994-10-26 Terminal electrode conductive paste coating method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6262877A JPH08124813A (en) 1994-10-26 1994-10-26 Terminal electrode conductive paste coating method

Publications (1)

Publication Number Publication Date
JPH08124813A true JPH08124813A (en) 1996-05-17

Family

ID=17381878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6262877A Withdrawn JPH08124813A (en) 1994-10-26 1994-10-26 Terminal electrode conductive paste coating method

Country Status (1)

Country Link
JP (1) JPH08124813A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8048228B2 (en) 2006-10-27 2011-11-01 Tdk Corporation Masking apparatus and method of fabricating electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8048228B2 (en) 2006-10-27 2011-11-01 Tdk Corporation Masking apparatus and method of fabricating electronic component

Similar Documents

Publication Publication Date Title
JPH08124813A (en) Terminal electrode conductive paste coating method
JPH09214095A (en) Board and circuit module, and method for manufacturing circuit module
JPH04336490A (en) Method for forming reflow solder
JP3294479B2 (en) Carrier plate for holding chip-shaped component and method for transferring chip-shaped component printing paste
KR100349895B1 (en) Method and apparatus for soldering film type electronic component
JPS62160290A (en) Soldering mask
JPH0661634A (en) Bonding method for electronic component and adhesive coating nozzle
JPS6366078B2 (en)
JP3498440B2 (en) Dispenser nozzle and viscous object coating device using the same
KR100274991B1 (en) Csp and mounting method thereof, and jig for forming patterns on electrodes of csp
JPH08124812A (en) Terminal electrode conductive paste coating method
JP4301426B2 (en) External electrode forming apparatus and external electrode forming method for electronic parts
JPH066022A (en) Part mounting method
JPS63247392A (en) Partial plating device
JPH05116272A (en) Solder paste printing method
JP4278807B2 (en) Method and apparatus for mounting semiconductor device
JPH0612623Y2 (en) Chippujiyanpa
JPH0722742A (en) Soldering method for printed wiring board
JPH1098074A (en) Opening structure of metal mask and manufacturing method of printed form
JPH08162749A (en) Cream solder coater
JPH1022167A (en) Porcelain capacitor and its manufacturing method
JP2003309353A (en) Electronic circuit unit
JPH0555736A (en) Chip component mounting method
JPS59218797A (en) Printed wiring circuit device
JPH0738241A (en) Electrode structure for printed wiring board and formation thereof

Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 20020115