JPH08124812A - Terminal electrode conductive paste coating method - Google Patents

Abstract

PURPOSE: To provide a terminal electrode conductive paste coating method with which a continuous spreading to the adjacent surface can be formed on the corner part. CONSTITUTION: A plurality of parts 1 are maintained in such a manner that terminal electrode forming objective surface are positioned almost on the same plane surface and terminal electrode forming positions are arranged on a straight line through the spacers 6 of the prescribed height, the drawing nozzle part 7, where a drawing nozzle 7a having the width corresponding to the width of the terminal electrode is provided, is shifted corresponding to the forming position of the terminal electrode, and the conductive paste 9 injected from the drawing nozzle part 7 is spread on the parts 1. Accordingly, as the conductive paste 9 is spread on the parts 1 in almost U-shaped cross-section, a continuous spreading to the adjacent surface can be formed on the corner part, and the surface electrode and the terminal electrode can be connected with sufficient superposition even when a surface layer electrode is formed on the adjacent surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for applying a conductive paste for terminal electrodes of electronic parts such as laminated composite parts having a plurality of terminal electrodes arranged in parallel.

[0002]

2. Description of the Related Art Conventionally, in an electronic component as shown in FIG. 2, for example, a laminated composite component 1, in order to connect an internal electrode 2 and a surface layer electrode 3, and the laminated composite component 1 is soldered to a mother board (component mounting board). For attachment, a plurality of strip-shaped terminal electrodes 4 arranged in parallel are formed.

The terminal electrode 4 is formed by applying a conductive paste to the end surface of the element body after firing by screen printing or the like. Further, after the terminal electrode 4 is formed, the surface layer electrode 3 is subsequently formed by screen printing.
Further, depending on the product, thereafter, a thick film resistor conductively connected to the surface layer electrode 3 is formed on the surface of the laminated composite component 1,
An electronic component such as a semiconductor may be soldered to the surface layer electrode 3.

[0004]

However, in the above-mentioned conventional method of applying the conductive paste for terminal electrodes, since the terminal electrodes 4 and the surface layer electrodes 3 are formed by screen printing, these terminals at the corners are formed. Since the overlap between the electrode 4 and the surface layer electrode 3 is small, they are not connected to each other, and the overlapping part between the terminal electrode 4 and the surface layer electrode 3 is thin, which may cause an open defect during soldering, which is high. There was a problem that reliability was not obtained.

In view of the above problems, an object of the present invention is to provide a method for applying a conductive paste for a terminal electrode, which can form a continuous wraparound to an adjacent surface at a corner portion.

[0006]

In order to achieve the above object, the present invention provides a method for applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, wherein the terminal of the electronic component is While masking a predetermined portion of each of the surface layer electrode formation surface adjacent to the electrode formation target surface and the surface facing the surface layer electrode formation surface, while ejecting a conductive paste from the drawing nozzle to the terminal electrode formation target surface, By moving the drawing nozzle or the electronic component in a predetermined direction,
A method for applying a conductive paste for a terminal electrode is proposed in which the conductive paste for a terminal electrode is continuously applied to the target electrode formation target surface and a part of at least one surface adjacent to the target terminal electrode formation target surface.

According to a second aspect of the present invention, there is provided a method of applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, wherein a plurality of electronic components and spacers are alternated so that the terminal electrode forming positions are aligned on a straight line. And a step is provided such that the terminal electrode formation target surface projects a predetermined height above the spacer, and masks and holds predetermined portions of the respective side surfaces of the electronic components located at the both ends, By moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components while ejecting a conductive paste from the drawing nozzle onto the terminal electrode formation target surface, the terminal electrode formation target surface and the terminal electrode A method for applying a conductive paste for a terminal electrode is proposed in which the conductive paste for a terminal electrode is continuously applied to a part of at least one surface adjacent to the formation target surface.

According to a third aspect of the present invention, there is provided a method of applying a conductive paste for a terminal electrode of an electronic component having a plurality of terminal electrodes arranged at a predetermined interval, wherein the terminal electrode forming positions are arranged on a straight line. A plurality of electronic components and spacers are arranged alternately, and a step is provided so that the terminal electrode formation target surface projects a predetermined height above the spacers, and a predetermined side surface of each of the electronic components located at the both ends. The portion is masked and held, and while the conductive paste is ejected from the drawing nozzle having a plurality of injection holes corresponding to the plurality of terminal electrodes onto the target surface for forming the terminal electrode, the drawing nozzle is set to the plurality of electrons. By moving in a predetermined direction with respect to the component, the terminal electrode formation target surface and a part of at least one surface adjacent to the terminal electrode formation target surface are continuously formed for the terminal electrode. We propose a method applying terminal electrode conductive paste for applying the conductive paste.

According to a fourth aspect of the present invention, there is provided a method for applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, wherein a cut having a predetermined shape is formed at least in a corner portion corresponding to a position where the terminal electrode is formed. A plurality of spacers and a plurality of electronic components are alternately arranged so that the terminal electrode formation positions and the cuts are aligned on a straight line, and a predetermined portion of each side surface of the electronic components located at the both ends is masked and held. Then, while ejecting a conductive paste from the drawing nozzle to the terminal electrode formation target surface, the drawing nozzle is moved in a predetermined direction with respect to the plurality of electronic components, thereby the terminal electrode formation target surface, and A method for applying a conductive paste for a terminal electrode, in which a conductive paste for a terminal electrode is continuously applied to a part of at least one surface adjacent to the surface on which the terminal electrode is formed. Suggest.

Further, according to a fifth aspect of the present invention, there is provided a method of applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, wherein a plurality of electronic components and corners of a surface of the electronic component that are aligned with a surface on which the terminal electrode is formed. The plurality of spacers each having a tapered portion are arranged alternately so that the terminal electrode formation positions are arranged on a straight line, and a predetermined portion of each side surface of the electronic component located at the both ends is masked and held. While ejecting a conductive paste from the drawing nozzle to the terminal electrode formation target surface, the drawing nozzle is moved in a predetermined direction with respect to the plurality of electronic components, thereby the terminal electrode formation target surface, and A method for applying a conductive paste for a terminal electrode is proposed in which the conductive paste for a terminal electrode is continuously applied to a part of at least one surface adjacent to the target surface for forming a terminal electrode.

According to a sixth aspect of the present invention, in the method of applying the conductive paste for a terminal electrode according to any of the second to fifth aspects, the conductive paste is applied from the drawing nozzle at a position corresponding to the electronic component. A method for applying a conductive paste for a terminal electrode, which is ejected and does not eject the conductive paste at a position corresponding to the spacer, is proposed.

According to a seventh aspect of the present invention, there is provided a method of applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, wherein the corner portion corresponding to the terminal electrode forming position on the terminal electrode formation target surface of the electronic component is applied. Forming a cutout, masking predetermined portions of the surface layer electrode formation surface adjacent to the terminal electrode formation target surface and the surface facing the surface layer electrode formation surface, respectively, from the drawing nozzle to the terminal electrode formation target surface A terminal electrode for applying a conductive paste for a terminal electrode continuously to the terminal electrode formation target surface and the cut by moving the drawing nozzle or the electronic component in a predetermined direction while ejecting the conductive paste. We propose a method of applying conductive paste.

Further, according to the present invention, there is provided a method of applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, wherein the corner portion of the surface of the electronic component corresponding to the terminal electrode forming position is formed on the terminal electrode forming target surface. A plurality of electronic components are formed side by side so that the terminal electrode formation target surface is located on substantially the same plane and the terminal electrode formation positions are aligned on a straight line by forming a cutout, and the electronic components located at the both ends. By masking a predetermined portion of each side surface of the device and ejecting a conductive paste from the drawing nozzle onto the terminal electrode formation target surface, the drawing nozzle is moved in a predetermined direction with respect to the plurality of electronic components. A method for applying a conductive paste for a terminal electrode is proposed, in which the conductive paste for a terminal electrode is applied continuously to the target electrode formation target surface and the cut.

Further, according to a ninth aspect of the present invention, there is provided a method of applying a conductive paste for a terminal electrode of an electronic component having a plurality of terminal electrodes arranged side by side at predetermined intervals, wherein the terminal on the terminal electrode formation target surface of the electronic component is applied. A cut is formed at a corner portion corresponding to an electrode forming position, the terminal electrode forming target surface is located on substantially the same plane, and a plurality of electronic components are arranged and held so that the terminal electrode forming position is aligned on a straight line. , Masking a predetermined part of each side surface of the electronic component located at the both ends, and applying a conductive paste to the terminal electrode formation target surface from a drawing nozzle having a plurality of injection holes corresponding to the plurality of terminal electrodes. While ejecting, the drawing nozzle is moved in a predetermined direction with respect to the plurality of electronic components, so that the terminal electrode guide surface is continuously formed on the terminal electrode formation target surface and the cutout. We propose a method applying terminal electrode conductive paste for applying the sexual paste.

[0015]

According to the first aspect of the present invention, predetermined portions of the surface layer electrode formation surface adjacent to the terminal electrode formation target surface of the electronic component and the surface facing the surface layer electrode formation surface are masked, and the drawing nozzle or A conductive paste is ejected from a drawing nozzle onto the surface on which the terminal electrode is formed while moving the electronic component in a predetermined direction. As a result, the terminal electrode formation target surface and a part of at least one surface adjacent to the terminal electrode formation target surface are continuously coated with the terminal electrode conductive paste, and the electronic component has a substantially U-shaped cross section. A conductive paste is applied to the shape.

According to a second aspect of the present invention, a plurality of electronic components and spacers are alternately arranged, a step is provided so that the surface of the electronic component on which the terminal electrodes are formed protrudes by a predetermined height, and the terminal electrodes are formed. The positions are aligned on a straight line, and predetermined portions of the side surfaces of the electronic components located at both ends are masked and held. In this state, a conductive paste is ejected from the drawing nozzle onto the terminal electrode formation target surface while moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components. As a result, the terminal electrode formation target surface and a part of at least one surface adjacent to the terminal electrode formation target surface are continuously coated with the terminal electrode conductive paste, and the electronic component has a substantially U-shaped cross section. A conductive paste is applied to the shape.

According to a third aspect of the present invention, a plurality of electronic components and spacers are alternately arranged, a step is provided so that a surface of the electronic component on which a terminal electrode is formed protrudes by a predetermined height, and a plurality of terminals are provided. Electrode formation positions are arranged on a straight line, and further, predetermined portions of the side surfaces of the electronic components located at both ends are masked and held. In this state, the drawing nozzle having the plurality of injection holes corresponding to the plurality of terminal electrode forming positions is moved in a predetermined direction with respect to the plurality of electronic components, and the drawing nozzle is formed on the terminal electrode formation target surface. A conductive paste is injected from the. As a result, the terminal electrode formation target surface and a part of at least one surface adjacent to the terminal electrode formation target surface are continuously coated with the terminal electrode conductive paste, and the electronic component includes the plurality of terminals. The conductive paste is applied to the electrode formation position in a substantially U-shaped cross section.

According to a fourth aspect of the present invention, a plurality of spacers and a plurality of electronic components each having a predetermined shape cut at a corner corresponding to at least a terminal electrode forming position and a plurality of electronic components are provided at the terminal electrode forming position and the cutting position. The oysters are alternately arranged so as to be arranged on a straight line, and further, predetermined portions of the side surfaces of the electronic components located at the both ends are masked and held. In this state, a conductive paste is ejected from the drawing nozzle onto the terminal electrode formation target surface while moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components. Thereby, in the cut portion, the conductive paste also adheres to the surface adjacent to the terminal electrode formation target surface, the terminal electrode formation target surface, and at least one of the terminal electrode formation target surface adjacent to the surface. The conductive paste for terminal electrodes is continuously applied to a part of the surface, and the conductive paste is applied to the electronic component in a substantially U-shaped cross section.

According to a fifth aspect of the present invention, the plurality of spacers, in which the corners of the surface of the electronic component lined up with the surface on which the terminal electrode is formed, are tapered, and the plurality of electronic components, the terminal electrode formation positions are linear. The electronic parts are alternately arranged so as to be arranged on the upper side, and further, predetermined portions of the side surfaces of the electronic components located at the both ends are masked and held. In this state, a conductive paste is ejected from the drawing nozzle onto the terminal electrode formation target surface while moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components. Thereby, in the tapered corner portion, the conductive paste adheres to the surface adjacent to the terminal electrode formation target surface, and the terminal electrode formation target surface, and at least one adjacent to the terminal electrode formation target surface The conductive paste for terminal electrodes is continuously applied to a part of the surface of the above, and the conductive paste is applied to the electronic component in a substantially U-shaped cross section.

According to the sixth aspect, the conductive paste is ejected from the drawing nozzle at a position corresponding to the electronic component, and the conductive paste is ejected at a position corresponding to the spacer. Absent.

According to a seventh aspect of the present invention, a surface layer electrode adjacent to the terminal electrode formation target surface is formed with a cut at a corner portion corresponding to the terminal electrode formation position of the terminal electrode formation target surface of the electronic component. A predetermined portion of each of the formation surface and the surface facing the surface electrode formation surface is masked, and a conductive paste is applied from the drawing nozzle to the terminal electrode formation target surface while moving the drawing nozzle or the electronic component in a predetermined direction. Is ejected. As a result, the terminal electrode conductive paste is applied continuously to the terminal electrode formation target surface and the cut, and the electronic component is applied with the conductive paste having a substantially U-shaped cross section.

According to the eighth aspect, a plurality of electronic components having the cutouts formed at the corners corresponding to the terminal electrode formation positions on the terminal electrode formation target surface of the electronic component are arranged, and the terminal electrode formation positions are arranged. Predetermined portions on the respective side surfaces of the electronic components arranged on a straight line and located at both ends are masked and held. In this state, a conductive paste is ejected from the drawing nozzle onto the terminal electrode formation target surface while moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components. As a result, the terminal electrode conductive paste is applied continuously to the terminal electrode formation target surface and the cut, and the electronic component is applied with the conductive paste having a substantially U-shaped cross section.

According to a ninth aspect of the invention, a plurality of electronic components each having a cutout formed at a corner portion corresponding to a terminal electrode formation position on a surface of the electronic component on which a terminal electrode is formed are arranged to form a plurality of terminal electrodes. The positions are aligned on a straight line, and further, predetermined portions of the side surfaces of the electronic components located at both ends are masked and held. In this state, a drawing nozzle having a plurality of ejection holes corresponding to a plurality of terminal electrode formation positions is moved from the drawing nozzle to the terminal electrode formation target surface while moving in a predetermined direction with respect to the plurality of electronic components. The conductive paste is injected. Thereby, the conductive paste for the terminal electrode is continuously applied to the terminal electrode formation target surface and the cut, and the electronic component has the conductive paste in a substantially U-shaped cross section at the plurality of terminal electrode forming positions. Is applied.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a side sectional view showing a laminated composite component in which a terminal electrode is formed in this embodiment. In the figure, the same components as those of the above-described conventional example are denoted by the same reference numerals. That is, reference numeral 1 denotes a laminated composite component (hereinafter referred to as component), which is arranged in parallel for connecting the internal electrode 2 and the surface electrode 3 and for soldering the component 1 to a motherboard (component mounting board). The strip-shaped terminal electrode 5 is formed.

This terminal electrode 5 is formed in a substantially U-shaped cross section from the side surface of the component 1 to the upper surface and the lower surface thereof, and is electrically connected to the surface layer electrode 3 with sufficient overlap on the upper surface.

Therefore, since the terminal electrodes 5 and the surface layer electrodes 3 are sufficiently overlapped at the corners, they are not connected, and the overlapping portion between the terminal electrodes 5 and the surface layer electrode 3 is different from the conventional case. Since it is thin, open defects do not occur during soldering, and high reliability is obtained.

The method of forming the terminal electrode 5 of the component 1 described above is performed by applying a conductive paste for a terminal electrode by the method described below and then curing the conductive paste.

That is, the method of applying the conductive paste for the terminal electrode in the first embodiment is as shown in FIG.
Are held in parallel via a spacer 6 having a predetermined width. At this time, the surfaces on which the terminal electrodes 5 of the component 1 are to be formed are all located in the same plane, and the plurality of components 1 are held at predetermined intervals so that the terminal electrode formation positions are aligned in a straight line. Further, the spacer 6 is provided slightly apart from the surface on which the terminal electrode is formed so that the terminal electrode surface projects. Further, the spacers 6 are positioned at both ends.

With respect to the plurality of components 1 held in this way, a plurality of drawing nozzles 7a having a width corresponding to the width of the terminal electrode 5 as shown in FIG. 4 are provided in parallel below the paste pot 7b. The conductive paste 9 in the paste pot 7b is ejected from the drawing nozzle 7a of the portion 7 and moved along the terminal electrode forming surface. Thereby, the conductive paste 9 ejected from the drawing nozzle portion 7 can be applied to the component 1, and a plurality of terminal electrodes 5 arranged in parallel can be formed.

When the drawing nozzle 7a moves to the boundary between the component 1 and the spacer 6, as shown in FIG. 3B, the conductive paste 9 is also applied to a part of the surface adjacent to the surface on which the terminal electrode is formed. Are continuously applied, and the conductive paste 9 is applied to the component 1 in a substantially U-shaped cross section.

At both ends, the spacers 6 serve as masks to prevent the conductive paste 9 from dripping on the side surfaces of the component 1 located at both ends.

Next, a method of applying the conductive paste for terminal electrodes according to the second embodiment of the present invention will be described. FIG. 5 and FIG. 6 are main part configuration diagrams showing a coating apparatus in the second embodiment. In the figure, reference numeral 10 denotes a carrier, which is a pair of rotating bodies 11a and 11b provided on the left and right and the rotating bodies 11a and 11
A plurality of support plates 12a are fixed to the belt 12 so as to be perpendicular to the belt surface and parallel to each other. Further, as shown in FIG. 5, the width of the support plate 12a is equal to the width of the component 1, and the length thereof is set to be slightly shorter than that of the component 1. Further, a drawing nozzle unit 7 is provided on the upper part of the carrier 10.

When the component 1 is coated with the terminal electrode conductive paste 9 by the coating device having the above-mentioned structure,
As shown in FIG. 5, the component 1 is provided in the upper right portion of the carrier 10.
Is supplied to the carrier 10. As a result, the component 1 is inserted between the support plates 12a that are widened in the upper right portion, and the rotating body 1
When the belt 12 rotates together with the rotation of 1a and 11b, the component 1 is sandwiched and held between two adjacent support plates 12a. At this time, the upper end of the component 1 is in a state of slightly protruding from the support plate 12a.

When the belt 12 rotates and the parts 1 sequentially move to the left, the support plate 12a serves as the above-mentioned spacer, and the plurality of parts 1 are held in parallel at a predetermined interval. In this state, when the component 1 moves to the middle, the conductive paste 9 is ejected from the drawing nozzle portion 7 toward the upper surface of the component 1 (terminal electrode formation target surface).

As a result, the conductive paste 9 ejected from the drawing nozzle portion 7 is applied to the upper surface of the component 1. At this time, when the drawing nozzle portion 7 is positioned between two adjacent components 1, the conductive paste 9 is continuously applied to a part of the side surface of the component 1 as described above, and the component 1 has a cross section. The conductive paste 9 is applied in a substantially U shape.

Next, a method of applying the conductive paste for terminal electrodes according to the third embodiment of the present invention will be described. In the third embodiment, as shown in FIG. 7, the corners of the upper surface of the spacer 6 are tapered. As a result, when the components 1 and the spacers 6 are alternately arranged, even if the upper surface of the component 1 (the surface on which the terminal electrode is formed) and the upper surface of the spacer 6 are in the same plane, the tapered surface 6a causes the upper end of the component 1 to move. The portion is slightly projected from the spacer 6. Further, the spacers 6 are positioned at both ends.

While injecting the conductive paste 9 in the paste pot 7b from the drawing nozzle 7a of the drawing nozzle section 7 to the plurality of components 1 held in this way,
It is moved along the terminal electrode formation surface. Thereby, the conductive paste 9 ejected from the drawing nozzle portion 7 can be applied to the component 1, and a plurality of terminal electrodes 5 arranged in parallel can be formed.

When the drawing nozzle 7a is moved to the boundary between the component 1 and the spacer 6, as shown in FIG. 7 (b), the recess formed by the tapered surface 6a adjoins the terminal electrode formation target surface. Conductive paste 9 on part of the surface
Are continuously applied, and the conductive paste 9 is applied to the component 1 in a substantially U-shaped cross section.

At both ends, the spacers 6 serve as masks to prevent the conductive paste 9 from dripping on the side surfaces of the component 1 located at both ends.

Next, a method of applying the conductive paste for terminal electrodes according to the fourth embodiment of the present invention will be described. In the fourth embodiment, as shown in FIG. 8, a cut 6b having a predetermined shape is formed at a corner portion of the upper surface of the spacer 6 corresponding to the position where the terminal electrode is formed.
Was formed. Accordingly, when the components 1 and the spacers 6 are alternately arranged, even if the upper surface of the component 1 (the surface on which the terminal electrode is formed) and the upper surface of the spacer 6 are in the same plane, the terminals of the component 1 are cut by the cutouts 6b. A depression is formed on the side surface of the electrode formation position. Further, the spacers 6 are positioned at both ends.

While injecting the conductive paste 9 in the paste pot 7b from the drawing nozzle 7a of the drawing nozzle section 7 to the plurality of components 1 held in this way,
It is moved along the terminal electrode formation surface. Thereby, the conductive paste 9 ejected from the drawing nozzle portion 7 can be applied to the component 1, and a plurality of terminal electrodes 5 arranged in parallel can be formed.

Further, when the drawing nozzle 7a moves to the position of the recess formed by the scribe 6b, as shown in FIG. 8 (b),
Due to the depression formed by the cutout 6b, the conductive paste 9 is also applied to a part of the surface adjacent to the surface on which the terminal electrode is formed.
Are continuously applied, and the conductive paste 9 is applied to the component 1 in a substantially U-shaped cross section.

At both ends, the spacers 6 serve as masks to prevent the conductive paste 9 from dripping on the side surfaces of the component 1 located at both ends.

Next, a method of applying the conductive paste for terminal electrodes according to the fifth embodiment of the present invention will be described. In the fourth example, as shown in FIG. 9, a cut 1a having a predetermined shape was formed in the corner portion of the upper surface of the component 1 corresponding to the terminal electrode formation position. Thereby, when a plurality of parts 1 are arranged in series,
A cut 1a is formed on the upper surface of the component 1 (the surface on which the terminal electrodes are formed)
Thus, a depression is formed on the side surface of the terminal electrode formation position. At this time, the mask members 13 are positioned on both ends.

While injecting the conductive paste 9 in the paste pot 7b from the drawing nozzle 7a of the drawing nozzle portion 7 to the plurality of components 1 held in this way,
It is moved along the terminal electrode formation surface. Thereby, the conductive paste 9 ejected from the drawing nozzle portion 7 can be applied to the component 1, and a plurality of terminal electrodes 5 arranged in parallel can be formed.

Further, when the drawing nozzle 7a moves to the position of the recess formed by the scribe 1a, as shown in FIG. 9 (b),
Due to the depression formed by the cutout 1a, the conductive paste 9 is also formed on a part of the surface adjacent to the surface on which the terminal electrode is formed.
Are continuously applied, and the conductive paste 9 is applied to the component 1 in a substantially U-shaped cross section.

The mask members 13 serve as masks at both ends to prevent the conductive paste 9 from dripping on the side surfaces of the component 1 located at both ends.

Next, a method of applying the conductive paste for terminal electrodes according to the sixth embodiment of the present invention will be described. FIG. 10 is a main part configuration diagram showing a coating apparatus in the sixth embodiment. In the figure, reference numeral 30 denotes a support plate, and a plurality of holes 31 are formed in a matrix shape on the upper surface thereof, and the component 1 is inserted into each hole 31 with the surface for forming the terminal electrode as the upper surface. Reference numeral 32 denotes a drawing nozzle group, in which a plurality of the drawing nozzle portions 7 described above are connected in parallel corresponding to the rows of the holes 31, and are supported so as to be movable along the surface of the support plate 30.

Each hole 31 has a shape in which the component 1 is inscribed as shown in FIG. 11, and the depth thereof is set so that the upper portion of the component 1 slightly projects from the surface of the support plate 30.

When the component 1 is coated with the terminal electrode conductive paste 9 by the coating device having the above-described structure, the drawing nozzle portion 7 is maintained above the surface of the support plate 30 by a predetermined distance, and the support plate 30 is maintained. Move along the plane of. Here, since it is sufficient that the drawing nozzle group 32 and the support plate 30 move relative to each other, the drawing nozzle group 32 may move,
The support plate 30 may move.

As a result, the conductive paste 9 ejected from the drawing nozzle portion 7 is applied to the upper surface of the component 1 (terminal electrode formation target surface). At this time, two drawing nozzles 7 are adjacent to each other.
When located between two components 1, the conductive paste 9 is continuously applied to a part of the side surfaces (two surfaces adjacent to the terminal electrode formation target surface) of the component 1 as described above.
A conductive paste 9 having a substantially U-shaped cross section is applied to this.

In the sixth embodiment described above, the upper part of the component 1 is made to slightly project from the surface of the support plate 30, but as in the seventh embodiment shown in FIG. The holes 31 are formed so that the upper surface and the surface of the support plate 30 are substantially flush with each other.
When the depth is set, if the opening peripheral edge of the hole 31 is formed in an elliptical taper shape, the conductive paste can be applied as described above.

In this case, since the elliptical tapered surface 31a is formed at the opening of the hole 31, a gap is formed between the side surface of the component 1 (the surface adjacent to the surface on which the terminal electrode is formed) and the support plate 30. When the conductive paste 9 is applied,
The conductive paste 9 is continuously applied to part of the side surfaces of the component 1 (two surfaces adjacent to the terminal electrode formation target surface),
The conductive paste 9 is applied to the component 1 in a substantially U-shaped cross section.

When the component 1 is inserted into the hole 31, the hole 3
Since the tapered surface 31a is formed at the peripheral edge portion of the opening 1, the component 1 can be easily inserted.

Incidentally, in the above-mentioned first to seventh embodiments,
Although the conductive paste 9 is continuously ejected from the drawing nozzle portion 7, the conductive paste 9 is ejected from the drawing nozzle portion 7 at a position corresponding to the component 1, and the conductive paste 9 is electrically conductive at a position corresponding to the spacer 6 or the like. If the paste 9 is not injected, waste of the conductive paste 9 can be omitted.

[0056]

As described above, according to the first aspect of the present invention, the conductive paste is continuously applied to a part of the surface adjacent to the surface on which the terminal electrode is formed, and the cross section is substantially omitted for the electronic component. Since the conductive paste is applied in a U shape, it is possible to form a continuous wraparound to the adjacent surface at the corner portion,
Even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode can be connected with sufficient overlap. As a result, it is possible to prevent the occurrence of an open defect between the terminal electrode and the surface electrode during soldering, and it is possible to obtain high reliability.

According to the second aspect, the conductive paste is continuously applied to a part of the surface adjacent to the surface where the terminal electrode is formed, and the conductive paste having a substantially U-shaped cross section is applied to the electronic component. Since it is applied, it is possible to form a continuous wraparound to the adjacent surface at the corner portion, and even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode can be connected with sufficient overlap. . This allows
It is possible to prevent the occurrence of an open defect between the terminal electrode and the surface layer electrode during soldering, and it is possible to obtain high reliability. Also, since it is possible to apply the conductive paste to a plurality of electronic components almost at the same time,
Work efficiency can be improved.

According to the third aspect, the conductive paste is continuously applied to a part of the surface adjacent to the surface where the terminal electrode is formed, and the electronic component is coated with the conductive paste in a substantially U-shaped cross section. Since it is applied, it is possible to form a continuous wraparound to the adjacent surface at the corner portion, and even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode can be connected with sufficient overlap. . This allows
It is possible to prevent the occurrence of an open defect between the terminal electrode and the surface layer electrode during soldering, and it is possible to obtain high reliability. Further, the conductive paste can be simultaneously applied to a plurality of terminal electrode formation positions arranged in parallel,
Since the conductive paste can be applied to a plurality of electronic components almost at the same time, work efficiency can be improved.

According to a fourth aspect of the present invention, the conductive paste is adhered also to the surface of the electronic component adjacent to the terminal electrode formation target surface in the cutout portion of the spacer, and the terminal electrode formation target surface and the terminal are formed. The conductive paste for the terminal electrode is continuously applied to a part of at least one surface adjacent to the electrode formation target surface, and the conductive paste is applied to the electronic component in a substantially U-shaped cross section, so the corner portion In, the continuous wraparound can be formed to the adjacent surface, and even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode can be connected with sufficient overlap.
As a result, it is possible to prevent the occurrence of an open defect between the terminal electrode and the surface electrode during soldering,
High reliability can be obtained.

According to a fifth aspect of the present invention, the conductive paste adheres to the surface of the spacer which is adjacent to the terminal electrode formation target surface of the electronic component at the tapered corner portion of the spacer,
The terminal electrode formation target surface and a part of at least one surface adjacent to the terminal electrode formation target surface are continuously coated with the terminal electrode conductive paste, and the electronic component is electrically conductive in a substantially U-shaped cross section. Since the conductive paste is applied, a continuous wraparound can be formed in the adjacent surface at the corner portion, and even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode are connected with sufficient overlap. be able to. As a result, it is possible to prevent the occurrence of an open defect between the terminal electrode and the surface electrode during soldering, and it is possible to obtain high reliability.

According to claim 6, in addition to the above effect, the conductive paste is ejected from the drawing nozzle at a position corresponding to the electronic component, and the conductive paste is discharged at a position corresponding to the spacer. Since the paste is not injected, waste of the conductive paste can be omitted.

According to a seventh aspect of the present invention, the conductive paste for the terminal electrode is applied continuously to the surface of the electronic component on which the terminal electrode is to be formed and the cut, and the electronic component is electrically conductive in a substantially U-shaped cross section. Since the paste is applied, it is possible to form a continuous wraparound to the adjacent surface at the corner portion, and even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode should be connected with sufficient overlap. You can As a result, it is possible to prevent the occurrence of an open defect between the terminal electrode and the surface electrode during soldering, and it is possible to obtain high reliability.

According to the eighth aspect, the conductive paste for the terminal electrode is applied continuously to the surface of the electronic component on which the terminal electrode is to be formed and the cutout, and the electronic component is electrically conductive in a substantially U-shaped cross section. Since the paste is applied, it is possible to form a continuous wraparound to the adjacent surface at the corner portion, and even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode should be connected with sufficient overlap. You can As a result, it is possible to prevent the occurrence of an open defect between the terminal electrode and the surface electrode during soldering, and it is possible to obtain high reliability. Moreover, since the conductive paste can be applied simultaneously to a plurality of terminal electrode formation positions arranged in parallel, work efficiency can be improved.

According to a ninth aspect of the present invention, a conductive paste for a terminal electrode is applied continuously to the surface on which the terminal electrode is to be formed and the cutout of the electronic component, and the electronic component is electrically conductive in a substantially U-shaped cross section. Since the paste is applied, it is possible to form a continuous wraparound to the adjacent surface at the corner portion, and even when the surface layer electrode is formed on the adjacent surface, the surface layer electrode and the terminal electrode should be connected with sufficient overlap. You can As a result, it is possible to prevent the occurrence of an open defect between the terminal electrode and the surface electrode during soldering, and it is possible to obtain high reliability. Further, the conductive paste can be applied simultaneously to a plurality of terminal electrode forming positions arranged in parallel, and the conductive paste can be applied to a plurality of electronic components almost at the same time, so that the work efficiency can be improved. .

[Brief description of drawings]

FIG. 1 is a side sectional view showing a laminated composite component in which a terminal electrode is formed in an embodiment of the present invention.

FIG. 2 is a configuration diagram showing a laminated composite component of a conventional example.

FIG. 3 is a diagram illustrating a method for applying a conductive paste for terminal electrodes according to the first embodiment of the present invention.

FIG. 4 is a configuration diagram showing a drawing nozzle unit in the first embodiment of the present invention.

FIG. 5 is a main part configuration diagram showing a device for applying a conductive paste for terminal electrodes in a second embodiment of the present invention.

FIG. 6 is a configuration diagram of essential parts showing a coating device for a conductive paste for terminal electrodes in a second embodiment of the present invention.

FIG. 7 is a diagram illustrating a method for applying a conductive paste for terminal electrodes according to a third embodiment of the present invention.

FIG. 8 is a diagram illustrating a method for applying a conductive paste for terminal electrodes according to a fourth embodiment of the present invention.

FIG. 9 is a diagram illustrating a method for applying a conductive paste for terminal electrodes according to a fifth embodiment of the present invention.

FIG. 10 is a configuration diagram of essential parts showing a coating device of a conductive paste for terminal electrodes in a sixth embodiment of the present invention.

FIG. 11 is a diagram illustrating a method for applying a conductive paste for terminal electrodes according to a sixth embodiment of the present invention.

FIG. 12 is a diagram illustrating a method for applying a conductive paste for terminal electrodes according to a seventh embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Laminated composite part, 2 ... Internal electrode, 3 ... Surface layer electrode, 4,
5 ... Terminal electrode, 6 ... Spacer, 7 ... Drawing nozzle part, 7
a ... Drawing nozzle, 7b ... Paste pot, 9 ... Conductive paste, 10 ... Conveyor, 11a, 11b ... Rotating body, 12
... belt, 12a ... support plate, 30 ... support plate, 31 ... hole,
31a ... Tapered surface, 32 ... Coating roller group.

Claims (9)

[Claims] 1. A method for applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, comprising: a surface layer electrode forming surface adjacent to a terminal electrode formation target surface of the electronic component and facing the surface layer electrode forming surface. By masking each predetermined part of the surface and moving the drawing nozzle or the electronic component in a predetermined direction while ejecting a conductive paste from the drawing nozzle onto the terminal electrode formation target surface, the terminal electrode is formed. A method for applying a conductive paste for a terminal electrode, which comprises continuously applying a conductive paste for a terminal electrode to a target surface and a part of at least one surface adjacent to the target electrode formation target surface. 2. A method of applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, wherein a plurality of electronic components and spacers are alternately arranged so that the terminal electrode forming positions are aligned on a straight line, and A step is provided so that the terminal electrode formation target surface projects a predetermined height above the spacer, and predetermined portions of the side surfaces of the electronic components located at the both ends are masked and held, and the terminal electrode formation target surface is formed. By moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components while ejecting the conductive paste from the drawing nozzle, the terminal electrode formation target surface and the terminal electrode formation target surface are adjacent. A method for applying a conductive paste for a terminal electrode, characterized in that the conductive paste for a terminal electrode is continuously applied to a part of at least one of the surfaces. 3. A method of applying a conductive paste for a terminal electrode of an electronic component having a plurality of terminal electrodes arranged at a predetermined interval, wherein the plurality of electronic components are arranged so that the terminal electrode forming positions are arranged in a straight line. While arranging the spacers alternately, a step is provided so that the terminal electrode formation target surface projects a predetermined height above the spacer, and predetermined portions of the side surfaces of the electronic components located at the both ends are masked. While holding the drawing paste, the drawing nozzle having a plurality of injection holes corresponding to the plurality of terminal electrodes ejects the conductive paste onto the target surface for forming the terminal electrode, and the drawing nozzle is predetermined for the plurality of electronic components. By moving in the direction, the terminal electrode formation target surface and a part of at least one surface adjacent to the terminal electrode formation target surface are continuously coated with the terminal electrode conductive paste. The method of coating the terminal electrode conductive paste, characterized by. 4. A method for applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, comprising: a plurality of spacers having a predetermined shape cut at a corner portion corresponding to at least a terminal electrode formation position; And the electronic parts of the terminal parts are alternately arranged so that the terminal electrode formation positions and the cuts are arranged on a straight line, and a predetermined part of each side surface of the electronic parts located at the both ends is held by masking, and the terminal electrodes By moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components while ejecting the conductive paste from the drawing nozzle to the formation target surface, the terminal electrode formation target surface and the terminal electrode formation target A method for applying a conductive paste for a terminal electrode, characterized in that the conductive paste for a terminal electrode is continuously applied to a part of at least one surface adjacent to the surface. 5. A method for applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, comprising: a plurality of electronic components; and a corner portion of a surface of the electronic component that is lined up with a terminal electrode formation target surface is tapered. The plurality of formed spacers are alternately arranged so that the terminal electrode formation positions are aligned on a straight line, and a predetermined portion of each side surface of the electronic component located at the both ends is masked and held to form the terminal electrode formation. The terminal electrode formation target surface and the terminal electrode formation target surface by moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components while ejecting a conductive paste from the drawing nozzle to the target surface. A method for applying a conductive paste for a terminal electrode, characterized in that the conductive paste for a terminal electrode is continuously applied to a part of at least one surface adjacent to the. 6. The ejection nozzle ejects the conductive paste at a position corresponding to the electronic component, and does not eject the conductive paste at a position corresponding to the spacer. 6. A method for applying a conductive paste for terminal electrode according to any one of 5 to 5. 7. A method of applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, wherein a cut is formed at a corner portion of the surface of the electronic component corresponding to the terminal electrode formation target surface. Masking predetermined portions of the surface layer electrode formation surface adjacent to the terminal electrode formation target surface and the surface facing the surface layer electrode formation surface, and injecting a conductive paste from the drawing nozzle to the terminal electrode formation target surface. While the drawing nozzle or the electronic component is moved in a predetermined direction, the terminal electrode conductive paste is applied continuously to the terminal electrode formation target surface and the cut. Application method of conductive paste. 8. A method of applying a conductive paste for a terminal electrode of an electronic component having a terminal electrode, wherein a cut is formed at a corner portion of a surface of the electronic component corresponding to the terminal electrode formation target surface. , The terminal electrode formation target surface is located on substantially the same plane, while holding a plurality of electronic components side by side so that the terminal electrode formation position is aligned on a straight line, the side surface of each of the electronic components located at the both ends. Forming the terminal electrode by masking a predetermined portion and moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components while injecting a conductive paste from the drawing nozzle onto the terminal electrode formation target surface. A method for applying a conductive paste for a terminal electrode, characterized in that the conductive paste for a terminal electrode is applied continuously to the target surface and the cut. 9. A method of applying a conductive paste for a terminal electrode of an electronic component having a plurality of terminal electrodes arranged at a predetermined interval, the method corresponding to a terminal electrode forming position of a surface of the electronic component on which a terminal electrode is formed. Form a cut in the corner portion, the terminal electrode formation target surface is located on substantially the same plane, while holding a plurality of electronic components side by side so that the terminal electrode formation position is aligned on a straight line, at the both ends While masking a predetermined portion of each side surface of the located electronic component, while ejecting a conductive paste onto the terminal electrode formation target surface from a drawing nozzle having a plurality of injection holes corresponding to the plurality of terminal electrodes, By moving the drawing nozzle in a predetermined direction with respect to the plurality of electronic components, the terminal electrode formation target surface and the terminal electrode conductive paste are applied continuously to the cut. The method of coating the terminal electrode conductive paste, characterized by.