JPH08115675A - Gas-discharge display panel - Google Patents

Abstract

PURPOSE: To reduce variations in the resistance value of resistance elements by properly shaping and arranging electrodes and time resistance elements, and providing tolerances to patterning accuracy and to positioning width. CONSTITUTION: A bus bar 4 is linear or in a linear shape with a projection 4b for connection to a resistance element 9, and a branching portion 8a branching from a terminal 8 and used for connection to the resistance element 9 is formed parallel to the bus bar 4, and the resistance element 9 is installed between the bus bar 4 and the branching portion 8a. Therefore, the shape of the resistance element 9 can be simplified, and variations in resistance value due to the accuracy of thick-film printing can be reduced. Also, extreme accuracy is not required in the positioning of electrodes and the resistance elements 9, and the danger of the resistance elements covering terminal portions can be avoided.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas discharge display panel, and more particularly to a gas discharge display panel having a novel structure of electrodes and resistance elements.

[0002]

2. Description of the Related Art There are various types of gas discharge display panels, which are being developed with the aim of increasing their size, increasing their efficiency and increasing their definition. The most representative of these is 2
A panel of a system in which a cathode group and an anode group are respectively arranged on a sheet of transparent insulating substrate, these two substrates are sealed at a constant interval, and gas discharge is generated in the gap to emit light is provided. Are known. Furthermore, a panel in which a resistance element is installed in each discharge cell in order to control the discharge current has been proposed. As an example of this, Takano et al. “Pulse memory drive of discharge display panel with resistance” (1990, Television The annual conference, p 77-78).

FIG. 1 shows a schematic view of the structure of the gas discharge display panel shown in this document, (a) is a perspective view from the front of the panel, and (b) is a transverse sectional view of the panel.

This gas discharge display panel is composed of two substrates, a front plate 1 and a back plate 2. A cathode 3 installed on the front plate 1, an anode bus bar 4 and an auxiliary anode 5 installed on the back plate 2.
Are formed so as to be orthogonal to each other. Discharge cell 6
Is defined by a barrier 7, an anode terminal 8 is included in each discharge cell 6, and a cathode 3 crosses the vicinity of the center of each discharge cell 6. Further, the anode terminal 8 is electrically connected to the anode bus 4 via the resistance element 9. Then, when a predetermined voltage is applied between the cathode 3 and the anode bus bar 4, a current flows through the resistance element 9 to the anode terminal 8 to generate a discharge in the discharge cell 6, and the ultraviolet rays generated by this discharge are generated. The phosphors 10 of RGB three colors are adapted to emit light. This light emission is radiated to the outside through the front plate 1 to display a full-color image. In this case, the auxiliary anode 5 has a role of supplying charged particles serving as a pilot fire of discharge to the discharge cell 6 through the priming slit 11. Reference numeral 12 is a white back layer, which is intended to make color display clear. In this type of gas discharge display panel, the current is controlled by the function of the resistance element 9, so that there is an advantage that the current efficiency is improved and further the deterioration of the brightness due to the sputtering of the cathode 3 can be prevented and the panel life can be lengthened.

[0005]

In the gas discharge display panel with a resistance element as described above, it is a problem to control the resistance value of the resistance element provided in each discharge cell to a constant value. This is because the variation in the resistance value directly leads to the variation in the discharge current of each discharge cell, that is, the variation in the light emission intensity, and the brightness unevenness occurs on the display screen.

By the way, in a large-scale gas discharge display panel, the constituent elements on the front plate and the rear plate are formed by a thick film printing method typified by a screen printing method, but electrodes and resistance elements are also exceptions. Absent. This method has a drawback in that the dimensions and thicknesses of the respective constituent elements vary due to manufacturing precision. Therefore, when an L-shaped resistance element is formed as in the panel described in the related art, a large variation in resistance value occurs due to poor dimensional accuracy. Furthermore, since the terminal portion, which is an electrode related to discharge, is directly connected to the resistance element, there is a possibility that the resistance element may cover the terminal portion if the alignment accuracy of the resistance element and the terminal portion is poor. . The accuracy of the screen printing method depends on various mechanical parameters, but largely depends on the accuracy of the screen plate. A larger display panel requires a larger screen plate, but the pattern accuracy on the screen plate also deteriorates accordingly, and a pattern shift between the electrode and the resistance element frequently occurred.

The present invention has been made in view of the above problems, and an object of the present invention is to reduce the variation in the resistance value of each resistance element, and to reduce the shapes of electrodes and resistance elements and An object of the present invention is to provide a gas discharge display panel having an electrode and a resistance element having a novel structure in which the layout is optimized and the pattern accuracy and the positioning accuracy have a margin.

[0008]

In order to achieve the above-mentioned object, the present invention provides a front plate and a back plate on opposing plate surfaces such that a plurality of cathode groups and a plurality of anode groups are orthogonal to each other. In the gas discharge display panel of the type in which the cathode group and the anode group, or one of them is composed of a bus bar and a terminal, and the bus bar and the terminal are electrically connected via a resistance element, The busbar is linear or linear and has a shape having a protrusion for connecting to the resistance element, and a branch portion for connecting to the resistance element is formed in parallel with the busbar from the terminal. A resistor element is installed between the bus bar and the branch portion.

[0009]

In the gas discharge display panel of the present invention having the above-described structure, the shape of the resistance element is simplified, so that the variation in the resistance value due to the accuracy of thick film printing can be suppressed as compared with the conventional panel. it can. Also, by installing the resistance element between the bus bar and the branch portion extending from the terminal,
Even if the electrodes and the resistance element are slightly misaligned, the effective dimension of the resistance element (the distance between the bus bar and the branch portion) does not change, and therefore the resistance value is not affected. Further, unlike the conventional panel, the possibility that the resistance element covers the terminal portion is extremely reduced.

Further, in the conventional panel, the center of each discharge cell and the intersection of the cathode and anode terminals are displaced from each other, which is a so-called offset type. However, in the electrode structure of the present invention, the center of each discharge cell is discharged. Since the terminal section involved is installed, which is a so-called onset type, a large margin (difference between the discharge writing voltage and the discharge sustaining voltage) can be secured when the display panel is driven by the memory.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

2A and 2B show an example of the structure of the gas discharge display panel according to the present invention. FIG. 2A is a perspective view from the front of the panel, and FIG. 2B is a cross-sectional view of the panel.

As shown in the figure, the gas discharge display panel of this embodiment is composed of two substrates, a front plate 1 and a rear plate 2, on which a linear cathode 3 and a back plate are arranged. An anode bus bar 4, an anode terminal 8 and an auxiliary anode 5 are installed on the face plate 2. The anode bus 4 is composed of a linear anode 4a and a protrusion 4b for connecting to a resistance element. The auxiliary anode 5 is located between two adjacent anode buses 4. The discharge cell 6 is defined by a barrier 7, and an anode terminal 8 is installed at the center of each discharge cell 6. A branch portion 8a for connecting to a resistance element extends from the anode terminal 8 in a direction parallel to the anode bus bar 4, and is provided between the protruding portion 4b of the anode bus bar 4 and the branch portion 8a of the anode terminal 8. A resistance element 9 is installed in the.

Comparing the panel of this embodiment having the above-mentioned structure with the panel described in the prior art, although the shapes of the anode bus bar 4, the anode terminal 8 and the resistance element 9 are different, each component is different from the conventional one. The operation is the same as that of the technology panel, and the operation is also the same, so the description thereof is omitted.

The structural advantage of the gas discharge display panel having the above-described structure is that the resistance element is first changed to the L-shape to be simplified, so that the variation in the resistance value due to the accuracy of thick film printing can be suppressed. It is in. Also, by installing the resistance element between the bus bar and the branch portion extending from the terminal,
Even if the alignment between the electrode and the resistance element is slightly deviated, the effective dimension of the resistance element is defined by these distances as long as the resistance element is between the protrusion 4b of the anode bus and the branch 8a of the anode terminal. Therefore, it does not affect the resistance value of the resistance element. Further, the installation position of the resistance element is separated from the anode terminal involved in the discharge, and it is possible to avoid the risk of the resistance element covering the terminal portion due to misalignment of the anode terminal and the resistance element. The fact that the electrode structure can be improved to the onset type is also an advantage of the present invention, and a large margin (difference between the discharge writing voltage and the discharge sustaining voltage) can be secured when the display panel is driven by the memory.

Next, a method of manufacturing the gas discharge display panel according to the present invention will be described.

The electrode and the resistance element are most easily formed by the screen printing method as in the conventional technique. However, in this method, the resistance value of the resistance element varies due to the poor accuracy due to the pattern forming method itself. Is difficult to control. So, instead of the screen printing method,
Variation in resistance value can be reduced by adopting a patterning method of electrodes and resistance elements to which photolithography method is applied. Regarding this method, Japanese Patent Application No. 6-250301 and Japanese Patent Application No. 6-2503 filed separately by the present applicant.
No. 02 is as described.

The process of forming electrodes will be described below with reference to the process chart shown in FIG.

In FIG. 3, the substrate on which the electrodes are formed is the back plate 2. The back plate 2 may be a flat or curved surface and is chemically stable, and a glass substrate, a resin substrate, or the like may be used. In this embodiment, a glass substrate is used, and cleaning and annealing treatment is performed before use. did. In order to improve the printing quality, a glass paste is applied as a base layer 21 on a glass substrate by a screen printing method as shown in FIG. 3 (a), dried, and then baked. Used as the face plate 2.

First, a conductive paste is thick-film printed on the back plate 2 by a screen printing method, and after the paste is dried, the paste is baked to form a conductive film 22 (see FIG. 3B). Below, the underlayer 21 is not shown). The conductive film 22 is patterned by an etching process in a later process, and the anode bus bar 4 and the anode terminal 8 are patterned.
And the auxiliary anode 5. Examples of the conductive paste material include metals such as Au, Ag, Pd, Al, Ni, Cu, and alloys thereof, as well as conductive oxides such as ITO, which can be formed into a paste for thick film printing. Therefore, any material can be used as long as it can be chemically etched. In this example, Au and Ag were good.

Alternatively, as the conductive film 22, a thin film formed by a vapor deposition method or a sputtering method may be used instead of the above thick film. In that case, the choice of materials for the conductive film 22 is greatly expanded, and conductive materials that are commercially available in the form of tablets or pellets for vapor deposition or sputtering targets can be used.
Al, Ni, Cu, etc. were good.

Next, as shown in FIG. 3C, a liquid photosensitive resin 23 was applied onto the conductive film 22 and dried. As a coating method, spin coating, roll coating,
Any method may be used as long as it is a method for coating a liquid material such as blade coating, reverse coating, spraying or dipping. Further, the photosensitive resin 23 does not have to be liquid, and a film resist can be used. When a film resist is used, it may be directly attached onto the conductive film 22 using a laminator.

Then, as shown in FIG. 3D, the photosensitive resin 23 was exposed through a light-shielding mask 24 on which the patterns of the anode bus bar 4, the anode terminal 8 and the auxiliary anode 5 were arranged.
When the photosensitive resin 23 is a film resist,
After the exposure, heat treatment is performed at 70 to 90 ° C. for about 5 to 15 minutes,
The pattern resolution was better when the curing of the exposed area was promoted.

Next, as shown in FIG. 3E, pattern development of the layer of the photosensitive resin 23 is performed. Specifically, when the positive type is used as the photosensitive resin 23, the exposed part is chemically dissolved, and when the negative type is used, the unexposed part is chemically dissolved with a dedicated developer. The photosensitive resin 23 is pattern-developed. Then, after finishing the developing process, the photosensitive resin 23 is cured by heat treatment. As a result of this curing treatment, the adhesion between the conductive film 22 and the photosensitive resin 23 is increased, and it is possible to prevent the etching failure that occurs during the etching treatment in the subsequent process. This heat treatment is not always necessary depending on the photosensitive resin.

Subsequently, as shown in FIG. 3F, the conductive film 22 is formed by using the patterned photosensitive resin 23 as a mask.
Was chemically etched to simultaneously form the anode bus bar 4, the anode terminal 8 and the auxiliary anode 5. After finishing the etching process, cleaning and drying were performed.

After etching the conductive film 22, FIG.
As shown in (g), the photosensitive resin 23 was peeled off, and the substrate was washed and dried to form the anode bus bar 4, the anode terminal 8 and the auxiliary anode 5.

After the electrode formation is completed as described above, the resistance element is formed. The formation of the resistance element will be described below with reference to the process chart shown in FIG.

First, as shown in FIG. 4A, a layer of photosensitive resin 23 is formed on the back plate 2 on which the anode bus bar 4, the anode terminal 8 and the auxiliary anode 5 are formed. Photosensitive resin 2
3 may be in a liquid form or a film form, and its coating method may be any of the above-mentioned coating methods.

Thereafter, as shown in FIG. 4B, the light-shielding mask 25 in which the pattern of the resistance element 9 is arranged at a predetermined position.
Then, the photosensitive resin 23 was exposed to light through the above, and then, as shown in FIG. 4C, pattern development of the photosensitive resin 23 was performed to form a recess 23a for embedding the resistance material in a later step.

Subsequently, as shown in FIG. 4D, a resistance material 26 was embedded in the recess 23a formed in the photosensitive resin 23. When a RuO ₂ paste for thick film printing is used as the resistance material 26, the volume of the paste shrinks when the paste is dried after the paste is embedded in the recess 23a. Therefore, it is better to repeat this process at least twice.

After filling the resistance material 25, the photosensitive resin 23 was peeled from the substrate as shown in FIG. 4 (e). When the RuO ₂ paste is used as the resistance material, the photosensitive resin 23 is peeled off, and then the paste is fired to form the resistance element 9
Formation was completed.

The panel manufacturing process after forming the electrodes and the resistance elements by the above-mentioned process or the thick film printing method similar to the conventional technique is the same as that of the conventional technique. The phosphor 10 was formed by screen printing, and the barrier 7 was formed by screen printing or sandblasting. Further, a cathode 3 is formed on the front plate 1 by a screen printing method, and the cathode (Ne-Xe or He-X) is combined with the rear plate 2 manufactured in the above process.
The sealing of e) was performed, and a desired gas discharge display panel was produced.

Although the embodiment described above is the type in which the resistance element 9 is formed on the anode group side of the discharge cell 6, the resistance element 9 may be installed on the cathode group side. You may replace all the anode groups with the cathode group. Alternatively, the resistance element 9 may be provided on both sides of the anode group and the cathode group, or the resistance element 9 may not be provided. Regarding the wiring pattern of the electrodes, not only the structure shown in FIG. 2 but also the one without the auxiliary anode 5, the auxiliary anode 5 arranged three-dimensionally, the anode bus bar 4,
The structure in which the position, shape and size of the anode terminal 8 and the resistance element 9 are different, for example, even if the busbar protrusion 4b is not present, the anode terminal 8 is not rectangular, or the position of the base of the anode terminal branch 8a is different The effect is the same as this embodiment.

Further, the present invention is not limited to the gas discharge display panel having the structure shown in FIG. 2. For example, the colored light of gas discharge using Ne-based gas as the discharge gas is used as it is without utilizing the phosphor emission. It can also be applied to a panel taken out to the outside.

[0035]

As described above, in the gas discharge display panel of the present invention, by simplifying the shape of the resistance element, it is possible to suppress the variation in the resistance value due to the accuracy of thick film printing.

Further, since the resistance element is installed between the bus bar and the branch portion extending from the terminal, the positioning accuracy of the electrode and the resistance element is not so high, and the resistance element covers the terminal portion. The risk of hiding can be avoided.

Further, by improving the electrode structure to the onset type, a large margin can be taken when the display panel is driven by the memory.

[Brief description of drawings]

FIG. 1 shows a schematic view of the structure of a conventional gas discharge display panel, FIG. 1 (a) is a perspective view from the front surface of the panel, and FIG. 1 (b) is a transverse sectional view of the panel.

2A and 2B show one structural example of a gas discharge display panel according to the present invention, FIG. 2A is a perspective view from the front surface of the panel, and FIG. 2B is a cross-sectional view of the panel.

FIG. 3 is a process drawing of forming electrodes in the gas discharge display panel shown in FIG.

FIG. 4 is a process drawing of forming a resistance element after forming electrodes.

[Explanation of symbols]

 1 Front Plate 2 Back Plate 3 Cathode 4 Anode Bus 5 Auxiliary Anode 6 Discharge Cell 7 Barrier 8 Anode Terminal 9 Resistive Element 10 Fluorescent Material 11 Priming Slit 12 White Back Layer 21 Underlayer 22 Conductive Film 23 Photosensitive Resin 24, 25 Shading Mask 26 Resistance material

Claims (1)

[Claims] 1. A plurality of cathode groups and a plurality of anode groups are arranged on mutually facing plate surfaces of a front plate and a back plate so as to be orthogonal to each other, and the cathode group and / or the anode group, or either one of them. In a gas discharge display panel of a type in which a bus bar and a terminal are electrically connected to each other through a resistance element, the bus bar is linear or linear and is connected to the resistance element. And a branching portion for connecting with a resistance element is formed in parallel with the busbar from the terminal, and a resistance element is installed between the busbar and the branching portion. A gas discharge display panel characterized in that