JPH09185946A - Dc type plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a structure hardly affected by the connecting part of adjacent discharge cells even when if discharge terminals of the adjacent discharge cells are connected with a continuously formed resistor. SOLUTION: In a DC type plasma display panel in which a bus 24 and a discharge terminal 28 are electrically connected through a resistor 25, wiring of the resistor 25 from the bus 24 is performed such that the connecting part for connecting the bus 24 and the resistor 25 is formed every other one of discharge cells 26. Continuously formed resistor structure easy to manufacture can be adopted. Since the connecting part of an electrode and resistor 25 is arranged every other one, even if very fine wiring is required, manufacture is easy, and the dispersion of resistance values of resistors 25 of discharge cells can be reduced.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (hereinafter referred to as PDP) which is a gas discharge display panel, and more particularly to a DC PDP having electrodes and resistors having a novel structure. .

[0002]

2. Description of the Related Art Generally, there are various types of gas discharge display panels, which are being developed with the aim of increasing the size, increasing efficiency, and increasing definition. As the most typical one among them, a cathode group and an anode group are arranged on two transparent insulating substrates respectively, and these two substrates are sealed at a constant interval, and a gas is provided in the gap. A DC type PDP of a type that generates a discharge and emits light is well known. In this DC type PDP, it is extremely important to suppress the sputtering of the cathode due to the discharge gas in order to achieve a long service life of the panel. Therefore, a method of increasing the discharge gas pressure in the panel and reducing the kinetic energy of positive ions in the discharge gas has been proposed, but in order to do so, it is necessary to avoid abnormal discharge due to high gas pressure. Therefore, there is proposed a device in which a current control is performed by providing a resistor of 500 to 1500 kΩ for each discharge cell.

FIG. 1 is a schematic configuration diagram showing an example of this DC type PDP with resistance, (a) is a perspective view from the front surface of the panel, and (b) is a cross-sectional view of the panel. As shown in the figure, this PDP is composed of two substrates, a front plate 1 and a rear plate 2,
A cathode 3 installed on the front plate 1 and an anode bus 4 and an auxiliary anode 5 installed on the back plate 2 are formed so as to be orthogonal to each other. The discharge cells 6 are defined by barriers 7, each discharge cell 6 includes a discharge terminal 8, and the cathode 3 crosses the vicinity of the center of each discharge cell 6. Furthermore, the discharge terminal 8 is electrically connected to the anode bus 4 via the resistor 9. Then, when a predetermined voltage is applied between the cathode 3 and the anode bus bar 4, a current flows to the discharge terminal 8 via the resistor 9 and a discharge is generated in the discharge cell 6 by the ultraviolet rays generated by this discharge. The phosphors 10 of RGB three colors are adapted to emit light. This light emission is radiated to the outside through the front plate 1 to display a full-color image. In this case, the auxiliary anode 5 has a role of supplying charged particles serving as a pilot fire of discharge to the discharge cell 6 through the priming slit 11. In addition, reference numeral 12 denotes an insulating layer, which has a function of whitening to make a color display clear and preventing discharge from other than the discharge terminal 8. In this type of PDP, the current is controlled by the function of the resistor 9 provided for each discharge cell 6, so that the current efficiency is improved, and the deterioration of the luminance due to the sputtering of the cathode 3 is prevented and the panel life can be extended.

[0004]

In the conventional DC type PDP, since the resistors are arranged in an isolated pattern for each discharge cell as described above, it is structurally unsuitable for miniaturization. There is a problem that it is difficult to make, and there are variations in the resistance value of each resistor, which directly leads to variations in the discharge current in each discharge cell, that is, variations in the emission intensity, causing uneven brightness on the display screen. Was becoming. Therefore, the present inventor is also studying to form a resistor continuously through the discharge cells so as to connect a plurality of discharge terminals. However, in the conventional structure, if the resistor is formed continuously in a straight line, there is a problem that the discharge terminal is affected by the adjacent connecting portion.

The present invention has been made in view of the above problems, and an object thereof is to devise the wiring of electrodes to continuously form discharge terminals of adjacent discharge cells. An object of the present invention is to provide a DC-type PDP that is not easily affected by the connection portion of adjacent discharge cells even if it is connected by a resistor, and that can easily select and manufacture a resistor.

[0006]

In order to achieve the above object, the present invention is directed to a grid provided between a front plate and a back plate so as to be parallel to and opposite to each other, and provided between the two. A plurality of discharge cells as display elements are formed by the circular barriers, and the plurality of cathode groups and the plurality of anode groups are arranged on the opposite plate surfaces of the front plate and the back plate so as to be orthogonal to each other. The cathode group and the anode group, or one of them, is composed of a plurality of bus bars extending in parallel to each other and a discharge terminal installed in the discharge cell, the bus bar and the discharge terminal is a resistor. In a DC type plasma display panel of a type electrically connected via the above, a connecting portion for connecting the bus bar and the resistor is formed for every other one of the discharge cells. .

According to the present invention, since the connecting portion for connecting the bus bar and the resistor is formed in every other discharge cell, the resistor continuously formed so as to be connected to the discharge terminals of the adjacent discharge cells. Even if the body is used, the distance from the connection portion of the adjacent discharge cell that does not share the connection portion is three times as long as the distance to the connection portion of the discharge cell that performs discharge. Hardly affected by the connection.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 2 shows an example of the structure of a PDP according to the present invention, in which (a) is a perspective view from the front of the panel.
(B) is a cross-sectional view of the panel which passes through AA in (a).

As shown in the figure, the PDP of this configuration example
Is composed of two substrates, a front plate 21 and a rear plate 22,
A linear cathode 23 is formed on the front plate 21, while an anode bus 24 and a linear resistor 25 parallel to the anode bus 24 are installed on the back plate 22, and the resistor 2 extends from the anode bus 24.
A connection portion 24a for connecting with the device 5 is provided. The discharge cell 26 is defined by a barrier 27, and each discharge cell 2
The discharge terminal 28 is formed so as to overlap with the resistor 25 at the center of 6.
Is installed. In addition, 2 adjacent to each discharge cell 26
The auxiliary discharge cells 29 are defined by the barriers 27 for each row, and the discharge terminals 28 are provided at positions corresponding to the discharge terminals 28 of the discharge cells 26 so as to overlap the resistor 25. At the discharge cell 26, the anode bus 24
A connecting portion 24a is formed every other discharge cell 26 along the barrier 27. In addition, the auxiliary discharge cell 29
At this point, the connecting portion 24a from the anode bus 24 is provided on the same line as the connecting portion 24a. In addition, 30 is an insulator layer, 31 is a phosphor, and 32 is a priming slit. Further, 28a is a lower discharge terminal which is formed if necessary, and is formed when a material is formed such that a film is formed on the surface of the resistor when the resistor is formed and the upper discharge terminal 28 and the resistor are not well contacted. Is.

Anode bus 2 in the PDP shown in FIG.
4, the pattern of the resistor 25 and the discharge terminal 28 is shown in FIG.
Although it is as shown in FIG. 3A, the connecting portions 24 a of the anode busbars 24 may be provided alternately in adjacent discharge cells as shown in FIG. 3B.

Comparing the panel having the above-mentioned structure with the panel described in the prior art, the resistor 25 is linear and the wiring method from the anode bus 24 is different, but each component is different from the conventional one. Since it operates in the same manner as the technology panel and operates in the same manner, its explanation is omitted here, and the P
The DP manufacturing procedure will be described below. The electrode and the resistor are most easily formed by the screen printing method. However, in this method, the resistance value of the resistor is likely to vary due to poor accuracy due to the pattern forming method itself. Therefore, here, the variation of the resistance value is reduced by adopting the patterning method of the electrode and the resistor applying the photolithography method.

FIG. 4 is a process diagram for forming electrodes on the substrate 40 which will be the back plate 22. The substrate 40 may be a flat or curved surface and is chemically stable, and a glass substrate, a resin substrate, or the like is conceivable. In this configuration example, a glass substrate is used, and cleaning and annealing treatment is performed before use. . Also,
For the purpose of improving printing quality, as shown in FIG. 4A, a glass paste is applied as a base layer 41 on a glass substrate by a screen printing method, dried, and then baked to obtain a substrate 40. used.

First, a conductive paste is thick-film printed on the substrate 40 by a screen printing method, and after the paste is dried, the paste is fired to form a conductive film 42 (see FIG. 4B and subsequent figures). Then, the illustration of the underlayer 41 is omitted). This conductive film 42 is patterned by an etching process in a later step to become an anode bus. Conductive paste materials include Au, Ag, Pd,
In addition to metals such as Al, Ni and Cu or alloys thereof, I
Any conductive oxide such as TO that can be formed into a paste for thick film printing and that can be chemically etched may be used, but here, A
u and Ag were good.

Alternatively, as the conductive film 42, a thin film formed by a vapor deposition method or a sputtering method may be used instead of the thick film as described above. In that case, the choice of materials for the conductive film 42 is greatly expanded, and conductive materials that are commercially available in the form of tablets or pellets for vapor deposition or sputtering targets can be applied, but Cr, Al,
Ni, Cu, etc. were good.

Next, as shown in FIG. 4C, a liquid photosensitive resin 43 was applied onto the conductive film 42 and dried. As a coating method, spin coating, roll coating,
Any method may be used as long as it is a method for coating a liquid material such as blade coating, reverse coating, spraying or dipping. Further, the photosensitive resin 43 does not have to be liquid, and a film resist can be used. When a film resist is used, it may be directly attached on the conductive film 42 using a laminator.

Next, as shown in FIG. 4D, the photosensitive resin 43 was exposed through a light-shielding mask M on which a pattern of the anode bus 24 having a connecting portion 24a was arranged. When the photosensitive resin 43 was a film-like resist, the pattern resolution was better when it was exposed and then heat-treated at 70 to 90 ° C. for about 5 to 15 minutes to accelerate curing of the exposed portion. After that, as shown in FIG.
Pattern development of the layer. Specifically, the photosensitive resin 4
The photosensitive resin 43 is pattern-developed by chemically dissolving an exposed portion when a positive type is used as 3 and an unexposed portion when a negative type is used with a dedicated developer. . Then, after the development process is completed, the photosensitive resin 43 is cured by heat treatment. As a result of this curing treatment, the adhesiveness between the conductive film 42 and the photosensitive resin 43 is increased, and it is possible to prevent the etching failure that occurs during the etching treatment in the subsequent process. This heat treatment is not always necessary depending on the photosensitive resin.

Subsequently, as shown in FIG. 4F, the conductive film 4 is formed by using the patterned photosensitive resin 43 as a mask.
2 was chemically etched to form an electrode 44 (anode bus bar 24 having a connection portion 24a). After finishing the etching process, cleaning and drying were performed. After the etching process of the conductive film 42, as shown in FIG.
3 was peeled off, and the substrate was washed and dried.

The lower discharge terminal 2 shown in FIG.
In the case of forming 8a, the lower discharge terminal 2 is formed at the same time as forming the electrode 44 (the anode bus 24 having the connection portion 24a).
It may be formed by using the light-shielding mask M also having the pattern 8a.

After forming the electrodes as described above, the resistors are formed. Hereinafter, the formation of the resistor is shown in FIG.
It will be described with reference to the process chart shown in FIG.

First, as shown in FIG.
A layer of the photosensitive resin 45 is formed on the substrate 40 on which the (anode bus 24 having the connection portion 24a) is formed. The photosensitive resin 45 may be in a liquid form or a film form, and its coating method may be any of the coating methods described above.
After that, as shown in FIG. 5B, the photosensitive resin 45 is exposed through a light-shielding mask M ′ in which the pattern of the resistor 25 is arranged at a predetermined position, and then as shown in FIG. To
The photosensitive resin 45 was pattern-developed to form a recess 45a for embedding a resistance material in a later step.

Subsequently, as shown in FIG. 5D, a resistance material 46 was embedded in the recess 45a formed in the photosensitive resin 45. When a RuO ₂ paste for thick film printing is used as the resistance material 46, the volume of the paste shrinks if the paste is dried after the paste is embedded in the recess 45a. Therefore, it is better to repeat this process at least twice. After filling the resistance material 46, the photosensitive resin 45 was peeled from the substrate as shown in FIG. When the RuO ₂ paste was used as the resistance material, after the photosensitive resin 45 was peeled off, the paste was fired to complete the formation of the resistor 47 (25).

After forming the resistor as described above, the discharge terminal is formed. Specifically, as in the case of forming the resistor 47, a photosensitive resin layer is first formed, a concave portion is formed by exposure and development, and then a conductive material is embedded therein. After that, the photosensitive resin layer was peeled off and the conductive material was baked to complete the discharge terminal 28 of FIG. Here, any material may be used as the material of the discharge terminal as long as it is a conductive and fillable material, but here, Au or Ni is used.
Etc. were good.

The steps for manufacturing the panel after forming the electrodes, the resistors and the discharge terminals by the screen printing method are the same as those in the prior art, and therefore will be described briefly. However, the insulator layer 30 and the phosphor 31 are described. By screen printing method,
The barrier 27 was formed by a screen printing method or a sandblast method. Further, the cathode 23 is formed on the substrate that becomes the front plate 21.
Is formed by a screen printing method, and the gas (Ne-Xe or He-
Xe) was sealed to produce the desired PDP.

When the resistors are continuously formed as in the above-described configuration example, the influence of electrical interference of discharge cells that do not share the anode bus may not be neglected depending on the resistance value setting. Conceivable. In such a case, as shown in FIG. 6, it is possible to reduce interference between the cells by narrowing the resistor 25 between the discharge cells that do not share the anode bus 24 to be narrower than the regular width. Yes,
In addition, the stability of the resistance value and the ease of forming the resistor can both be achieved.

Further, in the above-mentioned configuration example, the anode bus bar, the connecting portion and the resistor are formed on the same plane, but for further high definition, holes are provided as shown in FIG. An insulator layer 33 is formed on the anode bus bar 24,
It is also possible to form the resistor 25 on the insulating layer 33 so as to overlap with, and form the connecting portion 25a with the resistor 25. Even in this case, in order to reduce interference between adjacent discharge cells that do not share the anode bus 24, the resistor 2
It is also possible to provide a neck in 5.

Although the embodiment described above is the type in which the resistor is formed on the anode group side of the discharge cell, the resistor may be installed on the cathode group side. All may be replaced with the cathode group. Alternatively, it is possible to install resistors on both sides of the anode group and the cathode group.

Further, the present invention is a PDP having the structure shown in FIG.
Not only this, for example, the present invention can be applied to a panel that directly takes out the colored light of a gas discharge using a Ne-based gas as a discharge gas without utilizing the phosphor light emission.

[0028]

As described above, the DC type P of the present invention is used.
Since the DP has a structure in which the connecting portion for connecting the bus bar and the resistor is formed in every other discharge cell, it is possible to employ a continuously formed resistor structure which is easy to manufacture. Further, since there is only one connecting portion between the electrode and the resistor, it is easy to manufacture even if fine wiring corresponding to high definition is required. Further, by adopting the structure in which the resistors are continuously formed, it is possible to reduce the variation in the resistance value of the resistors in each discharge cell.

[Brief description of the drawings]

FIG. 1 shows a schematic view of the structure of a conventional plasma display panel, (a) is a perspective view from the front of the panel,
(B) It is a cross-sectional view of the panel.

2A and 2B show one configuration example of a plasma display panel according to the present invention, in which FIG. 2A is a perspective view from the front surface of the panel, and FIG. 2B is a cross-sectional view of the panel taken along the line AA in FIG. is there.

FIG. 3 is a pattern diagram showing an arrangement of electrodes and resistors of the plasma display panel according to the present invention.

FIG. 4 is a process drawing of forming electrodes of the plasma display panel shown in FIG.

FIG. 5 is a process drawing of forming a resistor following the formation of electrodes.

FIG. 6 is a pattern diagram showing another arrangement pattern of electrodes and resistors.

7A and 7B show another arrangement pattern of electrodes and resistors, FIG. 7A is a pattern diagram, and FIG. 7B is a sectional structure diagram of FIG. 7A.

[Explanation of symbols]

 21 Front Plate 22 Back Plate 23 Cathode 24 Anode Bus 24a Connection 25 Resistor 25a Connection 26 Discharge Cell 27 Barrier 28 Discharge Terminal 29 Auxiliary Discharge Cell 30 Insulator Layer 31 Phosphor 32 Priming Slit

Claims (5)

[Claims] 1. A front plate and a rear plate are arranged in parallel and opposite to each other, and a plurality of discharge cells as display elements are formed by a lattice-shaped barrier provided between the front plate and the rear plate. , A plurality of cathode groups and a plurality of anode groups are arranged on each plate surface of the front plate and the back plate so as to be orthogonal to each other, the cathode group and the anode group, or one of them, In a DC type plasma display panel of a type which is composed of a plurality of bus bars extending in parallel with each other and a discharge terminal installed in the discharge cell, and the bus bar and the discharge terminal are electrically connected via a resistor,
A DC type plasma display panel, characterized in that a connecting portion for connecting the bus bar and the resistor is formed for every other one of the discharge cells. 2. The DC type plasma display panel according to claim 1, wherein the connection portion is arranged orthogonal to the bus bar. 3. The DC type plasma display panel according to claim 1, wherein the resistor is arranged on the bus bar via an insulating layer, and the connecting portion is provided so as to penetrate the insulating layer. 4. The DC type plasma display panel according to claim 1, wherein the resistor is continuously formed. 5. The DC type plasma display panel according to claim 4, wherein the width of the resistor is narrow near the barrier where the connecting portion is not provided.