JPH08115676A - Gas-discharge display panel and its manufacture - Google Patents

Abstract

PURPOSE: To provide a resistance-equipped gas-discharge display panel in which the dimensional and positioning accuracies of resistance elements are good and the resistance values of the elements are not varied, so that the panel can be enlarged and mass-produced. CONSTITUTION: A resistance element 9 is formed in the recessed portion 13a of a layer 13 of insulating material provided on a substrate 2, in such a way that the element 9 is flush with the layer 13. More specifically, the layer 13 of insulating material having the recessed portion 13a corresponding to the resistance element 9 is formed on the substrate 2. A resistance paste is embedded in the recessed portion 13a, then dried and baked to form the resistance element 9, and then electrodes to be electrically connected to the resistance element 9 are formed on the layer 13 of insulating material. The high-definition resistance element 9 can be formed, and variations in resistance value can be reduced through the enhancement of the accuracy of processing the resistance element 9.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a gas discharge display panel, and more particularly to a gas discharge display panel with resistance and a method of manufacturing the same.

[0002]

2. Description of the Related Art There are various types of gas discharge display panels, which are being developed with the aim of increasing their size, increasing their efficiency and increasing their definition. The most representative of these is 2
A panel of a system in which a cathode group and an anode group are respectively arranged on a sheet of transparent insulating substrate, these two substrates are sealed at a constant interval, and gas discharge is generated in the gap to emit light is provided. Are known. Furthermore, a panel in which a resistance element is installed in each discharge cell in order to control the discharge current has been proposed. As an example of this, Takano et al. “Pulse memory drive of discharge display panel with resistance” (1990, Television The annual conference, p 77-78).

FIG. 1 shows a schematic view of the structure of the gas discharge display panel shown in this document, (a) is a perspective view from the front of the panel, and (b) is a transverse sectional view of the panel.

This gas discharge display panel is composed of two substrates, a front plate 1 and a back plate 2. A cathode 3 installed on the front plate 1, an anode bus bar 4 and an auxiliary anode 5 installed on the back plate 2.
Are formed so as to be orthogonal to each other. Discharge cell 6
Is defined by a barrier 7, an anode terminal 8 is included in each discharge cell 6, and a cathode 3 crosses the vicinity of the center of each discharge cell 6. Further, the anode terminal 8 is electrically connected to the anode bus 4 via the resistance element 9. Then, when a predetermined voltage is applied between the cathode 3 and the anode bus bar 4, a current flows through the resistance element 9 to the anode terminal 8 to generate a discharge in the discharge cell 6, and the ultraviolet rays generated by this discharge are generated. The phosphors 10 of RGB three colors are adapted to emit light. This light emission is radiated to the outside through the front plate 1 to display a full-color image. In this case, the auxiliary anode 5 has a role of supplying charged particles serving as a pilot fire of discharge to the discharge cell 6 through the priming slit 11. Reference numeral 12 is a white back layer, which is intended to make color display clear. In this type of gas discharge display panel, the current is controlled by the function of the resistance element 9, so that there is an advantage that the current efficiency is improved and further the deterioration of the brightness due to the sputtering of the cathode 3 can be prevented and the panel life can be lengthened.

[0005]

By the way, in a large-sized gas discharge display panel, the components on the front plate and the back plate are formed by a thick film printing method typified by a screen printing method. The method has a drawback that the dimensions and thicknesses of the respective constituent elements vary depending on the manufacturing precision. In particular, in the display panel with resistance as described above,
The resistance value of each display cell greatly fluctuated due to inaccuracy in the positional relationship and size of the electrodes and the size and thickness of the resistance element. The variation in the resistance value directly leads to the variation in the discharge current of each discharge cell, that is, the variation in the light emission intensity, and there is a problem in that the brightness unevenness occurs on the display screen.

The present invention has been made in view of the above problems, and an object of the present invention is to provide a resistive element with good dimensional and positional accuracy, without variation in its resistance value, and in a large area. Disclosed is a gas discharge display panel and a method for manufacturing the same, which can be used for high-volume production and mass production.

[0007]

To achieve the above object, the gas discharge display panel of the present invention has a front plate and a back plate facing each other such that a plurality of cathode groups and a plurality of anode groups are orthogonal to each other. A gas of a type in which the cathode group and the anode group, or one of them is composed of a bus bar and a terminal, and the bus bar and the terminal are electrically connected via a resistance element. In the discharge display panel,
It is characterized in that the resistance element is formed in a recess formed on the substrate so as to be substantially flush with the surface of the substrate.

This type of gas discharge display panel manufacturing method is characterized in that the substrate having the resistance element is manufactured by a method including at least the following steps. (1) First step of forming a concave portion corresponding to the resistance element on a substrate (2) Second step of filling the concave portion with a resistance paste, followed by drying and firing to form the resistance element (3) Third step of forming the cathode group or the anode group electrically connected to the resistance element on the substrate

Then, it is preferable to carry out the above-mentioned first step by a method including at least the following steps. (1) First step of forming a layer of photosensitive resin on the substrate (2) Exposure and development of the photosensitive resin are performed, and an opening is formed at a predetermined position in the layer of the photosensitive resin to be the recess. Second Step of Forming (3) Third Step of Forming Recesses by Grinding the Substrate by Sand Blasting Using the Photosensitive Resin Layer as a Mask Material
Step (4) Fourth step of peeling the photosensitive resin

In order to achieve the same object, the gas discharge display panel of the present invention has a front plate and a back plate facing each other such that a plurality of cathode groups and a plurality of anode groups are orthogonal to each other. In the gas discharge display panel of the type arranged above, the cathode group and the anode group, or one of them is composed of a bus bar and a terminal, and the bus bar and the terminal are electrically connected via a resistance element. The resistor element is formed in a recess formed in the insulator layer provided on the substrate so as to be substantially flush with the surface of the insulator layer.

This type of gas discharge display panel manufacturing method is characterized in that the substrate having the resistance element is manufactured by a method including at least the following steps. (1) A first step of forming an insulating layer having a recess corresponding to the resistance element on a substrate (2) A resistance paste is embedded in the recess and then dried and fired to form a resistance element Step (3) Third step of forming the cathode group or the anode group electrically connected to the resistance element on the insulator layer

Then, it is preferable to carry out the above-mentioned first step by a method including at least the following steps. (1) First step of applying an insulating paste on the substrate and drying it (2) Second step of forming a layer of a photosensitive resin on the insulating paste (3) Exposure and development of the photosensitive resin And a third step of forming an opening at a predetermined position to become the recess in the photosensitive resin layer. (4) The insulating paste is ground by a sand blast method using the photosensitive resin layer as a mask material. Fourth step of forming recesses by means of (5) Fifth step of peeling the photosensitive resin (6) Sixth step of firing the insulating paste

[0013]

According to the present invention having the above-described structure, the formation of the resistance element by embedding the resistance paste in the recess not only improves the dimensional accuracy, but also does not require a thin film forming step, which results in a large area and If possible, support for mass production. In particular, by applying the sandblast method, it is possible to process a sub-micron-order high-precision resistive element. In addition, it is easy to align the resistance element and the electrode formed in a later step. Furthermore, since the resistance element is formed below the electrode, structural irregularities can be reduced and the connection between the electrode and the resistance element can be ensured.

[0014]

Embodiments of the present invention will be described below with reference to the drawings.

2A and 2B show an example of the structure of the gas discharge display panel according to the present invention. FIG. 2A is a perspective view from the front of the panel, and FIG. 2B is a transverse sectional view of the panel.

As shown in the figure, the gas discharge display panel of this embodiment is composed of two substrates, a front plate 1 and a rear plate 2, and a linear cathode 3 is installed on the front plate 1. There is. On the other hand, an insulator layer 13 is formed on the back plate 2, and the resistance element 9 is embedded in the recess 13 a of the insulator layer 13. Further, an anode bus bar 4, an anode terminal 8 and an auxiliary anode 5 are provided on the insulator layer 13. The anode bus bar 4 is composed of a linear anode 4a and an anode branch portion 4b extending from the linear anode 4a in the vertical and horizontal directions. The auxiliary anode 5 is located between two adjacent anode buses 4. Discharge cell 6 is a barrier 7
The anode terminal 8 is installed at the center of each discharge cell 6. The anode terminal 8 and the anode branch portion 4b are electrically connected by a resistance element 9.

Comparing the panel of this embodiment having the above-mentioned structure with the panel described in the prior art, the shapes of the anode bus bar 4, the anode terminal 8 and the resistance element 9, and the insulating layer 13 are compared.
Although different depending on the presence or absence of each element, each component has the same function as the panel of the prior art and the operation is also the same, so the description thereof will be omitted. The face plate will be mainly described.

The back plate 2 may be a flat or curved surface and is chemically stable, and a glass substrate, a resin substrate, or the like may be used. In this embodiment, a glass substrate is used, and cleaning and annealing treatment is performed before use. Was applied.

First, the insulator layer 13 is formed on the back plate 2. For example, when the insulator layer 13 is formed by the screen printing method, the insulator layer 13 may be thick-film printed while leaving a predetermined pattern to be a recess to be filled with the resistance paste in a later step. In this case, the film thickness of the insulator layer 13 is adjusted to the desired film thickness of the resistance element 9.

When the sandblast method was used instead of the thick film printing method as the method for forming the concave portion in the insulating layer 13, the processing accuracy of the resistance element 9 was increased. Therefore, the method of forming the recess by the sandblast method will be described in detail below.

First, as shown in FIG. 3A, the back plate 2
The insulating layer 13 was formed by applying an insulating paste and drying it. At this stage, the insulator layer 13 does not need to be particularly patterned and may be a continuous film. As a method for applying the insulating paste, a coating method such as dipping or blade coating may be used,
Screen printing is the simplest. As the insulating paste, glass paste, SiO _2, etc. are preferable.

Next, as shown in FIG. 3B, a photosensitive resin 21 was applied on the insulator layer 13. In this embodiment, a film resist is used as the photosensitive resin 21, but it may be liquid. In the case of a film resist, a laminator is used to form the insulator layer 1
It should be pasted directly on top of 3. When a liquid photosensitive resin is used, it may be applied by an appropriate coating method such as spin coating, roll coating, blade coating, reverse coating, spraying or dipping and then dried.

After that, as shown in FIG. 3C, the photosensitive resin 21 was exposed through a light-shielding mask 22 having a pattern arranged at a predetermined position to be a recess for embedding the resistance paste in a later step. When the photosensitive resin 21 is a film-like resist, it is exposed at 70 to 90 ° C. for 5 to 1 after exposure.
The pattern resolution was better when the heat treatment was carried out for about 5 minutes to accelerate the curing of the exposed portion.

Next, as shown in FIG. 3D, pattern development of the layer of the photosensitive resin 21 is performed, and the opening 21a is formed at a predetermined position to be a concave portion to be filled with the resistance paste in a later step.
Was formed. Specifically, when the positive type is used as the photosensitive resin 21, the exposed part is chemically dissolved, and when the negative type is used, the unexposed part is chemically dissolved with a dedicated developer. The photosensitive resin 21 is pattern-developed. Then, after completing the developing process, the photosensitive resin 21 was cured by heat treatment. By thus sufficiently curing the photosensitive resin 21, a stable resin film can be obtained even in the subsequent process. This heat treatment is not always necessary depending on the resist.

Subsequently, as shown in FIG. 3 (e), the portion of the insulator layer 13 which is not covered with the photosensitive resin is ground by the sandblast method using the photosensitive resin 21 as a mask material. A concave portion 13 a was formed in the groove 13. When a glass paste was used as the insulating paste, glass beads and alumina powder were examined as the powder to be sprayed by the sandblast method, but the use of alumina powder showed a higher grinding speed and good results. Although the back plate 2 is the glass substrate in this embodiment, the back plate functions as a grinding stop layer because the grinding speed by the sandblast method is significantly different between the glass substrate and the insulating layer obtained by drying the glass paste.

After forming the recess 13a in the insulating layer 13,
As shown in FIG. 3F, the photosensitive resin 21 was peeled off, and then the insulator layer 13 was baked.

In the above embodiment, the insulator layer 13 was provided on the back plate 2 and the recess 13a was formed in the insulator layer 13. However, when the back plate 2 itself is an insulator, the insulator layer is formed. It is also possible to omit the formation of 13 and form the recess directly on the back plate 2. In this case, the layer of the photosensitive resin 21 is directly formed on the back plate 2, the photosensitive resin 21 is exposed and developed through the light-shielding mask 22, and an opening is formed at a predetermined position to be a recess. After that, the portion not covered with the photosensitive resin 21 on the back plate 2 is ground by the sandblasting method using the layer of the photosensitive resin 21 as a mask material, and then the photosensitive resin 21 is peeled off to form the concave portion. .

Even if the concave portion for embedding the resistance paste is directly formed on the back plate 2 as described above, or the insulating layer 1 is formed.
3 may be formed, but in the following description, the insulator layer 1
Only the case where the concave portion 13a is formed in No. 3 will be described.
Even when the concave portion is directly formed on the back plate 2, the following steps are the same and therefore omitted here.

After forming the recess 13a in the insulator layer 13 as described above, the recess 13a is formed as shown in FIG. 3 (g).
Embed the resistance paste in and dry. In this case, since the volume of the resistance paste is reduced by drying, the embedding and drying are repeated at least twice or more, and then the surface is washed or polished to remove the resistance paste adhering to other than the recess 13a, and then the firing is performed. Then, the resistance element 9 is formed so as to be substantially flush with the surface of the insulating layer 13. As a method of forming the resistance element 9 so as to be substantially flush with the surface of the insulator layer 13, it is possible to previously form the resistance paste thicker than the recess 13a and polish the entire surface later. is there. As described above, unless the surface of the insulating layer 13 and the resistance element 9 are formed so as to be substantially flush with each other, the connection with the anode bus bar 4 and the anode terminal 8 to be formed later cannot be performed well. That is, since air is present in the dented areas, the electrode material having a high viscosity is difficult to enter in normal printing and cannot enter unless it is pressed.

As the material of the resistance paste, the RuO ₂ paste for thick film printing was the most preferable, but SnO ₂ , ITO, carbon or the like can be applied. The resistance paste may be filled by first placing the paste on one end of the substrate and scanning with a spatula or blade made of resin, metal or ceramic. In this case, it is not necessary to complete the embedding of the resistance paste in one procedure, and it is better to repeat the embedding several times as described above.

Subsequently, the anode bus 4 and the anode terminal 8 and simultaneously the auxiliary anode 5 were formed on the insulating layer 13 so as to be electrically connected to the resistance element 9. As a method for forming the anode bus bar 4, the anode terminal 8 and the auxiliary anode 5, a screen printing method which is a conventional technique may be used, but the forming method described in Japanese Patent Application No. 6-250261 by the applicant of the present invention is a resistance method. This is effective in reducing the variation in the resistance value of the element 9.

In this way, the size of 350 × 150 × 1
When the resistance element 9 of 0 μm was installed corresponding to each discharge cell 6, the resistance element 9 having a resistance value of about 1 MΩ could be uniformly formed.

The following steps are the same as those in the prior art and will be described briefly. However, the white back layer 12 having an insulating property,
The phosphor 10 was formed by a screen printing method, and the barrier 7 was formed by a screen printing method or a sandblast method. Further, the cathode 3 is formed on the front plate 1 by the screen printing method,
Together with the back plate 2 manufactured in the above process, gas (N
e-Xe or He-Xe) was sealed to produce the desired gas discharge display panel.

In the embodiment described above, the resistance element 9 is formed on the anode group side of the discharge cell 6, but the resistance element 9 may be installed on the cathode group side. You may replace all the anode groups with the cathode group. Alternatively, it is possible to install the resistance elements 9 on both sides of the anode group and the cathode group. Further, the anode group on the front plate,
A structure in which the cathode group is installed on the back plate may be used.

Further, the present invention is not limited to the gas discharge display panel having the structure shown in FIG. 2. For example, the colored light of gas discharge using Ne-based gas as the discharge gas is used as it is without utilizing the phosphor emission. It can also be applied to a panel taken out to the outside.

Further, regarding the wiring pattern of the electrodes, the shape of the resistance element, and the method of coupling the electrodes and the resistance element,
In addition to the structure shown in FIG. 2, for example, the one without auxiliary anode 5, the one in which auxiliary anode 5 is three-dimensionally arranged, the position, shape and size of anode bus bar 4, anode terminal 8 and resistance element 9 are It can be applied to different structures.

[0037]

Since the present invention is configured as described above, it has the following effects.

In the prior art, when installing a resistance element in each discharge cell of a gas discharge display panel, it was very difficult to suppress the variation in the resistance value between the cells, but according to the present invention. Since it is possible to easily form a high-definition resistance element, it is possible to suppress variations in resistance value by improving the processing accuracy of the resistance element. Further, it is an advantage of the present invention that the electrode and the resistance element structure are flattened.

Further, according to the present invention, the resistance element can be manufactured with a precision of submicron order by forming the concave portion for embedding the resistance element by the sandblast method using the photosensitive resin as the mask material. As a result, as compared with the conventional printing method, the electrode pattern and the resistance element pattern are easily aligned with each other, and the gas discharge display panel with resistance capable of increasing the area and mass production can be manufactured.

[Brief description of drawings]

FIG. 1 shows a schematic view of the structure of a conventional gas discharge display panel, FIG. 1 (a) is a perspective view from the front surface of the panel, and FIG. 1 (b) is a transverse sectional view of the panel.

2A and 2B show one structural example of a gas discharge display panel according to the present invention, FIG. 2A is a perspective view from the front surface of the panel, and FIG. 2B is a cross-sectional view of the panel.

FIG. 3 is a process drawing for explaining the manufacturing method of the gas discharge display panel shown in FIG.

[Explanation of symbols]

 1 Front Plate 2 Back Plate 3 Cathode 4 Anode Bus 5 Auxiliary Anode 6 Discharge Cell 7 Barrier 8 Anode Terminal 9 Resistance Element 10 Phosphor 11 Priming Slit 12 White Back Layer 13 Insulator Layer 13a Recess 21a Opening

Claims (6)

[Claims] 1. A plurality of cathode groups and a plurality of anode groups are arranged on mutually facing plate surfaces of a front plate and a back plate so as to be orthogonal to each other, and the cathode group and / or the anode group, or either one of them. In a gas discharge display panel of a type in which a bus bar and a terminal are electrically connected to each other through a resistance element, the resistance element is substantially the same as the substrate surface in the recess formed on the substrate. A gas discharge display panel, which is formed so as to be a surface. 2. A plurality of cathode groups and a plurality of anode groups are arranged on the respective facing plate surfaces of a front plate and a back plate so as to be orthogonal to each other, and the cathode group and / or the anode group, or either one of them. Is a bus bar and a terminal, a method for manufacturing a gas discharge display panel of the type in which the bus bar and the terminal are electrically connected through a resistance element, the substrate having the resistance element at least the following steps A method for manufacturing a gas discharge display panel, characterized by being manufactured by a method including (1) First step of forming a concave portion corresponding to the resistance element on a substrate (2) Second step of filling the concave portion with a resistance paste, followed by drying and firing to form the resistance element (3) Third step of forming the cathode group or the anode group electrically connected to the resistance element on the substrate 3. The method of manufacturing a gas discharge display panel according to claim 2, wherein the first step includes at least the following steps. (1) First step of forming a layer of photosensitive resin on the substrate (2) Exposure and development of the photosensitive resin are performed, and an opening is formed at a predetermined position in the layer of the photosensitive resin to be the recess. Second Step of Forming (3) Third Step of Forming Recesses by Grinding the Substrate by Sand Blasting Using the Photosensitive Resin Layer as a Mask Material
Step (4) Fourth step of peeling the photosensitive resin 4. A plurality of cathode groups and a plurality of anode groups are arranged on respective plate surfaces of a front plate and a back plate facing each other so as to be orthogonal to each other, and the cathode group and / or the anode group, or either one of them. In a gas discharge display panel of a type in which a bus bar and a terminal are electrically connected to each other through a resistance element, the resistor is formed in a recess formed in an insulating layer provided on a substrate. A gas discharge display panel, wherein the element is formed so as to be substantially flush with the surface of the insulator layer. 5. A plurality of cathode groups and a plurality of anode groups are arranged on respective plate surfaces of a front plate and a back plate facing each other so as to be orthogonal to each other, and the cathode group and / or the anode group, or either one of them. Is a bus bar and a terminal, a method for manufacturing a gas discharge display panel of the type in which the bus bar and the terminal are electrically connected through a resistance element, the substrate having the resistance element at least the following steps A method for manufacturing a gas discharge display panel, characterized by being manufactured by a method including (1) A first step of forming an insulating layer having a recess corresponding to the resistance element on a substrate (2) A resistance paste is embedded in the recess and then dried and fired to form a resistance element Step (3) Third step of forming the cathode group or the anode group electrically connected to the resistance element on the insulator layer 6. The method for manufacturing a gas discharge display panel according to claim 5, wherein the first step includes at least the following steps. (1) First step of applying an insulating paste on the substrate and drying it (2) Second step of forming a layer of a photosensitive resin on the insulating paste (3) Exposure and development of the photosensitive resin And a third step of forming an opening at a predetermined position to become the recess in the photosensitive resin layer. (4) The insulating paste is ground by a sand blast method using the photosensitive resin layer as a mask material. Fourth step of forming recesses by means of (5) Fifth step of peeling the photosensitive resin (6) Sixth step of firing the insulating paste