JPH06103902A - Plasma display panel and its manufacture - Google Patents

Abstract

PURPOSE:To obtain an AC type plasma display panel(PDP) which can be connected with an external drive circuit easily while maintaining a low resistance and a high precision of a maintenance electrode and a scanning electrode. CONSTITUTION:A maintenance electrode and a scanning electrode formed on a back plate 1 are made in a laminate structure of the low resistance metal membranous electrode or electrodes 4 and the conductive intermediate electrode or electrodes 3, and as the connecting terminal or terminals of the frit seals and the external circuits, a printed and baked type thick film electrodes 2 are used. Since the metal film electrode 4 is not contacted directly to the frit member in such a structure, a poor sealing to generate a leakage and the like in not generated, and furthermore, a flexible printed circuit(FPC) application process or a COG process having a high reliability in the connection with an external driving circuit can be applied.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma display panel (hereinafter referred to as PDP) using discharge and light emission.

[0002]

2. Description of the Related Art FIG. 3 shows an example of the configuration of a conventional PDP. In FIG. 3, 1 is a back plate, 4 is a metal thin film electrode (sustain electrode and scan electrode), and 5 is a frit sealing part. The metal thin film electrode 4 (sustain electrode and scan electrode) is usually made of Al or Cr in order to improve the definition of the display portion and reduce the electric resistance.
A low-resistance thin film metal material typified by a CuCr three-layer structure is used, and a connection portion with an external drive circuit is also an extension of this electrode to serve as an external electrode extraction portion.

[0003]

However, in the above-mentioned conventional structure, the metal thin film electrode is in direct contact with the portion sealed with the frit glass or the like, and the metal electrode is oxidized before the sealing step. There is a problem that the metal electrode is not completely sealed when the metal electrode is changed in quality during the sealing process.

The metal electrode is formed by a resistance heating vapor deposition method, an electron beam vapor deposition method or a sputtering method, and is a thin film having a thickness of about several μm. For this reason, the connection with the external drive circuit is difficult to use due to lack of strength in the thermocompression bonding method of the commonly used flexible printed circuit (hereinafter referred to as FPC), which is difficult to use. Was taking. The connection by the clip is unreliable, the manufacturing cost is high, and the yield is reduced.

The chip-on-glass method (hereinafter referred to as the COG method) for directly connecting recently used drive circuit parts to the PDP glass surface is also used in the above conventional metal electrodes because the circuit parts are connected by bumps or wire bonding. There was a problem that I could not.

The connection with the external drive circuit by the thermocompression bonding / COG method may be achieved by using a printing and firing type thick film electrode. This problem can be solved by using only the printing and firing electrode, but the metal thin film is of the printing and firing type. When the thick film electrode is directly connected, there is a problem that the metal surface at the connection interface is deteriorated due to oxidation or the like in the firing process and contact failure occurs.

The present invention has been made to solve the above-mentioned problems, and a plasma display panel and a plasma display panel which can be connected to a highly reliable external drive circuit while maintaining a low resistance and a high definition of a sustain electrode and a scan electrode. It is intended to provide a manufacturing method.

[0008]

In order to achieve the above object, the present invention provides a conductive intermediary electrode made of an oxide conductor patterned in a predetermined portion on a back plate, and one end of the conductive intermediary electrode. And a sustain electrode and a scan electrode, which are metal thin-film electrodes patterned in a region including, and a print-baked thick film electrode patterned in a region including the other end of the conductive mediating electrode.

[0009]

With this configuration, the metal thin film does not come into direct contact with the frit, and sealing defects such as leaks are eliminated. Since the metal thin film electrode and the print firing electrode do not directly contact with each other, the contact defect is eliminated. Since the connection portion with the external drive circuit also serves as the printed firing electrode, it can be connected by the FPC or COG method, and the reliability and yield are high and the manufacturing cost can be reduced.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIG.

FIG. 1A is a top view of a display panel (PDP) which is an embodiment of the present invention, and FIG. 1B is a sectional view thereof.

In FIG. 1, 1 is a back plate, 2 is a printed and baked thick film electrode, 3 is a conductive mediating electrode, and 4 is a metal thin film electrode (sustaining electrode and scanning electrode), all of which are formed on the back plate 1. The frit application section 5 is in close contact with and sealed to the front plate.

A conductive film made of an oxide conductive material such as ITO or SnO ₂ is formed on the entire surface of the back plate 1 by, for example, a sputtering method. This is formed into a predetermined intermediate shape by using a photo etching process or the like, and the conductive intermediate electrode 3 is formed. Next, a low resistance metal is formed on the entire surface of the back plate 1 by resistance heating evaporation, electron beam evaporation or sputtering. The metal thin film electrode (sustain and scan electrode) 4 is formed by using the same photoetching process. Below the end of the metal thin film electrode 4 is the conductive mediating electrode 3 previously formed, and the metal thin film electrode 4 (maintaining and scanning electrode)
Connected with.

Next, a metal printing paste (for example, silver) is printed and fired in a furnace to form a print fired thick film electrode 2.

In the above embodiment, the conductive mediating electrode 3 has a structure that mediates only between the printed and baked thick film electrode and the metal thin film electrode 4 as shown in FIG. 1B, but as shown in FIG. In addition, the metal thin film electrode 4 may be arranged over the entire area below.

[0016]

As is apparent from the above embodiments, the present invention includes a conductive mediation electrode made of an oxide conductor patterned in a predetermined portion on the back plate and one end of the conductive mediation electrode. Due to the configuration having at least the sustain electrode and the scan electrode composed of the metal thin film electrode patterned in the region, and the printed and baked thick film electrode patterned in the region including the other end of the conductive mediating electrode, the internal sustaining and It is possible to provide a plasma display panel and a manufacturing method thereof in which highly reliable FPC thermocompression bonding or COG method can be used for connection with an external driving circuit while maintaining low resistance and high definition of scan electrodes.

[Brief description of drawings]

1A is a plan view of a plasma display panel according to an embodiment of the present invention; FIG. 1B is a sectional view of the plasma display panel of FIG. 1A.

FIG. 2 is a sectional view of a plasma display panel according to another embodiment of the present invention.

FIG. 3 is a plan view of a conventional plasma display panel.

[Explanation of symbols]

 1 Back Plate 2 Printed and Thick Film Electrode 3 Conductive Mediating Electrode 4 Metal Thin Film Electrode 5 Frit Coating Section

Claims (4)

[Claims] 1. A back plate, a conductive mediating electrode made of an oxide conductor patterned in a predetermined portion on the back plate, and a metal thin film patterned in a region including one end of the conductive mediating electrode. A plasma display panel comprising at least a sustain electrode and a scan electrode, which are electrodes, and a printed and baked thick film electrode patterned in a region including the other end of the conductive mediation electrode. 2. The plasma display panel according to claim 1, wherein one end of the conductive mediation electrode is formed so as to extend over the entire area below the metal thin film electrode. 3. The plasma display panel according to claim 1, wherein the oxide conductor is ITO or SnO ₂ . 4. A step of patterning a conductive intermediate electrode made of an oxide conductive material on a predetermined portion of the back plate, and a sustain electrode made of a metal thin film electrode in a region including at least one end on the conductive intermediate electrode. A method for manufacturing a plasma display panel, which comprises at least a step of patterning a scanning electrode and a step of printing and baking a thick film electrode in a region including the other end on the conductive intermediary electrode to form a pattern. .