JPH0810953Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0810953Y2
JPH0810953Y2 JP1990082990U JP8299090U JPH0810953Y2 JP H0810953 Y2 JPH0810953 Y2 JP H0810953Y2 JP 1990082990 U JP1990082990 U JP 1990082990U JP 8299090 U JP8299090 U JP 8299090U JP H0810953 Y2 JPH0810953 Y2 JP H0810953Y2
Authority
JP
Japan
Prior art keywords
semiconductor
semiconductor chips
plate
semiconductor device
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990082990U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0440547U (enExample
Inventor
彰三 南出
孝明 津田
崇道 前田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1990082990U priority Critical patent/JPH0810953Y2/ja
Publication of JPH0440547U publication Critical patent/JPH0440547U/ja
Application granted granted Critical
Publication of JPH0810953Y2 publication Critical patent/JPH0810953Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
JP1990082990U 1990-08-02 1990-08-02 半導体装置 Expired - Lifetime JPH0810953Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990082990U JPH0810953Y2 (ja) 1990-08-02 1990-08-02 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990082990U JPH0810953Y2 (ja) 1990-08-02 1990-08-02 半導体装置

Publications (2)

Publication Number Publication Date
JPH0440547U JPH0440547U (enExample) 1992-04-07
JPH0810953Y2 true JPH0810953Y2 (ja) 1996-03-29

Family

ID=31630289

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990082990U Expired - Lifetime JPH0810953Y2 (ja) 1990-08-02 1990-08-02 半導体装置

Country Status (1)

Country Link
JP (1) JPH0810953Y2 (enExample)

Also Published As

Publication number Publication date
JPH0440547U (enExample) 1992-04-07

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term