JPH0810217Y2 - 集積回路の取外し具 - Google Patents
集積回路の取外し具Info
- Publication number
- JPH0810217Y2 JPH0810217Y2 JP1989122105U JP12210589U JPH0810217Y2 JP H0810217 Y2 JPH0810217 Y2 JP H0810217Y2 JP 1989122105 U JP1989122105 U JP 1989122105U JP 12210589 U JP12210589 U JP 12210589U JP H0810217 Y2 JPH0810217 Y2 JP H0810217Y2
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- peeling
- circuit board
- printed circuit
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000002184 metal Substances 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 description 15
- 229910000679 solder Inorganic materials 0.000 description 11
- 239000004020 conductor Substances 0.000 description 8
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989122105U JPH0810217Y2 (ja) | 1989-10-17 | 1989-10-17 | 集積回路の取外し具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989122105U JPH0810217Y2 (ja) | 1989-10-17 | 1989-10-17 | 集積回路の取外し具 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0361376U JPH0361376U (enrdf_load_html_response) | 1991-06-17 |
JPH0810217Y2 true JPH0810217Y2 (ja) | 1996-03-27 |
Family
ID=31670121
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989122105U Expired - Lifetime JPH0810217Y2 (ja) | 1989-10-17 | 1989-10-17 | 集積回路の取外し具 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0810217Y2 (enrdf_load_html_response) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7023557B1 (ja) * | 2021-12-22 | 2022-02-22 | 株式会社エイム | 電子部品の取り外し治具 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5687263U (enrdf_load_html_response) * | 1979-11-30 | 1981-07-13 | ||
JPH01127667U (enrdf_load_html_response) * | 1988-02-10 | 1989-08-31 |
-
1989
- 1989-10-17 JP JP1989122105U patent/JPH0810217Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0361376U (enrdf_load_html_response) | 1991-06-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CA1282469C (en) | Solderable lead | |
US5549240A (en) | Surface mount device removal tool | |
EP1588419A2 (en) | Circuit board threadplate | |
JPH0810217Y2 (ja) | 集積回路の取外し具 | |
US2882380A (en) | Desoldering tool | |
JPH05206627A (ja) | リード接続用電極及びリード・電極の接続方法 | |
JPH07116835A (ja) | はんだごて | |
JPH0741574Y2 (ja) | 実装icチップ取り外し鏝 | |
JP2822496B2 (ja) | プリント配線板へのリードピンの半田付け方法 | |
JPH0528799Y2 (enrdf_load_html_response) | ||
JPH0719661Y2 (ja) | ハンダコテ | |
JPS5828699Y2 (ja) | ハンダコテ | |
JP3125903U (ja) | はんだ加熱器具用先端チップ及びそれを装着したはんだ加熱器具 | |
JPH01132070A (ja) | 電気的連結ピン | |
JPH0222141Y2 (enrdf_load_html_response) | ||
JPS582548Y2 (ja) | はんだ鏝 | |
KR100199948B1 (ko) | 전기 인두 | |
JPH0239650Y2 (enrdf_load_html_response) | ||
JPS61193727A (ja) | 電子部品の装着方法 | |
JPH08330724A (ja) | Ic取外し装置 | |
JPH04284968A (ja) | Icの取外専用半田ゴテ | |
JP2000151091A (ja) | 電気部品の実装方法 | |
JPH0319242Y2 (enrdf_load_html_response) | ||
JPH05175401A (ja) | リードフレーム | |
JPS63180160U (enrdf_load_html_response) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |