JPH0810216Y2 - チップ部品の実装構造 - Google Patents

チップ部品の実装構造

Info

Publication number
JPH0810216Y2
JPH0810216Y2 JP1987108078U JP10807887U JPH0810216Y2 JP H0810216 Y2 JPH0810216 Y2 JP H0810216Y2 JP 1987108078 U JP1987108078 U JP 1987108078U JP 10807887 U JP10807887 U JP 10807887U JP H0810216 Y2 JPH0810216 Y2 JP H0810216Y2
Authority
JP
Japan
Prior art keywords
electrode
chip component
pattern
solder
electrode part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987108078U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6413101U (enrdf_load_stackoverflow
Inventor
実 関
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1987108078U priority Critical patent/JPH0810216Y2/ja
Publication of JPS6413101U publication Critical patent/JPS6413101U/ja
Application granted granted Critical
Publication of JPH0810216Y2 publication Critical patent/JPH0810216Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Details Of Resistors (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1987108078U 1987-07-14 1987-07-14 チップ部品の実装構造 Expired - Lifetime JPH0810216Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987108078U JPH0810216Y2 (ja) 1987-07-14 1987-07-14 チップ部品の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987108078U JPH0810216Y2 (ja) 1987-07-14 1987-07-14 チップ部品の実装構造

Publications (2)

Publication Number Publication Date
JPS6413101U JPS6413101U (enrdf_load_stackoverflow) 1989-01-24
JPH0810216Y2 true JPH0810216Y2 (ja) 1996-03-27

Family

ID=31343073

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987108078U Expired - Lifetime JPH0810216Y2 (ja) 1987-07-14 1987-07-14 チップ部品の実装構造

Country Status (1)

Country Link
JP (1) JPH0810216Y2 (enrdf_load_stackoverflow)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5521283Y2 (enrdf_load_stackoverflow) * 1977-05-26 1980-05-22
JPS61210601A (ja) * 1985-03-14 1986-09-18 進工業株式会社 チツプ抵抗器

Also Published As

Publication number Publication date
JPS6413101U (enrdf_load_stackoverflow) 1989-01-24

Similar Documents

Publication Publication Date Title
US5542601A (en) Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate
US6373371B1 (en) Preformed thermal fuse
JPH1022617A (ja) 表面実装部品の実装回路基板
JPH06177526A (ja) 接合剤の印刷方法
JPH0810216Y2 (ja) チップ部品の実装構造
US3553824A (en) Process for eliminating icicle-like formations on soldered circuit substrates
JPH0621237U (ja) チップ部品
JPH0730014A (ja) 半田バンプの形成方法
JPH0254991A (ja) フレキシブル基板の半田付け方法
JPH02211995A (ja) ペースト状ハンダ
JP2682135B2 (ja) Icパッケージ
JP4733253B2 (ja) プリント配線板
JP3872600B2 (ja) 電子回路ユニットの取付方法
JPH0749827Y2 (ja) プリント配線基板の印刷構造
JPH0766074A (ja) 表面実装部品
JPH0427150Y2 (enrdf_load_stackoverflow)
JPH05283587A (ja) 多リード素子の半田付方法
JPH0523502U (ja) チツプ部品
JPS63312693A (ja) 面実装型電子部品を使用した基板装置
JPH0512999Y2 (enrdf_load_stackoverflow)
JPH0661002A (ja) チップ型電子部品
JPH02271588A (ja) チップ部品取付用スペーサ
JPH0547997B2 (enrdf_load_stackoverflow)
JP2000151085A (ja) 電子回路装置及び電子部品の配線基板実装方法
JPH07263853A (ja) プリント基板