JPH0810214Y2 - 電子部品実装用回路基板 - Google Patents
電子部品実装用回路基板Info
- Publication number
- JPH0810214Y2 JPH0810214Y2 JP1989139999U JP13999989U JPH0810214Y2 JP H0810214 Y2 JPH0810214 Y2 JP H0810214Y2 JP 1989139999 U JP1989139999 U JP 1989139999U JP 13999989 U JP13999989 U JP 13999989U JP H0810214 Y2 JPH0810214 Y2 JP H0810214Y2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- conductive pad
- hole
- electronic components
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 19
- 239000011148 porous material Substances 0.000 claims description 12
- 239000011888 foil Substances 0.000 claims description 10
- 230000002093 peripheral effect Effects 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Combinations Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989139999U JPH0810214Y2 (ja) | 1989-12-01 | 1989-12-01 | 電子部品実装用回路基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989139999U JPH0810214Y2 (ja) | 1989-12-01 | 1989-12-01 | 電子部品実装用回路基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0379441U JPH0379441U (en, 2012) | 1991-08-13 |
JPH0810214Y2 true JPH0810214Y2 (ja) | 1996-03-27 |
Family
ID=31687009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989139999U Expired - Lifetime JPH0810214Y2 (ja) | 1989-12-01 | 1989-12-01 | 電子部品実装用回路基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0810214Y2 (en, 2012) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6134989A (ja) * | 1984-07-25 | 1986-02-19 | イビデン株式会社 | 電子部品搭載用基板 |
-
1989
- 1989-12-01 JP JP1989139999U patent/JPH0810214Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0379441U (en, 2012) | 1991-08-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |