JPH0810207Y2 - 樹脂封止形半導体装置 - Google Patents

樹脂封止形半導体装置

Info

Publication number
JPH0810207Y2
JPH0810207Y2 JP1988002975U JP297588U JPH0810207Y2 JP H0810207 Y2 JPH0810207 Y2 JP H0810207Y2 JP 1988002975 U JP1988002975 U JP 1988002975U JP 297588 U JP297588 U JP 297588U JP H0810207 Y2 JPH0810207 Y2 JP H0810207Y2
Authority
JP
Japan
Prior art keywords
resin
die pad
semiconductor device
hole
thin film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1988002975U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01107157U (enExample
Inventor
隆一郎 森
好孝 竹本
龍彦 秋山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1988002975U priority Critical patent/JPH0810207Y2/ja
Priority to US07/227,332 priority patent/US4942454A/en
Publication of JPH01107157U publication Critical patent/JPH01107157U/ja
Application granted granted Critical
Publication of JPH0810207Y2 publication Critical patent/JPH0810207Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H10W72/30—
    • H10W72/884—
    • H10W72/931—
    • H10W74/00—
    • H10W90/736—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1988002975U 1987-08-05 1988-01-12 樹脂封止形半導体装置 Expired - Lifetime JPH0810207Y2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP1988002975U JPH0810207Y2 (ja) 1988-01-12 1988-01-12 樹脂封止形半導体装置
US07/227,332 US4942454A (en) 1987-08-05 1988-08-02 Resin sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988002975U JPH0810207Y2 (ja) 1988-01-12 1988-01-12 樹脂封止形半導体装置

Publications (2)

Publication Number Publication Date
JPH01107157U JPH01107157U (enExample) 1989-07-19
JPH0810207Y2 true JPH0810207Y2 (ja) 1996-03-27

Family

ID=31204206

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988002975U Expired - Lifetime JPH0810207Y2 (ja) 1987-08-05 1988-01-12 樹脂封止形半導体装置

Country Status (1)

Country Link
JP (1) JPH0810207Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2779843B2 (ja) * 1989-08-08 1998-07-23 イビデン株式会社 電子部品搭載用基板及び電子部品パッケージ

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63150953A (ja) * 1986-12-15 1988-06-23 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム

Also Published As

Publication number Publication date
JPH01107157U (enExample) 1989-07-19

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