JPH0810191Y2 - ワイヤボンディング装置 - Google Patents
ワイヤボンディング装置Info
- Publication number
- JPH0810191Y2 JPH0810191Y2 JP1990077848U JP7784890U JPH0810191Y2 JP H0810191 Y2 JPH0810191 Y2 JP H0810191Y2 JP 1990077848 U JP1990077848 U JP 1990077848U JP 7784890 U JP7784890 U JP 7784890U JP H0810191 Y2 JPH0810191 Y2 JP H0810191Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- pressing member
- wire bonding
- bonding
- vertical movement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000010438 heat treatment Methods 0.000 claims description 21
- 230000007246 mechanism Effects 0.000 claims description 14
- 238000001514 detection method Methods 0.000 claims description 7
- 239000011295 pitch Substances 0.000 description 6
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003303 reheating Methods 0.000 description 2
- 229920006395 saturated elastomer Polymers 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077848U JPH0810191Y2 (ja) | 1990-07-24 | 1990-07-24 | ワイヤボンディング装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990077848U JPH0810191Y2 (ja) | 1990-07-24 | 1990-07-24 | ワイヤボンディング装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0459142U JPH0459142U (enrdf_load_stackoverflow) | 1992-05-21 |
| JPH0810191Y2 true JPH0810191Y2 (ja) | 1996-03-27 |
Family
ID=31809537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990077848U Expired - Fee Related JPH0810191Y2 (ja) | 1990-07-24 | 1990-07-24 | ワイヤボンディング装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0810191Y2 (enrdf_load_stackoverflow) |
-
1990
- 1990-07-24 JP JP1990077848U patent/JPH0810191Y2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0459142U (enrdf_load_stackoverflow) | 1992-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |