JPH0810190Y2 - ボンディング装置 - Google Patents

ボンディング装置

Info

Publication number
JPH0810190Y2
JPH0810190Y2 JP1990110222U JP11022290U JPH0810190Y2 JP H0810190 Y2 JPH0810190 Y2 JP H0810190Y2 JP 1990110222 U JP1990110222 U JP 1990110222U JP 11022290 U JP11022290 U JP 11022290U JP H0810190 Y2 JPH0810190 Y2 JP H0810190Y2
Authority
JP
Japan
Prior art keywords
frame
bonding
compression
pressing
molded body
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1990110222U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0467335U (enExample
Inventor
勇 緩詰
平馬 山崎
光格 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP1990110222U priority Critical patent/JPH0810190Y2/ja
Publication of JPH0467335U publication Critical patent/JPH0467335U/ja
Application granted granted Critical
Publication of JPH0810190Y2 publication Critical patent/JPH0810190Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07178—Means for aligning

Landscapes

  • Wire Bonding (AREA)
JP1990110222U 1990-10-23 1990-10-23 ボンディング装置 Expired - Fee Related JPH0810190Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990110222U JPH0810190Y2 (ja) 1990-10-23 1990-10-23 ボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990110222U JPH0810190Y2 (ja) 1990-10-23 1990-10-23 ボンディング装置

Publications (2)

Publication Number Publication Date
JPH0467335U JPH0467335U (enExample) 1992-06-15
JPH0810190Y2 true JPH0810190Y2 (ja) 1996-03-27

Family

ID=31857529

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990110222U Expired - Fee Related JPH0810190Y2 (ja) 1990-10-23 1990-10-23 ボンディング装置

Country Status (1)

Country Link
JP (1) JPH0810190Y2 (enExample)

Also Published As

Publication number Publication date
JPH0467335U (enExample) 1992-06-15

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Legal Events

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