JPH0793176B2 - Work fixture - Google Patents
Work fixtureInfo
- Publication number
- JPH0793176B2 JPH0793176B2 JP31375489A JP31375489A JPH0793176B2 JP H0793176 B2 JPH0793176 B2 JP H0793176B2 JP 31375489 A JP31375489 A JP 31375489A JP 31375489 A JP31375489 A JP 31375489A JP H0793176 B2 JPH0793176 B2 JP H0793176B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- fixing jig
- soldering
- flux
- thick film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
Description
【発明の詳細な説明】 〔産業上の利用分野〕 この発明は薄板製リードフレームと厚膜基板のパッドと
の半田付け接合時に使用するワーク（リードフレーム
用）固定治具に関するものである。Description: TECHNICAL FIELD The present invention relates to a work (for lead frame) fixing jig used when soldering and joining a thin plate lead frame and a pad of a thick film substrate.
第３図〜第６図は従来の固定治具を示すもので、図にお
いて、１は厚膜基板、1aは厚膜基板１に実装された実装
部品、1bは厚膜基板１に設けられた、外部との接続のた
めのパッド、２はリードフレーム、2aはその垂直方向の
ストレート部、３は厚膜基板１を固定するための位置決
めステージ、3aは厚膜基板１を位置決めするための基板
固定ピン、3bはリードフレーム２を位置決めするための
位置決めピンである。なお、厚膜基板１は基板固定ピン
3aに対峙する２方向より押圧されている（図示せず）。
４はパッド1bとリードフレーム２の半田付けを容易にす
るための活性剤であるフラックス、4aはフラックス４の
構成成分で、溶剤が蒸発したヤニ、５はリードフレーム
２のパッド1bとの位置ずれのばらつき及び半田付け時の
固定用のリードフレームの固定治具、5aは固定治具５の
先端の押え部、６は固定治具５を上下に駆動するための
駆動部、７は位置決めステージ３を第１工程より第２工
程まで移動させるためのスライダである。3 to 6 show a conventional fixing jig, in which 1 is a thick film substrate, 1a is a mounting component mounted on the thick film substrate 1, and 1b is a thick film substrate 1. , A pad for connection to the outside, 2 a lead frame, 2a a vertical portion of the lead frame, 3 a positioning stage for fixing the thick film substrate 1, 3a a substrate for positioning the thick film substrate 1 The fixing pins 3b are positioning pins for positioning the lead frame 2. The thick film substrate 1 is a substrate fixing pin.
It is pressed from two directions facing the 3a (not shown).
4 is a flux which is an activator for facilitating soldering of the pad 1b and the lead frame 2, 4a is a constituent component of the flux 4, and 5 is a misaligned solvent and the pad 1b of the lead frame 2. Of the lead frame for fixing at the time of soldering, 5a is a holding portion at the tip of the fixing jig 5, 6 is a driving portion for driving the fixing jig 5 up and down, and 7 is a positioning stage 3 Is a slider for moving from the first step to the second step.
次に、半田付け方法について説明する。第４図におい
て、第１工程にて位置決めステージ３上に厚膜基板１と
リードフレームをセットし、次にフラックス４を塗布す
る。その後スライダ７により、矢印方向に移動し、第
２工程の位置にセットされる。ここでは、駆動部６によ
り固定治具５が矢印方向の下方に降り、リードフレー
ム２を押圧する。その時にリードフレーム２の垂直方向
のストレート部2aは固定治具５の押え部5aの面に沿って
支えられる場合もある。その後第３工程でパッド1bとリ
ードフレーム２を半田付けするための半田ごて（図示せ
ず）により半田付けがなされる。最後に半田付けが所定
の箇所完了すれば固定治具５が矢印とは逆の方向に上
昇する。Next, a soldering method will be described. In FIG. 4, in the first step, the thick film substrate 1 and the lead frame are set on the positioning stage 3, and then the flux 4 is applied. After that, the slider 7 moves in the direction of the arrow to set it in the position of the second step. Here, the fixing jig 5 descends downward in the arrow direction by the drive unit 6 and presses the lead frame 2. At that time, the vertical straight portion 2a of the lead frame 2 may be supported along the surface of the holding portion 5a of the fixing jig 5. Then, in a third step, the pad 1b and the lead frame 2 are soldered by a soldering iron (not shown) for soldering. Finally, when the soldering is completed at a predetermined position, the fixing jig 5 rises in the direction opposite to the arrow.
従来のリードフレーム２を固定するための固定治具５の
押え部5aは以上のように構成されているので、フラック
ス４の塗布後にリードフレーム２に沿ってはい上り、更
にリードフレーム２と押え部5aとの狭小な隙間による毛
細現象にてフラックス４が急激に押え部5aの上部までは
い上り、半田付け作業完了後、固定治具５を駆動部６に
より矢印とは逆方向に上昇するときに、フラックス４
のヤニ4aにより押え部5aとリードフレーム２が粘着して
いるために、またリードフレーム２と押え部5aが僅かに
接触しているために、スムーズにリードフレーム２と押
え部5aの両者が離れず、薄板状のリードフレーム２を変
形させたり、或いは押え部5aのヤニ4aの除去のために洗
浄を頻繁に実施しなければならず、作業性が悪くなるな
どの問題点があった。Since the holding portion 5a of the fixing jig 5 for fixing the conventional lead frame 2 is configured as described above, it rises up along the lead frame 2 after the flux 4 is applied, and further the lead frame 2 and the holding portion. When the flux 4 rapidly rises to the upper part of the holding part 5a due to the capillary phenomenon due to the narrow gap with the 5a and the fixing jig 5 is lifted by the driving part 6 in the direction opposite to the arrow after the completion of the soldering work. , Flux 4
Since the pressing portion 5a and the lead frame 2 are adhered by the crocodile 4a and the lead frame 2 and the pressing portion 5a are slightly in contact with each other, both the lead frame 2 and the pressing portion 5a are smoothly separated from each other. First, the thin plate-shaped lead frame 2 must be deformed frequently, or cleaning must be frequently performed to remove the varnish 4a of the holding portion 5a, resulting in a problem of poor workability.
この発明は上記のような問題点を解消するためになされ
たもので、リードフレーム２と押え部5aとの狭小な隙間
へのフラックス４のはい上りをできるだけ少量に、また
リードフレーム２と押え部5aの接触面を減らし、摩擦力
を減ずることのできる固定治具を得ることを目的として
いる。The present invention has been made to solve the above-mentioned problems, and the flux 4 rises to the narrow gap between the lead frame 2 and the holding portion 5a as little as possible, and the lead frame 2 and the holding portion 5a. The purpose is to obtain a fixing jig that can reduce the contact surface of 5a and reduce the frictional force.
この発明に係るワーク固定治具は、リードフレーム押え
部でリードフレームと引出し用パッドとの半田付け部に
近接する部分に凹部を設けたものである。In the work fixing jig according to the present invention, a concave portion is provided in a portion of the lead frame pressing portion that is close to the soldering portion between the lead frame and the extraction pad.
この発明における凹部は、半田付けの際のフラックス
が、固定治具の押え部とリードフレームとの間を毛細管
現象ではい上るのを防止する。このため、半田付け後
に、押え部とリードフレームとがフラックスのヤニで固
着する範囲が極力抑えられ、作業がスムーズに行われ
る。The concave portion in the present invention prevents the flux at the time of soldering from rising between the holding portion of the fixing jig and the lead frame by the capillary phenomenon. Therefore, after soldering, the range in which the pressing portion and the lead frame are fixed to each other by the flux varnish is suppressed as much as possible, and the work is smoothly performed.
以下この発明の一実施例を図について説明する。第１
図、第２図において、５は固定治具、5bは固定地具５の
リードフレーム２と対向する面に設けられた凹部であ
る。なお、その他の構成は従来のものと同様なので説明
は省略する。An embodiment of the present invention will be described below with reference to the drawings. First
In FIG. 2 and FIG. 2, 5 is a fixing jig, and 5b is a recess provided on the surface of the fixed ground tool 5 facing the lead frame 2. The rest of the configuration is the same as that of the conventional one, and the description thereof is omitted.
次に動作について説明する。この発明の全体の動作は従
来と同じである。第１図、第２図に示すように、第１工
程位置において、位置決めステージ３にリードフレーム
２を位置決め載置し、第２工程位置において駆動部６に
より固定地具５を下降させる。このとき、第１図、第２
図に示すように、固定地具５の先端部の押え部5aの一部
に凹部5bが設けられているため、フラックス４のはい上
りが押え部5aのみで止まると同時に、リードフレーム２
と押え部5aの接触面が少ないため、摩擦抵抗が小さくな
る。Next, the operation will be described. The entire operation of the present invention is the same as the conventional one. As shown in FIGS. 1 and 2, the lead frame 2 is positioned and mounted on the positioning stage 3 at the first process position, and the fixed grounding tool 5 is lowered by the drive unit 6 at the second process position. At this time, FIG. 1 and FIG.
As shown in the figure, since the recess 5b is provided in a part of the pressing portion 5a at the tip of the fixed ground tool 5, the flux 4 stops rising at only the pressing portion 5a, and at the same time, the lead frame 2
Since the contact surface between the pressing portion 5a and the pressing portion 5a is small, the frictional resistance is small.
以上のようにこの発明によれば、固定治具の押え部の一
部に凹部を設けたので、フラックスのはい上りが防止さ
れ、半田付け完了時の駆動部による固定治具の上昇時
に、ヤニによるリードフレームと押え部の固着がなくな
り、両者の分離を容易にすることができ、リードフレー
ムの変形防止が可能で、半田付け後の後工程に支障なく
流すことができる。また、ヤニのはい上りが少なくなる
ことにより、固定治具の押え部の汚れが抑えられ、ヤニ
の除去などの洗浄作業も不要となる。As described above, according to the present invention, since the recess is provided in a part of the holding portion of the fixing jig, the flux is prevented from rising, and when the fixing jig is lifted by the driving unit at the completion of soldering, Since the lead frame and the pressing portion are not fixed to each other due to the above, the separation of the two can be facilitated, the lead frame can be prevented from being deformed, and it can be flowed without any trouble in the post process after soldering. In addition, since the rise of the crocodile is reduced, the pressing portion of the fixing jig is prevented from becoming dirty, and cleaning work such as removal of the crocodile is unnecessary.
第１図はこの発明の一実施例によるワーク固定治具を示
す側面図、第２図は第１図の押え部を拡大して示す断面
図、第３図はリードフレームの位置決め状態を示す斜視
図、第４図イ，ロは従来のワーク固定治具の動作を説明
する側面図、第５図は従来のワーク固定治具を示す側面
図、第６図は第５図の押え部を拡大して示す断面図であ
る。 図中、１は厚膜基板、1bはパッド、２はリードフレー
ム、３は位置決めステージ、４はフラックス、５は固定
治具、5aは押え部、5bは凹部である。 なお、図中同一符号は同一又は相当部分を示す。FIG. 1 is a side view showing a work fixing jig according to an embodiment of the present invention, FIG. 2 is an enlarged sectional view showing a holding portion of FIG. 1, and FIG. 3 is a perspective view showing a positioning state of a lead frame. FIGS. 4A and 4B are side views for explaining the operation of the conventional work fixing jig, FIG. 5 is a side view showing the conventional work fixing jig, and FIG. 6 is an enlarged view of the holding portion of FIG. FIG. In the figure, 1 is a thick film substrate, 1b is a pad, 2 is a lead frame, 3 is a positioning stage, 4 is flux, 5 is a fixing jig, 5a is a holding part, and 5b is a recess. The same reference numerals in the drawings indicate the same or corresponding parts.
Claims (1)
膜基板上の外部引出し用パッドと、タイバーにて一体化
されたリードフレームとを半田付けする際に上記リード
フレームを動かないように押えるための固定治具におい
て、この固定治具のリードフレーム押え部で上記半田付
け部に近接する部分に凹部を設けたことを特徴とするワ
ーク固定治具。1. A method for pressing a lead frame so that it does not move when soldering an external lead-out pad on a thick film substrate positioned and fixed to a positioning stage and a lead frame integrated by a tie bar. A work fixing jig, wherein a recess is provided in a portion of the fixing jig near the soldering portion in the lead frame pressing portion of the fixing jig.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31375489A JPH0793176B2 (en) | 1989-12-01 | 1989-12-01 | Work fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31375489A JPH0793176B2 (en) | 1989-12-01 | 1989-12-01 | Work fixture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03176977A JPH03176977A (en) | 1991-07-31 |
| JPH0793176B2 true JPH0793176B2 (en) | 1995-10-09 |
Family
ID=18045135
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31375489A Expired - Fee Related JPH0793176B2 (en) | 1989-12-01 | 1989-12-01 | Work fixture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0793176B2 (en) |
-
1989
- 1989-12-01 JP JP31375489A patent/JPH0793176B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03176977A (en) | 1991-07-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |